XCL212B082DR [TOREX]
3.1mmÃ4.7mm, h=1.3mm;
| 型号： | XCL212B082DR |
| 厂家： | 
Torex Semiconductor |
| 描述： | 3.1mmÃ4.7mm, h=1.3mm |
| 文件： | 总16页 (文件大小：626K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
XCL211/XCL212Series
ETR28006-001
2.0A Inductor Built-in Step-Down “micro DC/DC” Converters
☆GreenOperation Compatible
■GENERAL DESCRIPTION
The XCL211/XCL212series is a synchronous step-down micro DC/DC converter which integrates an inductor and a control IC in
one tiny package (3.1mm×4.7mm, h=1.3mm).
An internal coil simplifies the circuit and enables minimization of noise and other operational trouble due to the circuit wiring.
A wide operating voltage range of 2.7V to 6.0V enables support for applications that require an externally set output voltage can
be selected. The XCL211/XCL212 series uses synchronous rectification at an operating frequency of 2.4MHz. PWM control
(XCL211) or automatic PWM/PFM switching control (XCL212) can be selected. The XCL211 series has a fixed frequency,
enabling the suppression of output ripple. The XCL212 series achieves high efficiency while holding down output ripple across the
full range of loads, from light to heavy, enabling the extension of battery operation time.
The series have a high speed soft-start as fast as 1ms in typical for quick turn-on. With the built-in UVLO (Under Voltage Lock
Out) function, the internal P-channel driver transistor is forced OFF when input voltage becomes 2.4V or lower. It’s suitable for
large-current application due to limit current is configured 4.0A in typical. The integrated CL discharge function which enables the
electric charge at the output capacitor CL to be discharged via the internal discharge switch located between the LX and GND
pins. Due to CL discharge function, malfunction on LX is prevented when Stand-by mode.
■APPLICATIONS
●Note PCs
■FEATURES
Package Size
: 3.1mm×4.7mm, h=1.3mm
: 2.7V～6.0V
●Printers
Input Voltage
●Tablet PCs
Output Voltage
High Efficiency
Output Current
: 0.9V～VIN (FB Voltage=0.8V±2%)
: 94% (VIN=5.0V, VOUT=3.3V)
: 2.0A
●PND(Portable Navigation Device)
Oscillation Frequency : 2.4MHz (±15%)
Maximum Duty Cycle : 100%
Control Methods
: PWM (XCL211)
PWM/PFM (XCL212)
Functions
: Current Limit Circuit (automatic return)
Soft-Start Circuit Built-In
CL Discharge, UVLO
Output Capacitor
: Low ESR Ceramic Capacitor
Operating Ambient Temperature : -40℃～+85℃
Package
: USP-11B01
Environmental Friendly : EU RoHS Compliant, Pb Free
■TYPICAL PERFORMANCE
■TYPICAL APPLICATION CIRCUIT
CHARACTERISTICS
XCL211B082DR /XCL212B082DR
100
XCL212
80
XCL211
60
40
VIN=5.0V
VOUT=3.3V
20
0
0.1
1
10
100
1000
10000
Output Current : IOUT (mA)
1/16
XCL211/XCL212 series
■BLOCK DIAGRAM
XCL211/XCL212 Series (USP-11B01)
Inductor
L1
L2
UVLO Cmp
AVIN
UVLO
R1
R2
PVIN
Current Feedback
Current Limit
Error
Amp.
PWM
Comparator
Synch
Buffer
Drive
FB
CE
Logic
Lx
Vref with
Soft Start,
CE
Ramp Wave
Phase
Compensation
Generator
OSC
CE/B
CE
Control
Logic
Thermal
Shutdoun
PWM/PFM
Selector
GND
* The XCL211 offers a fixed PWM control, a Control Logic of PWM/PFM Selector is fixed at “PWM” internally.
The XCL212 control scheme is a fixed PWM/PFM automatic switching, a Control Logic of PWM/PFM Selector is fixed at “PWM/PFM automatic
switching” internally.
Diodes inside the circuit are an ESD protection diode and a parasitic diode.
