CMS16 [TOSHIBA]
Switching Mode Power Supply Applications Portable Equipment Battery Applications DC-DC Converter Applications; 开关模式电源应用便携式设备电池应用的DC- DC转换器应用
| 型号： | CMS16 |
| 厂家： | 
TOSHIBA |
| 描述： | Switching Mode Power Supply Applications Portable Equipment Battery Applications DC-DC Converter Applications |
| 文件： | 总6页 (文件大小：182K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
CMS16
TOSHIBA Schottky Barrier Diode
CMS16
Switching Mode Power Supply Applications
Unit: mm
Portable Equipment Battery Applications
DC-DC Converter Applications
②
•
•
•
•
Forward voltage: V
Average forward current: I
Repetitive peak reverse voltage: V
= 0.55 V (max) (@I
= 3.0 A)
FM
FM
= 3.0 A
F (AV)
= 40 V
RRM
Suitable for compact assembly due to a small surface-mount package:
TM
“M−FLAT ” (Toshiba package name)”
①
0.16
Absolute Maximum Ratings (Ta = 25°C)
1.75 ± 0.1
+ 0.2
2.4 − 0.1
Characteristic
Symbol
Rating
Unit
Repetitive peak reverse voltage
Average forward current
V
40
V
A
RRM
I
3.0 (Note 1)
30 (50 Hz)
−40 to 150
−40 to 150
F (AV)
① ANODE
② CATHODE
Nonrepetitive peak surge current
Junction temperature
I
A
FSM
T
j
°C
°C
Storage temperature range
T
stg
JEDEC
⎯
Note : Using continuously under heavy loads (e.g. the application of
high temperature/current/voltage and the significant change in
temperature, etc.) may cause this product to decrease in the
reliability significantly even if the operating conditions (i.e.
operating temperature/current/voltage, etc.) are within the
absolute maximum ratings.
JEITA
⎯
TOSHIBA
3-4E1A
Weight: 0.023 g (typ.)
Please design the appropriate reliability upon reviewing the
Toshiba Semiconductor Reliability Handbook (“Handling Precautions”/“Derating Concept and Methods”) and
individual reliability data (i.e. reliability test report and estimated failure rate, etc).
Note 1: Tℓ = 106°C
Device mounted on a ceramic board
Board size: 50 mm × 50 mm
Soldering size: 2 mm × 2 mm
Board thickness: 0.64 mm
Rectangular waveform (α = 180°), V = 20 V
R
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CMS16
Electrical Characteristics (Ta = 25°C)
Characteristic
Peak forward voltage
Symbol
Test Condition
= 1.0 A (pulse test)
Min
Typ.
Max
Unit
V
V
I
I
⎯
⎯
⎯
⎯
⎯
0.40
0.50
2.0
26
⎯
0.55
⎯
FM (1)
FM (2)
FM
FM
V
= 3.0 A (pulse test)
I
V
V
V
= 5 V (pulse test)
= 40 V (pulse test)
RRM (1)
RRM (2)
RRM
RRM
Peak repetitive reverse current
Junction capacitance
μA
I
200
⎯
C
= 10 V, f = 1.0 MHz
R
95
pF
j
Device mounted on a ceramic board
(board size: 50 mm × 50 mm)
(soldering land: 2 mm × 2 mm)
(board thickness: 0.64 mm)
⎯
⎯
⎯
⎯
60
Device mounted on a glass-epoxy board
(board size: 50 mm × 50 mm)
(soldering land: 6 mm × 6 mm)
(board thickness: 1.6 mm)
Thermal resistance
(junction to ambient)
R
°C/W
°C/W
135
th (j-a)
Device mounted on a glass-epoxy board
(board size: 50 mm × 50 mm)
⎯
⎯
⎯
⎯
210
16
(soldering land: 2.1 mm × 1.4 mm)
(board thickness: 1.6 mm)
Thermal resistance
(junction to lead)
R
⎯
th (j-ℓ)
Marking
Abbreviation Code
Part No.
SF
CMS16
Land pattern dimensions for reference only
Unit: mm
1.4
3.0
1.4
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CMS16
Handling Precaution
1) Schottky barrier diodes have reverse current characteristics compared to other diodes. SBDs can cause thermal
runaway when used under high temperature or high voltage conditions. Be sure to take forward and reverse
loss into consideration during design.
2) The absolute maximum ratings denote the absolute maximum ratings, which are rated values that must not be
exceeded during operation, even for an instant. The following are the general derating methods that we
recommend for designing a circuit incorporating this device.
