XD6130A241MR-Q [TOREX]
Watchdog Timeout Period Externally Adjustable Voltage Detector;
| 型号： | XD6130A241MR-Q |
| 厂家： | 
Torex Semiconductor |
| 描述： | Watchdog Timeout Period Externally Adjustable Voltage Detector |
| 文件： | 总30页 (文件大小：1102K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
XD6130/XD6131Series
Watchdog Timeout Period Externally Adjustable Voltage Detector
ETR02039-003
☆AEC-Q100 Grade1
■ GENERAL DESCRIPTION
The XD6130/XD6131 series are voltage detectors with a watchdog function. The watchdog timeout time and release delay
time can be set as desired using a single external capacitor. These voltage detectors are used for microprocessor monitoring,
and when the power voltage reaches the detect voltage or an L→H pulse is not input to the watchdog pin within the watchdog
timeout time, an L level signal is output from the RESETB pin.
The XD6130 series has a manual reset function. When the manual reset pin is set to Low level at any desired timing, an L level
signal is output from the RESETB pin.
The XD6131 series has a watchdog ON/OFF function. By setting the EN pin to L level, the watchdog function can be turned
OFF while the voltage detector that monitors the power voltage continues to operate.
The MRB pin and EN pin are pulled up internally to VIN, and thus these pins can be left open when not used.
■FEATURES
■APPLICATIONS
Operating Ambient Temperature : -40℃～+125℃
●Microprocessor reset and malfunction monitoring circuitry
●Memory battery backup circuits
●Power-on reset circuits
Operating Voltage Range
Detect Voltage (Standard)
: 1.5V～6.0V
: 1.6V,2.2V,2.3V,2.4V,2.9V,3.0V,
3.1V,4.4V,4.5V,4.6V,±1.0%
●Power failure detection
Detect Voltage Range(Option) : 1.6V～5.0V (±1.0％)
Hysteresis Width
: VDFL×5％
Temperature Characteristics
Output Configuration
Low Power Consumption
: ±50ppm/℃
: N-channel open drain output
: 8.1μA Detect
9.8μA Release
2.5μA Release (EN=L)
: Manual Reset (XD6130)
: Watchdog function OFF (XD6131)
: 100ms (Cd=0.1μF)
: 100ms (Cd=0.1μF) (at power on)
10ms (Cd=0.1μF)
Function
WD Timeout Time
Release Delay Time
(After Watchdog Timeout)
: SOT-26
Package
Environmentally Friendly
: EU RoHS compliant, Pb free
■TYPICAL APPLICATION CIRCUIT
■TYPICAL PERFORMANCE
CHARACTERISTICS
XD6130 Series
Cd=0.01μF, WD=RESETB=OPEN, Ta=25℃
EN=VSS(WD Function OFF)
EN=VIN (WD Function ON)
XD6131A301MR-Q
14
12
10
8
WD Function ON
WD Function OFF
6
4
XD6131 Series
2
0
0
1
2
3
4
5
6
Input Voltage:VIN(V)
The above values do not include the current that flows to the EN pull-up resistance.
1/30
XD6130/XD6131 Series
■BLOCK DIAGRAM
●XD6130 Series Type A
VIN
RH
RX
RY
-
+
RESETB
RESET
LOGIC
RMR
Voltage
Reference
VSS
MRB
Cd
LOGIC
+
-
L→H PULSE
DETECT LOGIC
Voltage
Reference
RWD
WD
Cd
● XD6131 Series Type A
VIN
RH
RX
RY
-
+
RESET
LOGIC
RESETB
RMR
Voltage
Reference
VSS
EN
Cd
LOGIC
+
-
L→H PULSE
DETECT LOGIC
Voltage
Reference
RWD
WD
Cd
* Diodes inside the circuit are an ESD protection diode and a parasitic diode.
2/30
XD6130/XD6131
Series
■BLOCK DIAGRAM
● XD6131 Series Type B
VIN
RH
RX
RY
-
+
RESET
LOGIC
RESETB
Voltage
Reference
VSS
ENB
Cd
LOGIC
RENB
+
-
L→H PULSE
DETECT LOGIC
Voltage
Reference
RWD
WD
Cd
* Diodes inside the circuit are an ESD protection diode and a parasitic diode.
3/30
XD6130/XD6131 Series
■PRODUCT CLASSIFICATION
●Ordering Information
XD6130①②③④⑤⑥-⑦
DESIGNATOR
ITEM
SYMBOL
DESCRIPTION
①
②③
④
TYPE
A
16～50
1
MRB pin With pull-up resistor
e.g. 1.6V → ②=1, ③=6
±1.0％
Detect Voltage
Detect Accuracy
Package (Order Unit)
(*1)
⑤⑥-⑦
MR-Q
SOT-26 (3000pcs/Reel)(*2)
(*1) The “-Q” suffix denotes “AEC-Q100” and “Halogen and Antimony free” as well as being fully EU RoHS compliant.
(*2) The SOT-26 reels are shipped in a moisture-proof packing.
XD6131①②③④⑤⑥-⑦
DESIGNATOR
ITEM
TYPE
SYMBOL
DESCRIPTION
A
B
EN pin With pull up resistor
ENB pin With pull down resistor
e.g. 1.6V → ②=1, ③=6
±1.0％
①
②③
④
Detect Voltage
Detect Accuracy
16～50
1
(*1)
⑤⑥-⑦
Package (Order Unit)
MR-Q
SOT-26 (3000pcs/Reel)(*2)
(*1) The “-Q” suffix denotes “AEC-Q100” and “Halogen and Antimony free” as well as being fully EU RoHS compliant.
(*2) The SOT-26 reels are shipped in a moisture-proof packing.
●Detect Voltage (Standard)
Detect
Detect
Part No.
