XC9268B75CER-G [TOREX]
36V Operation 600mA Synchronous Step-Down DC/DC Converters;型号: | XC9268B75CER-G |
厂家: | Torex Semiconductor |
描述: | 36V Operation 600mA Synchronous Step-Down DC/DC Converters |
文件: | 总30页 (文件大小:1103K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
XC9268Series
36V Operation 600mA Synchronous Step-Down DC/DC Converters
ETR05071-001a
■GENERAL DESCRIPTION
The XC9268 series are 36V operation synchronous step-down DC/DC converter ICs with a built-in P-channel MOS driver transistor
and N-channel MOS switching transistor. The XC9268 series has operating voltage range of 3.0V~36.0V and high-efficiency power
supply up to an output current of 600mA. Low ESR capacitors such as ceramic capacitors can be used for the load capacitor (CL).
A 0.75V reference voltage source is incorporated in the IC, and the output voltage can be set to a value from 1.0V to 25.0V using
external resistors (RFB1, RFB2).
1.2MHz or 2.2MHz can be selected for the switching frequency. In automatic PWM/PFM control, the IC operates by PFM control
when the load is light to achieve high efficiency over the full load range from light to heavy.
The soft-start time is internally set to 2.0ms (TYP.), but can be adjusted to set a longer time using an external resistor and capacitor.
With the built-in UVLO function, the driver transistor is forced OFF when input voltage becomes 2.7V or lower.
The output state can be monitored using the power good function.
Internal protection circuits include over current protection and thermal shutdown circuits to enable safe use.
■FEATURES
Input Voltage Range
Output Voltage Range
FB Voltage
■APPLICATIONS
● Electric Meter
:
:
:
:
:
:
:
:
:
:
:
:
:
:
:
:
:
3.0 ~ 36V (Absolute Max 40V
1.0 ~ 25V
● Gas Detector
0.75V ± 1.5%
● Various Sensor
Oscillation Frequency
Output Current
1.2MHz, 2.2MHz
● Industrial Equipment
● Home appliance
600mA
Quiescent Current
12.5μA (1.2MHz)
13.5μA (2.2MHz)
Control Methods
PWM/PFM Auto
Efficiency 83%@12V→5V、1mA
Adjustable by RC
Soft-start Time
Protection Circuits
Over Current Protection
Thermal Shutdown
Ceramic Capacitor
- 40℃ ~ + 105℃
Output Capacitor
Operating Ambient Temperature
Packages
SOT-89-5 (Without Power Good)
USP-6C (With Power Good)
EU RoHS Compliant, Pb Free
Environmentally Friendly
■TYPICAL APPLICATION CIRCUIT ■TYPICAL PERFORMANCE
CHARACTERISTICS
L
VIN
Lx
CIN
RFB1
2.2μF
CFB
EN/SS
FB
CL
RFB2
10μF×2
RPG
GND
PG
1/30
XC9268 Series
■BLOCK DIAGRAM
XC9268 Series
VIN
Current
SENSE
LocalReg
Chip
Enable
EN/SS
each
Current
feed
back
Current
Limit
PFM
circuit
Current
Limit
High
Side
Buffer
Gate
CLAMP
Under
Voltage
Lx
Low
Side
Lock Out
Buffer
Thermal
Shutdown
each
circuit
Operation
Enable
Vref
Soft Start
+
Err Amp
-
+
PWM
PWM/PFM
ControlLOGIC
FB
Comparator
-
GND
Ramp
Wave
OSC
PG
(USP-6C Package Only)
+
-
PowerGood
Comparator
*Diodes inside the circuit are an ESD protection diodes and a parasitic diodes.
2/30
XC9268
Series
■PRODUCT CLASSIFICATION
● Ordering Information
(*1)
XC9268①②③④⑤⑥-⑦
PWM/PFM Auto
ITEM
DESIGNATOR
SYMBOL
DESCRIPTION
Refer to Selection Guide
①
Type
B
75
②③
FB Voltage
0.75V
C
1.2MHz
④
Oscillation Frequency
Packages
D
2.2MHz
PR-G(*1)
ER-G(*1)
SOT-89-5 (1000pcs/Reel)
USP-6C (3000pcs/Reel)
⑤⑥-⑦
(*1) The “-G” suffix denotes Halogen and Antimony free as well as being fully EU RoHS compliant.
● Selection Guide
B TYPE
FUNCTION
SOT-89-5
USP-6C
Chip Enable
UVLO
Yes
Yes
Yes
Yes
-
Yes
Yes
Yes
Yes
Yes
Thermal Shutdown
Soft Start
Power-Good
Current Limitter
Yes
Yes
(Automatic Recovery)
3/30
XC9268 Series
■PIN CONFIGURATION
VIN
EN/SS
4
5
2
1
2
3
Lx
VIN
EN/SS 5
PG
6
GND
FB
4
1
2
3
Lx
GND
FB
SOT-89-5
(TOP VIEW)
USP-6C
(BOTTOM VIEW)
* The dissipation pad for the USP-6C package should be solder-plated in recommended mount pattern and metal masking so as
to enhance mounting strength and heat release. If the pad needs to be connected to other pins, it should be connected to the
GND (No. 2) pin.
■PIN ASSIGNMENT
PIN NUMBER
PIN NAME
FUNCTION
SOT-89-5
USP-6C
1
2
3
-
1
2
3
4
5
6
Lx
GND
FB
Switching Output
Ground
Output Voltage Sense
Power-good Output
Enable Soft-start
Power Input
PG
4
5
EN/SS
VIN
4/30
XC9268
Series
■FUNCTION CHART
PIN NAME
SIGNAL
STATUS
Stand-by
L
H
EN/SS
Active
OPEN
Undefined State(*1)
(*1) Please do not leave the EN/SS pin open. Each should have a certain voltage
PIN NAME
PG
CONDITION
SIGNAL
VFB > VPGDET
H (High impedance)
L (Low impedance)
L (Low impedance)
VFB ≦ VPGDET
EN/SS = H
EN/SS = L
Thermal Shutdown
UVLO
Undefined State
(VIN < VUVLO1
Stand-by
)
L (Low impedance)
■ABSOLUTE MAXIMUM RATINGS
Ta=25℃
PARAMETER
VIN Pin Voltage
EN/SS Pin Voltage
FB Pin Voltage
PG Pin Voltage(*1)
PG Pin Current(*1)
Lx Pin Voltage
SYMBOL
VIN
RATINGS
-0.3 ~ +40
-0.3 ~ +40
-0.3 ~ +6.2
-0.3 ~ +6.2
8
UNITS
V
V
VEN/SS
VFB
V
VPG
V
IPG
mA
V
VLx
-0.3 ~ VIN + 0.3 or +40 (*2)
Lx Pin Current
ILx
1800
mA
SOT-89-5
1750 (JESD51-7 board) (*4)
1250 (JESD51-7 board) (*4)
+46(*3)
Power
Dissipation
Pd
mW
USP-6C(DAF)
Surge Voltage
VSURGE
Topr
V
Operating Ambient Temperature
Storage Temperature
-40 ~ +105
℃
℃
Tstg
-55 ~ +125
* All voltages are described based on the GND pin.