V
RRM
: Use this rating with reference to (1) above. V
has a temperature coefficient of 0.1%/°C. Take
RRM
this temperature coefficient into account when designing a device for operation at low
temperature.
I : We recommend that the worst case current be no greater than 80% of the absolute maximum
F (AV)
rating of
I
and that T be below 120°C. When using this device, take the margin into consideration by
j
F (AV)
using an allowable Tamax-I
curve.
F (AV)
I
:
This rating specifies the nonrepetitive peak current. This is applied only for abnormal operation,
which seldom occurs during the lifespan of the device.
FSM
T :
j
Derate this rating when using the device to ensure high reliability.
We recommend that the device be used at a T of below 120°C.
j
3) Thermal resistance between junction and ambient fluctuates depending on the mounting condition of the
device. When using the device, design the circuit board and soldering land size to match the appropriate
thermal resistance value.
4) Refer to the Rectifiers databook for further information.
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CMS16
i
– v
P
– I
F (AV)
F
F
F (AV)
180°
100
2.6
2.4
Pulse test
DC
2.2
2.0
1.8
1.6
1.4
30
10
120°
T = 150°C
j
α = 60°
125°C
75°C
3
1
1.2
1.0
0.8
0.6
0.4
0.2
0
Rectangular
waveform
25°C
0° α 360°
0.3
0.1
Conduction angle α
0
0.2
0.4
0.6
0.8
1.0
1.2
1.4
1.6
0
0.4 0.8 1.2 1.6 2.0 2.4 2.8 3.2 3.6 4.0 4.4
Instantaneous forward voltage
v
(V)
Average forward current
I
(A)
F
F (AV)
Tℓ max – I
Ta max – I
F (AV)
F (AV)
160
140
120
100
80
160
140
120
100
80
Rectangular
waveform
Device mounted on a ceramic board:
board size: 50 mm × 50 mm
soldering land:
2 mm × 2 mm
board thickness:
0° α 360°
0.64 mm
I
F (AV)
Conduction
α = 60°
angle α
V
= 20 V
R
120°
Rectangular
120° 180°
DC
waveform
60
60
α = 60°
180°
DC
40
40
0° α 360°
I
F (AV)
Conduction
angle α
= 20 V
20
20
V
R
0
0
0
0
3.2
F (AV)
0.4 0.8 1.2 1.6 2.0 2.4 2.8
3.6 4.0 4.4
(A)
0.4 0.8 1.2 1.6 2.0 2.4 2.8 3.2 3.6 4.0 4.4
Average forward current
I
Average forward current
I
(A)
F (AV)
r
– t
th (j-a)
1000
Device mounted on a glass-epoxy board:
board size: 50 mm × 50 mm
Soldering land: 2.1 mm × 1.4 mm
board thickness: 1.6 mm
500
300
100
50
30
Device mounted on a glass-epoxy board:
board size: 50 mm × 50 mm
Soldering land: 6.0 mm × 6.0 mm
board thickness: 1.6 mm
10
5
3
Device mounted on a ceramic board:
board size: 50 mm × 50 mm
Soldering land: 2.0 mm × 2.0 mm
board thickness: 0.64 mm
1
0.001 0.003
0.01
0.03
0.1
0.3
1
3
10
30
100
300
1000
Time
t (s)
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CMS16
C – V
j
(typ.)
Surge forward current
R
1000
500
50
40
30
20
10
0
Ta = 25°C
Ta = 25°C
f = 50 Hz
f = 1 MHz
100
50
10
5
1
1
1
3
5
10
30
50
100
3
5
10
30
50
100
Reverse voltage
V
(V)
Number of cycles
R
I
– T
(typ.)
P
– V
R
(typ.)
R
j
R (AV)
100
1.6
1.4
Rectangular
waveform
Pulse test
0°
360°
10
1
1.2
1.0
0.8
0.6
0.4
0.2
0.0
V
DC
R
α
Conduction angle α
300°
T = 150°C
j
40 V
30 V
240°
0.1
0.01
180°
120°
20 V
100
10 V
V
= 5 V
R
α = 60°
0.001
0
20
40
60
80
120
140
160
0
10
20
30
40
Junction temperature
T
j
(°C)
Reverse voltage
V
(V)
R
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CMS16
RESTRICTIONS ON PRODUCT USE
•
•
•
Toshiba Corporation, and its subsidiaries and affiliates (collectively “TOSHIBA”), reserve the right to make changes to the information
in this document, and related hardware, software and systems (collectively “Product”) without notice.
