CMG03(TE12L,Q) [TOSHIBA]
DIODE GEN PURP 600V 1A M-FLAT;
| 型号： | CMG03(TE12L,Q) |
| 厂家： | 
TOSHIBA |
| 描述： | DIODE GEN PURP 600V 1A M-FLAT |
| 文件： | 总4页 (文件大小：373K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
CMG03
TOSHIBA Rectifier Silicon Diffused Type
CMG03
○ General-Purpose Rectifiers
Unit: mm
•
•
•
•
Repetitive peak reverse voltage : V
= 600 V
RRM
Average forward current
Peak forward voltage
: I
= 2.0 A
F (AV)
: VFM = 1.1 V (max)
Suitable for high-density board assembly due to the use of a small
Toshiba Nickname: M−FLATTM
Absolute Maximum Ratings (Ta = 25°C)
Characteristics
Repetitive peak reverse voltage
Average forward current
Symbol
Rating
600
Unit
V
V
RRM
1
2
ANODE
I
2.0 (Note1)
80 (50 Hz)
−40 to 150
−40 to 150
A
F (AV)
CATHODE
Non-repetitive peak forward surge current
Junction temperature
I
A
FSM
T
°C
°C
j
Storage temperature
T
stg
JEDEC
JEITA
―
―
Note 1: Tℓ =106°C
Device mounted on a ceramic board
board size : 50 mm × 50 mm
Soldering land size : 2 mm × 2 mm
board thickness : 0.64 mm
Half-sine waveform : α = 180°
TOSHIBA
3-4E1S
Weight: 0.023 g (typ.)
Note : Using continuously under heavy loads (e.g. the application of
high temperature/current/voltage and the significant change in temperature, etc.) may cause this product to
decrease in the reliability significantly even if the operating conditions (i.e. operating
temperature/current/voltage, etc.) are within the absolute maximum ratings.
Please design the appropriate reliability upon reviewing the Toshiba Semiconductor Reliability Handbook
(“Handling Precautions”/“Derating Concept and Methods”) and individual reliability data (i.e. reliability test
report and estimated failure rate, etc.).
Electrical Characteristics (Ta = 25°C)
Characteristics
Symbol
Test Condition
= 1.0 A (Pulse test)
Min
―
Typ.
0.88
0.92
―
Max
―
Unit
V
V
FM(1)
V
FM(2)
I
RRM
I
I
FM
FM
Peak forward voltage
= 2.0 A (Pulse test)
= 600 V (Pulse test)
―
1.1
10
V
Repetitive peak reverse current
V
―
μA
RRM
Device mounted on a ceramic board
board size
soldering land size
board thickness
50 mm × 50 mm
2 mm × 2 mm
0.64 mm
―
―
―
―
60
Device mounted on a glass-epoxy board
board size
soldering land size
board thickness
Thermal resistance
(junction to ambient)
50 mm × 50 mm
6 mm × 6 mm
1.6 mm
R
110
°C/W
°C/W
th (j-a)
Device mounted on a glass-epoxy board
board size
soldering land size
board thickness
50 mm × 50 mm
2.1 mm × 1.4 mm
1.6 mm
―
―
―
―
180
16
Thermal resistance (junction to lead)
R
―
th (j-ℓ)
Start of commercial production
2004-06
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CMG03
Marking
Abbreviation Code
G3
Part No.
CMG03
Land pattern dimensions for reference only
Unit: mm
1.4
3.0
1.4
Handling Precaution
1) The absolute maximum ratings denote the absolute maximum ratings, which are rated values and must not be
exceeded during operation, even for an instant. The following are the general derating methods that we recommend
when you design a circuit with a device.
V
RRM: We recommend that the worst case voltage, including surge voltage, be no greater than 80% of the absolute
maximum rating of VRRM for a DC circuit and be no greater than 50% of that of VRRM for an AC circuit.
VRRM has a temperature coefficient of 0.1%/°C. Take this temperature coefficient into account designing a
device at low temperature.
I
F(AV): We recommend that the worst case current be no greater than 80% of the absolute maximum rating of IF(AV)
and Tj be below 120°C. Carry out adequate heat design. If you can’t design a circuit with excellent heat
radiation, set the margin by using an allowable Ta max - IF(AV) curve.
IFSM: This rating specifies the non-repetitive peak current in one cycle of a 50-Hz sine wave, condition angle 180.