■PRODUCT CLASSIFICATION
● Ordering Information
XCL211①②③④⑤⑥
XCL212①②③④⑤⑥
DESIGNATOR
Fixed PWM
PWM/PFM Auto Switching
SYMBOL
ITEM
Type
DESCRIPTION
Refer to Selection Guide
Reference Voltage is fixed at 0.8V
2.4MHz
①
②③
④
B
Reference Voltage
Oscillation Frequency
Package (Order Unit)
08
2
(*1)
⑤⑥
DR
USP-11B01 (*2) (1,000pcs/Reel)
(*1) Halogen free and EU RoHS compliant.
(*2) The USP-11B01 reels are shipped in a moisture-proof packing.
● Selection Guide
SOFT-START
TIME
CHIP
CURRENT
LIMITER
THERMAL
CL AUTO-
UVLO
TYPE
B
ENABLE
SHUTDOWN
DISCHARGE
Fixed
Yes
Yes
Yes
Yes
Yes
2/16
XCL211/XCL212
Series
■PIN CONFIGURATION
PVIN
AVIN
CE
FB
NC
NC
Lx
Lx
* Please connect the AVIN pin (No.7) and the PVIN pin (No.9) when operating.
* Please connect the LX pins (No.2 and No.3).
USP-11B01
(BOTTOM VIEW)
■PIN ASSIGNMENT
PIN NUMBER
PIN NAME
FUNCTIONS
1
2
NC
No Connection
Switching Output
Switching Output
No Connection
Output Voltage Monitor
Chip Enable
Lx
3
Lx
4
NC
5
FB
6
CE
7
AVIN
GND
PVIN
L1
Analog Input
8
Ground
9
Power Input
10
11
Inductor Electrodes
Inductor Electrodes
L2
■CE PIN FUNCTION
PIN NAME
SIGNAL
STATUS
Low
Stand-by
Active
CE
High
* Please do not leave the CE pin open.
■ABSOLUTE MAXIMUM RATINGS
Ta=25℃
PARAMETER
PVIN Pin Voltage
AVIN Pin Voltage
CE Pin Voltage
FB Pin Voltage
Lx Pin Voltage
Lx Pin Current
SYMBOL
VPVIN
VAVIN
VCE
RATINGS
UNIT
V
-0.3 ~ +7.0 (*1)
-0.3 ~ +7.0
-0.3 ~ +7.0
-0.3 ~ +7.0 or VPVIN +0.3 (*2)
V
V
VFB
VLx
V
ILx
±6.0 (*3)
A
Power Dissipation
USP-11B01
Pd
1000
mW
℃
℃
Operating Ambient Temperature
Storage Temperature
Topr
Tstg
-40 ~ +85
-55 ~ +125
All voltages are described based on the ground voltage of GND.
(*1) Please connect PVIN pin (No.9) and AVIN pin (No.7) for use.
(*2) The maximum value should be either +7.0 or VPVIN+0.3 in the lowest.
(*3) It is measured when the two Lx pins (No.2 and 3) are tied up to each other.
3/16
XCL211/XCL212 series
■ ELECTRICAL CHARACTERISTICS
XCL211B082DR/XCL212B082DR,
Ta=25℃
PARAMETER
SYMBOL
CONDITIONS
VIN=5.0V, VCE=5.0V
MIN.
TYP.
MAX.