TYPE
Part No.
TYPE
Voltage
1.6V
2.2V
2.3V
2.4V
2.9V
3.0V
3.1V
4.4V
4.5V
4.6V
Voltage
XD6130A161MR-Q
XD6130A221MR-Q
XD6130A231MR-Q
XD6130A241MR-Q
XD6130A291MR-Q
XD6130A301MR-Q
XD6130A311MR-Q
XD6130A441MR-Q
XD6130A451MR-Q
XD6130A461MR-Q
XD6131A161MR-Q
XD6131A221MR-Q
XD6131A231MR-Q
XD6131A241MR-Q
XD6131A291MR-Q
XD6131A301MR-Q
XD6131A311MR-Q
XD6131A441MR-Q
XD6131A451MR-Q
XD6131A461MR-Q
XD6131B161MR-Q
XD6131B221MR-Q
XD6131B231MR-Q
XD6131B241MR-Q
XD6131B291MR-Q
XD6131B301MR-Q
XD6131B311MR-Q
XD6131B441MR-Q
XD6131B451MR-Q
XD6131B461MR-Q
1.6V
2.2V
2.3V
2.4V
2.9V
3.0V
3.1V
4.4V
4.5V
4.6V
1.6V
2.2V
2.3V
2.4V
2.9V
3.0V
3.1V
4.4V
4.5V
4.6V
MRB pin With
pull-up resistor
EN pin With
pull-up resistor
ENB pin With
pull-down resistor
For another type of detect voltage, please contact your local Torex sales office or representative.
Output voltages can be set internally from 1.6V to 5.0V.
4/30
XD6130/XD6131
Series
■PIN CONFIGURATION
XD6130 series
XD6131 series
■PIN ASSIGNMENT
XD6130 Series
PIN NUMBER
PIN NAME
SOT-26
FUNCTIONS
1
2
3
4
5
WD
MRB
VIN
Watchdog Input
Manual Reset Input
Power Input
RESETB
VSS
Reset Output
Ground
Adjustable Pin for Release Delay
Time/Watchdog Timeout
6
Cd
XD6131 Series
PIN NUMBER
SOT-26
PIN NAME
FUNCTIONS
1
2
WD
EN
Watchdog Input
Watchdog ON/OFF Control (XD6131A)
Watchdog ON/OFF Control (XD6131B)
Power Input
ENB
VIN
3
4
5
RESETB
VSS
Reset Output
Ground
Adjustable Pin for Release Delay
Time/Watchdog Timeout
6
Cd
5/30
XD6130/XD6131 Series
■FUNCTION CHART
1) XD6130 Series
*2
*3
*6
*7
*7
*7
VIN
VMRB
VWD
H
VRESETB
L⇔H
L
H
H
OPEN
H
L
L
L
L⇔H
L
L
H
L
*1
H
2) XD6131A Series
*2
*4
*6
VIN
VEN
VWD
VRESETB
H
L⇔ H
L
H
H
OPEN
L⇔ H
H
H
L
L
L
H
L
*1
H
L
3) XD6131B Series
*2
*5
*6
VIN
VENB
VWD
VRESETB
H
L⇔ H
L
H
L
OPEN
L⇔ H
H
H
L
H
L
H
L
* 1
H
L
*1: Includes all WD logic (VWD=H, L, OPEN, H→L, L→H)
*2: VIN=H indicates higher than the release voltage.
VIN=L indicates lower than the detect voltage.
*3: VMRB=H indicates MRB High Level Voltage.
VMRB=L indicates MRB Low Level Voltage.
Since MRB pin of XD6130 Series is pulled up internally, the open condition of MRB pin is acceptable when MR function is not required.
*4: VEN=H indicates EN High Level Voltage.
VEN=L indicates EN Low Level Voltage.
The EN pin of the XD6131A Series is pulled up internally, enabling the WD function to be used with EN open.
*5: VENB=H indicates ENB High Level Voltage.
V
ENB=L indicates ENB Low Level Voltage.
The ENB pin of the XD6131B Series is pulled down internally, enabling the WD function to be used with ENB open.
*6: VWD=H indicates WD High Level Voltage.
VWD=L indicates WD Low Level Voltage.
*7: VRESETB=H indicates the release state.
VRESETB=L indicates the detect state.
6/30
XD6130/XD6131
Series
■ ABSOLUTE MAXIMUM RATINGS
Ta=25℃
XD6130 Series
PARAMETER
SYMBOL
RATINGS
UNITS
Input Voltage
WD Input Voltage
MRB Input Voltage
Cd Pin Voltage
Output Voltage
Cd Pin Current
Output Current
VIN
VWD
VMRB
VCd
-0.3～+7.0
V
V
-0.3～+7.0
-0.3～+7.0
V
-0.3～+VIN+0.3 or +7.0(*1)
V
VRESETB
ICd
-0.3～+7.0
V
10
30
mA
mA
mW
IOUT
Power Dissipation
SOT-26
Pd
250
Operating Ambient
Temperature
Topr
Tstg
-40～+125
-55～+125
℃
℃
Storage Temperature
All voltages are described based on the VSS pin.
(*1) The maximum value should be VIN+0.3 or +7.0 in the lowest.
Ta=25℃
XD6131 Series
PARAMETER
SYMBOL
RATINGS
UNITS
Input Voltage
WD Input Voltage
EN/ENB Input Voltage
Cd Pin Voltage
VIN
VWD
-0.3～+7.0
V
V
-0.3～+7.0
VEN/VENB
VCd
-0.3～+7.0
V
-0.3～+VIN+0.3 or +7.0(*1)
V
Output Voltage
VRESETB
ICd
-0.3～+7.0
V
Cd Pin Current
10
30
mA
mA
mW
Output Current
IOUT
Power Dissipation
SOT-26
Pd
250
Operating Ambient
Topr
Tstg
-40～+125
-55～+125
℃
℃
Temperature
Storage Temperature
All voltages are described based on the VSS pin.