(*1) For the USP-6C Package only.
(*2) The maximum value should be either VIN+0.3 or 40 in the lowest.
(*3) Applied Time≦400ms
(*4) The power dissipation figure shown is PCB mounted and is for reference only.
The mounting condition is please refer to PACKAGING INFORMATION.
5/30
XC9268 Series
■ELECTRICAL CHARACTERISTICS
XC9268 Series
Ta=25℃
CIRCUIT
PARAMETER
SYMBOL
VFBE
CONDITIONS
VFB=0.739V→0.761V,
FB Voltage when Lx pin voltage changes
MIN.
TYP.
MAX.
UNIT
FB Voltage
V
0.739 0.750 0.761
V
②
from "H" level to "L" level
Setting Output
Voltage Range (*1)
VOUTSET
VIN
-
1
3
-
-
25
36
V
V
-
-
Operating Input
Voltage Range (*1)
-
VEN/SS=12V,VIN:2.8V→2.6V,VFB=0V
UVLO Detect Voltage
UVLO Release Voltage
VUVLOD
V
IN Voltage which Lx pin voltage holding
"H" level
EN/SS=12V,VIN:2.7V→2.9V,VFB=0V
2.6
2.7
2.7
2.8
2.8
2.9
V
V
②
②
V
VUVLOR
VIN Voltage which Lx pin voltage holding
"L" level
XC9268B75C
VFB=0.825V
-
-
-
12.5
13.5
1.65
21.0
22.0
2.50
Quiescent Current
Stand-by Current
Iq
μA
μA
④
④
XC9268B75D
ISTBY
VIN=12V, VEN/SS=VFB=0V
XC9268B75C 1.098 1.200 1.302
XC9268B75D 2.013 2.200 2.387
Connected to external
components,
Oscillation Frequency
fOSC
MHz
①
IOUT=200mA
Minimum On Time
Minimum Duty Cycle
Maximum Duty Cycle
Lx SW "H" On
tONMIN
DMIN
Connected to external components
VFB=0.825V
-
-
85 (*2)
-
0
-
ns
%
%
①
②
②
-
-
DMAX
VFB=0.675V
100
RLxH
RLxL
VFB=0.675V, ILx=200mA
-
-
1.20
1.38
-
Ω
Ω
⑤
⑤
Resistance
Lx SW "L" On
0.60
(*2)
Resistance
High side Current Limit
ILIMH
tSS1
tSS2
VFB=VFBE×0.98
VFB=0.675V
1.00
1.6
21
1.30
2.0
26
-
A
⑤
②
③
(*3)
Internal Soft-Start Time
2.4
33
ms
ms
External Soft-Start
Time
VFB=0.675V
RSS=430KΩ, CSS=0.47μF
Connected to external components,
PFM Switch Current
IPFM
EFFI
-
-
-
400
83
-
-
-
①
①
①
mA
%
VIN=VEN/SS=12V、IOUT=1mA
Connected to external
XC9268B75C
XC9268B75D
components,
VIN=12V, VOUT=5V,
IOUT=1mA
Efficiency (*5)
80
%
ΔVFB
(ΔTopr
VFBE
/
FB Voltage
Temperature
Characteristics
・
-40℃≦Topr≦105℃
-
±100
-
ppm/℃
②
)
Test Condition: Unless otherwise stated, VIN=12V, VEN/SS=12V
Peripheral parts connection conditions:L=6.8μH、RFB1=680kΩ、RFB2=120kΩ、CL=10μF×2、CIN=2.2μF
(*1) Please use within the range of VOUT/VIN≧tONMIN[ns]×fOSC[MHz]×10-3
(*2)Design reference value. This parameter is provided only for reference.
(*3)Current limit denotes the level of detection at peak of coil current.
(*4)For the USP-6C Package only.
6/30
XC9268
Series
■ELECTRICAL CHARACTERISTICS
XC9268 Series
Ta=25℃
CIRCUIT
PARAMETER
SYMBOL
CONDITIONS
MIN.
TYP.
MAX.
UNIT
V
VFB=0.712V→0.638V, RPG:100kΩ pull-up to
5V
PG detect voltage (*4)
VPGDET
0.638 0.675 0.712
⑤
VFB Voltage when PG pin voltage changes
from"H" level to "L" level
PG Output voltage (*4)
FB "H" Current
VPG
IFBH
IFBL
VFB=0.6V, IPG=1mA
-
-
-
-
0.3
0.1
0.1
V
②
④
④
VIN=VEN/SS=36V, VFB=3.0V
VIN=VEN/SS=36V, VFB=0V
-0.1
-0.1
μA
μA
FB "L" Current
VEN/SS=0.3V→2.5V, VFB=0.71V
VEN/SS Voltage when Lx pin voltage
changes from "L" level to "H" level
EN/SS "H" Voltage
EN/SS "L" Voltage
VEN/SSH
2.5
-
-
-
36
V
V
②
②
VEN/SS=2.5V→0.3V, VFB=0.71V
VEN/SS Voltage when Lx pin voltage
changes from "H" level to "L" level
VEN/SSL
0.3
EN/SS "H" Current
EN/SS "L" Current
IEN/SSH
IEN/SSL
VIN=VEN/SS=36V, VFB=0.825V
-
0.1
-
0.3
0.1
μA
μA
④
④
VIN=36V, VEN/SS=0V, VFB=0.825V
-0.1
Thermal Shutdown
Temperature
TTSD
THYS
Junction Temperature
Junction Temperature
-
-
150
25
-
-
℃
℃
-
-
Hysteresis Width
Test Condition: Unless otherwise stated, VIN=12V, VEN/SS=12V
Peripheral parts connection conditions:L=6.8μH、RFB1=680kΩ、RFB2=120kΩ、CL=10μF×2、CIN=2.2μF
(*4) For the USP-6C Package only.