0.816
UNIT
V
CIRCUIT
FB Voltage
VFB
Voltage to start oscillation while
0.784
0.800
③
VFB=0.72V → 0.88V
Operating Voltage Range
Maximum Output Current
VIN
When connected to external components
2.7
2.0
-
-
6.0
-
V
A
①
①
VIN=VCE=5.0V (*1,*2)
IOUTMAX
When connected to external components
V
CE=5.0V, VFB=0.72V
UVLO Voltage
VUVLO
2.00
-
2.68
V
③
Voltage which Lx pin holding “L” level (*3)
Quiescent Current
Stand-by Current
Iq
VIN=VCE=5.0V, VFB=0.88V
-
-
53
92
μA
μA
②
②
ISTB
VIN=5.0V, VCE=0V, VFB=0.88V
0.01
1.00
VIN=VCE=5.0V, IOUT=300mA
Oscillation Frequency
PFM Switch Current (*4)
PFM Duty Limit (*4)
fOSC
IPFM
2040
2400
680
2760
-
kHz
mA
%
①
①
①
When connected to external components
VIN=VCE=6.0V, IOUT=1mA
-
-
When connected to external components
VIN=VCE=2.7V, IOUT=1mA
DTYLIMIT_PFM
180
250
When connected to external components
Maximum Duty Cycle
Minimum Duty Cycle
LXSW”H”ON Resistance
LXSW”L”ON Resistance
LXSW”H” Leakage Current
Current Limit
DMAX
DMIN
RLXH
RLXL
ILeakH
ILIM
VIN=VCE=5.0V, VFB=0.72V
VIN=VCE=5.0V, VFB=0.88V
VIN=VCE=4.0V, VFB=0.72V (*6)
100
-
-
0
%
%
Ω
③
③
④
-
-
-
-
-
-
-
0.11
0.12
0.01
4.0
0.21
0.30 (*7)
1.00 (*8)
-
Ω
VIN=5.0V, VCE=0V, VFB=0.88V, VLx=0V
VIN=VCE=5.0V, VFB=0.72V (*9)
μA
A
⑤
④
Output Voltage
Temperature
IOUT=100mA
∆VOUT
/
-40℃≦Topr≦85℃
-
±100
-
ppm/℃
①
(∆topr・VOUT
)
Characteristics
When connected to external components
VIN=5.0V, VFB=0.72V Applied voltage to VCE
Voltage changes Lx to “H” level
VIN=5.0V, VFB=0.72V Applied voltage to VCE
Voltage changes Lx to “L” level
CE ”H” Voltage
CE ”L” Voltage
VCEH
1.2
-
-
VIN
0.4
V
V
③
③
VCEL
GND
CE ”H” Current
CE ”L” Current
FB ”H” Current
FB ”L” Current
ICEH
ICEL
IFBH
IFBL
VIN=5.0V, VCE=5.0V, VFB=0V
VIN=5.0V, VCE=0V, VFB=0V
VIN=5.0V, VCE =0V, VFB=5.0V
VIN=5.0V, VCE=0V, VFB=0V
-0.1
-0.1
-0.1
-0.1
-
-
-
-
0.1
0.1
0.1
0.1
μA
μA
μA
μA
⑤
⑤
⑤
⑤
VIN=5.0V, VCE=0V → 5.0V, IOUT=1mA
Soft-Start Time
tSS
0.3
1.0
2.0
ms
①
When connected to external components
Thermal Shutdown Temperature
Hysteresis Width
TTSD
THYS
RDCHG
L
-
-
150
20
-
℃
℃
Ω
-
-
-
CL Discharge Resistance
Inductance
VIN=5.0V, VCE=0V, VFB=0.72V, VLx=1.0V
Test Freq.=1.0MHz
80
-
130
1.5
2.3
160
⑥
-
-
-
μH
A
Inductor Rated Current
IDC
∆T=+40℃
-
-
External Components: CIN1=20μF(ceramic), CIN2=1μF(ceramic), CL=20μF(ceramic), R1=15kΩ, R2=30kΩ, CFB=1000pF
Condition: Unless otherwise stated,”H”= VIN ~ VIN - 1.2V, “L”= + 0.1V ~ -0.1V
(*1) Mount conditions affect heat dissipation. Maximum output current is not guaranteed when TTSD starts to operate earlier.
(*2) When the difference between the input and the output is small, some cycles may be skipped completely before current maximizes.
If current is further pulled from this state, output voltage will decrease because of P-ch driver ON resistance.
(*3) These values include UVLO detect voltage, UVLO release voltage and hysteresis operating voltage range.
UVLO release voltage is defined as the VIN voltage which makes Lx pin “H”.
(*4) XCL211 series exclude IPFM and DTYLIMIT_PFM because those are only for the PFM control’s functions.