(*1) The maximum value should be VIN+0.3 or +7.0 in the lowest.
7/30
XD6130/XD6131 Series
■ELECTRICAL CHARACTERISTICS
XD6130 Series
Ta=25℃
-40℃≦Ta≦125℃(*9)
PARAMETER
SYMBOL
CONDITIONS
UNITS
CIRCUIT
MIN.
1.5
TYP.
-
MAX.
6.0
MIN.
TYP.
-
MAX.
Operating Voltage
VIN
1.5
6.0
V
V
VDF(T)
×0.99
VDF(T)
×1.01
VDF(T)
VDF(T)
Detect Voltage
VDFL
VDF(T)(*1)=1.6～5.0V
-40℃≦Topr≦125℃
VDF(T)
±50
VDF(T)
±50
×0.975
×1.025
①
②
Temperature
∆VDFL
/
-
-
-
-
ppm /
V
℃
Characteristics
(∆Topr VDFL)
・
Hysteresis
Width
VDFL
VDFL
VDFL
VDFL
VDFL
VDFL
VHYS
Iss
×0.04
×0.05
×0.06
×0.03
×0.05
×0.07
VIN=VDF(T) ×0.9V
VIN=VDF(T) ×1.1V
-
8.1
9.8
12.1
-
8.1
9.8
14.0
Supply Current
μA
-
12.6
-
13.6
VIN=1.5V
2.6
4.9
9.2
12.3
3.5
-
-
-
-
1.4
3.0
5.8
7.7
3.5
-
-
-
-
VIN=2.0V(*2)
VIN=3.0V(*3)
VIN=4.0V(*4)
6.0
6.0
N-ch.
RESETB=0.3V
Output Current
IRBOUT
mA
③
④
V
10.3
13.8
10.3
13.8
Leak Current
Cd Pin Sink Current
Release Delay
Time1(*5)
ILeak
Icd
VIN=6.0V,VRESETB=6.0
VIN=1.5V, VCd=0.7V
-
0.01
770
0.1
-
-
0.01
770
1
-
μA
530
295
tDR1
VIN=1.5V→VDF T)×1.1V, Cd=0.01μF
8.5
10.0
1.0
11.5
1.15
7
10.0
1.0
12
（
Release Delay
Time2(*6)
tDR2
VIN=VDF T)×1.1V, Cd=0.01μF
0.85
0.7
1.2
ms
（
⑤
Watchdog Timeout
Period(*7)
Detect Delay Time(*8)
VIN=VDF（T)×1.1V,
tWD
tDF
8.5
-
10.0
10.0
11.5
50
7
-
10.0
10.0
12
Cd=0.01μF,WD=VSS
VIN=VDF T)×1.1V→1.5V, Cd=0.01μF
100
μs
（
Watchdog
VIN=6.0V,
Minimum
tWDIN
Apply pulse from 6.0V to 0V
to the WD pin.
100
-
-
100
-
-
ns
Pulse Width
Watchdog
⑥
VWDH
VWDL
RWD
VIN=VDF（T)×1.1V→6.0V
VIN=VDF（T)×1.1V→6.0V
VWD=6.0V, RWD=VWD/IWD
VIN×0.7
0
-
6
VIN×0.7
0
-
6
V
V
High Level Voltage
Watchdog
Low Level Voltage
Watchdog
-
550
-
VIN×0.3
1100
VIN
-
550
-
VIN×0.3
1350
VIN
280
1.3
0
220
1.3
0
kΩ
V
⑦
⑧
Pull-down Resistance
MRB High Level
Voltage
VMRH
VMRL
RMR
VIN=VDF（T)×1.1V～6.0V
MRB Low Level
Voltage
-
0.45
-
0.45
V
MRB Pull-up
Resistance
VIN=6.0V,
300
800
1200
230
800
1420
kΩ
⑨
⑩
V
MRB=0V, RMR=VIN/IMRB
VIN=6.0V,
MRB Minimum
Pulse Width
tMRIN
Apply pulse from 6.0V to 0V
to the MRB pin.
1.0
-
-
1.0
-
-
μs
NOTE:
*The WD pin and MRB pin are open unless otherwise specified in the measurement conditions.
(*1)
V
: Nominal detect voltage
DF(T)
(*2) For VDF(T)＞2.0V products only.
(*3) For VDF(T)＞3.0V products only.
(*4) For VDF(T)＞4.0V products only.
(*5) Until time when RESETB pin shows release status after VIN reached the release voltage.
Release voltage (VDR) = Detect voltage (VDFL) + Hysteresis width (VHYS
(*6) The time to change the status of RESETB pin from the detect-status after the watchdog-timeout happens with the condition of WD=VSS
(*7) The time to change the status of RESETB pin from the release-status to the detect-status with the condition of WD=VSS
)
.
.
(*8) When VIN is changed during watchdog timeout time, until time when RESETB pin shows detect status after VIN reached the detect voltage.
(*9) The ambient temperature range (-40℃≦Ta≦125℃) is design Value.
8/30
XD6130/XD6131
Series
■ELECTRICAL CHARACTERISTICS (Continued)
XD6131A Series
Ta=25℃
-40℃≦Ta≦125℃(*10)
PARAMETER
SYMBOL
CONDITIONS
UNITS CIRCUIT
MIN.
1.5
TYP.
-
MAX.
6.0
MIN.
1.5
TYP.
-
MAX.