7/30
XC9268 Series
■TEST CIRCUITS
CIRCUIT①
V
IN
A
Probe
EN/SS
PG
L
V
V
O UT
2.2μF
Lx
A
V
C
FB
R
R
FB1
FB
V
FB2
10μF×2
GND
CIRCUIT②
Probe
V
IN
V
Probe
EN/SS
2.2μF
Lx
1 00 kΩ
V
PG
FB
V
A
A
V
1 00 kΩ
GND
V
Probe
CIRCUIT③
Probe
V
IN
4 30 kΩ
Probe
EN/SS
Lx
2.2μF
V
V
PG
0.47μF
FB
V
GND
1 00 kΩ
V
* PG Pin is USP-6C Package only.
8/30
XC9268
Series
■TEST CIRCUITS
CIRCUIT④
V
IN
A
EN/SS
PG
A
Lx
V
V
FB
A
GND
V
CIRCUIT⑤
Probe
VIN
V
Probe
EN/SS
CIN
Lx
RPG =100kΩ
V
PG
FB
V
V
GND
V
Probe
* PG Pin is USP-6C Package only.
9/30
XC9268 Series
■TYPICAL APPLICATION CIRCUIT
L
VIN
Lx
CIN
RFB1
CFB
EN/SS
FB
CL
RFB2
RPG
GND
PG
<Inductance value setting>
For the XC9268 Series, operation is optimized by setting the following inductance value according to the set frequency and
setting output voltage.
fOSCSET: Frequency setting , VOUTSET: Output voltage setting
【Typical Examples】
fOSCSET
conditions
MANUFACTURER
TDK
PRODUCT NUMBER
CLF5030NIT-3R3N
XEL4030-332ME
VALUE
Coilcraft
1V<VOUTSET≦2V
3.3μH
Taiyo Yuden
Tokyo Coil
TDK
NRS4018T3R3MDGJ
SHP0420P-F3R3NAP
CLF5030NIT-4R7N
XEL4030-472ME
Coilcraft
2V<VOUTSET≦3.3V
4.7μH
Taiyo Yuden
Tokyo Coil
TDK
NRS5024T4R7MMGJ
SHP0530P-F4R7AP
CLF5030NIT-6R8N
XEL4030-682ME
1.2MHz
Coilcraft
3.3V<VOUTSET≦6V
6.8μH
10μH
Taiyo Yuden
Tokyo Coil
TDK
NRS5024T6R8MMGJ
SHP0530P-F6R8AP
CLF5030NIT-100N
NRS5040T100MMGJ
6V<VOUTSET≦25V
Taiyo Yuden
Tokyo Coil
TDK
SHP0530P-F100AP
CLF5030NIT-1R5N
L
Coilcraft
Taiyo Yuden
Tokyo Coil
TDK
XEL4030-152ME
1.5μH
1.6μH
1V<VOUTSET≦2V
NRS4018T1R5NDGJ
SHP0420P-F1R6NAP
CLF5030NIT-2R2N
Coilcraft
Taiyo Yuden
Tokyo Coil
TDK
XEL4030-222ME
2V<VOUTSET≦3.3V
3.3V<VOUTSET≦6V
6V<VOUTSET≦25V
2.2μH
3.3μH
4.7μH
NRS4018T2R2MDGJ
SHP0420P-F2R2NAP
CLF5030NIT-3R3N
2.2MHz
Coilcraft
Taiyo Yuden
Tokyo Coil
TDK
XEL4030-332ME
NRS4018T3R3MDGJ
SHP0420P-F3R3NAP
CLF5030NIT-4R7N
Coilcraft
Taiyo Yuden
Tokyo Coil
TDK
XEL4030-472ME
NRS5024T4R7MMGJ
SHP0530P-F4R7AP
C2012X6S1H475K125AC
C2012X6S1H475K125AC
C2012X7R1H225K125AC
C2012X7R1H225K125AC
C2012X7R1A106K125AC
C3216X7R1E106K160AB
C3225X7R1H106M250AC
VIN<20V
VIN≧20V
VIN<20V
VIN≧20V
4.7μF/50V
1.2MHz
2.2MHz
TDK
4.7μF/50V 2parallel
2.2μF/50V
CIN
TDK
TDK
2.2μF/50V 2parallel
10μF/10V 2parallel
10μF/25V 2parallel
10μF/50V 2parallel
CL
-
-
TDK
10/30
XC9268
Series
■TYPICAL APPLICATION CIRCUIT(Continued)
< Output voltage setting >
The output voltage can be set by adding an external dividing resistor.
The output voltage is determined by the equation below based on the values of RFB1 and RFB2
.
VOUT=0.75V × (RFB1+RFB2)/RFB2
With RFB2≦200kΩ and RFB1+RFB2≦1MΩ
<CFB setting>
Adjust the value of the phase compensation speed-up capacitor CFB using the equation below.
1
CFB
=
2π × fzfb× RFB1
1
A target value for fzfb of about fzfb =
【Setting Example】
is optimum.
2π CL × L
To set output voltage to 5V with fosc=1.2MHz, CL=10μF×2, L=6.8μH
When RFB1=680kΩ, RFB2=120kΩ, VOUTSET=0.75V× (680kΩ+120kΩ) / 120kΩ=5.0V
And fzfb is set to a target of 13.65 kHz using the above equation,
CFB=1/ (2×π×13.65 kHz×680kΩ) =17.15pF. A capacitor of E24 series is 18pF.
XC9268B75Cxx / fOSC=1.2MHz
RFB1 RFB2 CFB
XC9268B75Dxx / fOSC=2.2MHz
RFB1 RFB2 CFB
VOUTSET
1.2V
3.3V
5.0V
12V
L
fzfb
VOUTSET
1.2V
3.3V
5.0V
12V
L
fzfb
120kΩ 200kΩ 3.3μH 68pF 19.6kHz
510kΩ 150kΩ 4.7μH 18pF 16.4kHz
680kΩ 120kΩ 6.8μH 18pF 13.7kHz
120kΩ 200kΩ 1.5μH 47pF 29.1kHz
510kΩ 150kΩ 2.2μH 12pF 24.0kHz
680kΩ 120kΩ 3.3μH 12pF 19.6kHz
360kΩ
24kΩ 10μH 39pF 11.3kHz
360kΩ
24kΩ 4.7μH 27pF 16.4kHz
<Soft-start Time Setting>
The soft-start time can be adjusted by adding a capacitor and a resistor to the EN/SS pin.
Soft-start time (tSS2) is approximated by the equation below according to values of VEN/SS, RSS, and CSS
.
tss2=Css x Rss x ln ( VEN/SS / (VEN/SS-1.45) )
【Setting Example】
When CSS=0.47μF, RSS=430kΩ and VEN/SS=12V, tSS2=0.47x10-6 x 430 x 103 x (ln (12/ (12-1.45)) =26ms (Approx.)