(*5) On resistance = (VIN – Lx pin measurement voltage) / 0.1A
(*6) Design value
(*7) When temperature is high, a current of approximately 20μA (maximum) may leak.
(*8) Current limit denotes the level of detection at peak of coil current.
4/16
XCL211/XCL212
Series
■TEST CIRCUITS
< Circuit No.① >
Wave Form Measure Point
L
L2
L1
LX
※External Components
ꢀCIN1ꢀ：20μF（ceramic）
C
IN2ꢀ：1μF（ceramic）
PVIN
CL ：20μF（ceramic）
R1 ：15kΩ
R2 ：30kΩ
CFB
R1
AVIN
FB
A
A
C
L
V
IN
CIN2
V
I
OUT
CFB ：1000pF（ceramic）
C
IN1
CE
GND
R2
ꢀL
：1.5μH(Selected goods)
V
CE
CE
CE
CE
< Circuit No.② >
< Circuit No.③ >
L2
L1
LX
L2
L1
LX
Wave Form Measure Point
PVIN
AVIN
CE
PVIN
AVIN
CE
FB
FB
A
200Ω
V
IN
VIN
1μF
1μF
VFB
VFB
GND
GND
V
VCE
< Circuit No.④ >
< Circuit No.⑤ >
L2
L1
LX
L2
L1
LX
Wave Form Measure Point
ILeakH
A
IFBH
PVIN
AVIN
CE
PVIN
AVIN
CE
A
FB
FB
A
1μF
ILｘ
ICEH
V
IN
VIN
1μF
IFBL
V
FB
VFB
A
GND
GND
V
CE
ICEL
V
< Circuit No.⑥ >
L2
L1
LX
ILｘ
A
PVIN
AVIN
CE
FB
V
V
IN
1μF
V
Lx
VFB
GND
V
5/16
XCL211/XCL212 series
■TYPICAL APPLICATION CIRCUIT
VOUT
CFB
L2
L1
LX
R1
R2
PVIN
AVIN
CE
VIN
CL
FB
CIN1
CIN2
GND
VCE
NOTE:
The integrated Inductor can be used only for this DC/DC converter. Please do not use this inductor for other reasons.
【External Components】
VALUE
PRODUCT NUMBER
LMK212ABJ106KG (TaiyoYuden)
LMK212AB7106MG (TaiyoYuden)
C2012JB1A106K125AC (TDK)
C2012X7R1A106K125AC (TDK)
LMK212BBJ226MG (TaiyoYuden)
C2012JB1A226M125AB (TDK)
EMK107BJ105KA (TaiyoYuden)
EMK107B7105KA (TaiyoYuden)
C1005JB1C105K050BC (TDK)
C1005X5R1C105K050BC (TDK)
C1608X7R1C105K080AC (TDK)
10V/10μF
CIN1
CL
10V/22μF
16V/1μF
CIN2
NOTE:
The minimum value of the CIN1 should be 10μF, and it is optimum to set a capacitance value depends on the input impedance.
The value of the CL should be within the range from 20μF to 47μF.
<Output Voltage Setting>
Output voltage can be set by adding external split resistors. Output voltage is determined by the following equation, based on the values of
RFB1 and RFB2. The sum of RFB1 and RFB2 should normally be 100kΩ or less. Output voltage range is 0.9V~5.5V by a 0.8V (±2.0%)
reference voltage. When input voltage (VIN) ≦setting output voltage, output voltage (VOUT) can not output the power more than input voltage (VIN).
V
OUT = 0.8 x (R1 + R2) / R2
The value of CFB, speed-up capacitor for phase compensation, should be fZFB= 1 / (2 x π x CFB x RFB1) which is equal to 20kHz. Adjustments
are required from 1kHz to 10kHz depending on the application, value of inductance (L), and value of load capacitance (CL).