6.0
Operating Voltage
VIN
V
V
VDF(T)
×0.99
VDF(T)
×1.01
VDF(T)
VDF(T)
Detect Voltage
VDFL
VDF(T)(*1)=1.6～5.0V
-40℃≦Topr≦125℃
VDF(T)
VDF(T)
×0.975
×1.025
①
Temperature
∆VDFL
/
-
±50
-
-
±50
-
ppm /
V
℃
Characteristics
(∆Topr VDFL)
・
Hysteresis
Width
VDFL
VDFL
VDFL
VDFL
VDFL
VDFL
VHYS
×0.04
×0.05
×0.06
×0.03
×0.05
×0.07
VIN=VDF(T) ×0.9V
-
-
8.1
2.5
12.1
-
8.1
2.5
14.0
Supply Current
Iss
EN=L(*2)
3.5
-
5.0
μA
②
VIN=VDF(T)×1.1V
EN=H
-
9.8
12.6
-
9.8
13.6
VIN=1.5V
VIN=2.0V(*2)
VIN=3.0V(*3)
VIN=4.0V(*4)
2.6
4.9
9.2
12.3
3.5
-
-
-
-
1.4
3.0
5.8
7.7
3.5
-
-
-
-
6.0
6.0
N-ch.
RESETB=0.3V
Output Current
IRBOUT
mA
③
④
V
10.3
13.8
10.3
13.8
Leakage Current
Cd Pin Sink Current
Release Delay
Time1(*6)
ILeak
Icd
VIN=6.0V, VRESETB=6.0V
VIN=1.5V, VCd=0.7V
-
0.01
770
0.1
-
-
0.01
770
μA
530
295
-
tDR1
VIN=1.5V→VDF T)×1.1V, Cd=0.01μF
8.5
10.0
1.0
11.5
1.15
7
10.0
1.0
12
（
Release Delay
Time2(*7)
tDR2
VIN=VDF T)×1.1V, Cd=0.01μF
0.85
0.7
1.2
12
（
ms
⑤
Watchdog Timeout
Period(*8)
VIN=VDF（T)×1.1V,
tWD
8.5
-
10.0
10.0
11.5
50
7
-
10.0
10.0
Cd=0.01μF, WD=VSS
Detect Delay
Time(*9)
tDF
VIN=VDF T)×1.1V→1.5V, Cd=0.01μF
100
μs
（
Watchdog
Minimum
VIN=6.0V,
tWDIN
Apply pulse from 6.0V to 0V
to the WD pin.
100
-
-
100
-
-
ns
Pulse Width
Watchdog
⑥
⑦
VWDH
VDF(T)×1.1V≦VIN≦6.0V
VDF(T)×1.1V≦VIN≦6.0V
VIN×0.7
0
-
-
6
VIN×0.7
0
-
-
6
V
V
High Level Voltage
Watchdog
VWDL
VIN×0.3
VIN×0.3
Low Level Voltage
Watchdog
Pull-down
Resistance
RWD
VWD=6.0V, RWD=VWD/IWD
280
550
1100
220
550
1350
kΩ
EN High Level Voltage
EN Low Level Voltage
VENH
VENL
REN
1.3
0
-
-
VIN
1.3
0
-
-
VIN
V
V
⑧
⑨
VIN=VDF(T)×1.1V～6.0V
0.45
1200
0.45
1420
EN Pull-up Resistance
VIN=6.0V, VEN=0V, REN=VIN/IEN
300
800
230
800
kΩ
NOTE:
* The WD pin and EN pin are open unless otherwise specified in the measurement conditions.
(*1)
V
: Nominal detect voltage
DF(T)
(*2) Excludes the current that flows to EN pull-up resistance when EN = L.
(*3) For VDF(T)＞2.0V products only.
(*4) For VDF(T)＞3.0V products only.
(*5) For VDF(T)＞4.0V products only.
(*6) Until time when RESETB pin shows release status after VIN reached the release voltage.
Release voltage (VDR) = Detect voltage (VDFL) + Hysteresis width (VHYS
)
(*7) The time to change the status of RESETB pin from the detect-status after the watchdog-timeout happens with the condition of WD=VSS
.
(*8) The time to change the status of RESETB pin from the release-status to the detect-status with the condition of WD=VSS
.
(*9) When VIN is changed during watchdog timeout time, until time when RESETB pin shows detect status after VIN reached the detect voltage.
(*10) The ambient temperature range (-40℃≦Ta≦125℃) is design Value.
9/30
XD6130/XD6131 Series
■ELECTRICAL CHARACTERISTICS (Continued)
XD6131B Series
Ta=25℃
-40℃≦Ta≦125℃(*10)
PARAMETER
SYMBOL
CONDITIONS
UNITS CIRCUIT
MIN.
1.5
TYP.
-
MAX.
6.0
MIN.
TYP.
-
MAX.
Operating Voltage
VIN
1.5
6.0
V
VDF(T)
×0.99
VDF(T)
×1.01
VDF(T)
VDF(T)
Detect Voltage
VDFL
VDF(T)(*1)=1.6～5.0V
VDF(T)
±50
VDF(T)
±50
V
×0.975
×1.025
①
Temperature
∆VDFL
/
-40℃≦Topr≦125℃
-
-
-
-
ppm /℃
Characteristics
(∆Topr VDFL)
・
VDFL
VDFL
VDFL
VDFL
VDFL
VDFL
Hysteresis Width
VHYS
V
×0.04
×0.05
×0.06
×0.03
×0.05
×0.07
VIN=VDF(T) ×0.9V
-
-
8.1
2.5
12.1
-
8.1
2.5
14.0
Supply Current
Iss
ENB=H(*2)
3.5
-
5.0
μA
②
VIN=VDF(T)×1.1V
ENB=L
-
9.8
3.5
6.0
12.6
-
9.8
13.6
VIN=1.5V
2.6
4.9
9.2
-
-
-
1.4
3.0
5.8
3.5
-
-
-
-
VIN=2.0V(*2)
VIN=3.0V(*3)
VIN=4.0V(*4)
6.0
N-ch.
