CMZB150 [TOSHIBA]

Communication, Control and Measurement Equipment Constant Voltage Regulation; 通信,控制和测量设备恒压调节
CMZB150
型号: CMZB150
厂家: TOSHIBA    TOSHIBA
描述:

Communication, Control and Measurement Equipment Constant Voltage Regulation
通信,控制和测量设备恒压调节

二极管 齐纳二极管 通信
文件: 总5页 (文件大小:168K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
CMZB68~CMZB390  
TOSHIBA Zener Diode Silicon Junction  
CMZB68~CMZB390  
Communication, Control and  
Unit: mm  
Measurement Equipment  
Constant Voltage Regulation  
Power dissipation: P = 1.0 W  
Zener voltage: V = 68 to 390 V  
Z
Suitable for high-density board assembly due to the use of a small  
surface-mount package, MFLAT  
TM  
0.16  
Absolute Maximum Ratings (Ta = 25°C)  
1.75 ± 0.1  
+ 0.2  
2.4 0.1  
Characteristics  
Power dissipation  
Symbol  
P
Rating  
Unit  
1.0 (Note 1)  
150  
W
°C  
°C  
Junction temperature  
T
j
ANODE  
CATHODE  
Storage temperature range  
T
stg  
55 to 150  
Note : Using continuously under heavy loads (e.g. the application of  
high temperature/current/voltage and the significant change in  
temperature, etc.) may cause this product to decrease in the  
reliability significantly even if the operating conditions (i.e.  
operating temperature / current / voltage, etc.) are within the  
absolute maximum ratings.  
JEDEC  
JEITA  
TOSHIBA  
3-4E1A  
Please design the appropriate reliability upon reviewing the  
Toshiba Semiconductor Reliability Handbook (“Handling  
Weight: 0.023 g (typ.)  
Precautions”/“Derating Concept and Methods”) and individual reliability data (i.e. reliability test report and  
estimated failure rate, etc).  
Note 1: Ta = 40°C  
Device mounted on a glass-epoxy board  
Board size: 50 mm × 50 mm  
Land pattern: 6 mm × 6 mm  
Board thickness: 1.6 mm  
Land pattern dimensions for reference only  
Unit: mm  
1.4  
3.0  
1.4  
1
2011-06-20  
CMZB68~CMZB390  
Electrical Characteristics (Ta = 25°C)  
Dynamic  
Resistance  
Zener Voltage  
Vz (V)  
Temperature  
Coefficient  
Forward Voltage  
Reverse Current  
V
(V)  
I
R
(μA)  
F
r
d
(Ω)  
Type  
Measure-  
ment  
Measure-  
ment  
αT (mV/°C)  
Measure-  
ment  
Measure-  
ment  
Current  
Current  
Current  
Voltage  
Min  
Typ.  
Max  
Max  
Typ.  
Max  
Max  
Max  
I
(mA)  
I
Z
(mA)  
I
(A)  
V (V)  
R
Z
F
CMZB68  
CMZB75  
61.2  
67.5  
73.8  
90  
68  
74.8  
82.5  
90.2  
110  
121  
165  
198  
220  
242  
264  
297  
330  
363  
429  
4
120  
150  
4
57  
66  
90  
1.2  
1.2  
1.2  
1.2  
1.2  
1.2  
1.2  
1.2  
1.2  
1.2  
1.2  
1.2  
1.2  
1.2  
0.2  
10  
10  
10  
10  
10  
10  
10  
10  
10  
10  
10  
10  
10  
10  
54.4  
60  
75  
4
4
104  
113  
138  
152  
210  
254  
269  
309  
343  
385  
428  
473  
555  
0.2  
0.2  
0.2  
0.2  
0.2  
0.2  
0.2  
0.2  
0.2  
0.2  
0.2  
0.2  
0.2  
CMZB82  
82  
3
170  
3
71  
65.6  
80  
CMZB100  
CMZB110  
CMZB150  
CMZB180  
CMZB200  
CMZB220  
CMZB240  
CMZB270  
CMZB300  
CMZB330  
CMZB390  
100  
110  
150  
180  
200  
220  
240  
270  
300  
330  
390  
3
300  
3
87  
99  
3
300  
3
96  
88  
135  
162  
180  
198  
216  
243  
270  
297  
351  
2
450  
2
136  
161  
170  
200  
215  
243  
270  
296  
350  
120  
144  
160  
176  
192  
216  
240  
264  
312  
1.5  
1.5  
0.5  
0.5  
0.5  
0.5  
0.5  
0.5  
500  
1.5  
1.5  
0.5  
0.5  
0.5  
0.5  
0.5  
0.5  
500  
5000  
5000  
5000  
5000  
5000  
10000  
Marking  
Abbreviation Code  
Part No.  