[Example of calculation]
When RFB1=47kΩ, RFB2=15kΩ, VOUT=0.8×(47kΩ+15kΩ) / 15kΩ =3.3V
When CFB=330pF, fzfb= 1/(2×π×330pF×47 kΩ) =10.26kHz
VOUT
(V)
RFB1
RFB2
CFB
VOUT
(V)
RFB1
RFB2
CFB
(kΩ)
(kΩ)
(pF)
(kΩ)
(kΩ)
(pF)
1.0
1.2
1.5
1.8
7.5
15
26
30
30
30
30
24
2000
1000
560
2.5
3.0
3.3
5.0
51
33
47
43
24
12
15
8.2
300
470
330
390
510
6/16
XCL211/XCL212
Series
■OPERATIONAL DESCRIPTION
The XCL211/XCL212 series consists of a reference voltage source, ramp wave circuit, error amplifier, PWM comparator, phase compensation
circuit, output voltage adjustment resistors, P-channel MOS driver transistor, N-channel MOS switching transistor for the synchronous switch,
current limiter circuit, UVLO circuit and others. (See the BLOCK DIAGRAM below) The series ICs compare, using the error amplifier, the
voltage of the internal voltage reference source with the feedback voltage from the FB pin. Phase compensation is performed on the resulting
error amplifier output, to input a signal to the PWM comparator to determine the turn-on time during PWM operation. The PWM comparator
compares, in terms of voltage level, the signal from the error amplifier with the ramp wave from the ramp wave circuit, and delivers the resulting
output to the buffer driver circuit to cause the Lx pin to output a switching duty cycle. This process is continuously performed to ensure stable
output voltage. The current feedback circuit monitors the P-channel MOS driver transistor current for each switching operation, and modulates
the error amplifier output signal to provide multiple feedback signals. This enables a stable feedback loop even when a low ESR capacitor such
as a ceramic capacitor is used ensuring stable output voltage.
VOUT
CFB
L2
L1
LX
R1
R2
PVIN
AVIN
CE
V
IN
CL
FB
CIN1
CIN2
GND
VCE
<BLOCK DIAGRAM>
<Reference Voltage Source>
The reference voltage source provides the reference voltage to ensure stable output voltage of the DC/DC converter.
<Ramp Wave Circuit>
The ramp wave circuit determines switching frequency. The frequency is fixed internally and can be selected from 1.2MHz or 2.4MHz.
Clock pulses generated in this circuit are used to produce ramp waveforms needed for PWM operation, and to synchronize all the internal
circuits.
<Error Amplifier>
The error amplifier is designed to monitor output voltage. The amplifier compares the reference voltage with the feedback voltage divided by
the external split resistors, R1 and R2. When a voltage lower than the reference voltage is fed back, the output voltage of the error amplifier
increases. The gain and frequency characteristics of the error amplifier output are fixed internally to deliver an optimized signal to the mixer.
<Current Limit>
The XCL211/XCL212 series includes a fold-back circuit, which aids the operation of the current limiter and circuit protection. The
XCL211/XCL212 series monitors the current flowing through the P-channel MOS driver transistor
①When current flowing through P-channel MOS driver transistor reaches current limit ILIM, the current limiter circuit operates to limit the
inductor current ILX
.
If this state continues, the fold-back circuit operates and limit the output current in order to protect the IC from damage.
②The output voltage is automatically resumed if the load goes light. When it is resumed, the soft-start function operates.
7/16
XCL211/XCL212 series
■OPERATIONAL DESCRIPTION (Continued)
<Thermal Shutdown>
For protection against heat damage, the thermal shutdown function monitors chip temperature. When the chip’s temperature reaches 150OC
(TYP.), the thermal shutdown circuit starts operating and the P-channel driver transistor will be turned off. At the same time, the output voltage
decreases. When the temperature drops to 130OC (TYP.) after shutting off the current flow, the IC performs the soft start function to initiate
output startup operation.
< Function of CE pin >
The XCL211/212 series will enter into stand-by mode by inputting a low level signal to the CE pin. During a stand-by mode, the current
consumption of the IC becomes 0μA (TYP.). The IC starts its operation by inputting a high level signal to the CE pin. The input of the CE pin is
a CMOS input and the sink current is 0μA (TYP.).