Output Current
IRBOUT
mA
③
④
VRESETB=0.3V
10.3
10.3
12.3
-
13.8
0.01
770
-
0.1
-
7.7
-
13.8
0.01
770
Leakage Current
Cd Pin Sink Current
Release Delay
Time1(*6)
ILeak
Icd
VIN=6.0V, VRESETB=6.0V
VIN=1.5V, VCd=0.7V
μA
530
295
-
tDR1
VIN=1.5V→VDF T)×1.1V, Cd=0.01μF
8.5
10.0
1.0
11.5
1.15
7
10.0
1.0
12
（
Release Delay
Time2(*7)
tDR2
VIN=VDF T)×1.1V, Cd=0.01μF
0.85
0.7
1.2
12
（
ms
⑤
Watchdog Timeout
Period(*8)
VIN=VDF（T)×1.1V,
tWD
8.5
-
10.0
10.0
11.5
50
7
-
10.0
10.0
Cd=0.01μF, WD=VSS
Detect Delay
Time(*9)
tDF
VIN=VDF T)×1.1V→1.5V, Cd=0.01μF
100
μs
（
Watchdog
Minimum
VIN=6.0V,
tWDIN
Apply pulse from 6.0V to 0V
to the WD pin.
100
-
-
100
-
-
ns
Pulse Width
Watchdog
⑥
VWDH
VDF(T)×1.1V≦VIN≦6.0V
VDF(T)×1.1V≦VIN≦6.0V
VIN×0.7
0
-
-
6
VIN×0.7
0
-
-
6
V
V
High Level Voltage
Watchdog
VWDL
VIN×0.3
VIN×0.3
Low Level Voltage
Watchdog
Pull-down
Resistance
RWD
VWD=6.0V, RWD=VWD/IWD
280
550
1100
220
550
1350
kΩ
⑦
⑧
ENB High Level Voltage
ENB Low Level Voltage
VENBH
VENBL
1.3
0
-
-
VIN
1.3
0
-
-
VIN
V
V
VIN=VDF（T)×1.1V～6.0V
0.45
0.45
⑨
ENB Pull-down
Resistance
RENB
VENB=6.0V, RENB=VENB/IENB
300
800
1200
230
800
1420
kΩ
NOTE:
*The WD pin and ENB pin are open unless otherwise specified in the measurement conditions.
(*1)
V
: Nominal detect voltage
DF(T)
(*2) Excludes the current that flows to the EN pull-down resistance when ENB = H.
(*3) For VDF(T)＞2.0V products only.
(*4) For VDF(T)＞3.0V products only.
(*5) For VDF(T)＞4.0V products only.
(*6) Until time when RESETB pin shows release status after VIN reached the release voltage.
Release voltage (VDR) = Detect voltage (VDFL) + Hysteresis width (VHYS
)
(*7) The time to change the status of RESETB pin from the detect-status after the watchdog-timeout happens with the condition of WD=VSS
.
(*8) The time to change the status of RESETB pin from the release-status to the detect-status with the condition of WD=VSS
.
(*9) When VIN is changed during watchdog timeout time, until time when RESETB pin shows detect status after VIN reached the detect voltage.
(*10) The ambient temperature range (-40℃≦Ta≦125℃) is design Value.
10/30
XD6130/XD6131
Series
■ TEST CIRCUITS
CIRCUIT①
CIRCUIT②
CIRCUIT③
CIRCUIT④
CIRCUIT⑤
VIN
100ｋΩ
MRB/EN/ENB
RESETB
Waveform
Measure
Point
Cd
WD
VSS
11/30
XD6130/XD6131 Series
■ TEST CIRCUITS (Continued)
CIRCUIT⑥
VIN
tWDIN
100ｋΩ
WD
VIN×0.7
MRB/EN/ENB
RESETB
Cd
Waveform
Measure
Point
VIN×0.3
RESETB
WD
VSS
(VDFL
)
tDR2
tWD
tDR2
CIRCUIT⑦
CIRCUIT⑧
CIRCUIT⑨
IMRB
IEN
IENB
VIN
MRB/EN/ENB
A
RESETB
Cd
WD
VSS
CIRCUIT⑩
tMRIN
MRB
VIN
100ｋΩ
MRB
RESETB
Waveform
Measure
Point
Cd
RESETB
（VDFL
tDR2
)
WD
VSS
12/30
XD6130/XD6131
Series
■OPERATIONAL EXPLANATION
In the XD6130/XD6131 Series, the voltage divided by RH, RX, and RY connected to the VIN pin is compared to the internal reference
voltage by the comparator, and the resulting output signal drives the watchdog logic and output driver. The VIN pin voltage is gradually
lowered, and when the VIN pin voltage reaches the detect voltage, H→L level signal is output to the reset output pin (VDFL type).
VIN
RH
-
RX
RY
+
RESETB
RESET
LOGIC
RMR
Voltage
Reference
VSS
MRB
Cd
LOGIC
+
-
L→H PULSE
DETECT LOGIC
Voltage
Reference
RWD
WD
Cd
XD6130 Series
<Output signal of reset output pin>
If the VIN pin voltage is below the detect voltage, the reset output pin outputs H→L level signal.
After the VIN pin voltage reaches the release voltage, the reset output pin holds L level during release delay time1 (tDR1). If a start signal is
not input to the WD pin within the watchdog timeout time, the reset output pin holds L level during release delay time 2 (tDR2) and then
outputs H level signal.