*The soft-start time is the time from the start of VEN/SS until the output voltage reaches 90% of the set voltage.
If the EN/SS pin voltage rises steeply without connecting CSS and RSS (RSS=0Ω), Output rises with taking the soft-start time of
tSS1=2.0ms (TYP.) which is fixed internally.
RSS
VEN/SS
EN/SS
CSS
VEN/SS
90 % of setting voltage
V
OUT
tSS1
tSS2
11/30
XC9268 Series
■OPERATIONAL EXPLANATION
The XC9268 series consists internally of a reference voltage supply with soft-start function, error amp, PWM comparator, ramp
wave circuit, oscillator circuit, Current limiting PFM circuit, phase compensation (Current feedback) circuit, current limiting circuit,
High-side driver Tr., Low-side driver Tr., buffer drive circuit, internal power supply (Local Reg) circuit, under-voltage lockout
(UVLO) circuit, gate clamp (CLAMP) circuit, thermal shutdown (TSD) circuit, power good comparator, PWM/PFM control block
and other elements.
The voltage feedback from the FB pin is compared to the internal reference voltage by the error amp, the output from the error
amp is phase compensated, and the signal is input to the PWM comparator to determine the ON time of switching during PWM
operation. The output signal from the error amp is compared to the ramp wave by the PWM comparator, and the output is sent
to the buffer drive circuit and output from the LX pin as the duty width of switching. This operation is performed continuously to
stabilize the output voltage.
The driver transistor current is monitored at each switching by the phase compensation (Current feedback) circuit, and the
output signal from the error amp is modulated as a multi-feedback signal. This allows a stable feedback system to be obtained
even when a low ESR capacitor such as a ceramic capacitor is used, and this stabilizes the output voltage.
XC9268 Series
VIN
Current
SENSE
LocalReg
Chip
Enable
EN/SS
each
Current
feed
back
Current
Limit
PFM
circuit
Current
Limit
High
Side
Buffer
Gate
CLAMP
Under
Voltage
Lx
Low
Side
Lock Out
Buffer
Thermal
Shutdown
each
circuit
Operation
Enable
Vref
Soft Start
+
Err Amp
-
+
PWM
PWM/PFM
ControlLOGIC
FB
Comparator
-
GND
Ramp
Wave
OSC
PG
(USP-6C Package Only)
+
-
PowerGood
Comparator
* Diodes inside the circuits are ESD protection diodes and parasitic diodes.
<Reference voltage source>
The reference voltage source provides the reference voltage to ensure stable output voltage of the DC/DC converter.
<Oscillator circuit>
The oscillator circuit determines switching frequency.1.2MHz or 2.2MHz is available for the switching frequency.
Clock pulses generated in this circuit are used to produce ramp waveforms needed for PWM operation.
<Error amplifier>
The error amplifier is designed to monitor output voltage. The amplifier compares the reference voltage with the feedback
voltage divided by the internal voltage divider, RFB1 and RFB2. When a voltage is lower than the reference voltage, then the
voltage is fed back, the output voltage of the error amplifier increases. The error amplifier output is fixed internally to deliver an
optimized signal to the mixer.
12/30
XC9268
Series
■OPERATIONAL EXPLANATION(Continued)
<Current limiting>
The current limiting circuit of the XC9268 series monitors the current that flows through the High-side driver transistor and
Low-side driver transistor, and when over-current is detected, the current limiting function activates.
(1) High-side driver Tr. current limiting
The current in the High-side driver Tr. is detected to equivalently monitor the peak value of the coil current. The High-side driver
Tr. current limiting function forcibly turns off the High-side driver Tr. when the peak value of the coil current reaches the High-
side driver current limit value ILIMH
.
High-side driver Tr. current limit value ILIMH=1.3A (TYP.)
(2) Low-side driver Tr. current limiting
The current in the Low-side driver Tr. is detected to equivalently monitor the bottom value of the coil current. The Low-side
driver Tr. current limiting function operates when the High-side driver Tr. current limiting value reaches ILIMH. The Low-side driver
Tr. current limiting function prohibits the High-side driver Tr. from turning on in an over-current state where the bottom value of
the coil current is higher than the Low-side driver Tr. current limit value ILIML
.
Low side driver Tr. current limit value ILIML=0.9A (TYP.)
The current foldback circuit operates control to lower the switching frequency fOSC. When the over-current state is released,
normal operation resumes.
Current Limit
ILIMH=1.3A(TYP.)
ILIML=0.9A(TYP.)
ILX
0A
VLX
VOUT
0V
13/30
XC9268 Series
■OPERATIONAL EXPLANATION(Continued)
<Soft-start function>
The output voltage of XC9268 rises with soft start by slowly raising the reference voltage. The rise time of this reference
voltage is the soft start time. The soft-start time is set to tss1 (TYP. 2.0ms) which is fixed internally or to the time set by adding a
capacitor and a resistor to the EN / SS pin whichever is later.
<Thermal shutdown>
The thermal shutdown (TSD) as an over temperature limit is built in the XC9268 series.
When the junction temperature reaches the detection temperature, the driver transistor is forcibly turned off. When the junction
temperature falls to the release temperature while in the output stop state, restart takes place by soft-start.
<UVLO>
When the VIN pin voltage falls below VUVLO1 (TYP. 2.7V), the driver transistor is forcibly turned off to prevent false pulse output
due to instable operation of the internal circuits. When the VIN pin voltage rises above VUVLO2 (TYP. 2.8V), the UVLO function is
released, the soft-start function activates, and output start operation begins. Stopping by UVLO is not shutdown; only pulse
output is stopped and the internal circuits continue to operate.
<Power good>
On USP-6C Package, the output state can be monitored using the power good function. The PG pin is an Nch open drain
output, therefore a pull-up resistance (approx. 100kΩ) must be connected to the PG pin.
CONDITIONS
SIGNAL
V
FB>VPGDET
FB≦VPGDET
H (High impedance)
L (Low impedance)
L (Low impedance)
Undefined State
V
EN/SS=H
EN/SS=L
Thermal Shutdown
UVLO(VIN<VUVLOD
)
Stand-by
L (Low impedance)
14/30
XC9268
Series
■NOTE ON USE
1) In the case of a temporary and transient voltage drop or voltage rise.
If the absolute maximum ratings are exceeded, the IC may be deteriorate or destroyed.
Case 1
If a voltage exceeding the absolute maximum voltage is applied to the IC due to chattering caused by a mechanical switch or an
external surge voltage, please use a protection element such as TVS and a protection circuit as a countermeasure.