<UVLO>
When the VIN pin voltage becomes 2.4V (TYP.) or lower, the P-channel MOS driver transistor output driver transistor is forced OFF to prevent
false pulse output caused by unstable operation of the internal circuitry. When the VIN pin voltage becomes 2.68V (MAX.) or higher, switching
operation takes place. By releasing the UVLO function, the IC performs the soft start function to initiate output startup operation. The soft start
function operates even when the VIN pin voltage falls momentarily below the UVLO operating voltage. The UVLO circuit does not cause a
complete shutdown of the IC, but causes pulse output to be suspended; therefore, the internal circuitry remains in operation.
<Soft Start>
The XCL211/XCL212 series provide 1.0ms (TYP). Soft start time is defined as the time interval to reach 90% of the output voltage from the time
when the VCE is turned on.
<CL High Speed Discharge>
The XCL211/XCL212 series can quickly discharge the electric charge at the output capacitor (CL) when a low signal to the CE pin which
enables a whole IC circuit put into OFF state, is inputted via the N-channel MOS switch transistor located between the LX pin and the VGND pin.
When the IC is disabled, electric charge at the output capacitor (CL) is quickly discharged so that it may avoid application malfunction. Discharge
time of the output capacitor (CL) is set by the CL auto-discharge resistance (R) and the output capacitor (CL). By setting time constant of a CL
auto-discharge resistance value [R] and an output capacitor value (CL) as τ(τ=C x R), discharge time of the output voltage after discharge via
the N-channel transistor is calculated by the following formulas.
V = VOUT(E)×e -t /τ or t = τln (VOUT(E) /V)
V : Output voltage after discharge
VOUT(E) : Output voltage
t: Discharge time
τ: CL×RDCHG
CL : Capacitance of Output capacitor
RDCHG : CL auto-discharge resistance
Output Voltage Dischage characteristics
RDCHG
= 130Ω(TYP.)
C =20
μF
L
5.0
4.5
4.0
3.5
3.0
2.5
2.0
1.5
1.0
0.5
0.0
VOUT =1.2V
V=1.8V
OUT
V
=3.3V
OUT
0
2
4
6
8
10 12 14 16 18 20
Discharge Time: t(ms)
8/16
XCL211/XCL212
Series
■OPERATIONAL DESCRIPTION (Continued)
<PFM Switch Current> (*1)
In PFM control operation, until coil current reaches to a specified level (IPFM), the IC keeps the P-channel MOS driver transistor on. In this
case, time that the P-channel MOS driver transistor is kept on (tON) can be given by the following formula. Please refer to IPFM①
t
ON = L × IPFM / (VIN - VOUT
)
<PFM Duty Limit> (*1)
In PFM control operation, the PFM duty limit (DTYLIMIT_PFM) is set to 200% (TYP.). Therefore, under the condition that the duty increases (e.g.
the condition that the step-down ratio is small), it’s possible for P-channel MOS driver transistor to be turned off even when coil current doesn’t
reach to IPFM. Please refer to IPFM
②
(*1) XCL211 Series is excluded.
Fig.
Fig.
9/16
XCL211/XCL212 series
■NOTE ON USE
1. Please use this IC within the stated maximum ratings. For temporary, transitional voltage drop or voltage rising phenomenon,
the IC is liable to malfunction should the ratings be exceeded.
2. Where wiring impedance is high, operations may become unstable due to noise and/or phase lag depending on output current.
Please wire the input capacitor (CIN) and the output capacitor (CL) as close to the IC as possible.
3. When the difference between VIN and VOUT is large in PWM control, very narrow pulses will be outputted, and there is the possibility that some
cycles may be skipped completely.
4. When the difference between VIN and VOUT is small, and the load current is heavy, very wide pulses will be outputted and there is the
possibility that some cycles may be skipped completely.