<Hysteresis>
If the internal comparator outputs L level signal, the PMOS transistor connected in parallel to RH turns ON and the hysteresis circuit
activates. The hysteresis voltage width is obtained from the difference between the detect voltage and the release voltage.
The hysteresis width is (VDFL×0.05) V (TYP.).
<WD pin>
A watchdog timer is used to detect abnormal operation and runaway in a microprocessor. If “L→H” signal is not input from the
microprocessor within the watchdog timeout time, the reset output pin holds the detect state during release delay time 2 (tDR2), and then L →
H level signal is output to the reset output pin.
In addition, the watchdog pin is pulled down internally to VSS, and when the watchdog pin is OPEN, a reset signal is output after the
watchdog timeout time.
The watchdog timeout time (tWD) can be set using the equation below.
t
WD＝Cd×106
Example: When Cd is 0.1μF, tWD=0.1×10-6×106 = 100ms (TYP.)
13/30
XD6130/XD6131 Series
■OPERATIONAL EXPLANATION (Continued)
<Release delay time 1>
When power is added on the VIN, the time from the point that VIN reaches the release voltage until the reset output pin reaches the release
voltage is release delay time 1 (tDR1).
Release delay time 1 (tDR1) can be set using the equation below.
t
DR1=Cd×106
Example: When Cd is 0.1μF, tDR1= 0.1×10-6×106=100ms (TYP.)
<Release delay time 2>
Release delay time 2 (tDR2) is the duration of the detect state until the watchdog timer restarts when “L → H” signal is not input to the WD pin
within the watchdog timeout time.
Release delay time 2 (tDR2) can be set using the equation below.
t
DR2=Cd×105
Example: When Cd is 0.1μF, tDR2=0.1×10-6×105=10ms (TYP.)
<Detect delay time>
The detect delay time (tDF) is the time until the VIN pin voltage drops to the detect voltage and the reset output pin enters the detect state.
<MRB pin> *XD6130 Series
The MRB pin voltage can be input to force the signal of the reset output pin to the detect state.
When the MRB pin voltage input reaches an H→L level signal, an H→L level signal is output to the reset output pin. After the MRB pin voltage
reaches L→H level, the reset output pin holds the detect state during release delay time 1(tDR1).
<EN pin>
*XD6131A Series
If the watchdog function will not be used, the EN pin can be set to L level to forcibly stop only the watchdog function and keep the voltage
detector operating. When using the watchdog function, use the EN pin at H level. If the input voltage and EN pin voltage reach L→H level,
the reset output pin holds the detect state during release delay time 1 (tDR1). (Refer to Timing Chart 2, ①)
If the input voltage is higher than the release voltage and the EN pin voltage reaches L→H level, the watchdog function recovers. (Refer to
Timing Chart 2, ②)
<ENB Pin> *XD6131B Series
When the watchdog function is not used, the ENB pin can be set to H level to keep the voltage detector operating and forcibly stop only the
watchdog function. To use the watchdog function, use the ENB pin at L level. When the input voltage and ENB pin voltage reach H→L level,
the reset output pin holds the detect state during release delay time 1 (tDR1). (Refer to Timing Chart 3, ①)
When the input voltage is higher than the release voltage and the ENB pin voltage reaches H→L level, the watchdog function recovers. (Refer
to Timing Chart 3, ②)
14/30
XD6130/XD6131
Series
■OPERATIONAL EXPLANATION (Continued)
<Timing Chart 1>
XD6130 Series
15/30
XD6130/XD6131 Series
■OPERATIONAL EXPLANATION (Continued)
<Timing Chart 2>
XD6131A Series
VIN
VDR Level
VIN Pin Wave Form
Hysterisis Range
VDF Level
Min.Operating Voltage
GND
EN Pin Wave Form
EN
GND
tWD>tWDIN
WD
WD Pin Wave Form
tWD
tWD
tWD
tWD
GND
Cd Pin Wave Form
Cd HIGH Level
Cd Low Level
GND
RESETB Pin Wave Form
VDR Level
VDF Level
Min.Operating Voltage
GND
Unstable
tDR2
tDR1
tDR2
tDR2
①
②
16/30
XD6130/XD6131
Series
■OPERATIONAL EXPLANATION(Continued)
<Timing Chart 3>
XD6131B Series
VIN
VDR Level
VIN Pin Wave Form
Hysterisis Range
VDF Level
Min.Operating Voltage
GND
ENB
ENB Pin Wave Form
GND
tWD>tWDIN
WD
WD Pin Wave Form
tWD
tWD
tWD
tWD
GND
Cd Pin Wave Form
Cd HIGH Level
Cd Low Level
GND
RESETB Pin Wave Form
VDR Level
VDF Level
Min.Operating Voltage
GND
Unstable
tDR1
tDR2
tDR2
tDR2
①
②
17/30
XD6130/XD6131 Series
■NOTES ON USE
1. Use this IC within the absolute maximum ratings. Risk of deterioration or damage if the absolute maximum ratings are exceeded during
temporary or transient voltage drops or voltage jumps.
2. If a resistance is added between the power and the VIN pin, the flowthrough current when the IC operates will cause the VIN pin voltage to
drop and the IC may malfunction.
3. When raising the input voltage from the minimum operating voltage or less, if changed suddenly, the release delay time may become short.
4. Sufficiently reinforce the VIN and GND lines, as power noise may cause malfunctioning of the watchdog function and voltage detector. It is
recommended that a capacitor be added between VIN and GND.
5. Enter “H” level, or “L” level should be fed to MRB and EN/ENB pin.
6. To ensure stable operation of the watchdog function, be sure to add a capacitor at the Cd pin.
The release delay time and watchdog timeout time are affected by the accuracy and temperature characteristics of the Cd pin capacitor.