L
VIN
Lx
CIN
RFB1
CFB
EN/SS
FB
CL
TVS
RFB2
RPG
GND
PG
Case 2
Under conditions where the input voltage drops below the output voltage, overcurrent may flow to the parasitic diode inside the
IC, and the absolute maximum rating of the Lx pin may be exceeded. If current is drawn to the input side with low impedance
between Vin and GND, please take measures such as adding an SBD between VOUT and VIN.
SBD
L
VOUT
VIN
Lx
CIN
RFB1
CFB
EN/SS
FB
CL
RFB2
RPG
GND
PG
2) Make sure that the absolute maximum ratings of the external components and of this IC are not exceeded.
3) The DC/DC converter characteristics depend greatly on the externally connected components as well as on the characteristics
of this IC, so refer to the specifications and standard circuit examples of each component when carefully considering which
components to select.
Be especially careful of the capacitor characteristics and use X7R or X5R (EIA standard) ceramic capacitors.
The capacitance decrease caused by the bias voltage may become remarkable depending on the external size of the
capacitor.
15/30
XC9268 Series
■NOTE ON USE(Continued)
4) The DC/DC converter of this IC uses a current-limiting circuit to monitor the coil peak current. If the potential dropout voltage
is large or the load current is large, the peak current will increase, which makes it easier for current limitation to be applied
which in turn could cause the operation to become unstable. When the peak current becomes large, adjust the coil inductance
and sufficiently check the operation.
The following formula is used to show the peak current.
Peak Current: Ipk = (VIN – VOUT) × VOUT / VIN / (2 × L × fOSC) + IOUT
L: Coil Inductance [H]
fOSC: Oscillation Frequency [Hz]
IOUT: Load Current [A]
5) If there is a large dropout voltage, a circuit delay could create the ramp-up of coil current with staircase waveform exceeding
the current limit.
6) Even in the PWM control, the intermittent operation occurs and the ripple voltage becomes higher, when the minimum On
Time is faster than 85ns (TYP.) as well as the dropout voltage is large.
7) The ripple voltage could be increased when switching from discontinuous conduction mode to continuous conduction mode
and at switching to 100% Duty cycle. Please evaluate IC well on customer’s PCB.
8) PWM/PFM auto series may cause superimposed ripple voltage by continuous pulses if it uses in high temperature and no
load. It is necessary to set an idle current of higher than 100 μA from VOUT if it uses at no load.
It can make an effect as same as RFB2 is lower than 7.5 kΩ, Please refer to the < Output voltage setting > in the TYPCAL
APPLICATION CIRCUIT..
9) If the voltage at the EN/SS Pin does not start from 0V but it is at the midpoint potential when the power is switched on, the
soft start function may not work properly and it may cause the larger inrush current and bigger ripple voltages.
10) Torex places an importance on improving our products and their reliability. We request that users incorporate fail-safe designs
and post-aging protection treatment when using Torex products in their systems.
11) Instructions of pattern layouts
The operation may become unstable due to noise and/or phase lag from the output current when the wire impedance is
high, please place the input capacitor(CIN) and the output capacitor (CL) as close to the IC as possible.
(1) In order to stabilize VIN voltage level, we recommend that a by-pass capacitor (CIN) be connected as close as possible
to the VIN and GND pins.
(2) Please mount each external component as close to the IC as possible.
(3) Wire external components as close to the IC as possible and use thick, short connecting traces to reduce the circuit
impedance.
(4) Make sure that the GND traces are as thick as possible, as variations in ground potential caused
by high ground currents at the time of switching may result in instability of the IC.
(5) Please note that internal driver transistors bring on heat because of the load current and ON resistance
of High side driver transistor, Low side driver transistor. Please make sure that the heat is dissipated properly,
especially at higher temperatures.
16/30
XC9268
Series
<Reference Pattern Layout>
USP-6C
Layer 1
Layer 2
Layer 4
Layer 3
SOT-89-5
Layer 1
Layer 2
Layer 3
Layer 4
17/30
XC9268 Series
■TYPICAL PERFORMANCE CHARACTERISTICS
(1) Efficiency vs. Output Current
XC9268B75Cxx
XC9268B75Cxx