5. With the IC, the peak current of the coil is controlled by the current limit circuit. Since the peak current increases when dropout voltage or
load current is high, current limit starts operation, and this can lead to instability. When peak current becomes high, please adjust the coil
inductance value and fully check the circuit operation. In addition, please calculate the peak current according to the following formula:
Ipk = (VIN-VOUT)×OnDuty / (2×L×fOSC) + IOUT
L : Coil Inductance Value
fOSC: Oscillation Frequency
6. Use of the IC at voltages below the recommended voltage range may lead to instability.
7. This IC should be used within the stated absolute maximum ratings in order to prevent damage to the device.
8. When the IC is used in high temperature, output voltage may increase up to input voltage level at no load because of the leak current of the
P-channel driver transistor.
9. The XCL211/XCL212 uses fold-back circuit limiter. However, fold-back may become “droop” affected by the wiring conditions. Care must
be taken especially for CIN distance and position.
10. If CL capacitance reduction happens such as in the case of low temperature, the IC may enter unstable operation. Care must be taken for
CL capacitor selection and its capacitance value.
Ta = - 50
1ch VLx 2.0V/di
℃
：
ｖ
V = 3.6V, VOUT = 0.9V, fOSC = 2.4MHz
IN
CIN = 20 F(Ceramic)
μ
C = 14.7 F(Ceramic)
μ
L
IOUT = 300mA
2ch VOUT 50mV/di
：
ｖ
x-axis : 2.0μs / div
11. Torex places an importance on improving our products and its reliability.
However, by any possibility, we would request user fail-safe design and post-aging treatment on system or equipment.
10/16
XCL211/XCL212
Series
■NOTE ON USE(Continued)
12) Instructions of pattern layouts
(1) In order to stabilize VIN voltage level, we recommend that that a by-pass capacitor (CIN) be connected as close as possible to PVIN pin, AVIN
pin and GND pins.
(2) Make sure to avoid noise from the PVIN pin to the AVIN pin.
(3) Please mount each external component as close to the IC as possible.
(4) Wire external components as close to the IC as possible and use thick, short connecting traces to reduce the circuit impedance.
(5) Make sure that the PCB GND traces are as thick as possible, as variations in ground potential caused by high ground currents at the time of
switching may result in instability of the IC.
(6) This series’ internal driver transistors bring on heat because of the output current and ON resistance of P-channel and N-channel MOS
driver transistors.
<Reference Pattern Layout>
<1st>
<2nd>
<4th>
<3rd>
11/16
XCL211/XCL212 series
■TYPICAL PERFORMANCE CHARACTERISTICS
(1) Output Voltage vs. Output Current
VOUT=1.8
VOUT=3.3
Ｖ
Ｖ
2.0
1.9
1.8
1.7
1.6
3.5
3.4
3.3
3.2
3.1
VIN=5.0V
XCL211
VIN=3.7V,5.0V
XCL211
XCL212
XCL212
VIN=3.7V,5.0V
0.1
1
10
100
1000
10000
0.1
1
10
100
1000
10000
Output Current : IOUT (mA)
Output Current : IOUT (mA)
(2) Efficiency vs. Output Current
VOUT=1.8
VOUT=3.3
Ｖ
Ｖ
100
80
60
40
20
0
100
80
60
40
20
0
XCL212
XCL212
XCL211
VIN=5.0V
5.0V
VIN=3.7V
XCL211
100
0.1
1
10
1000
10000
0.1
1
10
100
1000 10000
Output Current : IOUT (mA)
Output Current : IOUT (mA)
(3) Ripple Voltage vs. Output Current
VOUT=1.8
VOUT=3.3
Ｖ
Ｖ
100
100
80
60
40
20
0
VIN=5.0V
80
XCL212
VIN=3.7V,5.0V
XCL211
VIN=3.7V,5.0V
60
40
20
0
XCL211
XCL212
0.1
1
10
100
1000