7. If the Cd pin capacitor is unable to discharge to the ground level during recovery after a power interruption, the release delay may become
noticeably shorter. Exercise caution.
8. The output voltage at detection is determined by the pull-up resistance connected to RESETB pin.
Select the resistance based on the following considerations:
At detection: VRESETB=(Vpull-Up)/(1+Rpull/RON
Vpull-Up: Voltage after pull-up
)
RON (*1): ON resistance of N-ch driver （calculated from VRESETB/IRBOUT1 in electrical characteristics）(*3)
Example calculation:
When VIN=2.0V (*2), RON=0.3/4.9×10-3≒61.2Ω（MAX.）. If you wish to make the VRESETB voltage at detection 0.1V
or lower with Vpull-Up=3.0V,
Rpull=(Vpull-Up /VRESETB-1)×RON=(3/0.1-1)×61.2≒1.8kΩ,
and thus to make the output voltage at detection 0.1V or less under the above conditions, the pull-up resistance must be 1.8kΩ or higher.
(*1) The smaller VIN is, the larger RON becomes.
(*2) When selecting VIN, calculate using the lowest value of the input voltage range you will use.
(*3)
I
specified in the electrical characteristics is the value at Ta=25℃. IRBOUT1 varies depending on the ambient temperature.
RBOUT1
To select the pull-up resistance taking ambient temperature into account, please calculate IRBOUT with the MIN. value of the ambient
temperature range of -40℃≦Ta≦125℃.
At release: VRESETB = (Vpull-Up)/(1+Rpull/ROFF
Vpull-Up: Voltage after pull-up
)
ROFF: Resistance value 60MΩ（MIN.）
when N-ch driver is OFF (calculated from VRESETB/ILEAK in electrical characteristics)
Calculation example:
If you wish to make VRESETB 5.99V or higher with Vpull-Up=6.0V
Rpull=(Vpull-Up/VRESETB-1)×ROFF=(6/5.99-1)×60×106≒100kΩ,
and thus to make the output voltage 5.99V or higher at release under the above conditions, the pull-up resistance must be 100kΩ or less.
9. We place importance on improving our products and increasing reliability. However, please design safety into the device and system,
including fail-safe design and post-aging treatment.
18/30
XD6130/XD6131
Series
■TYPICAL PERFORMANCE CHARACTERISTICS
(1) Detect, Release Voltage vs. Ambient Temperature
(2) Detect, Release Voltage vs. Input Voltage
XD6130,XD6131 (VDF(T)=1.6V)
Rpull-up=100kΩ
6
5
4
3
2
1
0
Ta=-40℃
Ta=25℃
Ta=85℃
Ta=125℃
0
1
2
3
4
5
6
Input Voltage : VIN (V)
XD6130,XD6131 (VDF(T)=5.0V)
XD6130,XD6131 (VDF(T)=3.0V)
Rpull-up=100kΩ
Rpull-up=100kΩ
6
5
4
3
2
1
0
6
5
4
3
2
1
0
Ta=-40℃
Ta=25℃
Ta=85℃
Ta=125℃
Ta=-40℃
Ta=25℃
Ta=85℃
Ta=125℃
0
1
2
3
4
5
6
0
1
2
3
4
5
6
Input Voltage : VIN (V)
Input Voltage : VIN (V)
19/30
XD6130/XD6131 Series
■TYPICAL PERFORMANCE CHARACTERISTICS
(3) Supply Current vs. Input Voltage
20/30
XD6130/XD6131
Series
■TYPICAL PERFORMANCE CHARACTERISTICS
(3) Supply Current vs. Input Voltage (Continued)
(4) Output Current vs. VRESETB
(5) Output Current vs. Input Voltage
21/30
XD6130/XD6131 Series
■TYPICAL PERFORMANCE CHARACTERISTICS
(6) Cd Sink Current vs. Ambient Temperature
(7) Release Delay Time1 vs. Ambient Temperature
(8) Release Delay Time2 vs. Ambient Temperature
22/30
XD6130/XD6131
Series
■TYPICAL PERFORMANCE CHARACTERISTICS
(9) Watchdog Timeout Period vs. Ambient Temperature
(10) WD High Level Threshold Voltage vs. Ambient Temperature
(11) WD Low Level Threshold Voltage vs. Ambient Temperature
23/30
XD6130/XD6131 Series
■TYPICAL PERFORMANCE CHARACTERISTICS
(12) MRB High Level Threshold Voltage vs. Ambient Temperature
(13) MRB Low Level Threshold Voltage vs. Ambient Temperature
(14) EN High Level Threshold Voltage vs. Ambient Temperature
(15) EN Low Level Threshold Voltage vs. Ambient Temperature
(16) ENB High Level Threshold Voltage vs. Ambient Temperature
(17) ENB Low Level Threshold Voltage vs. Ambient Temperature
24/30
XD6130/XD6131
Series
■TYPICAL PERFORMANCE CHARACTERISTICS
(18) MRB Pull-up Resistance vs. Ambient Temperature
(19) EN Pull-up Resistance vs. Ambient Temperature
(20) ENB Pull-down Resistance vs. Ambient Temperature
XD6131B
(21) WD Pull-down Resistance vs. Ambient Temperature
1000
900
800
700
600
500
400
300
-50
-25
0
25
50
75
100
125
150
Ambient Temperature : Ta (℃)
25/30
XD6130/XD6131 Series
■PACKAGING INFORMATION
●SOT-26 (unit: mm)
2.9±0.2
+0.1
0.4
-0.05
+0.1
-0.05
0.4
6
5
4
0～0.1
1234
1
2
3
+0.1
-0.05
0.15
(0.95)
(0.95)
●SOT-26 Reference Pattern Layout (unit: mm)
26/30
XD6130/XD6131
Series
■PACKAGING INFORMATION (Continued)
● SOT-26 Power Dissipationꢀ(Tjmax =125℃)
Power dissipation data for the SOT-26 is shown in this page.
