XC9235A18DMR-G [TOREX]
IC REG BCK 1.8V 0.6A SYNC SOT-25;
| 型号： | XC9235A18DMR-G |
| 厂家： | 
Torex Semiconductor |
| 描述： | IC REG BCK 1.8V 0.6A SYNC SOT-25 |
| 文件： | 总33页 (文件大小：1132K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
Series
ETR0514-016
600mA Driver Tr. Built-In, Synchronous Step-Down DC/DC Converters
☆GreenOperation Compatible
■GENERAL DESCRIPTION
The XC9235/XC9236/XC9237 series is a group of synchronous-rectification type DC/DC converters with a built-in 0.42Ω P-
channel MOS driver transistor and 0.52Ω N-channel MOS switching transistor, designed to allow the use of ceramic capacitors.
Operating voltage range is from 2.0V to 6.0V (A~C types), 1.8V to 6.0V (D~G types). For the D/F types which have a reference
voltage of 0.8V (accuracy:±2.0%), the output voltage can be set from 0.9V by using two external resistors. The A/B/C/E/G types
have a fixed output voltage from 0.8V to 4.0V in increments of 0.05V (accuracy:±2.0%). The device provides a high efficiency,
stable power supply with an output current of 600mA to be configured using only a coil and two capacitors connected externally.
With the built-in oscillator, either 1.2MHz or 3.0MHz can be selected for suiting to your particular application. As for operation
mode, the XC9235 series is PWM control, the XC9236 series is automatic PWM/PFM switching control and the XC9237 series
can be manually switched between the PWM control mode and the automatic PWM/PFM switching control mode, allowing fast
response, low ripple and high efficiency over the full range of loads (from light load to heavy load).
The soft start and current control functions are internally optimized. During stand-by, all circuits are shutdown to reduce current
consumption to as low as 1.0μA or less. The B/F/G types have a high speed soft-start as fast as 0.25ms in typical for quick turn-
on. With the built-in UVLO function, the internal P-channel MOS driver transistor is forced OFF when input voltage becomes 1.4V
or lower.
The B to G types integrate CL
discharge function which enables the electric charge at the output capacitor CL to be discharged
via the internal discharge switch located between the LX and VSS pins. When the devices enter stand-by mode, output voltage
quickly returns to the VSS level as a result of this function.
Four types of package SOT-25, USP-6C, USP-6EL and WLP-5-03 are available.
■APPLICATIONS
■FEATURES
●Smart phones / Mobile phones
●Bluetooth
Driver Transistor Built-In
: 0.42Ω P-ch driver transistor
0.52Ω N-ch switch transistor
: 2.0V ~ 6.0V (A/B/C types)
1.8V ~ 6.0V (D/E/F/G types)
: 0.8V ~ 4.0V (Internally set)
0.9V ~ 6.0V (Externally set)
: 92% (TYP.)*
Input Voltage
●Mobile devices / terminals
●Portable game consoles
●Digital still cameras / Camcorders
●Note PCs / Tablet PCs
Output Voltage
High Efficiency
Output Current
: 600mA
Oscillation Frequency
Maximum Duty Cycle
Control Methods
: 1.2MHz, 3.0MHz (+15%)
: 100%
: PWM (XC9235)
PWM/PFM Auto (XC9236)
PWM/PFM Manual (XC9237)
: Current Limiter Circuit Built-In
(Constant Current & Latching)
CL Discharge (B/C/D/E/F/G types)
High Speed Soft Start (B/F/G type)
: Low ESR Ceramic Capacitor
:-40℃ ~ +85℃
■
TYPICAL APPLICATION CIRCUIT
Function
●XC9235/XC9236/XC9237
A/B/C/E/G types (Output Voltage Fixed)
Capacitor
Operating Ambient Temperature
Packages
VOUT
600mA
L
V
IN
Lx
V
IN
: SOT-25 (A/B/C types only)
USP-6C
VSS
VSS
CIN
(ceramic)
USP-6EL (A/B/C/G types only)
WLP-5-03 (A/B types only)
: EU RoHS Compliant, Pb Free
C
L
CE/
MODE
VOUT
(ceramic)
CE/MODE
Environmentally Friendly
* Performance depends on external components and wiring on the PCB.
■
TYPICAL PERFORMANCE CHARACTERISTICS
●Efficiency vs. Output Current (fOSC=1.2MHz, VOUT=1.8V)
●XC9235/XC9236/XC9237
D/F types (Output Voltage Externally Set)
PWM/PFM Automatic Sw itching Control
100
90
80
VOUT
L
VIN= 4.2V
70
600mA
V
IN
V
IN
Lx
PWM Control
VIN= 4.2V
3.6V
2.4V
3.6V
2.4V
60
50
40
30
20
10
0
VSS
VSS
C
IN
RFB1
RFB2
C
(ceramic)
L
CFB
(ceramic)
CE/
MODE
FB
CE/MODE
0.1
1
10
100
1000
Output Current:IOUT(mA)
1/40
Series
■BLOCK DIAGRAM
●XC9235 / XC9236 / XC9237 A Series
●XC9235 / XC9236 / XC9237 B/C/E/G
Phase
Compensation
Phase
Compensation
Current Feedback
Current Limit
Current Feedback
Current Limit
VOUT
VOUT
CFB
CFB
Error Amp.
R2
R2
R1
Error Amp.
PWM
Comparator
PWM
Comparator
Synch
Buffer
Drive
Synch
Buffer
Drive
FB
FB
Logic
Logic
R1
Lx
Lx
VSHORT
VSHORT
VIN
VIN
Vref with
Soft Start,
CE
Vref with
Soft Start,
CE
PWM/PFM
ꢀSelector
PWM/PFM
ꢀSelector
CE/
Ramp Wave
UVLO Cmp
Ramp Wave
Generator
OSC
UVLO Cmp
Generator
OSC
UVLO
R3
R4
UVLO
R3
R4
VSS
VSS
CE/MODE
Control
Logic
CE/MODE
Control
Logic
CE/MODE
CE/MODE
●XC9235 / XC9236 / XC9237 D/F Series
Phase
Compensation
Current Feedback
Current Limit
FB
Error Amp.
PWM
Comparator
Synch
Buffer
Drive
FB
Logic
Lx
VSHORT
VIN
Vref with
Soft Start,
CE
PWM/PFM
ꢀSelector
CE/
Ramp Wave
Generator
OSC
UVLO Cmp
UVLO
R3
R4
VSS
CE/MODE
Control
Logic
CE/MODE
NOTE: The signal from CE/MODE Control Logic to PWM/PFM Selector is being fixed to "L" level inside,
and XC9235 series chooses only PWM control.
The signal from CE/MODE Control Logic to PWM/PFM Selector is being fixed to "H" level inside,
and XC9236 series chooses only PWM/PFM automatic switching control.
Diodes inside the circuit are ESD protection diodes and parasitic diodes.
2/33
XC9235/XC9236/XC9237
Series
■PRODUCT CLASSIFICATION
●Ordering Information
(
(
(
)
)
)
*1
*1
*1
XC9235①②③④⑤⑥-⑦
XC9236①②③④⑤⑥-⑦
XC9237①②③④⑤⑥-⑦
Fixed PWM control
PWM / PFM automatic switching control
Fixed PWM control PWM / PFM automatic switching manual selection
DESIGNATOR
ITEM
SYMBOL
DESCRIPTION
A
B
C
E
G
D
F
VIN≧2.0V, No CL discharge, Low speed soft-start
VIN≧2.0V, CL discharge, High speed soft-start
VIN≧2.0V, CL discharge, Low speed soft-start
VIN≧1.8V, CL discharge, Low speed soft-start
VIN≧1.8V, CL discharge, High speed soft-start
VIN≧1.8V, CL discharge, Low speed soft-start
VIN≧1.8V, CL discharge, High speed soft-start
Fixed Output voltage (VOUT
)
Functional selection
①
Adjustable Output voltage (FB)
Functional selection
Output voltage options
e.g. VOUT=2.8V→②=2, ③=8
Fixed Output Voltage (VOUT
)
08 ~ 40
VOUT=2.85V→②=2, ③=L
②③
0.05V increments: 0.05=A, 0.15=B, 0.25=C, 0.35=D, 0.45=E,
0.55=F, 0.65=H, 0.75=K, 0.85=L, 0.95=M
Reference voltage is fixed in 0.8V
②=0, ③=8
Adjustable Output Voltage
(FB)
08
C
1.2MHz
3.0MHz
④
Oscillation Frequency
D
MR
MR-G
ER
SOT-25(*2) (3,000pcs/Reel)
SOT-25(*2) (3,000pcs/Reel)
USP-6C (3,000pcs/Reel)
USP-6C (3,000pcs/Reel)
USP-6EL(*4) (3,000pcs/Reel)
WLP-5-03 (*3) (3,000pcs/Reel)
Packages
⑤⑥-⑦
(Order Unit)
ER-G
4R-G
0R-G
(*1) The “-G” suffix denotes Halogen and Antimony free as well as being fully EU RoHS compliant.
(*2) SOT-25 package are available for the A/B/C series only.
(*3) WLP-5-03 package is available for the A/B series only.
(*4) USP-6EL package are available for the A/B/C/G series only.
3/33
Series
■PIN CONFIGURATION
Lx
VOUT
5
4
VIN
VSS
6
5
4
1
2
3
Lx
VIN
VSS
6
5
4
1
2
3
Lx
VSS
VSS
VOUT
CE/MODE
VOUT (FB)
CE/MODE
1
2
3
VIN
VSS CE/MODE
SOT-25
(Top View)
USP-6C
(BOTTOM VIEW)
USP-6EL
(BOTTOM VIEW)
1
2
4
CE/MODE
VIN
VOUT
Lx
* Please short the VSS pin (No. 2 and 5).
* The dissipation pad for the USP-6C/USP-6EL packages should be solder-
plated in recommended mount pattern and metal masking so as to enhance
mounting strength and heat release. We recommend keeping the dissipation pas
electrically isolated from the other Pins. If the pad needs to be connected to other
pins, it should be connected to the VSS (No. 5) pin.
5
VSS
3
WLP-5-03
(BOTTOM VIEW)
■PIN ASSIGNMENT
PIN NUMBER
PIN NAME
FUNCTIONS
SOT-25
USP-6C/USP-6EL
WLP-5-03
1
2
3
6
2, 5
4
2
3
1
VIN
VSS
Power Input
Ground
CE / MODE
VOUT
High Active Enable / Mode Selection Pin
Fixed Output Voltage Pin (A/B/C/E/G types)
Output Voltage Sense Pin (D/F types)
Switching Output
4
5
3
1
4
5
FB
Lx
■FUNCTION
OPERATIONAL STATES
XC9237
OPERATIONAL STATES
CE/MODE
H Level (*3)
CE/MODE
XC9235
XC9236
Synchronous
PWM/PFM
Automatic Switching
Synchronous PWM Fixed Control
Stand-by
Synchronous
PWM Fixed
Control
Synchronous
PWM/PFM
Automatic Switching
H Level (*1)
L Level (*2)
M Level (*4)
L Level (*5)
Stand-by
Stand-by
CE/MODE pin voltage level range
(*1) H Level ： VIN 0.65V ≦ H Level ≦ 6.0V
(*2) L Level ： 0V ≦ L Level ≦ 0.25V
(*3) H Level ： VIN - 0.25V ≦ H Level ≦ 6.0V
(*4) M Level ： 0.65V ≦ M Level ≦ VIN - 1.0V
(*5) L Level ： 0V ≦ L Level ≦ 0.25V
(*6) For XC9235 / XC9236 / XC9237B ~ G types, the internal resistance turns on during standby.
Discharge the CL charge through the CL discharge resistor.
(*7) Please do not leave the CE/MODE pin open.