(VIN=12V, VOUT=3.3V, fOSC=1.2MHz)
(VIN=12V, VOUT=5V, fOSC=1.2MHz)
L=4.7μH(CLF5030NIT-4R7), CIN=4.7μF×2(C2012X6S1H475K)
CL=10μF×2 (C3216X7R1E106K)
L=6.8μH(CLF5030NIT-6R8), CIN=4.7μF×2(C2012X6S1H475K)
CL=10μF×2 (C3216X7R1E106K)
100
100
90
80
70
60
50
40
30
20
10
0
90
80
70
60
50
40
30
20
10
0
0.1
1
10
100
1000
0.1
1
10
100
1000
Output Current :IOUT[mA]
Output Current :IOUT[mA]
XC9268B75Dxx
XC9268B75Dxx
(VIN=12V, VOUT=5V, fOSC=2.2MHz)
(VIN=12V, VOUT=3.3V, fOSC=2.2MHz)
L=2.2μH(CLF5030NIT-2R2), CIN=2.2μF×2(C2012X7R1H225K)
CL=10μF×2 (C3216X7R1E106K)
L=3.3μH(CLF5030NIT-3R3), CIN=2.2μF×2(C2012X7R1H225K)
CL=10μF×2 (C3216X7R1E106K)
100
100
90
80
70
60
50
40
30
20
10
0
90
80
70
60
50
40
30
20
10
0
0.1
1
10
100
1000
0.1
1
10
100
1000
Output Current :IOUT[mA]
Output Current :IOUT[mA]
(2) Output Voltage vs. Output Current
XC9268B75Cxx
XC9268B75Cxx
(VIN=12V, VOUT=5V, fOSC=1.2MHz)
(VIN=12V, VOUT=3.3V, fOSC=1.2MHz)
L=6.8μH(CLF5030NIT-6R8), CIN=4.7μF×2(C2012X6S1H475K)
CL=10μF×2 (C3216X7R1E106K)
6.00
L=4.7μH(CLF5030NIT-4R7), CIN=4.7μF×2(C2012X6S1H475K)
CL=10μF×2 (C3216X7R1E106K)
4.30
4.10
3.90
3.70
3.50
3.30
3.10
2.90
2.70
2.50
2.30
5.80
5.60
5.40
5.20
5.00
4.80
4.60
4.40
4.20
4.00
1
10
100
1000
1
10
100
1000
Output Current :IOUT[mA]
Output Current :IOUT[mA]
18/30
XC9268
Series
■TYPICAL PERFORMANCE CHARACTERISTICS(Continued)
(2) Output Voltage vs. Output Current
XC9268B75Dxx
XC9268B75Dxx
(VIN=12V, VOUT=3.3V, fOSC=2.2MHz)
(VIN=12V, VOUT=5V, fOSC=2.2MHz)
L=2.2μH(CLF5030NIT-2R2), CIN=2.2μF×2(C2012X7R1H225K)
CL=10μF×2 (C3216X7R1E106K)
L=3.3μH(CLF5030NIT-3R3), CIN=2.2μF×2(C2012X7R1H225K)
CL=10μF×2 (C3216X7R1E106K)
4.30
6.00
4.10
3.90
3.70
3.50
3.30
3.10
2.90
2.70
2.50
2.30
5.80
5.60
5.40
5.20
5.00
4.80
4.60
4.40
4.20
4.00
1
10
100
1000
1
10
100
1000
Output Current :IOUT[mA]
Output Current :IOUT[mA]
(3) Ripple Voltage vs. Output Current
XC9268B75Cxx
XC9268B75Dxx
(VIN=12V, VOUT=5V, fOSC=1.2MHz)
(VIN=12V, VOUT=5V, fOSC=2.2MHz)
L=6.8μH(CLF5030NIT-6R8), CIN=4.7μF×2(C2012X6S1H475K)
CL=10μF×2 (C3216X7R1E106K)
L=3.3μH(CLF5030NIT-3R3), CIN=2.2μF×2(C2012X7R1H225K)
CL=10μF×2 (C3216X7R1E106K)
100
100
90
80
70
60
50
40
30
20
10
0
90
80
70
60
50
40
30
20
10
0
0.1
1
10
100
1000
0.1
1
10
100
1000
Output Current :IOUT[mA]
Output Current :IOUT[mA]
(4) FB Voltage vs. Ambient Temperature
XC9268B75xxx
(5) UVLO Voltage vs. Ambient Temperature
XC9268B75xxx
VIN=12V
0.760
0.755
0.750
0.745
0.740
3.0
VUVLO1(DetectVoltage)
2.9
VUVLO2(ReleaseVoltage)
2.8
2.7
2.6
2.5
-50 -25
0
25
50
75 100 125
-50 -25
0
25
50
75 100 125
Ambient Temperature :Ta[℃]
Ambient Temperature :Ta[℃]
19/30
XC9268 Series
■TYPICAL PERFORMANCE CHARACTERISTICS(Continued)
(6) Oscillation Frequency vs. Ambient Temperature
XC9268B75Cxx
(fOSC=1.2MHz)
XC9268B75Dxx
(fOSC=2.2MHz)
VIN=12V
VIN=12V
2650
2500
2350
2200
2050
1900
1750
1440
1360
1280
1200
1120
1040
960
-50 -25
0
25
50
75 100 125
-50 -25
0
25
50
75 100 125
Ambient Temperature :Ta[℃]
Ambient Temperature :Ta[℃]
(7) Stand-by Current vs. Ambient Temperature
XC9268B75xxx
(8) Lx SW ON Resistance vs. Ambient Temperature
XC9268B75xxx
VIN=12V
VIN=12V
2.0
4.0
3.0
2.0
1.0
0.0
Highside SW.
Lowside SW.
1.5
1.0
0.5
0.0
-50 -25
0
25
50
75 100 125
-50 -25
0
25
50
75 100 125
Ambient Temperature :Ta[℃]
Ambient Temperature :Ta[℃]
(9) Quiescent Current vs. Ambient Temperature
XC9268B75Dxx
(fOSC=2.2MHz)
XC9268B75Cxx
(fOSC=1.2MHz)
VIN=12V
VIN=12V
30
25
20
15
10
5
30
25
20
15
10
5
0
0
-50 -25
0
25
50
75 100 125
-50 -25
0
25
50
75 100 125
Ambient Temperature :Ta[℃]
Ambient Temperature :Ta[℃]
20/30
XC9268
Series
■TYPICAL PERFORMANCE CHARACTERISTICS(Continued)
(10) Internal Soft-Start Time vs. Ambient Temperature
(11) External Soft-Start Time vs. Ambient Temperature
XC9268B75xxx
XC9268B75xxx
VIN=12V, RSS=430kΩ, CSS=0.47μF
VIN=12V
4.0
35
3.5
3.0
2.5
2.0
1.5
1.0
0.5
0.0
30
25
20
15
-50 -25
0
25
50
75 100 125
-50 -25
0
25
50
75 100 125
Ambient Temperature :Ta[℃]
Ambient Temperature :Ta[℃]
(12) PG Detect Voltage vs. Ambient Temperature
XC9268B75xxx
(13) PG Output Voltage vs. Ambient Temperature
XC9268B75xxx
VIN=12V
VIN=12V, IPG=1mA
0.75
0.4
0.3
0.2
0.1
0.0
0.70
0.65
0.60
-50 -25
0
25
50
75 100 125
-50 -25
0
25
50
75 100 125
Ambient Temperature :Ta[℃]
Ambient Temperature :Ta[℃]
(14) EN/SS Voltage vs. Ambient Temperature
XC9268B75xxx
VIN=12V
4.0
3.0
2.0
1.0
0.0
EN/SS"H"
EN/SS"L"
-50 -25
0
25
50
75 100 125
Ambient Temperature :Ta[℃]
21/30
XC9268 Series
■TYPICAL PERFORMANCE CHARACTERISTICS(Continued)