This document and any information herein may not be reproduced without prior written permission from TOSHIBA. Even with
TOSHIBA’s written permission, reproduction is permissible only if reproduction is without alteration/omission.
Though TOSHIBA works continually to improve Product’s quality and reliability, Product can malfunction or fail. Customers are
responsible for complying with safety standards and for providing adequate designs and safeguards for their hardware, software and
systems which minimize risk and avoid situations in which a malfunction or failure of Product could cause loss of human life, bodily
injury or damage to property, including data loss or corruption. Before customers use the Product, create designs including the
Product, or incorporate the Product into their own applications, customers must also refer to and comply with (a) the latest versions of
all relevant TOSHIBA information, including without limitation, this document, the specifications, the data sheets and application notes
for Product and the precautions and conditions set forth in the “TOSHIBA Semiconductor Reliability Handbook” and (b) the
instructions for the application with which the Product will be used with or for. Customers are solely responsible for all aspects of their
own product design or applications, including but not limited to (a) determining the appropriateness of the use of this Product in such
design or applications; (b) evaluating and determining the applicability of any information contained in this document, or in charts,
diagrams, programs, algorithms, sample application circuits, or any other referenced documents; and (c) validating all operating
parameters for such designs and applications. TOSHIBA ASSUMES NO LIABILITY FOR CUSTOMERS’ PRODUCT DESIGN OR
APPLICATIONS.
•
Product is intended for use in general electronics applications (e.g., computers, personal equipment, office equipment, measuring
equipment, industrial robots and home electronics appliances) or for specific applications as expressly stated in this document.
Product is neither intended nor warranted for use in equipment or systems that require extraordinarily high levels of quality and/or
reliability and/or a malfunction or failure of which may cause loss of human life, bodily injury, serious property damage or serious
public impact (“Unintended Use”). Unintended Use includes, without limitation, equipment used in nuclear facilities, equipment used
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power, and equipment used in finance-related fields. Do not use Product for Unintended Use unless specifically permitted in this
document.
•
•
Do not disassemble, analyze, reverse-engineer, alter, modify, translate or copy Product, whether in whole or in part.
Product shall not be used for or incorporated into any products or systems whose manufacture, use, or sale is prohibited under any
applicable laws or regulations.
•
•
The information contained herein is presented only as guidance for Product use. No responsibility is assumed by TOSHIBA for any
infringement of patents or any other intellectual property rights of third parties that may result from the use of Product. No license to
any intellectual property right is granted by this document, whether express or implied, by estoppel or otherwise.
ABSENT A WRITTEN SIGNED AGREEMENT, EXCEPT AS PROVIDED IN THE RELEVANT TERMS AND CONDITIONS OF SALE
FOR PRODUCT, AND TO THE MAXIMUM EXTENT ALLOWABLE BY LAW, TOSHIBA (1) ASSUMES NO LIABILITY
WHATSOEVER, INCLUDING WITHOUT LIMITATION, INDIRECT, CONSEQUENTIAL, SPECIAL, OR INCIDENTAL DAMAGES OR
LOSS, INCLUDING WITHOUT LIMITATION, LOSS OF PROFITS, LOSS OF OPPORTUNITIES, BUSINESS INTERRUPTION AND
LOSS OF DATA, AND (2) DISCLAIMS ANY AND ALL EXPRESS OR IMPLIED WARRANTIES AND CONDITIONS RELATED TO
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FOR A PARTICULAR PURPOSE, ACCURACY OF INFORMATION, OR NONINFRINGEMENT.
•
•
Do not use or otherwise make available Product or related software or technology for any military purposes, including without
limitation, for the design, development, use, stockpiling or manufacturing of nuclear, chemical, or biological weapons or missile
technology products (mass destruction weapons). Product and related software and technology may be controlled under the
Japanese Foreign Exchange and Foreign Trade Law and the U.S. Export Administration Regulations. Export and re-export of Product
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Please contact your TOSHIBA sales representative for details as to environmental matters such as the RoHS compatibility of Product.
Please use Product in compliance with all applicable laws and regulations that regulate the inclusion or use of controlled substances,
including without limitation, the EU RoHS Directive. TOSHIBA assumes no liability for damages or losses occurring as a result of
noncompliance with applicable laws and regulations.
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