4/33
XC9235/XC9236/XC9237
Series
■ABSOLUTE MAXIMUM RATINGS
PARAMETER
VIN Pin Voltage
SYMBOL
VIN
RATINGS
- 0.3 ~ 6.5
- 0.3 ~ VIN + 0.3
- 0.3 ~ 6.5
- 0.3 ~ 6.5
- 0.3 ~ 6.5
±1500
UNIT
V
Lx Pin Voltage
VLX
V
VOUT Pin Voltage
FB Pin Voltage
VOUT
VFB
V
V
CE/MODE Pin Voltage
Lx Pin Current
VCE/MODE
ILx
V
mA
250
SOT-25
600 (40mm x 40mm Standard board)(*1)
760 (JESD51-7 board)(*1)
120
Power
Dissipation
(Ta=25℃)
USP-6C
Pd
1000 (40mm x 40mm Standard board )(*1)
1250 (JESD51-7 board(*1)
120
1000 (40mm x 40mm Standard board )(*1)
750 (40mm x 40mm Standard board )(*1)
- 40 ~ + 85
mW
USP-6EL
WLP-5-03
Operating Ambient Temperature
Storage Temperature
(*1) The power dissipation figure shown is PCB mounted and is for reference only.
Topr
Tstg
OC
OC
- 55 ~ + 125
Please refer to PACKAGING INFORMATION for the mounting condition.
5/33
Series
■ELECTRICAL CHARACTERISTICS
XC9235A18Cxx/XC9236A18Cxx/XC9237A18Cxx, VOUT=1.8V, fOSC=1.2MHz, Ta=25℃
PARAMETER
SYMBOL
CONDITIONS
MIN.
TYP.
MAX. UNIT CIRCUIT
When connected to external components,
VIN=VCE=5.0V, IOUT=30mA
Output Voltage
VOUT
VIN
1.764
2.0
1.800 1.836
V
V
①
①
①
Operating Voltage Range
Maximum Output Current
-
-
6.0
-
VIN=VOUT(E)+2.0V, VCE=1.0V,
IOUTMAX
600
mA
When connected to external components (*9)
VCE =VIN, VOUT=0V,
UVLO Voltage
VUVLO
1.00
1.40
1.78
V
③
Voltage which Lx pin holding “L” level (*1, *11)
Supply Current
IDD
VIN=VCE=5.0V, VOUT=VOUT(E)×1.1V
-
-
15
0
33
μA
μA
②
②
Stand-by Current
ISTB
VIN=5.0V, VCE=0V, VOUT=VOUT(E)×1.1V
1.0
When connected to external components,
VIN=VOUT(E)+2.0V, VCE =1.0V, IOUT=100mA
Oscillation Frequency
PFM Switching Current
fOSC
1020
120
1200
160
1380
200
kHz
mA
①
①
When connected to external components,
VIN=VOUT(E)+2.0V, VCE =VIN, IOUT=1mA (*12)
IPFM
PFM Duty Limit
Maximum Duty Cycle
Minimum Duty Cycle
DTYLIMIT_PFM VCE=VIN=(C-1), IOUT=1mA (*12)
200
300
%
%
%
①
③
③
DMAX
DMIN
VIN=VCE=5.0V, VOUT=VOUT(E)×0.9V
VIN=VCE=5.0V, VOUT=VOUT(E)×1.1V
100
-
-
-
-
0
When connected to external components,
VCE=VIN=VOUT(E)+1.2V, IOUT=100mA
Efficiency (*2)
EFFI
-
92
-
%
①
Lx SW "H" ON Resistance 1
Lx SW "H" ON Resistance 2
Lx SW "L" ON Resistance 1
Lx SW "L" ON Resistance 2
Lx SW "H" Leak Current (*5)
Lx SW "L" Leak Current (*5)
Current Limit (*10)
RLxH
RLxH
VIN=VCE=5.0V, VOUT=0V, ILx=100mA (*3)
VIN=VCE=3.6V, VOUT=0V, ILx=100mA (*3)
VIN=VCE=5.0V (*4)
-
0.35
0.42
0.45
0.52
0.01
0.01
1050
0.55
0.67
0.65
0.77
1.0
Ω
Ω
④
④
④
-
-
RLxL
-
Ω
RLxL
VIN=VCE=3.6V (*4)
-
Ω
ILEAKH
ILEAKL
ILIM
VIN=VOUT=5.0V, VCE=0V, Lx=0V
VIN=VOUT=5.0V, VCE=0V, Lx=5.0V
VIN=VCE=5.0V, VOUT=VOUT(E)×0.9V (*8)
-
-
μA
μA
mA
⑤
⑤
⑥
1.0
900
1350
Output Voltage
Temperature Characteristics (VOUT・△Topr)
△VOUT/
IOUT=30mA, -40℃≦Topr≦85℃
-
±100
-
ppm/
℃
①
③
③
VOUT=0V, Applied voltage to VCE
,
CE "H" Voltage
CE "L" Voltage
VCEH
VCEL
0.65
VSS
-
-
6.0
0.25
V
Voltage changes Lx to “H” level (*11)
VOUT=0V, Applied voltage to VCE
Voltage changes Lx to “L” level (*11)
,
V
When connected to external components,
IOUT=1mA (*6), Voltage which oscillation frequency
becomes 1020 kHz≦fOSC≦1380kHz (*13)
PWM "H" Level Voltage
VPWMH
-
-
VIN - 1.0
V
①
When connected to external components,
IOUT=1mA (*6), Voltage which oscillation frequency
becomes fOSC＜1020kHz (*13)
VIN
0.25
-
PWM "L" Level Voltage
VPWML
-
-
V
①
CE "H" Current
CE "L" Current
ICEH
ICEL
VIN=VCE=5.0V, VOUT=0V
VIN=5.0V, VCE=0V, VOUT=0V
- 0.1
- 0.1
-
-
0.1
0.1
μA
μA
⑤
⑤
When connected to external components,
VCE=0V → VIN, IOUT=1mA
Soft Start Time
Latch Time
tSS
0.5
1.0
1.0
-
2.5
ms
ms
①
⑦
VIN=VCE=5.0V, VOUT=0.8×VOUT(E)
,
tLAT
20.0
Short Lx at 1Ω resistance (*7)
Sweeping VOUT, VIN=VCE=5.0V, Short Lx at
1Ω resistance, VOUT voltage which Lx becomes
“L” level within 1ms
Short Protection Threshold
Voltage
VSHORT
0.675 0.900 1.150
V
⑦
Test conditions: Unless otherwise stated, VIN=5.0V, VOUT(E)=Nominal Voltage
NOTE:
(*1)
Including hysteresis operating voltage range.
EFFI = { ( output voltage×output current ) / ( input voltage×input current) }×100
ON resistance (Ω)= (VIN - Lx pin measurement voltage) / 100mA
R&D value
When temperature is high, a current of approximately 10μA (maximum) may leak.
The CE/MODE pin of the XC9237A series works also as an external switching pin of PWM control and PWM/PFM control. When the IC is in the operation,
control is switched to the automatic PWM/PFM switching mode when the CE/MODE pin voltage is equal to or greater than VIN minus 0.3V, and to the PWM
(*2)
(*3)
(*4)
(*5)
(*6)
mode when the CE/MODE pin voltage is equal to or lower than VIN minus 1.0V and equal to or greater than VCEH
.
(*7)
(*8)
(*9)
Time until it short-circuits VOUT with GND via 1Ωof resistor from an operational state and is set to Lx=0V from current limit pulse generating.
When VIN is less than 2.4V, limit current may not be reached because voltage falls caused by ON resistance.
When the difference between the input and the output is small, some cycles may be skipped completely before current maximizes.
If current is further pulled from this state, output voltage will decrease because of P-ch driver ON resistance.
Current limit denotes the level of detection at peak of coil current.
“H”=VIN~VIN-1.2V, “L”=+0.1V~-0.1V
XC9235 series exclude IPFM and DTYLIMIT_PFM because those are only for the PFM control’s functions.
XC9235/XC9236 series exclude VPWMH and VPWML because those are only for the XC9237 series’ functions.
(*10)
(*11)
(*12)
(*13)
6/33
XC9235/XC9236/XC9237
Series
■ELECTRICAL CHARACTERISTICS (Continued)
XC9235A18Dxx/XC9236A18Dxx/XC9237A18Dxx, VOUT=1.8V, fOSC=3.0MHz, Ta=25℃
PARAMETER
SYMBOL
CONDITIONS
MIN.
TYP.
MAX. UNIT CIRCUIT
When connected to external components,
VIN=VCE=5.0V, IOUT=30mA
Output Voltage
VOUT
VIN
1.764
2.0
1.800 1.836
V
V
①
①
①
Operating Voltage Range
Maximum Output Current
-
-
6.0
-
VIN=VOUT(E)+2.0V, VCE=1.0V,
IOUTMAX
600
mA
When connected to external components (*9)
VCE=VIN, VOUT=0V,
UVLO Voltage
VUVLO
1.00
1.40
1.78
V
③
Voltage which Lx pin holding “L” level (*1,*11)
Supply Current
IDD
VIN=VCE=5.0V, VOUT=VOUT(E)×1.1V
-
-
21
0
35
μA
μA
②
②
Stand-by Current
ISTB
VIN=5.0V, VCE=0V, VOUT=VOUT(E)×1.1V
1.0
When connected to external components,
VIN=VOUT(E)+2.0V, VCE=1.0V, IOUT=100mA
Oscillation Frequency
PFM Switching Current
fOSC
2550
170
3000
220
3450
270
kHz
mA
①
①
When connected to external components,
VIN=VOUT(E)+2.0V, VCE=VIN, IOUT=1mA (*12)
IPFM
PFM Duty Limit
Maximum Duty Cycle
Minimum Duty Cycle
DTYLIMIT_PFM VCE=VIN=(C-1), IOUT=1mA (*12)
-
100
-
200
300
%
%
%
①
③
③
DMAX
DMIN
VIN=VCE=5.0V, VOUT=VOUT(E)×0.9V
-
-
-
VIN=VCE=5.0V, VOUT=VOUT(E)×0.1V
0
When connected to external components,
VCE=VIN＝VOUT(E)+1.2V, IOUT=100mA
VIN=VCE=5.0V, VOUT =0V, ILx=100mA (*3)
VIN=VCE=3.6V, VOUT =0V, ILx=100mA (*3)
VIN=VCE=5.0V (*4)
Efficiency (*2)
EFFI
-
86
-
%
①
Lx SW "H" ON Resistance 1
Lx SW "H" ON Resistance 2
Lx SW "L" ON Resistance 1
Lx SW "L" ON Resistance 2
Lx SW "H" Leak Current (*5)
Lx SW "L" Leak Current (*5)
Current Limit (*10)
RLxH
RLxH
-
0.35
0.42
0.45
0.52
0.01
0.01
1050
0.55
0.67
0.65
0.77
1.0
Ω
Ω
④
④
-
-
RLxL
-
Ω
RLxL
VIN=VCE=3.6V (*4)
-
Ω
-
ILEAKH
ILEAKL
ILIM
VIN=VOUT=5.0V, VCE=0V, Lx=0V
VIN=VOUT=5.0V, VCE=0V, Lx=5.0V
VIN=VCE=5.0V, VOUT=VOUT(E)×0.9V (*8)
-
-
μA
μA
mA
⑤
⑤
⑥
1.0
900
1350
Output Voltage
Temperature Characteristics (VOUT・△Topr)
△VOUT/
IOUT=30mA, -40℃≦Topr≦85℃
-
±100
-
ppm/
℃
①
③
③
VOUT=0V, Applied voltage to VCE
,
CE "H" Voltage
CE "L" Voltage
VCEH
VCEL
0.65
VSS
-
-
6.0
0.25
V
Voltage changes Lx to “H” level (*11)
VOUT=0V, Applied voltage to VCE
,
V
Voltage changes Lx to “L” level (*11)
When connected to external components,
IOUT=1mA (*6), Voltage which oscillation frequency
becomes 2550kHz≦fOSC≦3450kHz (*13)
PWM "H" Level Voltage
VPWMH
-
-
VIN - 1.0
V
①
When connected to external components,
IOUT=1mA (*6), Voltage which oscillation frequency
becomes fOSC＜2550kHz (*13)
VIN
0.25
-
PWM "L" Level Voltage
VPWML
-
-
V
①
CE "H" Current
CE "L" Current
ICEH
ICEL
VIN=VCE=5.0V, VOUT=0V
VIN=5.0V, VCE=0V, VOUT=0V
- 0.1
- 0.1
-
-
0.1
0.1
μA
μA
⑤
⑤
When connected to external components,
VCE=0V → VIN, IOUT=1mA
Soft Start Time
Latch Time
tSS
0.5
1.0
0.9
-
2.5
20
ms
ms
①
⑦
VIN=VCE=5.0V, VOUT=0.8×VOUT(E)
,
tLAT
Short Lx at 1Ω resistance (*7)
Sweeping VOUT, VIN=VCE=5.0V, Short Lx at
1Ω resistance, VOUT voltage which Lx becomes
“L” level within 1ms
Short Protection Threshold
Voltage
VSHORT
0.675 0.900 1.150
V
⑦
Test conditions: Unless otherwise stated, VIN=5.0V, VOUT(E)=Nominal Voltage
NOTE:
(*1)
Including hysteresis operating voltage range.