(15) Load Transient Response
XC9268B75Cxx、 fOSC=1.2MHz
VIN=12V, VOUT=3.3V, IOUT=10mA→300mA
XC9268B75Cxx、 fOSC=1.2MHz
VIN=24V, VOUT=3.3V, IOUT=10mA→300mA
L=4.7μH(CLF5030NIT-4R7), CIN=4.7μF×2(C2012X6S1H475K)
CL=10μF×2 (C3216X7R1E106K)
L=4.7μH(CLF5030NIT-4R7), CIN=4.7μF×2(C2012X6S1H475K)
CL=10μF×2 (C3216X7R1E106K)
1.0ms/div
1.0ms/div
IOUT=10mA→300mA
IOUT=10mA→300mA
VOUT: 500mV/div
VOUT: 500mV/div
XC9268B75Cxx、 fOSC=1.2MHz
VIN=12V, VOUT=5.0V, IOUT=10mA→300mA
XC9268B75Cxx、 fOSC=1.2MHz
VIN=24V, VOUT=5.0V, IOUT=10mA→300mA
L=6.8μH(CLF5030NIT-6R8), CIN=4.7μF×2(C2012X6S1H475K)
CL=10μF×2 (C3216X7R1E106K)
L=6.8μH(CLF5030NIT-6R8), CIN=4.7μF×2(C2012X6S1H475K)
CL=10μF×2 (C3216X7R1E106K)
1.0ms/div
1.0ms/div
IOUT=10mA→300mA
IOUT=10mA→300mA
VOUT: 500mV/div
VOUT: 500mV/div
XC9268B75Dxx、 fOSC=2.2MHz
VIN=12V, VOUT=3.3V, IOUT=10mA→300mA
L=2.2μH(CLF5030NIT-2R2), CIN=2.2μF×2(C2012X7R1H225K)
CL=10μF×2 (C3216X7R1E106K)
1.0ms/div
IOUT=10mA→300mA
VOUT: 500mV/div
22/30
XC9268
Series
■TYPICAL PERFORMANCE CHARACTERISTICS(Continued)
(15) Load Transient Response
XC9268B75Dxx、 fOSC=2.2MHz
VIN=12V, VOUT=5.0V, IOUT=10mA→300mA
XC9268B75Dxx、 fOSC=2.2MHz
VIN=24V, VOUT=5.0V, IOUT=10mA→300mA
L=3.3μH(CLF5030NIT-3R3), CIN=2.2μF×2(C2012X7R1H225K)
CL=10μF×2 (C3216X7R1E106K)
L=3.3μH(CLF5030NIT-3R3), CIN=2.2μF×2(C2012X7R1H225K)
CL=10μF×2 (C3216X7R1E106K)
1.0ms/div
1.0ms/div
IOUT=10mA→300mA
IOUT=10mA→300mA
VOUT: 500mV/div
VOUT: 500mV/div
(16) Input Transient Response
XC9268B75Cxx、 fOSC=1.2MHz
VIN=8V→16V, VOUT=3.3V, IOUT=300mA
XC9268B75Cxx、 fOSC=1.2MHz
VIN=16V→32V, VOUT=3.3V, IOUT=300mA
L=4.7μH(CLF5030NIT-4R7), CIN=4.7μF×2(C2012X6S1H475K)
CL=10μF×2 (C3216X7R1E106K)
L=4.7μH(CLF5030NIT-4R7), CIN=4.7μF×2(C2012X6S1H475K)
CL=10μF×2 (C3216X7R1E106K)
1.0ms/div
1.0ms/div
VIN=16V→32V
VIN=8V→16V
VOUT: 200mV/div
VOUT: 200mV/div
XC9268B75Cxx、 fOSC=1.2MHz
VIN=8V→16V, VOUT=5.0V, IOUT=300mA
XC9268B75Cxx、 fOSC=1.2MHz
VIN=16V→32V, VOUT=5.0V, IOUT=300mA
L=6.8μH(CLF5030NIT-6R8), CIN=4.7μF×2(C2012X6S1H475K)
CL=10μF×2 (C3216X7R1E106K)
L=6.8μH(CLF5030NIT-6R8), CIN=4.7μF×2(C2012X6S1H475K)
CL=10μF×2 (C3216X7R1E106K)
1.0ms/div
1.0ms/div
VIN=16V→32V
VIN=8V→16V
VOUT: 200mV/div
VOUT: 200mV/div
23/30
XC9268 Series
■TYPICAL PERFORMANCE CHARACTERISTICS(Continued)
(16) Input Transient Response
XC9268B75Dxx、 fOSC=2.2MHz
VIN=8V→16V, VOUT=3.3V, IOUT=300mA
L=2.2μH(CLF5030NIT-2R2), CIN=2.2μF×2(C2012X7R1H225K)
CL=10μF×2 (C3216X7R1E106K)
1.0ms/div
VIN=8V→16V
VOUT: 200mV/div
XC9268B75Dxx、 fOSC=2.2MHz
VIN=8V→16V, VOUT=5.0V, IOUT=300mA
XC9268B75Dxx、 fOSC=2.2MHz
VIN=16V→32V, VOUT=5.0V, IOUT=300mA
L=3.3μH(CLF5030NIT-3R3), CIN=2.2μF×2(C2012X7R1H225K)
CL=10μF×2 (C3216X7R1E106K)
L=3.3μH(CLF5030NIT-3R3), CIN=2.2μF×2(C2012X7R1H225K)
CL=10μF×2 (C3216X7R1E106K)
1.0ms/div
1.0ms/div
VIN=16V→32V
VIN=8V→16V
VOUT: 200mV/div
VOUT: 200mV/div
(17) EN/SS Rising Response
XC9268B75Cxx、 fOSC=1.2MHz
VIN=12V, VENSS=0→12V, VOUT=3.3V, IOUT=300mA
XC9268B75Cxx、 fOSC=1.2MHz
VIN=24V, VENSS=0→24V, VOUT=3.3V, IOUT=300mA
L=4.7μH(CLF5030NIT-4R7), CIN=4.7μF×2(C2012X6S1H475K)
CL=10μF×2 (C3216X7R1E106K)
L=4.7μH(CLF5030NIT-4R7), CIN=4.7μF×2(C2012X6S1H475K)
CL=10μF×2 (C3216X7R1E106K)
1.0ms/div
1.0ms/div
VEN/SS=0V→24V
VEN/SS=0V→12V
VOUT : 2V/div
VOUT : 2V/div
24/30
XC9268
Series
■TYPICAL PERFORMANCE CHARACTERISTICS(Continued)
(17) EN/SS Rising Response
XC9268B75Cxx、 fOSC=1.2MHz
VIN=12V, VENSS=0→12V, VOUT=5V, IOUT=300mA
XC9268B75Cxx、 fOSC=1.2MHz
VIN=24V, VENSS=0→24V, VOUT=5V, IOUT=300mA
L=6.8μH(CLF5030NIT-6R8), CIN=4.7μF×2(C2012X6S1H475K)
CL=10μF×2 (C3216X7R1E106K)
L=6.8μH(CLF5030NIT-6R8), CIN=4.7μF×2(C2012X6S1H475K)
CL=10μF×2 (C3216X7R1E106K)
1.0ms/div
1.0ms/div
VEN/SS=0V→24V
VEN/SS=0V→12V
VOUT : 2V/div
VOUT : 2V/div
XC9268B75Dxx、 fOSC=2.2MHz
VIN=12V, VENSS=0→12V, VOUT=3.3V, IOUT=300mA
L=2.2μH(CLF5030NIT-2R2), CIN=2.2μF×2(C2012X7R1H225K)
CL=10μF×2 (C3216X7R1E106K)
1.0ms/div
VEN/SS=0V→12V
VOUT : 2V/div
XC9268B75Dxx、 fOSC=2.2MHz
VIN=12V, VENSS=0→12V, VOUT=5V, IOUT=300mA
XC9268B75Dxx、 fOSC=2.2MHz
VIN=24V, VENSS=0→24V, VOUT=5V, IOUT=300mA
L=3.3μH(CLF5030NIT-3R3), CIN=2.2μF×2(C2012X7R1H225K)
CL=10μF×2 (C3216X7R1E106K)
L=3.3μH(CLF5030NIT-3R3), CIN=2.2μF×2(C2012X7R1H225K)
CL=10μF×2 (C3216X7R1E106K)
1.0ms/div
1.0ms/div
VEN/SS=0V→24V
VEN/SS=0V→12V
VOUT : 2V/div
VOUT : 2V/div
25/30
XC9268 Series
■TYPICAL PERFORMANCE CHARACTERISTICS(Continued)
(18) VIN Rising Response
XC9268B75Cxx、 fOSC=1.2MHz
IN=0→12V, VENSS=0→12V, VOUT=3.3V, IOUT=300mA
XC9268B75Cxx、 fOSC=1.2MHz
VIN=0→24V, VENSS=0→24V, VOUT=3.3V, IOUT=300mA