The value of power dissipation varies with the mount board conditions.
Please use this data as the reference data taken in the following condition.
1. Measurement Condition
Condition Mount on a board
：
Ambient Natural convection
：
Soldering Lead (Pb) free
：
Board Dimensions 40 x 40 mm
：
(1600 mm2 in one side)
Copper (Cu) traces occupy 50% of the board
area In top and back faces
Package heat-sink is tied to the copper traces
Material Glass Epoxy (FR-4)
：
Thickness 1.6mm
：
Through-hole 4 x 0.8 Diameter
：
Evaluation Board (Unit mm)
：
2.Power Dissipation vs. Ambient Temperature
Board Mount (Tj max = 125
)
℃
Ambient Temperature
Power Dissipation Pd mW
Thermal Resistance
166.67
W
(℃/ )
（℃）
（
）
25
85
600
240
0
125
Pd vs. Ta
700
600
500
400
300
200
100
0
25
45
65
85
105
125
Ambient Temperature Ta (℃)
27/30
XD6130/XD6131 Series
■MARKING RULE
●XD6130
① represents products series.
SOT-26
MARK
5
PRODUCT SERIES
XD6130******-Q
6
5
4
②③represents type of detector and detect voltage.
①
②
③
④
⑤
DETECT
MARK
TYPE
PRODUCT SERIES
1
2
3
VOLTAGE (V)
16
22
23
24
29
30
31
44
45
46
1.6
2.2
XD6130A161MR-Q
XD6130A221MR-Q
XD6130A231MR-Q
XD6130A241MR-Q
XD6130A291MR-Q
XD6130A301MR-Q
XD6130A311MR-Q
XD6130A441MR-Q
XD6130A451MR-Q
XD6130A461MR-Q
2.3
2.4
2.9
3.0
3.1
4.4
4.5
4.6
A
*For another marking rule of detect voltage, please contact your local Torex sales office or representative.
M
④⑤ represents production lot number
01～09, 0A～0Z, 11～9Z, A1～A9, AA～AZ, B1～ZZ in order.
(G, I, J, O, Q, W excluded)
* No character inversion used.
28/30
XD6130/XD6131
Series
■MARKING RULE
●XD6131
① represents products series.
SOT-26
MARK
PRODUCT SERIES
XD6131******-Q
5
6
5
4
②③ represents type of detector and detect voltage.
①
②
③
④
⑤
DETECT
MARK
TYPE
PRODUCT SERIES
VOLTAGE (V)
1
2
3
A6
B2
B3
B4
B9
C0
C1
D4
D5
D6
E6
F2
F3
F4
F9
H0
H1
K4
K5
K6
1.6
2.2
XD6131A161MR-Q
XD6131A221MR-Q
XD6131A231MR-Q
XD6131A241MR-Q
XD6131A291MR-Q
XD6131A301MR-Q
XD6131A311MR-Q
XD6131A441MR-Q
XD6131A451MR-Q
XD6131A461MR-Q
XD6131B161MR-Q
XD6131B221MR-Q
XD6131B231MR-Q
XD6131B241MR-Q
XD6131B291MR-Q
XD6131B301MR-Q
XD6131B311MR-Q
XD6131B441MR-Q
XD6131B451MR-Q
XD6131B461MR-Q
2.3
2.4
2.9
3.0
3.1
4.4
4.5
4.6
1.6
2.2
2.3
2.4
2.9
3.0
3.1
4.4
4.5
4.6
A
B
*For another marking rule of detect voltage, please contact your local Torex sales office or representative.
④⑤ represents production lot number
01～09, 0A～0Z, 11～9Z, A1～A9, AA～AZ, B1～ZZ in order.
(G, I, J, O, Q, W excluded)
* No character inversion used.
29/30
XD6130/XD6131 Series
1. The product and product specifications contained herein are subject to change without notice to
improve performance characteristics. Consult us, or our representatives before use, to confirm that
the information in this datasheet is up to date.
2. The information in this datasheet is intended to illustrate the operation and characteristics of our
products. We neither make warranties or representations with respect to the accuracy or
completeness of the information contained in this datasheet nor grant any license to any intellectual
property rights of ours or any third party concerning with the information in this datasheet.
3. Applicable export control laws and regulations should be complied and the procedures required by
such laws and regulations should also be followed, when the product or any information contained in
this datasheet is exported.
4. The product is neither intended nor warranted for use in equipment of systems which require
extremely high levels of quality and/or reliability and/or a malfunction or failure which may cause loss
of human life, bodily injury, serious property damage including but not limited to devices or
equipment used in 1) nuclear facilities, 2) aerospace industry, 3) medical facilities, 4) automobile
industry and other transportation industry and 5) safety devices and safety equipment to control
combustions and explosions, excluding when specified for in-vehicle use or other uses.
Do not use the product for in-vehicle use or other uses unless agreed by us in writing in advance.
5. Although we make continuous efforts to improve the quality and reliability of our products;
nevertheless Semiconductors are likely to fail with a certain probability. So in order to prevent
personal injury and/or property damage resulting from such failure, customers are required to
incorporate adequate safety measures in their designs, such as system fail safes, redundancy and
fire prevention features.
6. Our products are not designed to be Radiation-resistant.
7. Please use the product listed in this datasheet within the specified ranges.
8. We assume no responsibility for damage or loss due to abnormal use.
9. All rights reserved. No part of this datasheet may be copied or reproduced unless agreed by Torex
Semiconductor Ltd in writing in advance.
TOREX SEMICONDUCTOR LTD.
30/30
相关型号：
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