EFFI = { ( output voltage×output current ) / ( input voltage×input current) }×100
ON resistance (Ω)= (VIN - Lx pin measurement voltage) / 100mA
R&D value
When temperature is high, a current of approximately 10μA (maximum) may leak.
The CE/MODE pin of the XC9237A series works also as an external switching pin of PWM control and PWM/PFM control. When the IC is in the operation,
control is switched to the automatic PWM/PFM switching mode when the CE/MODE pin voltage is equal to or greater than VIN minus 0.3V, and to the PWM
(*2)
(*3)
(*4)
(*5)
(*6)
mode when the CE/MODE pin voltage is equal to or lower than VIN minus 1.0V and equal to or greater than VCEH
.
(*7)
(*8)
(*9)
Time until it short-circuits VOUT with GND via 1Ωof resistor from an operational state and is set to Lx=0V from current limit pulse generating.
When VIN is less than 2.4V, limit current may not be reached because voltage falls caused by ON resistance.
When the difference between the input and the output is small, some cycles may be skipped completely before current maximizes.
If current is further pulled from this state, output voltage will decrease because of P-ch driver ON resistance.
Current limit denotes the level of detection at peak of coil current.
“H”=VIN~VIN-1.2V, “L”=+0.1V~-0.1V
XC9235 series exclude IPFM and DTYLIMIT_PFM because those are only for the PFM control’s functions.
XC9235/XC9236 series exclude VPWMH and VPWML because those are only for the XC9237 series’ functions.
(*10)
(*11)
(*12)
(*13)
7/33
Series
■ELECTRICAL CHARACTERISTICS (Continued)
XC9235B(C)(E)(G)18Cxx/XC9236B(C)(E)(G)18Cxx/XC9237B(C)(E)(G)18Cxx, VOUT=1.8V, fOSC=1.2MHz, Ta=25℃
PARAMETER
Output Voltage
SYMBOL
VOUT
CONDITIONS
MIN.
TYP.
MAX. UNIT CIRCUIT
When connected to external components,
VIN=VCE=5.0V, IOUT=30mA
1.764
1.800 1.836
V
V
①
①
①
③
Operating Voltage Range (B/C series)
Operating Voltage Range (E/G series)
2.0
1.8
-
-
6.0
6.0
VIN
VIN=VOUT(E)+2.0V, VCE=1.0V,
Maximum Output Current
UVLO Voltage
IOUTMAX
VUVLO
600
-
-
mA
V
When connected to external components (*9)
VCE =VIN, VOUT=VOUT(E)×0.5V (*14)
1.00
1.40
1.78
Voltage which Lx pin holding “L” level (*1, *11)
Supply Current
IDD
VIN=VCE=5.0V, VOUT=VOUT(E)×1.1V
-
-
15
0
33
μA
μA
②
②
Stand-by Current
ISTB
VIN=5.0V, VCE=0V, VOUT=VOUT(E)×1.1V
1.0
When connected to external components,
VIN=VOUT(E)+2.0V, VCE =1.0V, IOUT=100mA
Oscillation Frequency
PFM Switching Current
fOSC
IPFM
1020
120
1200
160
1380
200
kHz
mA
①
①
When connected to external components,
VIN=VOUT(E)+2.0V, VCE =VIN, IOUT=1mA (*12)
PFM Duty Limit
Maximum Duty Cycle
Minimum Duty Cycle
VCE=VIN=(C-1), IOUT=1mA (*12)
200
300
%
%
%
①
③
③
DTYLIMIT_PFM
DMAX
VIN=VCE=5.0V, VOUT=VOUT(E)×0.9V
VIN=VCE=5.0V, VOUT=VOUT(E)×1.1V
100
-
-
-
-
0
DMIN
When connected to external components,
VCE=VIN=VOUT(E)+1.2V, IOUT=100mA
Efficiency (*2)
EFFI
-
92
-
%
①
Lx SW "H" ON Resistance 1
Lx SW "H" ON Resistance 2
Lx SW "L" ON Resistance 1
Lx SW "L" ON Resistance 2
Lx SW "H" Leak Current (*5)
RLxH
RLxH
RLxL
RLxL
ILEAKH
ILIM
VIN=VCE=5.0V, VOUT (E)×0.9V , ILx=100mA (*3)
VIN=VCE=3.6V, VOUT (E)×0.9V , ILx=100mA (*3)
VIN=VCE=5.0V (*4)
-
0.35
0.42
0.45
0.52
0.01
1050
0.55
0.67
0.65
0.77
1.0
Ω
Ω
④
④
④
-
-
-
Ω
VIN=VCE=3.6V (*4)
-
-
Ω
VIN=VOUT=5.0V, VCE=0V, Lx=0V
VIN=VCE=5.0V, VOUT=VOUT(E)×0.9V (*8)
μA
mA
⑤
⑥
Current Limit (*10)
900
1350
Output Voltage
Temperature Characteristics (VOUT・△Topr)
△VOUT
/
IOUT=30mA, -40℃≦Topr≦85℃
-
±100
-
ppm/
℃
①
③
③
VOUT
Voltage changes Lx to “H” level (*11)
VOUT OUT(E)×0.9V, Applied voltage to VCE
Voltage changes Lx to “L” level (*11)
= VOUT(E)×0.9V, Applied voltage to VCE,
CE "H" Voltage
CE "L" Voltage
VCEH
VCEL
0.65
VSS
-
-
6.0
0.25
V
=
V
,
V
When connected to external components,
PWM "H" Level Voltage
VPWMH
IOUT=1mA (*6), Voltage which oscillation frequency
-
-
VIN - 1.0
V
①
becomes 1020 kHz≦fOSC≦1380kHz (*13)
When connected to external components,
IOUT=1mA (*6), Voltage which oscillation frequency
becomes fOSC＜1020kHz (*13)
VIN
0.25
–
PWM "L" Level Voltage
VPWML
-
-
V
①
CE "H" Current
CE "L" Current
ICEH
ICEL
VIN=VCE=5.0V, VOUT
VIN=5.0V, VCE=0V, VOUT
=
V
OUT(E)×0.9V
OUT(E)×0.9V
- 0.1
- 0.1
-
-
0.1
0.1
μA
μA
⑤
⑤
=
V
When connected to external components,
VCE=0V → VIN, IOUT=1mA
When connected to external components,
VCE=0V → VIN, IOUT=1mA
Soft Start Time (B/G Series)
Soft Start Time (C/E Series)
Latch Time
tSS
tSS
-
0.25
1.0
-
0.40
2.5
ms
ms
ms
①
①
⑦
0.5
1.0
VIN=VCE=5.0V, VOUT=0.8×VOUT(E)
,
tLAT
20.0
Short Lx at 1Ω resistance (*7)
Sweeping VOUT, VIN=VCE=5.0V, Short Lx at
1Ω resistance, VOUT voltage which Lx becomes
“L” level within 1ms
Short Protection Threshold
Voltage (B/C Series)
VSHORT
0.675 0.900 1.150
V
⑦
Short Protection Threshold
Voltage (E/G Series)
VIN=VCE=5.0V, The VOUT at Lx=”Low"(*11) while
decreasing VOUT from VOUT (E)×0.4V
VSHORT
RDCHG
0.338 0.450 0.563
V
⑦
⑧
CL Discharge
VIN=5.0V, LX=5.0V, VCE=0V, VOUT=open
200
300
450
Ω
Test conditions: Unless otherwise stated, VIN=5.0V, VOUT(E)=Nominal Voltage, applied voltage sequence is VOUT→VIN→VCE
NOTE:
(*1)
Including hysteresis operating voltage range.
EFFI = { ( output voltage×output current ) / ( input voltage×input current) }×100
ON resistance (Ω)= (VIN - Lx pin measurement voltage) / 100mA
R&D value
When temperature is high, a current of approximately 10μA (maximum) may leak.
The CE/MODE pin of the XC9237A series works also as an external switching pin of PWM control and PWM/PFM control. When the IC is in the operation,
control is switched to the automatic PWM/PFM switching mode when the CE/MODE pin voltage is equal to or greater than VIN minus 0.3V, and to the PWM
(*2)
(*3)
(*4)
(*5)
(*6)
mode when the CE/MODE pin voltage is equal to or lower than VIN minus 1.0V and equal to or greater than VCEH
.
(*7)
(*8)
(*9)
Time until it short-circuits VOUT with GND via 1Ωof resistor from an operational state and is set to Lx=0V from current limit pulse generating.
When VIN is less than 2.4V, limit current may not be reached because voltage falls caused by ON resistance.
When the difference between the input and the output is small, some cycles may be skipped completely before current maximizes.
If current is further pulled from this state, output voltage will decrease because of P-ch driver ON resistance.
Current limit denotes the level of detection at peak of coil current.
“H”=VIN~VIN-1.2V, “L”=+0.1V~-0.1V
XC9235 series exclude IPFM and DTYLIMIT_PFM because those are only for the PFM control’s functions.
XC9235/XC9236 series exclude VPWMH and VPWML because those are only for the XC9237 series’ functions.
(*10)
(*11)
(*12)
(*13)
(*14)
VIN is applied when VOUT (E) x 0.5V becomes more than VIN
.
8/33
XC9235/XC9236/XC9237
Series
■ELECTRICAL CHARACTERISTICS (Continued)
XC9235B(C)(E)(G)18Dxx/XC9236B(C)(E)(G)18Dxx/XC9237B(C)(E)(G)18Dxx, VOUT=1.8V, fOSC=3.0MHz, Ta=25℃
PARAMETER
Output Voltage
SYMBOL
VOUT
CONDITIONS
MIN.
TYP.