Part No.  
Abbreviation Code  
B68  
B75  
B82  
B1A  
B1B  
B1F  
B1J  
CMZB68  
CMZB75  
CMZB82  
CMZB100  
CMZB110  
CMZB150  
CMZB180  
B2A  
B2C  
B2E  
B2H  
B3A  
B3D  
B3K  
CMZB200  
CMZB220  
CMZB240  
CMZB270  
CMZB300  
CMZB330  
CMZB390  
2
2011-06-20  
CMZB68~CMZB390  
Handling Precaution  
1) The absolute maximum ratings of a semiconductor device are a set of ratings that must not be exceeded,even  
for a moment. Do not exceed any of these ratings. The following are the general derating methods that we  
recommend when you design a circuit with a device.  
P:  
We recommend that the worst case power dissipation be no greater than 50% of the  
absolute maximum rating of power dissipation. Carry out adequate heat design.  
P
RSM:  
We recommend that a device be used within the recommended area in the figure,  
P
-tw.  
RSM  
T :  
j
Derate this rating when using a device in order to ensure high reliability.  
We recommend that the device be used at T of below 120°C.  
j
2) Thermal resistance between junction and ambient fluctuates depending on the device’s mounting condition.  
When using a device, design a circuit board and a land pattern to match the appropriate thermal resistance  
value.  
3) Please refer to the Rectifiers databook for further information.  
3
2011-06-20  
CMZB68~CMZB390  
Ta max – P  
α
T – VZ  
(typ.)  
400  
160  
120  
80  
Device mounted on a glass-epoxy board:  
board size: 50 mm × 50 mm  
Land pattern: 6.0 mm × 6.0 mm  
board thickness: 1.6 mm  
350  
300  
250  
200  
150  
100  
50  
40  
0
0
0
0.2  
0.4  
0.6  
0.8  
1.0  
1.2  
0
50  
100  
150  
200  
250  
300  
350  
400  
Power dissipation  
P
(W)  
Zener voltage VZ (V)  
P
– tW (reference value)  
RSM  
1000  
100  
10  
P
RSM  
t
W
Ta = 25°C  
Rectangular pulse  
Recommended  
0.1  
1
10  
Pulse width  
t
W
(ms)  
r
– t  
th (j-a)  
1000  
Device mounted on a glass-epoxy board:  
Board size: 50 mm × 50 mm  
Land pattern: 2.1 mm × 1.4 mm  
Board thickness: 1.6 mm  
100  
10  
1
Device mounted on a glass-epoxy board:  
Board size: 50 mm × 50 mm  
Land pattern: 6.0 mm × 6.0 mm  
Board thickness: 1.6 mm  
Device mounted on a ceramic board:  
Board size: 50 mm × 50 mm  
Land pattern: 2.0 mm × 2.0 mm  
Board thickness: 0.64 mm  
0.1  
0.001  
0.01  
0.1  
1
10  
100  
1000  
Time  
t (s)  
4
2011-06-20  
CMZB68~CMZB390  
RESTRICTIONS ON PRODUCT USE  
Toshiba Corporation, and its subsidiaries and affiliates (collectively “TOSHIBA”), reserve the right to make changes to the information  
in this document, and related hardware, software and systems (collectively “Product”) without notice.  