V
L=4.7μH(CLF5030NIT-4R7), CIN=4.7μF×2(C2012X6S1H475K)
CL=10μF×2 (C3216X7R1E106K)
L=4.7μH(CLF5030NIT-4R7), CIN=4.7μF×2(C2012X6S1H475K)
CL=10μF×2 (C3216X7R1E106K)
1.0ms/div
1.0ms/div
VIN=0V→24V
VIN=0V→12V
VOUT : 2V/div
VOUT : 2V/div
XC9268B75Cxx、 fOSC=1.2MHz
IN=0→12V, VENSS=0→12V, VOUT=5V, IOUT=300mA
XC9268B75Cxx、 fOSC=1.2MHz
IN=0→24V, VENSS=0→24V, VOUT=5V, IOUT=300mA
V
V
L=6.8μH(CLF5030NIT-6R8), CIN=4.7μF×2(C2012X6S1H475K)
CL=10μF×2 (C3216X7R1E106K)
L=6.8μH(CLF5030NIT-6R8), CIN=4.7μF×2(C2012X6S1H475K)
CL=10μF×2 (C3216X7R1E106K)
1.0ms/div
1.0ms/div
VEN/SS=0V→24V
VEN/SS=0V→12V
VOUT : 2V/div
VOUT : 2V/div
XC9268B75Dxx、 fOSC=2.2MHz
VIN=0→12V, VENSS=0→12V, VOUT=3.3V, IOUT=300mA
L=2.2μH(CLF5030NIT-2R2), CIN=2.2μF×2(C2012X7R1H225K)
CL=10μF×2 (C3216X7R1E106K)
1.0ms/div
VEN/SS=0V→12V
VOUT : 2V/div
26/30
XC9268
Series
■TYPICAL PERFORMANCE CHARACTERISTICS(Continued)
(18) VIN Rising Response
XC9268B75Dxx、 fOSC=2.2MHz
VIN=0→12V, VENSS=0→12V, VOUT=5V, IOUT=300mA
XC9268B75Dxx、 fOSC=2.2MHz
VIN=0→24V, VENSS=0→24V, VOUT=5V, IOUT=300mA
L=3.3μH(CLF5030NIT-3R3N-D), CIN=2.2μF×2(C2012X7R1H225K)
CL=10μF×2 (C3216X7R1E106K)
L=3.3μH(CLF5030NIT-3R3N-D), CIN=2.2μF×2(C2012X7R1H225K)
CL=10μF×2 (C3216X7R1E106K)
1.0ms/div
1.0ms/div
VEN/SS=0V→24V
VEN/SS=0V→12V
VOUT : 2V/div
VOUT : 2V/div
27/30
XC9268 Series
■PACKAGING INFORMATION
For the latest package information go to, www.torexsemi.com/technical-support/packages
PACKAGE
SOT-89-5
OUTLIN / LAND PATTERN
SOT-89-5 PKG
THERMAL CHARACTERISTICS
Standard Board
SOT-89-5 Power Dissipation
JESD51-7 Board
Standard Board
JESD51-7 Board
USP-6C
USP-6C PKG
USP-6C Power Dissipation
28/30
XC9268
Series
■MARKING RULE
●SOT-89-5
①② represents product series, products type,
5
2
4
MARK
PRODUCT SERIES
XC9268B75***-G
①
②
6
1
※USP-6CUnder dot
1
2
3
③ presents Oscillation Frequency
●USP-6C(Under dot)
MARK
Oscillation Frequency
PRODUCT SERIES
N
U
1.2MHz
2.2MHz
XC9268B75C**-G
XC9268B75D**-G
1
2
3
6
5
4
④⑤ represents production lot number
01~09, 0A~0Z, 11~9Z, A1~A9, AA~AZ, B1~ZZ repeated
(G,I,J,O,Q,W excluded)* No character inversion used.
29/30
XC9268 Series
1. The product and product specifications contained herein are subject to change without notice to
improve performance characteristics. Consult us, or our representatives before use, to confirm that
the information in this datasheet is up to date.
2. The information in this datasheet is intended to illustrate the operation and characteristics of our
products. We neither make warranties or representations with respect to the accuracy or
completeness of the information contained in this datasheet nor grant any license to any intellectual
property rights of ours or any third party concerning with the information in this datasheet.
3. Applicable export control laws and regulations should be complied and the procedures required by
such laws and regulations should also be followed, when the product or any information contained in
this datasheet is exported.
4. The product is neither intended nor warranted for use in equipment of systems which require
extremely high levels of quality and/or reliability and/or a malfunction or failure which may cause loss
of human life, bodily injury, serious property damage including but not limited to devices or equipment
used in 1) nuclear facilities, 2) aerospace industry, 3) medical facilities, 4) automobile industry and
other transportation industry and 5) safety devices and safety equipment to control combustions and
explosions. Do not use the product for the above use unless agreed by us in writing in advance.
5. Although we make continuous efforts to improve the quality and reliability of our products;
nevertheless Semiconductors are likely to fail with a certain probability. So in order to prevent personal
injury and/or property damage resulting from such failure, customers are required to incorporate
adequate safety measures in their designs, such as system fail safes, redundancy and fire prevention
features.
6. Our products are not designed to be Radiation-resistant.
7. Please use the product listed in this datasheet within the specified ranges.
8. We assume no responsibility for damage or loss due to abnormal use.
9. All rights reserved. No part of this datasheet may be copied or reproduced unless agreed by Torex
Semiconductor Ltd in writing in advance.
TOREX SEMICONDUCTOR LTD.
30/30
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