MAX. UNIT CIRCUIT
When connected to external components,
VIN=VCE=5.0V, IOUT=30mA
1.764
1.800 1.836
V
V
①
①
①
③
Operating Voltage Range (B/C series)
Operating Voltage Range (E/G series)
2.0
1.8
-
-
6.0
6.0
VIN
VIN=VOUT(E)+2.0V, VCE=1.0V,
Maximum Output Current
UVLO Voltage
IOUTMAX
VUVLO
600
-
-
mA
V
When connected to external components (*9)
VCE=VIN, VOUT=VOUT(E)×0.5V (*14)
,
1.00
1.40
1.78
Voltage which Lx pin holding “L” level (*1,*11)
VIN=VCE=5.0V, VOUT=VOUT(E)×1.1V
Supply Current
IDD
-
-
21
0
35
μA
μA
②
②
Stand-by Current
ISTB
VIN=5.0V, VCE=0V, VOUT=VOUT(E)×1.1V
1.0
When connected to external components,
VIN=VOUT(E)+2.0V, VCE=1.0V, IOUT=100mA
Oscillation Frequency
PFM Switching Current
fOSC
IPFM
2550
170
3000
220
3450
270
kHz
mA
①
①
When connected to external components,
VIN=VOUT(E)+2.0V, VCE=VIN, IOUT=1mA (*12)
PFM Duty Limit
Maximum Duty Cycle
Minimum Duty Cycle
VCE=VIN=(C-1), IOUT=1mA (*12)
-
100
-
200
300
%
%
%
①
③
③
DTYLIMIT_PFM
DMAX
VIN=VCE=5.0V, VOUT=VOUT(E)×0.9V
VIN=VCE=5.0V, VOUT=VOUT(E)×0.1V
-
-
-
0
DMIN
When connected to external components,
VCE=VIN＝VOUT(E)+1.2V, IOUT=100mA
Efficiency(*2)
EFFI
-
86
-
%
①
Lx SW "H" ON Resistance 1
Lx SW "H" ON Resistance 2
Lx SW "L" ON Resistance 1
Lx SW "L" ON Resistance 2
Lx SW "H" Leak Current (*5)
Current Limit (*10)
RLxH
RLxH
RLxL
RLxL
ILEAKH
ILIM
VIN=VCE=5.0V, VOUT
VIN=VCE=3.6V, VOUT
VIN=VCE=5.0V (*4)
VIN=VCE=3.6V (*4)
=
V
V
OUT(E)×0.9V, ILx=100mA (*3)
OUT(E)×0.9V, ILx=100mA (*3)
-
0.35
0.42
0.45
0.52
0.01
1050
0.55
0.67
0.65
0.77
1.0
Ω
Ω
④
④
-
=
-
-
Ω
-
-
Ω
-
VIN=VOUT=5.0V, VCE=0V, Lx=0V
VIN=VCE=5.0V, VOUT=VOUT(E)×0.9V (*8)
μA
mA
⑤
⑥
900
1350
Output Voltage
Temperature Characteristics (VOUT・△Topr)
△VOUT/
IOUT=30mA, -40℃≦Topr≦85℃
-
±100
-
ppm/
℃
①
③
③
VOUT=V
OUT(E)×0.9V, Applied voltage to VCE
Voltage changes Lx to “H” level (*11)
OUT(E)×0.9V, Applied voltage to VCE
Voltage changes Lx to “L” level (*11)
,
,
CE "H" Voltage
CE "L" Voltage
VCEH
VCEL
0.65
VSS
-
-
6.0
0.25
V
VOUT=V
V
When connected to external components,
IOUT=1mA (*6), Voltage which oscillation frequency
becomes 2550kHz≦fOSC≦3450kHz (*13)
PWM "H" Level Voltage
VPWMH
-
-
VIN - 1.0
V
①
When connected to external components,
IOUT=1mA (*6), Voltage which oscillation frequency
becomes fOSC＜2550kHz (*13)
VIN
0.25
–
PWM "L" Level Voltage
VPWML
-
-
V
①
CE "H" Current
CE "L" Current
ICEH
ICEL
VIN=VCE=5.0V, VOUT
VIN=5.0V, VCE=0V, VOUT
=
V
OUT(E)×0.9V
OUT(E)×0.9V
- 0.1
- 0.1
-
-
0.1
0.1
μA
μA
⑤
⑤
=
V
When connected to external components,
VCE=0V → VIN, IOUT=1mA
When connected to external components,
VCE=0V → VIN, IOUT=1mA
Soft Start Time (B/G Series)
Soft Start Time (C/E Series)
Latch Time
tSS
tSS
-
0.32
0.9
-
0.50
2.5
20
ms
ms
ms
①
①
⑦
0.5
1.0
VIN=VCE=5.0V, VOUT=0.8×VOUT(E)
,
tLAT
Short Lx at 1Ω resistance (*7)
Sweeping VOUT, VIN=VCE=5.0V, Short Lx at
1Ω resistance, VOUT voltage which Lx becomes
“L” level within 1ms
Short Protection Threshold
Voltage (B/C Series)
VSHORT
0.675 0.900 1.150
V
⑦
Short Protection Threshold
Voltage (E/G Series)
VIN=VCE=5.0V, The VOUT at Lx=”Low"(*11) while
decreasing VOUT from VOUT (E)×0.4V
VSHORT
RDCHG
0.338 0.450 0.563
V
⑦
⑧
CL Discharge
VIN=5.0V, LX=5.0V, VCE=0V, VOUT=open
200
300
450
Ω
Test conditions: Unless otherwise stated, VIN=5.0V, VOUT(E)=Nominal Voltage, applied voltage sequence is VOUT→VIN→VCE
NOTE:
(*1)
Including hysteresis operating voltage range.
EFFI = { ( output voltage×output current ) / ( input voltage×input current) }×100
ON resistance (Ω)= (VIN - Lx pin measurement voltage) / 100mA
R&D value
When temperature is high, a current of approximately 10μA (maximum) may leak.
The CE/MODE pin of the XC9237A series works also as an external switching pin of PWM control and PWM/PFM control. When the IC is in the operation,
control is switched to the automatic PWM/PFM switching mode when the CE/MODE pin voltage is equal to or greater than VIN minus 0.3V, and to the PWM
(*2)
(*3)
(*4)
(*5)
(*6)
mode when the CE/MODE pin voltage is equal to or lower than VIN minus 1.0V and equal to or greater than VCEH
.
(*7)
(*8)
(*9)
Time until it short-circuits VOUT with GND via 1Ωof resistor from an operational state and is set to Lx=0V from current limit pulse generating.
When VIN is less than 2.4V, limit current may not be reached because voltage falls caused by ON resistance.
When the difference between the input and the output is small, some cycles may be skipped completely before current maximizes.
If current is further pulled from this state, output voltage will decrease because of P-ch driver ON resistance.
Current limit denotes the level of detection at peak of coil current.
“H”=VIN~VIN-1.2V, “L”=+0.1V~-0.1V
XC9235 series exclude IPFM and DTYLIMIT_PFM because those are only for the PFM control’s functions.
XC9235/XC9236 series exclude VPWMH and VPWML because those are only for the XC9237 series’ functions.
(*10)
(*11)
(*12)
(*13)
(*14)
VIN is applied when VOUT (E) x 0.5V becomes more than VIN
.
9/33
Series
■ELECTRICAL CHARACTERISTICS (Continued)
XC9235D(F)08Cxx/XC9236D(F)08Cxx/XC9237D(F)08Cxx, FB Type, fOSC=1.2MHz, Ta=25℃
PARAMETER
FB Voltage
SYMBOL
VFB
CONDITIONS
MIN.
TYP.
MAX.
UNIT CIRCUIT
VIN = VCE =5.0V, The VFB at Lx=”High"(*11) while
decreasing FB pin voltage from 0.9V.
0.784 0.800 0.816
V
③
Operating Voltage Range
Maximum Output Current
VIN
1.8
-
-
6.0
-
V
①
①
VIN=3.2V, VCE=1.0V
IOUTMAX
600
mA
When connected to external components (*9)
VCE = VIN , VFB = 0.4V,
UVLO Voltage
VUVLO
1.00
1.40
1.78
V
③
Voltage which Lx pin holding “L” level (*1,*11)
VIN =VCE=5.0V, VFB= 0.88V
Supply Current
IDD
-
-
15
0
μA
μA
②
②
Stand-by Current
ISTB
VIN =5.0V, VCE=0V, VFB= 0.88V
1.0
When connected to external components,
VIN = 3.2V, VCE=1.0V, IOUT=100mA
Oscillation Frequency
PFM Switching Current
fOSC
IPFM
1020
120
1200
160
1380
kHz
mA
①
①
When connected to external components,
200
VIN =3.2V, VCE = VIN , IOUT=1mA (*12)
PFM Duty Limit
Maximum Duty Cycle
Minimum Duty Cycle
VCE= VIN =2.0V IOUT=1mA (*12)
VIN = VCE =5.0V, VFB = 0.72V
VIN = VCE =5.0V, VFB = 0.88V
200
300
%
%
%
①
③
③
DTYLIMIT_PFM
DMAX
100
-
-
-
-
0
DMIN
When connected to external components,
VCE = VIN ＝ 2.4V, IOUT = 100mA
VIN = VCE = 5.0V, VFB = 0.72V,ILX = 100mA (*3)
VIN = VCE = 3.6V, VFB = 0.72V,ILX = 100mA (*3)
VIN = VCE = 5.0V (*4)
Efficiency (*2)
EFFI
-
92
-
%
①
Lx SW "H" ON Resistance 1
Lx SW "H" ON Resistance 2
Lx SW "L" ON Resistance 1
Lx SW "L" ON Resistance 2
Lx SW "H" Leak Current (*5)
Current Limit (*10)
RLｘH
RLｘH
RLｘL
RLｘL
ILEAKH
ILIM
-
-
-
-
-
0.35
0.42
0.45
0.52
0.01
1050
0.55
0.67
0.65
0.77
1.0
Ω
Ω
Ω
Ω
μA
④
④
-
-
⑨
VIN = VCE = 3.6V (*4)
VIN = VFB = 5.0V, VCE = 0V, LX= 0V
VIN = VCE= 5.0V, VFB = 0.72V (*8)
900
1350
mA
⑥
Output Voltage
Temperature Characteristics (VOUT・△Topr)
△
VOUT
/
IOUT =30mA
-40℃≦Topr≦85℃
-
±100
-
ppm/ ℃
①
③
③
VFB =0.72V, Applied voltage to VCE
,
CE "H" Voltage
CE "L" Voltage
VCEH
VCEL
0.65
VSS
-
-
6.0
0.25
V
V
Voltage changes Lx to “H” level (*11)
VFB =0.72V, Applied voltage to VCE
Voltage changes Lx to “L” level (*11)
,
When connected to external components,
IOUT=1mA (*6), Voltage which oscillation frequency
becomes 1020kHz≦fOSC≦1380kHz (*13)
When connected to external components,
IOUT=1mA (*6), Voltage which oscillation frequency
becomes fOSC＜1020kHz (*13)
PWM "H" Level Voltage
PWM "L" Level Voltage
VPWMH
-
-
-
VIN - 1.0
V
V
①
①
VIN
0.25
-
VPWML
-
CE "H" Current
CE "L" Current
Soft Start Time (D series)
Soft Start Time (F series)
ICEH
ICEL
VIN = VCE =5.0V, VFB =0.72V
VIN =5.0V, VCE = 0V, VFB =0.72V
When connected to external components,
VCE = 0V → VIN , IOUT=1mA
- 0.1
- 0.1
0.5
-
-
-
0.1
0.1
2.5
μA
μA
⑤
⑤
1.0
0.25
tSS
ms
ms
①
⑦
0.40
VIN=VCE=5.0V, VFB=0.64, Short Lx at 1Ω
Latch Time
tLAT
1.0
-
20.0
resistance (*7)
Short Protection Threshold
Voltage
VIN = VCE =5.0V, The VFB at Lx=”Low" (*11) while
decreasing FB pin voltage from 0.4V.
VSHORT
RDCHG
0.15
0.200
0.25
V
⑦
⑧
CL Discharge
VIN = 5.0V ,LX = 5.0V, VCE = 0V, VFB= open
200
300
450
Ω
Test conditions: VOUT=1.2V when the external components are connected. Unless otherwise stated, VIN=5.0V, VOUT(E)=Nominal Voltage, applied voltage sequence is
OUT→VIN→VCE
V
NOTE:
(*1)
Including hysteresis operating voltage range.