Therefore, this is only applied for an abnormal operation, which seldom occurs during the lifespan of the
device.
Tj
: We recommend that a device be used at Tj below 120°C under the worst load and heat radiation conditions.
2) Thermal resistance between junction and ambient fluctuates depending on the device’s mounting condition. When
using a device, design a circuit board and a soldering land size to match the appropriate thermal resistance value.
3) For other design considerations, see the Toshiba website.
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CMG03
I
– V
P
– I
F (AV) F (AV)
F
F
2.4
2.0
1.6
1.2
0.8
0.4
0
100
10
150°C
75°C
1
Half-sine waveform
T = 25°C
j
0.1
0°
180°
Pulse test
1.6
Conduction angle 180°
0.01
0
0.4
0.8
1.2
2.0
0
0.4
0.8
1.2
1.6
2.0
2.4
Average forward current
I
(A)
F (AV)
Forward voltage
V
(V)
F
Tℓ max – I
Ta max – I
F (AV)
F (AV)
160
140
120
100
80
160
140
120
100
80
Device mounted on a glass-epoxy board:
board size: 50 mm × 50 mm
Soldering land size: 6 mm × 6 mm
board thickness: 1.6 mm
Half-sine waveform
0°
180°
Conduction angle 180°
60
60
Half-sine waveform
40
40
0°
180°
20
20
Conduction angle 180°
0
0
0
0
0.4
0.8
1.2
1.6
2.0
2.4
0.4
0.8
1.2
1.6
2.0
2.4
Average forward current
I
(A)
Average forward current
I
(A)
F (AV)
F (AV)
r
– t
th (j-a)
Repetitive peak forward current
1000
100
10
100
80
Device mounted on a glass-epoxy board:
board size: 50 mm × 50 mm
Soldering land size: 2.1 mm × 1.4 mm
board thickness: 1.6 mm
Ta = 25°C
f = 50 Hz
60
Device mounted on a glass-epoxy board:
board size: 50 mm × 50 mm
Soldering land size: 6 mm × 6 mm
board thickness: 1.6 mm
40
20
0
Device mounted on a ceramic board:
board size: 50 mm × 50 mm
Soldering land: size 2 mm × 2 mm
board thickness: 0.64 mm
1
0.1
0.001
0.01
0.1
1
10
100
1000
1
10
100
Number of cycles
Time
t
(s)
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2018-10-01
CMG03
RESTRICTIONS ON PRODUCT USE
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• TOSHIBA reserves the right to make changes to the information in this document and related Product without notice.
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TOSHIBA's written permission, reproduction is permissible only if reproduction is without alteration/omission.
• Though TOSHIBA works continually to improve Product's quality and reliability, Product can malfunction or fail. Customers are
responsible for complying with safety standards and for providing adequate designs and safeguards for their hardware, software and
systems which minimize risk and avoid situations in which a malfunction or failure of Product could cause loss of human life, bodily
injury or damage to property, including data loss or corruption. Before customers use the Product, create designs including the
Product, or incorporate the Product into their own applications, customers must also refer to and comply with (a) the latest versions of
all relevant TOSHIBA information, including without limitation, this document, the specifications, the data sheets and application notes
for Product and the precautions and conditions set forth in the "TOSHIBA Semiconductor Reliability Handbook" and (b) the
instructions for the application with which the Product will be used with or for. Customers are solely responsible for all aspects of their
own product design or applications, including but not limited to (a) determining the appropriateness of the use of this Product in such
design or applications; (b) evaluating and determining the applicability of any information contained in this document, or in charts,
diagrams, programs, algorithms, sample application circuits, or any other referenced documents; and (c) validating all operating
parameters for such designs and applications. TOSHIBA ASSUMES NO LIABILITY FOR CUSTOMERS' PRODUCT DESIGN OR
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•
PRODUCT IS NEITHER INTENDED NOR WARRANTED FOR USE IN EQUIPMENTS OR SYSTEMS THAT REQUIRE
EXTRAORDINARILY HIGH LEVELS OF QUALITY AND/OR RELIABILITY, AND/OR A MALFUNCTION OR FAILURE OF WHICH
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•
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OCCURRING AS A RESULT OF NONCOMPLIANCE WITH APPLICABLE LAWS AND REGULATIONS.
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4
2018-10-01
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