10000
0.1
1
10
100
1000
10000
Output Current : IOUT (mA)
Output Current : IOUT (mA)
12/16
XCL211/XCL212
Series
■TYPICAL PERFORMANCE CHARACTERISTICS (Continued)
(4) Output Voltage vs. Ambient Temperature
VOUT=1.8V
VOUT=3.3V
2.1
3.6
3.5
3.4
3.3
3.2
3.1
3.0
VOUT =3.3V
IOUT =1000mA
VOUT =1.8V
XCL212
XCL211
VIN=5.0V
IOUT =1000mA
VIN=3.3V,5.0V
2.0
1.9
1.8
1.7
1.6
1.5
XCL211
VIN=3.0V,5.0V
XCL212
VIN=5.0V
-50 -25
0
25
50
75 100 125
-50 -25
0
25
50
75 100 125
Ambient Temperature : Ta (℃)
Ambient Temperature : Ta (℃)
(5) Oscillation Frequency vs. Ambient Temperature
XCL211B082DR VOUT=1.8V
XCL211B082DR VOUT=3.3V
2.8
2.8
2.7
2.6
2.5
2.4
2.3
2.2
2.1
2.0
VOUT =1.8V
IOUT =1mA
VOUT =3.3V
IOUT =1mA
2.7
2.6
2.5
2.4
2.3
2.2
2.1
2.0
VIN=3.0V
VIN=4.0V
VIN=4.0V
VIN=5.0V
VIN=5.0V
-50 -25
0
25
50
75 100 125
-50 -25
0
25
50
75 100 125
Ambient Temperature : Ta (℃)
Ambient Temperature : Ta (℃)
(6) Load Transient Response
XCL211B082DR Vout=1.8V
XCL212B082DR Vout=1.8V
VOUT =1.8V
VOUT =1.8V
1
2
1
2
IOUT =1mA⇔2000mA
IOUT =1mA⇔2000mA
1ch:100mV/div, 2ch:IOUT SW 2.0V/div, H:100us/div
1ch:100mV/div, 2ch:IOUT SW 2.0V/div, H:100us/div
13/16
XCL211/XCL212 series
■PACKAGING INFORMATION
●USP-11B01 (unit:mm)
1pin INDENT
3.1±0.1
(1.9)
(0.2)
(0.9)
1.0±0.05
(0.3)
10
11
3
2
1
4
5
6
9
8
7
0.25±0.05
(0.3)
(0.2)
(0.5)
(0.8)
2.2±0.1
●USP-11B01 Reference Pattern Layout (unit: mm)
●USP-11B01 Reference Metal Mask Design (unit: mm)
14/16
XCL211/XCL212
Series
■MARKING RULE
●USP-11B01
① represents product series
MARK
PRODUCT SERIES
XCL211******
C
D
XCL212******
② represents integer of the reference voltage
MARK
A
OUTPUT VOLTAGE (V)
0.8 (fix)
PRODUCT SERIES
XCL21**08***
③ represents oscillation frequency
MARK
2
OSCILLATION FREQUENCY (MHz)
2.4
PRODUCT SERIES
XCL21****2**
④⑤ represents production lot number
01 to 09, 0A to 0Z, 11 to 9Z, A1 to A9, AA to AZ, B1 to ZZ repeated
(G, I, J, O, Q, W excluded)
*No character inversion used.
15/16
XCL211/XCL212 series
1. The products and product specifications contained herein are subject to change without
notice to improve performance characteristics. Consult us, or our representatives
before use, to confirm that the information in this datasheet is up to date.
2. We assume no responsibility for any infringement of patents, patent rights, or other
rights arising from the use of any information and circuitry in this datasheet.
3. Please ensure suitable shipping controls (including fail-safe designs and aging
protection) are in force for equipment employing products listed in this datasheet.
4. The products in this datasheet are not developed, designed, or approved for use with
such equipment whose failure of malfunction can be reasonably expected to directly
endanger the life of, or cause significant injury to, the user.
(e.g. Atomic energy; aerospace; transport; combustion and associated safety
equipment thereof.)
5. Please use the products listed in this datasheet within the specified ranges.
Should you wish to use the products under conditions exceeding the specifications,
please consult us or our representatives.
6. We assume no responsibility for damage or loss due to abnormal use.
7. All rights reserved. No part of this datasheet may be copied or reproduced without the
prior permission of TOREX SEMICONDUCTOR LTD.
16/16
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