EFFI = { ( output voltage×output current ) / ( input voltage×input current) }×100
ON resistance (Ω)= (VIN - Lx pin measurement voltage) / 100mA
(*2)
(*3)
(*4)
(*5)
(*6)
R&D value
When temperature is high, a current of approximately 10μA (maximum) may leak.
The CE/MODE pin of the XC9237A series works also as an external switching pin of PWM control and PWM/PFM control. When the IC is in the operation,
control is switched to the automatic PWM/PFM switching mode when the CE/MODE pin voltage is equal to or greater than VIN minus 0.3V, and to the PWM
mode when the CE/MODE pin voltage is equal to or lower than VIN minus 1.0V and equal to or greater than VCEH
.
(*7)
(*8)
(*9)
Time until it short-circuits VFB with GND via 1Ωof resistor from an operational state and is set to Lx=0V from current limit pulse generating.
When VIN is less than 2.4V, limit current may not be reached because voltage falls caused by ON resistance.
When the difference between the input and the output is small, some cycles may be skipped completely before current maximizes.
If current is further pulled from this state, output voltage will decrease because of P-ch driver ON resistance.
Current limit denotes the level of detection at peak of coil current.
“H”=VIN~VIN-1.2V, “L”=+0.1V~-0.1V
XC9235 series exclude IPFM and DTYLIMIT_PFM because those are only for the PFM control’s functions.
XC9235/XC9236 series exclude VPWMH and VPWML because those are only for the XC9237 series’ functions.
(*10)
(*11)
(*12)
(*13)
10/33
XC9235/XC9236/XC9237
Series
■ELECTRICAL CHARACTERISTICS (Continued)
XC9235D(F)08Dxx/XC9236D(F)08Dxx/XC9237D(F)08Dxx, FB, fOSC=3.0MHz, Ta=25℃
PARAMETER
FB Voltage
SYMBOL
VFB
CONDITIONS
MIN.
TYP.
MAX.
UNIT CIRCUIT
V
IN = VCE =5.0V, The VFB at Lx=”High"(*11) while
decreasing FB pin voltage from 0.9V.
0.784
0.800 0.816
V
③
Operating Voltage Range
Maximum Output Current
VIN
1.8
-
-
6.0
-
V
①
①
VIN=3.2V, VCE=1.0V
IOUTMAX
600
mA
When connected to external components (*9)
VCE = VIN , VFB = 0.4V ,
UVLO Voltage
VUVLO
1.00
1.40
1.78
V
③
Voltage which Lx pin holding “L” level (*1, *11)
VIN =VCE=5.0V, VFB= 0.88V
Supply Current
IDD
-
-
21
0
35
μA
μA
②
②
Stand-by Current
ISTB
VIN =5.0V, VCE=0V, VFB= 0.88V
1.0
When connected to external components,
VIN = 3.2V, VCE=1.0V, IOUT=100mA
Oscillation Frequency
PFM Switching Current
fOSC
IPFM
2550
170
3000
220
3450
270
kHz
mA
①
①
When connected to external components,
VIN =3.2V, VCE = VIN , IOUT=1mA (*12)
PFM Duty Limit
Maximum Duty Cycle
Minimum Duty Cycle
DTYLIMIT_PFM
DMAX
VCE= VIN =2.2V IOUT=1mA (*12)
200
300
%
%
%
①
③
③
VIN = VCE =5.0V, VFB = 0.72V
100
-
-
-
-
DMIN
VIN = VCE =5.0V, VFB = 0.88V
0
When connected to external components,
VCE = VIN ＝ 2.4V, IOUT = 100mA
VIN = VCE = 5.0V, VFB = 0.72V,ILX = 100mA (*3)
VIN = VCE = 3.6V, VFB = 0.72V,ILX = 100mA (*3)
VIN = VCE = 5.0V (*4)
Efficiency (*2)
EFFI
-
86
-
%
①
Lx SW "H" ON Resistance 1
Lx SW "H" ON Resistance 2
Lx SW "L" ON Resistance 1
Lx SW "L" ON Resistance 2
Lx SW "H" Leak Current (*5)
Current Limit (*10)
RLｘH
RLｘH
RLｘL
RLｘL
ILEAKH
ILIM
-
-
-
-
-
0.35
0.42
0.45
0.52
0.01
1050
0.55
0.67
0.65
0.77
1.0
Ω
Ω
Ω
Ω
μA
mA
④
④
-
-
⑨
VIN = VCE = 3.6V (*4)
VIN = VFB = 5.0V, VCE = 0V, LX= 0V
VIN = VCE= 5.0V, VFB = 0.72V (*8)
900
1350
⑥
IOUT =30mA
-40℃≦Topr≦85℃
VFB =0.72V , VCE,
Voltage changes Lx to “H” level (*11)
Output Voltage
Temperature Characteristics
△VOUT/
-
±100
-
ppm/ ℃
①
③
③
(VOUT・△Topr)
CE "H" Voltage
CE "L" Voltage
VCEH
0.65
VSS
-
-
6.0
0.25
V
V
VFB =0.72V, VCE
,
VCEL
Voltage changes Lx to “L” level (*11)
When connected to external components,
IOUT = 1mA (*6), Voltage which oscillation frequency
becomes 2550kHz≦fOSC≦3450kHz (*13)
When connected to external components,
IOUT = 1mA (*6), Voltage which oscillation frequency
PWM "H" Level Voltage
PWM "L" Level Voltage
VPWMH
-
-
-
VIN - 1.0
V
V
①
①
VIN
0.25
-
VPWML
-
becomes f
OSC＜2550kHz (*13)
CE "H" Current
CE "L" Current
Soft Start Time (D series)
Soft Start Time (F series)
ICEH
ICEL
VIN = VCE =5.0V, VFB =0.72V
- 0.1
- 0.1
0.5
-
-
-
0.1
0.1
2.5
μA
μA
⑤
⑤
VIN =5.0V, VCE = 0V, VFB =0.72V
When connected to external components,
VCE = 0V → VIN , IOUT=1mA
1.0
0.25
tSS
tLAT
ms
ms
V
①
⑦
⑦
0.40
VIN
Short Lx at 1
V
IN = VCE =5.0V, The VFB at Lx=”Low" (*11) while
=
VCE = 5.0V, VFB = 0.64,
Latch Time
1.0
-
20.0
0.25
Ω
resistance (*7)
Short Protection Threshold
Voltage
VSHORT
0.15
0.200
decreasing FB pin voltage from 0.4V.
CL Discharge
RDCHG
VIN = 5.0V ,LX = 5.0V ,VCE = 0V ,VFB= open
200
300
450
Ω
⑧
Test conditions: VOUT=1.2V when the external components are connected. Unless otherwise stated, VIN=5.0V, VOUT(E)=Nominal Voltage, applied voltage sequence is
OUT→VIN→VCE
V
NOTE:
(*1)
Including hysteresis operating voltage range.
EFFI = { ( output voltage×output current ) / ( input voltage×input current) }×100
ON resistance (Ω)= (VIN - Lx pin measurement voltage) / 100mA
(*2)
(*3)
(*4)
(*5)
(*6)
R&D value
When temperature is high, a current of approximately 10μA (maximum) may leak.
The CE/MODE pin of the XC9237A series works also as an external switching pin of PWM control and PWM/PFM control. When the IC is in the operation,
control is switched to the automatic PWM/PFM switching mode when the CE/MODE pin voltage is equal to or greater than VIN minus 0.3V, and to the PWM
mode when the CE/MODE pin voltage is equal to or lower than VIN minus 1.0V and equal to or greater than VCEH
.
(*7)
(*8)
(*9)
Time until it short-circuits VFB with GND via 1Ωof resistor from an operational state and is set to Lx=0V from current limit pulse generating.
When VIN is less than 2.4V, limit current may not be reached because voltage falls caused by ON resistance.
When the difference between the input and the output is small, some cycles may be skipped completely before current maximizes.
If current is further pulled from this state, output voltage will decrease because of P-ch driver ON resistance.
Current limit denotes the level of detection at peak of coil current.
“H”=VIN~VIN-1.2V, “L”=+0.1V~-0.1V
XC9235 series exclude IPFM and DTYLIMIT_PFM because those are only for the PFM control’s functions.
XC9235/XC9236 series exclude VPWMH and VPWML because those are only for the XC9237 series’ functions.
(*10)
(*11)
(*12)
(*13)
11/33
Series
■ELECTRICAL CHARACTERISTICS (Continued)
●PFM Switching Current (IPFM) by Oscillation Frequency and Setting Voltage
(mA)
MAX.
1.2MHz
3.0MHz
TYP.
260
SETTING VOLTAGE
MIN.
140
130
120
TYP.
180
170
160
MAX.
240
MIN.
190
180
170
VOUT(E) ≦1.2V
350
300
270
1.2V＜VOUT(E) ≦1.75V
1.8V≦VOUT(E)
220
240
200
220
●Input Voltage (VIN) for Measuring PFM Duty Limit (DTYLIMIT_PFM
)
fOSC
C-1
1.2MHz
3.0MHz
VOUT(E)+1.0V
VOUT(E)+0.5V
Minimum operating voltage is 2.0V.
ex.) Although when VOUT(E) is 1.2V and fOSC is 1.2MHz, (C-1) should be 1.7V, (C-1) becomes 2.0V for the minimum operating voltage 2.0V.
●Soft-Start Time, Setting Voltage (XC9235B(G)/XC9236B(G)/XC9237B(G) Series only)
(μs)
SERIES
fOSC
SETTING VOLTAGE
MIN.
TYP.
MAX.
1.2MHz
1.2MHz
1.2MHz
1.2MHz
0.8≦V OUT(E)<1.5
1.5≦V OUT(E)<1.8
1.8≦V OUT(E)<2.5
2.5≦V OUT(E)<4.0
-
-
-
-
250
320
250
320
400
500
400
500
XC9235B(G)/XC9237B(G)
1.2MHz
1.2MHz
0.8≦V OUT(E)<2.5
2.5≦V OUT(E)<4.0
0.8≦V OUT(E)<1.8
1.8≦V OUT(E)<4.0
-
-
-
-
250
320
250
320
400
500
400
500
XC9236B(G)
3.0MHz
3.0MHz
XC9235B(G)/
XC9236B(G)/XC9237B(G)
12/33
XC9235/XC9236/XC9237
Series
■TYPICAL APPLICATION CIRCUIT
●XC9235/XC9236/XC9237A, B, C, E, G Series (Output Voltage Fixed)
VOUT
600mA
L
VIN
Lx
VIN
VSS
VSS
C
IN
(ceramic)
C
L
CE/
MODE
VOUT
(ceramic)
CE/MODE
●fOSC=3.0MHz
●fOSC=1.2MHz
L: 4.7μH (NR4018 TAIYO YUDEN)
CIN : 4.7μF (Ceramic)
CL : 10μF (Ceramic)
L :
CIN : 4.7μF
CL : 10μF
1.5μH (NR3015 TAIYO YUDEN)
(Ceramic)
(Ceramic)
●XC9235/XC9236/XC9237D, F Series (Output Voltage External Setting)
V
OUT
L
600mA
V
IN
V
IN
Lx
VSS
VSS
C
IN
RFB1
RFB2
C
(ceramic)
L
CFB
(ceramic)
CE/
MODE
FB
CE/MODE
<Setting for Output Voltage>
Output voltage can be set externally by adding two resistors to the FB pin. The output voltage is calculated by the RFB1
and RFB2 value. The total of RFB1 and RFB2 is usually selected less than 1MΩ.
Output voltages can be set in the range of 0.9V to 0.6V by use of 0.8V±2.0% reference voltage. However, when input
voltage (VIN) is lower than the setting output voltage, output voltage (VOUT) can not be higher than the input voltage (VIN).
VOUT=0.8 × (RFB1+RFB2)/RFB2
The value of the phase compensation speed-up capacitor CFB is calculated by the formula of fZFB = 1/(2×π×CFB×RFB1) with
fZFB <10kHz. For optimization, fZFB can be adjusted in the range of 1kHz to 20kHz depending on the inductance L and the
load capacitance CL which are used.
【Formula】
When RFB1=470kΩ and RFB2=150k, VOUT1=0.8 × (470k+150k) / 150k=3.3V
【Example】
VOUT
(V)
RFB1
(kΩ)
100
RFB2
(kΩ)
820
CFB
(pF)
150
100
220
150
VOUT
(V)
RFB1
(kΩ)
510
RFB2
(kΩ)
240
120
150
30
CFB
(pF)
100
150
100
470
0.9
1.2
1.5
1.8
2.5
3.0
3.3
4.0
150
300
330
130
150
470
300
240
120
13/33
Series
■OPERATIONAL DESCRIPTION
The XC9235/XC9236/XC9237 series consists of a reference voltage source, ramp wave circuit, error amplifier, PWM
comparator, phase compensation circuit, output voltage adjustment resistors, P-channel MOS driver transistor, N-channel
MOS switching transistor for the synchronous switch, current limiter circuit, UVLO circuit and others. (See the block diagram
above.) The series ICs compare, using the error amplifier, the voltage of the internal voltage reference source with the
feedback voltage from the VOUT pin through split resistors, R1 and R2. Phase compensation is performed on the resulting
error amplifier output, to input a signal to the PWM comparator to determine the turn-on time during PWM operation. The
PWM comparator compares, in terms of voltage level, the signal from the error amplifier with the ramp wave from the ramp
wave circuit, and delivers the resulting output to the buffer driver circuit to cause the Lx pin to output a switching duty cycle.
This process is continuously performed to ensure stable output voltage. The current feedback circuit monitors the P-channel
MOS driver transistor current for each switching operation, and modulates the error amplifier output signal to provide multiple
feedback signals. This enables a stable feedback loop even when a low ESR capacitor such as a ceramic capacitor is used
ensuring stable output voltage.
<Reference Voltage Source>
The reference voltage source provides the reference voltage to ensure stable output voltage of the DC/DC converter.
<Ramp Wave Circuit>
The ramp wave circuit determines switching frequency. The frequency is fixed internally and can be selected from 1.2MHz or
3.0MHz. Clock pulses generated in this circuit are used to produce ramp waveforms needed for PWM operation, and to
synchronize all the internal circuits.
<Error Amplifier>
The error amplifier is designed to monitor output voltage. The amplifier compares the reference voltage with the feedback
voltage divided by the internal split resistors, R1 and R2. When a voltage lower than the reference voltage is fed back, the
output voltage of the error amplifier increases. The gain and frequency characteristics of the error amplifier output are fixed
internally to deliver an optimized signal to the mixer.
<Current Limit>
The current limiter circuit of the XC9235/XC9236/XC9237 series monitors the current flowing through the P-channel MOS
driver transistor connected to the Lx pin, and features a combination of the current limit mode and the operation suspension
mode.
① When the driver current is greater than a specific level, the current limit function operates to turn off the pulses from the Lx
pin at any given timing.
② When the driver transistor is turned off, the limiter circuit is then released from the current limit detection state.
③ At the next pulse, the driver transistor is turned on. However, the transistor is immediately turned off in the case of an over
current state.
④ When the over current state is eliminated, the IC resumes its normal operation.
The IC waits for the over current state to end by repeating the steps ① through ③. If an over current state continues for a
few ms and the above three steps are repeatedly performed, the IC performs the function of latching the OFF state of the
driver transistor, and goes into operation suspension mode. Once the IC is in suspension mode, operations can be
resumed by either turning the IC off via the CE/MODE pin, or by restoring power to the VIN pin. The suspension mode does
not mean a complete shutdown, but a state in which pulse output is suspended; therefore, the internal circuitry remains in
operation. The current limit of the XC9235/XC9236/XC9237 series can be set at 1050mA at typical. Besides, care must be
taken when laying out the PC Board, in order to prevent misoperation of the current limit mode. Depending on the state of
the PC Board, latch time may become longer and latch operation may not work. In order to avoid the effect of noise, the
board should be laid out so that input capacitors are placed as close to the IC as possible.
Limit<#ms
Limit>#ms
ILIM
ILx
0mA
V
OUT
VSS
Lx
VCE
Restart
V
IN
14/33
XC9235/XC9236/XC9237
Series
■OPERATIONAL DESCRIPTION (Continued)
<Short-Circuit Protection>
The short-circuit protection circuit monitors the internal R1 and R2 divider voltage from the VOUT pin (refer to FB point
in the block diagram shown in the previous page). In case where output is accidentally shorted to the Ground and when
the FB point voltage decreases less than half of the reference voltage (Vref) and a current more than the ILIM flows to
the Pch MOS driver transistor, the short-circuit protection quickly operates to turn off and to latch the driver transistor.
For the D/E/F/G series, it does not matter how much the current limit, once the FB voltage become less than the quarter
of reference voltage (VREF), the short-circuit protection operates to latch the Pch MOS driver transistor. In latch mode,
the operation can be resumed by either turning the IC off and on via the CE/MODE pin, or by restoring power supply to
the VIN pin.
When sharp load transient happens, a voltage drop at the VOUT is propagated to the FB point through CFB, as a result,
short circuit protection may operate in the voltage higher than 1/2 VOUT voltage.
<UVLO Circuit>
When the VIN pin voltage becomes 1.4V or lower, the Pch MOS driver transistor output driver transistor is forced OFF to
prevent false pulse output caused by unstable operation of the internal circuitry. When the VIN pin voltage becomes 1.8V or
higher, switching operation takes place. By releasing the UVLO function, the IC performs the soft start function to initiate
output startup operation. The soft start function operates even when the VIN pin voltage falls momentarily below the UVLO
operating voltage. The UVLO circuit does not cause a complete shutdown of the IC, but causes pulse output to be
suspended; therefore, the internal circuitry remains in operation.
<PFM Switch Current>
In PFM control operation, until coil current reaches to a specified level (IPFM), the IC keeps the Pch MOS driver transistor
on. In this case, time that the Pch MOS driver transistor is kept on (TON) can be given by the following formula.
tON= L×IPFM / (VIN－VOUT)
→IPFM①
< PFM Duty Limit >
In PFM control operation, the PFM duty limit (DTYLIMIT_PFM) is set to 200% (TYP.). Therefore, under the condition that the
duty increases (e.g. the condition that the step-down ratio is small), it’s possible for Pch MOS driver transistor to be turned
off even when coil current doesn’t reach to IPFM.
→IPFM②
tON
DTYLIMIT_PFM
fOSC
Lx
Lx
IPFM
IPFM
ILx
ILx
0mA
0mA
Fig. IPFM
①
Fig. IPFM
②
15/33
Series
■OPERATIONAL DESCRIPTION (Continued)
＜CL High Speed Discharge＞
XC9235B(C)(D)(E)(F)(G)/ XC9236B(C)(D)(E)(F)(G)/ XC9237B(C)(D)(E)(F)(G) series can quickly discharge the electric
charge at the output capacitor (CL) when a low signal to the CE pin which enables a whole IC circuit put into OFF state, is
inputted via the Nch MOS switch transistor located between the LX pin and the VSS pin. When the IC is disabled, electric
charge at the output capacitor (CL) is quickly discharged so that it may avoid application malfunction. Discharge time of
the output capacitor (CL) is set by the CL auto-discharge resistance (R) and the output capacitor (CL). By setting time
constant of a CL auto-discharge resistance value [R] and an output capacitor value (CL) as τ(τ=C x R), discharge time
of the output voltage after discharge via the N channel transistor is calculated by the following formulas.
τ
V = VOUT(E) x e –t/ or t=τLn (VOUT(E) / V)
V : Output voltage after discharge
VOUT(E) : Output voltage
t: Discharge time
τ: C x R
C= Capacitance of Output capacitor (CL)
R= CL auto-discharge resistance
Output Voltage Dischage Characteristics
（
Rdischg = 300Ω TYP
）
100
90
80
70
60
50
40
30
20
10
0
CL=10uF
CL=20uF
CL=50uF
0
10
20
30
40
50
60
70
80
90 100
Discharge Time t (ms)
16/33
XC9235/XC9236/XC9237
Series
■OPERATIONAL DESCRIPTION (Continued)
<CE/MODE Pin Function>
The operation of the XC9235/XC9236/XC9237 series will enter into the shut down mode when a low level signal is input to the
CE/MODE pin. During the shutdown mode, the current consumption of the IC becomes 0μA (TYP.), with a state of high
impedance at the Lx pin and VOUT pin. The IC starts its operation by inputting a high level signal to the CE/MODE pin. The input
to the CE/MODE pin is a CMOS input and the sink current is 0μA (TYP.).
●XC9235/XC9236 series - Examples of how to use CE/MODE pin
(B)
(A)
V
IN
V
IN
V
DD
V
DD
R1
SW_CE
CE/MODE
CE/MODE
R2
SW_CE
< IC inside >
< IC inside >
(A)
(B)
SW_CE
ON
STATUS
Stand-by
Operation
SW_CE
ON
STATUS
Operation
Stand-by
OFF
OFF
●XC9237 series - Examples of how to use CE/MODE pin
(B)
(A)
V
IN
VIN
V
DD
VDD
RM1
RM2
SW_PWM/PFM
RM1
SW_CE
CE/MODE
CE/MODE
SW_PWM/PFM
SW_CE
RM2
< IC inside >
< IC inside >
(A)
(B)
SW_CE
SW_PWM/PFM
STATUS
Stand-by
SW_CE
ON
SW_PWM/PFM
STATUS
ON
OFF
OFF
*
*
PWM/PFM Automatic Switching Control
PWM Control
ON
OFF
PWM Control
OFF
OFF
ON
OFF
PWM/PFM Automatic Switching Control
Stand-by
Intermediate voltage can be generated by RM1 and RM2. Please set the value of each R1, R2, RM1, RM2 from
few hundreds kΩ to few hundreds MΩ. For switches, CPU open-drain I/O port and transistor can be used.
17/33
Series
■OPERATIONAL DESCRIPTION (Continued)
＜Soft Start＞
Soft start time is available in two options via product selection.
The A,C,D,and E types of XC9235/XC9236/XC9237 series provide 1.0ms (TYP).
The B,F, and G types of XC9235/ XC9236/XC9237 series provide 0.25ms (TYP). However, for the D/F the soft-start time can
be set by the external components. Soft start time is defined as the time interval to reach 90% of the output voltage from the
time when the CE pin is turned on.
tSS
VCEH
0V
90% of setting voltage
VOUT
0V
18/33
XC9235/XC9236/XC9237
Series
■NOTE ON USE
1. For temporary, transitional voltage drop or voltage rising phenomenon, the IC is liable to malfunction should the ratings be
exceeded.
2. The XC9235/XC9236/XC9237 series is designed for use with ceramic output capacitors. If, however, the potential
difference is too large between the input voltage and the output voltage, a ceramic capacitor may fail to absorb the
resulting high switching energy and oscillation could occur on the output. If the input-output potential difference is large,
connect an electrolytic capacitor in parallel to compensate for insufficient capacitance.
3. Spike noise and ripple voltage arise in a switching regulator as with a DC/DC converter. These are greatly influenced by
external component selection, such as the coil inductance, capacitance values, and board layout of external components.
Once the design has been completed, verification with actual components should be done.
4. Depending on the input-output voltage differential, or load current, some pulses may be skipped, and the ripple voltage
may increase.
5. When the difference between VIN and VOUT is large in PWM control, very narrow pulses will be outputted, and there is the
possibility that some cycles may be skipped completely.
6. When the difference between VIN and VOUT is small, and the load current is heavy, very wide pulses will be outputted and
there is the possibility that some cycles may be skipped completely.
7. With the IC, the peak current of the coil is controlled by the current limit circuit. Since the peak current increases when
dropout voltage or load current is high, current limit starts operation, and this can lead to instability. When peak current
becomes high, please adjust the coil inductance value and fully check the circuit operation. In addition, please calculate
the peak current according to the following formula:
Ipk = (VIN - VOUT) x OnDuty / (2 x L x fOSC) + IOUT
L: Coil Inductance Value
fOSC: Oscillation Frequency
8. When the peak current which exceeds limit current flows within the specified time, the built-in Pch MOS driver transistor
turns off. During the time until it detects limit current and before the built-in transistor can be turned off, the current for limit
current flows; therefore, care must be taken when selecting the rating for the external components such as a coil.
9. When VIN is less than 2.4V, limit current may not be reached because voltage falls caused by ON resistance.
10. Care must be taken when laying out the PC Board, in order to prevent misoperation of the current limit mode.
Depending on the state of the PC Board, latch time may become longer and latch operation may not work. In order to
avoid the effect of noise, the board should be laid out so that input capacitors are placed as close to the IC as possible.
11. Use of the IC at voltages below the recommended voltage range may lead to instability.
12. This IC should be used within the stated absolute maximum ratings in order to prevent damage to the device.
13. When the IC is used in high temperature, output voltage may increase up to input voltage level at no load because of the
leak current of the driver transistor.
14. The current limit is set to 1350mA (MAX.) at typical. However, the current of 1350mA or more may flow. In case that the
current limit functions while the VOUT pin is shorted to the GND pin, when Pch MOS driver transistor is ON, the potential
difference for input voltage will occur at both ends of a coil. For this, the time rate of coil current becomes large. By contrast,
when Nch MOS driver transistor is ON, there is almost no potential difference at both ends of the coil since the VOUT pin
is shorted to the GND pin. Consequently, the time rate of coil current becomes quite small. According to the repetition of
this operation, and the delay time of the circuit, coil current will be converged on a certain current value, exceeding the
amount of current, which is supposed to be limited originally. Even in this case, however, after the over current state
continues for several ms, the circuit will be latched. A coil should be used within the stated absolute maximum rating in
order to prevent damage to the device.
①Current flows into Pch MOS driver transistor to reach the current limit (ILIM).
②The current of ILIM or more flows since the delay time of the circuit occurs during from the detection of the current limit to
OFF of Pch MOS driver transistor.
③Because of no potential difference at both ends of the coil, the time rate of coil current becomes quite small.
④Lx oscillates very narrow pulses by the current limit for several ms.
⑤The circuit is latched, stopping its operation.
②
④
①
③
⑤
Limit >
# ms
Delay
Lx
ILIM
ILx
19/33
Series
■NOTE ON USE (Continued)
15. In order to stabilize VIN’s voltage level and oscillation frequency, we recommend that a by-pass capacitor (CIN) be
connected as close as possible to the VIN & VSS pins.
16. High step-down ratio and very light load may lead an intermittent oscillation.
17. During PWM / PFM automatic switching mode, operating may become unstable at transition to continuous mode.
Please verify with actual parts.
18. Please note the inductance value of the coil. The IC may enter unstable operation if the combination of ambient
temperature, setting voltage, oscillation frequency, and L value are not adequate.
In the operation range close to the maximum duty cycle, The IC may happen to enter unstable output voltage
operation even if using the L values listed below.
●The Range of L Value
<External Components>
fOSC
VOUT
L Value
3.0MHz
0.8V＜VOUT<4.0V
1.0μH～2.2μH
3.3μH～6.8μH
4.7μH～6.8μH
V
OUT≦2.5V
1.2MHz
2.5V＜VOUT
*When a coil less value of 4.7μH is used at fOSC=1.2MHz
or when a coil less value of 1.5μH is used at fOSC=3.0MHz,
peak coil current more easily reach the current limit ILMI.
In this case, it may happen that the IC can not provide
600mA output current.
19. It may happen to enter unstable operation when the IC goes into continuous operation mode under the condition of large
input-output voltage difference. Care must be taken with the actual design unit.
<External Components>
20. Torex places an importance on improving our products and their reliability.
We request that users incorporate fail-safe designs and post-aging protection treatment when using Torex products in their
systems.
20/33
XC9235/XC9236/XC9237
Series
■NOTE ON USE (Continued)
21. Instructions of pattern layouts
(1) In order to stabilize VIN voltage level, we recommend that a by-pass capacitor (CIN) be connected as close as possible to
the VIN & VSS pins.
(2) Please mount each external component as close to the IC as possible.
(3) Wire external components as close to the IC as possible and use thick, short connecting traces to reduce the circuit
impedance.
(4) Make sure that the PCB GND traces are as thick as possible, as variations in ground potential caused by high ground
currents at the time of switching may result in instability of the IC.
(5) This series’ internal driver transistors bring on heat because of the output current and ON resistance of driver
transistors.
XC9235/XC9236/XC9237 A,B,C,E,G（Output Voltage Fixed
(PKG:USP-6C/USP-6EL)
）
XC9235/XC9236/XC9237 A,B,C（Output Voltage Fixed
(PKG:SOT-25)
）
L
Ceramic_Cap
Inductor
Ceramic_Cap
Inductor
L
VOUT
CL
VIN
CIN
CIN
IC
VOUT
IC
VIN
VSS
CE
VSS
VSS
VSS
CE
For the VIN, VOUT, VSS, CE, please put the wire.
For the VIN, VOUT, VSS, CE, please put the wire.
XC9235/XC9236/XC9237 A,B（Output Voltage Fixed
(PKG:WLP-5-03)
）
XC9235/XC9236/XC9237 D,F（Output Voltage External Setting
(PKG:USP-6C)
）
CL
VOUT
Ceramic_Cap
VSS
CE
IC
VSS
VIN
VOUT
CL
Chip Resistance
L
CFB
Lx
VIN
Inductor
CIN
IC
For the VIN, VOUT, VSS, CE, please put the wire.
RFB1
RFB2
CE
VSS
Ceramic_Cap
Inductor
For the VIN, VOUT, VSS, CE, please put the wire.
22. NOTE ON MOUNTING (WLP-5-03)
(1) Mount pad design should be optimized for user's conditions.
(2) Sn-AG-Cu is used for the package terminals. If eutectic solder is used, mounting reliability is decreased. Please do not
use eutectic solder paste.
(3) When underfill agent is used to increase interfacial bonding strength, please take enough evaluation for selection. Some
underfill materials and applied conditions may decrease bonding reliability.
(4) The IC has exposed surface of silicon material in the top marking face and sides so that it is weak against mechanical
damages. Please take care of handling to avoid cracks and breaks.
(5) The IC has exposed surface of silicon material in the top marking face and sides. Please use the IC with keeping the
circuit open (avoiding short-circuit from the out).
(6) Semi-transparent resin is coated on the circuit face of the package. Please be noted that the usage under strong lights
may affects device performance.
21/33
Series
■TEST CIRCUITS
< Circuit No.1 >
・A/B/C/E/G series
Wave Form Measure Point
・D/F series
Wave Form Measure Point
IOUT
L
L
VIN
Lx
A
VIN
Lx
A
Cfb
CIN
R1
R2
CL
CE/MODE
VSS
VOUT
V
RL
RL
V
CE/MODE
FB
CIN
CL
VSS
※ꢀExternal Components
ꢀꢀL
: 1.5μH(NR4018) 3.0MHz
: 4.7μH (NR3015) 1.2MHz
CIN : 4.7μF
VOUT=VFB×(R1+R2)/R2
※ꢀExternal Components
ꢀꢀL
:
1.5uH(NR3015) 3.0MHz
4.7uH(NR4018) 1.2MHz
CL : 10μF
R1 : 150kΩ
R2 : 300kΩ
Cfb : 120pF
ꢀꢀꢀꢀꢀꢀ
ꢀꢀCIN : 4.7μF(ceramic)
ꢀꢀCL :10μF(ceramic)
< Circuit No.2 >
< Circuit No.3 >
Wave Form Measure Point
VIN
Lx
VIN
Lx
A
VOUT
(FB)
VOUT
(FB)
Rpulldown
200Ω
CE/MODE
CE/MODE
1uF
1uF
VSS
VSS
< Circuit No.4 >
< Circuit No.5 >
VIN
Lx
VIN
Lx
A
ICEH
VOUT
(FB)
VOUT
(FB)
100mA
CE/MODE
CE/MODE
V
A
1uF
1uF
VSS
VSS
ICEL
ON resistance = (VIN-VLx)/100mA
< Circuit No.7 >
< Circuit No.6 >
Wave Form Measure Point
Wave Form Measure Point
VIN
Lx
VIN
Lx
Ilat
VOUT
(FB)
VOUT
(FB)
ILIM
CE/MODE
CE/MODE
VSS
V
1uF
1uF
VSS
Rpulldown
1Ω
< Circuit No.8 >
< Circuit No.9 >
ILx
VIN
Lx
VIN
Lx
A
A
VOUT
(FB)
VOUT
(FB)
CE/MODE
VSS
CE/MODE
1uF
CIN
VSS
22/33
XC9235/XC9236/XC9237
Series
■TYPICAL PERFORMANCE CHARACTERISTICS
(1) Efficiency vs. Output Current
XC9237A18C
XC9237A18D
L=4.7μH(NR4018), CIN=4.7μF, CL=10μF
L=1.5μH(NR3015), CIN=4.7μF, CL=10μF
PWM/PFM Automatic Sw itching Control
PWM/PFM Automatic Sw itching Control
100
90
80
70
60
50
40
30
20
10
0
100
90
80
70
60
50
40
30
20
10
0
VIN= 4.2V
VIN= 4.2V
3.6V
PWM Control
VIN= 4.2V
3.6V
2.4V
3.6V
2.4V
PWM Control
VIN= 4.2V
3.6V
2.4V
2.4V
0.1
1
10
100
1000
0.1
1
10
100
1000
Output Current:IOUT(mA)
Output Current:IOUT(mA)
(2) Output Voltage vs. Output Current
XC9237A18C
XC9237A18D
L=4.7μH(NR4018), CIN=4.7μF, CL=10μF
L=1.5μH(NR3015), CIN=4.7μF, CL=10μF
2.1
2.0
1.9
1.8
1.7
1.6
1.5
2.1
2.0
1.9
1.8
1.7
1.6
1.5
PWM/PFM Automatic Sw itching Control
PWM/PFM Automatic Sw itching Control
VIN＝4.2V,3.6V,2.4V
VIN＝4.2V,3.6V,2.4V
PWM Control
PWM Control
0.1
1
10
100
1000
0.1
1
10
100
1000
Output Current:IOUT(mA)
Output Current:IOUT(mA)
(3) Ripple Voltage vs. Output Current
XC9237A18C
XC9237A18D
L=4.7μH(NR4018), CIN=4.7μF, CL=10μF
L=1.5μH(NR3015), CIN=4.7μF, CL=10μF
100
80
60
40
20
0
100
80
60
40
20
0
PWM/PFM Automatic
Sw itching Control
VIN＝4.2V
PWM Control
VIN＝4.2V,3.6V,2.4V
PWM/PFM Automatic
Sw itching Control
VIN＝4.2V
PWM Control
VIN＝4.2V,3.6V,2.4V
3.6V
3.6V
ꢀꢀ2.4V
ꢀꢀ2.4V
0.1
1
10
100
1000
0.1
1
10
100
1000
Output Current:IOUT(mA)
Output Current:IOUT(mA)
23/33
Series
■TYPICAL PERFORMANCE CHARACTERISTICS (Continued)
(4) Oscillation Frequency vs. Ambient Temperature
XC9237A18D
XC9237A18C
L=1.5μH (NR3015), CIN=4.7μF, CL=10μF
L=4.7μH (NR4018), CIN=4.7μF, CL=10μF
1.5
1.4
1.3
1.2
1.1
1.0
0.9
0.8
3.5
3.4
3.3
3.2
3.1
3.0
2.9
2.8
2.7
2.6
2.5
VIN=3.6V
VIN=3.6V
-50
-25
0
25
50
75
100
-50
-25
0
25
50
75
100
Ambient Temperature: Ta (℃)
Ambient Temperature: Ta (℃)
(5) Supply Current vs. Ambient Temperature
XC9237A18D
XC9237A18C
40
40
VIN=6.0V
VIN=4.0V
35
30
35
30
25
20
15
10
5
VIN=6.0V
VIN=2.0V
25
20
15
10
5
VIN=4.0V
VIN=2.0V
0
0
-50
-25
0
25
50
75
100
-50
-25
0
25
50
75
100
Ambient Temperature: Ta (℃)
Ambient Temperature: Ta (℃)
(6) Output Voltage vs. Ambient Temperature
(7) UVLO Voltage vs. Ambient Temperature
XC9237A18D
XC9237A18D
2.1
1.8
CE=V IN
2.0
1.5
1.2
0.9
0.6
0.3
0.0
1.9
VIN=3.6V
1.8
1.7
1.6
1.5
-50
-25
0
25
50
75
100
-50
-25
0
25
50
75
100
Ambient Temperature: Ta (℃)
Ambient Temperature: Ta (℃)
24/33
XC9235/XC9236/XC9237
Series
■TYPICAL PERFORMANCE CHARACTERISTICS (Continued)
(8) CE "H" Voltage vs. Ambient Temperature
XC9237A18D
(9) CE "L" Voltage vs. Ambient Temperature
XC9237A18D
1.0
0.9
0.8
1.0
0.9
0.8
0.7
0.6
0.5
0.4
0.3
0.2
0.1
VIN=5.0V
0.7
0.6
0.5
0.4
0.3
0.2
0.1
0.0
VIN=5.0V
VIN=3.6V
VIN=3.6V
VIN=2.4V
VIN=2.4V
0.0
-50
-50
-25
0
25
50
75
100
-25
0
25
50
75
100
Ambient Temperature: Ta (℃)
Ambient Temperature: Ta (℃)
(10) Soft Start Time vs. Ambient Temperature
XC9237A18C
XC9237A18D
L=4.7μH(NR4018), CIN=4.7μF, CL=10μF
L=1.5μH(NR3015), CIN=4.7μF, CL=10μF
5
4
3
2
1
0
5
4
3
2
1
VIN=3.6V
VIN=3.6V
0
-50
-25
0
25
50
75
100
-50
-25
0
25
50
75
100
Ambient Temperature: Ta (℃)
Ambient Temperature: Ta (℃)
(11) "Pch / Nch" Driver on Resistance vs. Input Voltage
XC9237A18D
1.0
0.9
0.8
0.7
0.6
0.5
0.4
0.3
0.2
0.1
0.0
Nch on Resistance
Pch on Resistance
0
1
2
3
4
5
6
Input Voltage : VIN (V)
25/33
Series
■TYPICAL PERFORMANCE CHARACTERISTICS (Continued)
(12) XC9235B/36B/37B Rise Wave Form
XC9237B12C
XC9237B33D
L=4.7μH (NR4018), CIN=4.7μF, CL=10μF
L=1.5μH (NR3015), CIN=4.7μF, CL=10μF
VIN=5.0V
VIN=5.0V
IOUT=1.0mA
IOUT=1.0mA
VOUT：1.0V/div
VOUT：0.5V/div
CE：0.0V⇒1.0V
100μs/div
CE：0.0V⇒1.0V
100μs/div
(13) XC9235B/36B/37B
Soft-Start Time vs. Ambient Temperature
XC9237B12C
XC9237B33D
L=4.7μH(NR4018), CIN=4.7μF, CL=10μF
L=1.5μH(NR3015), CIN=4.7μF, CL=10μF
500
400
300
200
100
0
500
400
300
200
100
0
VIN=5.0V
IOUT=1.0mA
VIN=5.0V
IOUT=1.0mA
-50
-25
0
25
50
75
100
-50
-25
0
25
50
75
100
Ambient Temperature: Ta(℃)
Ambient Temperature: Ta(℃)
(14) XC9235B/36B/37B
CL Discharge Resistance vs. Ambient Temperature
XC9237B33D
600
500
400
300
200
100
VIN=6.0V
VIN=4.0V
VIN=2.0V
-50
-25
0
25
50
75
100
Ambient Temperature: Ta (℃)
26/33
XC9235/XC9236/XC9237
Series
■TYPICAL PERFORMANCE CHARACTERISTICS (Continued)
(15) Load Transient Response
XC9237A18C
L=4.7μH (NR4018), CIN=4.7μF (ceramic), CL=10μF (ceramic), Topr=25℃
VIN=3.6V, VCE=VIN (PWM/PFM Automatic Switching Control)
IOUT=1mA → 100mA
IOUT=1mA → 300mA
1ch: IOUT
1ch: IOUT
2ch
OUT: 50mV/div
2ch
V
VOUT: 50mV/div
50μs/div
50μs/div
IOUT=100mA → 1mA
IOUT=300mA → 1mA
1ch: IOUT
1ch: IOUT
2ch
2ch
VOUT: 50mV/div
VOUT: 50mV/div
200μs/div
200μs/div
27/33
Series
■TYPICAL PERFORMANCE CHARACTERISTICS (Continued)
(15) Load Transient Response (Continued)
XC9237A18C
L=4.7μH (NR4018), CIN=4.7μF (ceramic), CL=10μF (ceramic), Topr=25℃
VIN=3.6V, VCE=1.8V (PWM Control)
IOUT=1mA → 100mA
IOUT=1mA → 300mA
1ch: IOUT
1ch: IOUT
2ch
OUT: 50mV/div
2ch
V
VOUT: 50mV/div
50μs/div
50μs/div
IOUT=100mA → 1mA
IOUT=300mA → 1mA
1ch: IOUT
1ch: IOUT
2ch
2ch
VOUT: 50mV/div
VOUT: 50mV/div
200μs/div
200μs/div
28/33
XC9235/XC9236/XC9237
Series
■TYPICAL PERFORMANCE CHARACTERISTICS (Continued)
(15) Load Transient Response (Continued)
XC9237A18D
L=1.5μH (NR3015), CIN=4.7μF (ceramic), CL=10μF (ceramic), Topr=25℃
VIN=3.6V, VCE=VIN (PWM/PFM Automatic Switching Control)
IOUT=1mA → 100mA
IOUT=1mA → 300mA
1ch: IOUT
1ch: IOUT
2ch
OUT: 50mV/div
2ch
V
VOUT: 50mV/div
50μs/div
50μs/div
IOUT=100mA → 1mA
IOUT=300mA → 1mA
1ch: IOUT
1ch: IOUT
2ch
2ch
VOUT: 50mV/div
VOUT: 50mV/div
200μs/div
200μs/div
29/33
Series
■TYPICAL PERFORMANCE CHARACTERISTICS (Continued)
(15) Load Transient Response (Continued)
XC9237A18D
L=1.5μH (NR3015), CIN=4.7μF (ceramic), CL=10μF (ceramic), Topr=25℃
VIN=3.6V, VCE=1.8V (PWM Control)
IOUT=1mA → 100mA
IOUT=1mA → 300mA
1ch: IOUT
1ch: IOUT
2ch
OUT: 50mV/div
2ch
V
VOUT: 50mV/div
50μs/div
50μs/div
IOUT=100mA → 1mA
IOUT=300mA → 1mA
1ch: IOUT
1ch: IOUT
2ch
2ch
VOUT: 50mV/div
VOUT: 50mV/div
200μs/div
200μs/div
30/33
XC9235/XC9236/XC9237
Series
■PACKAGING INFORMATION
For the latest package information go to, www.torexsemi.com/technical-support/packages
PACKAGE
SOT-25
OUTLINE / LAND PATTERN
SOT-25 PKG
THERMAL CHARACTERISTICS
Standard Board
SOT-25 Power Dissipation
JESD51-7 Board
Standard Board
JESD51-7 Board
Standard Board
Standard Board
USP-6C
USP-6C PKG
USP-6C Power Dissipation
USP-6EL
WLP-5-03
USP-6EL PKG
WLP-5-03 PKG
USP-6EL Power Dissipation
WLP-5-03 Power Dissipation
31/33
Series
■MARKING RULE
●SOT-25
① represents product series
PRODUCT
SERIES
XC9235
XC9236
XC9237
5
4
A
B
C
D
E
F
4
C
K
K
4
5
D
L
6
E
M
M
6
②
③
④ ⑤
①
L
5
2
7
B
E
1
2
3
G
C
D
SOT-25
② represents integer number of output voltage and oscillation frequency
●A/B/C/F Series
(TOP VIEW)
MARK
OUTPUT
VOLTAGE (V)
fOSC=1.2MHz
fOSC=3.0MHz
●USP-6C/USP-6EL
0.X
1.X
2.X
3.X
4.X
A
B
C
D
E
F
H
K
L
M
●E/G/D Series
OUTPUT
MARK
VOLTAGE (V)
fOSC=1.2MlHz
fOSC=3.0MlHz
USP-6C/USP-6EL
(TOP VIEW)
0.X
1.X
2.X
3.X
4.X
N
P
R
S
T
U
V
X
Y
Z
●WLP-5-03
2
3
1
③ represents decimal point of output voltage
VOUT (V)
X.00
X.10
X.20
X.30
X.40
X.50
X.60
X.70
X.80
X.90
MARK
VOUT (V)
X.05
X.15
X.25
X.35
X.45
X.55
X.65
X.75
X.85
X.95
MARK
0
1
2
3
4
5
6
7
8
9
A
B
C
D
E
F
4
5
WLP-5-03
(TOP VIEW)
H
K
L
M
④⑤ represents production lot number
Order of 01～09, 0A～0Z, 11～9Z, A1～A9, AA～AZ, B1～ZZ.
(G, I, J, O, Q, W excluded)
*No character inversion used.
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XC9235/XC9236/XC9237
Series
1. The product and product specifications contained herein are subject to change without notice to
improve performance characteristics. Consult us, or our representatives before use, to confirm that
the information in this datasheet is up to date.
2. The information in this datasheet is intended to illustrate the operation and characteristics of our
products. We neither make warranties or representations with respect to the accuracy or
completeness of the information contained in this datasheet nor grant any license to any intellectual
property rights of ours or any third party concerning with the information in this datasheet.
3. Applicable export control laws and regulations should be complied and the procedures required by
such laws and regulations should also be followed, when the product or any information contained in
this datasheet is exported.
4. The product is neither intended nor warranted for use in equipment of systems which require
extremely high levels of quality and/or reliability and/or a malfunction or failure which may cause loss
of human life, bodily injury, serious property damage including but not limited to devices or equipment
used in 1) nuclear facilities, 2) aerospace industry, 3) medical facilities, 4) automobile industry and
other transportation industry and 5) safety devices and safety equipment to control combustions and
explosions. Do not use the product for the above use unless agreed by us in writing in advance.
5. Although we make continuous efforts to improve the quality and reliability of our products;
nevertheless Semiconductors are likely to fail with a certain probability. So in order to prevent personal
injury and/or property damage resulting from such failure, customers are required to incorporate
adequate safety measures in their designs, such as system fail safes, redundancy and fire prevention
features.
6. Our products are not designed to be Radiation-resistant.
7. Please use the product listed in this datasheet within the specified ranges.
8. We assume no responsibility for damage or loss due to abnormal use.
9. All rights reserved. No part of this datasheet may be copied or reproduced unless agreed by Torex
Semiconductor Ltd in writing in advance.
TOREX SEMICONDUCTOR LTD.
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