This document and any information herein may not be reproduced without prior written permission from TOSHIBA. Even with  
TOSHIBA’s written permission, reproduction is permissible only if reproduction is without alteration/omission.  
Though TOSHIBA works continually to improve Product’s quality and reliability, Product can malfunction or fail. Customers are  
responsible for complying with safety standards and for providing adequate designs and safeguards for their hardware, software and  
systems which minimize risk and avoid situations in which a malfunction or failure of Product could cause loss of human life, bodily  
injury or damage to property, including data loss or corruption. Before customers use the Product, create designs including the  
Product, or incorporate the Product into their own applications, customers must also refer to and comply with (a) the latest versions of  
all relevant TOSHIBA information, including without limitation, this document, the specifications, the data sheets and application notes  
for Product and the precautions and conditions set forth in the “TOSHIBA Semiconductor Reliability Handbook” and (b) the  
instructions for the application with which the Product will be used with or for. Customers are solely responsible for all aspects of their  
own product design or applications, including but not limited to (a) determining the appropriateness of the use of this Product in such  
design or applications; (b) evaluating and determining the applicability of any information contained in this document, or in charts,  
diagrams, programs, algorithms, sample application circuits, or any other referenced documents; and (c) validating all operating  
parameters for such designs and applications. TOSHIBA ASSUMES NO LIABILITY FOR CUSTOMERS’ PRODUCT DESIGN OR  
APPLICATIONS.  
Product is intended for use in general electronics applications (e.g., computers, personal equipment, office equipment, measuring  
equipment, industrial robots and home electronics appliances) or for specific applications as expressly stated in this document.  
Product is neither intended nor warranted for use in equipment or systems that require extraordinarily high levels of quality and/or  
reliability and/or a malfunction or failure of which may cause loss of human life, bodily injury, serious property damage or serious  
public impact (“Unintended Use”). Unintended Use includes, without limitation, equipment used in nuclear facilities, equipment used  
in the aerospace industry, medical equipment, equipment used for automobiles, trains, ships and other transportation, traffic signaling  
equipment, equipment used to control combustions or explosions, safety devices, elevators and escalators, devices related to electric  
power, and equipment used in finance-related fields. Do not use Product for Unintended Use unless specifically permitted in this  
document.  
Do not disassemble, analyze, reverse-engineer, alter, modify, translate or copy Product, whether in whole or in part.  
Product shall not be used for or incorporated into any products or systems whose manufacture, use, or sale is prohibited under any  
applicable laws or regulations.  
The information contained herein is presented only as guidance for Product use. No responsibility is assumed by TOSHIBA for any  
infringement of patents or any other intellectual property rights of third parties that may result from the use of Product. No license to  
any intellectual property right is granted by this document, whether express or implied, by estoppel or otherwise.  
ABSENT A WRITTEN SIGNED AGREEMENT, EXCEPT AS PROVIDED IN THE RELEVANT TERMS AND CONDITIONS OF SALE  
FOR PRODUCT, AND TO THE MAXIMUM EXTENT ALLOWABLE BY LAW, TOSHIBA (1) ASSUMES NO LIABILITY  
WHATSOEVER, INCLUDING WITHOUT LIMITATION, INDIRECT, CONSEQUENTIAL, SPECIAL, OR INCIDENTAL DAMAGES OR  
LOSS, INCLUDING WITHOUT LIMITATION, LOSS OF PROFITS, LOSS OF OPPORTUNITIES, BUSINESS INTERRUPTION AND  
LOSS OF DATA, AND (2) DISCLAIMS ANY AND ALL EXPRESS OR IMPLIED WARRANTIES AND CONDITIONS RELATED TO  
SALE, USE OF PRODUCT, OR INFORMATION, INCLUDING WARRANTIES OR CONDITIONS OF MERCHANTABILITY, FITNESS  
FOR A PARTICULAR PURPOSE, ACCURACY OF INFORMATION, OR NONINFRINGEMENT.  
Do not use or otherwise make available Product or related software or technology for any military purposes, including without  
limitation, for the design, development, use, stockpiling or manufacturing of nuclear, chemical, or biological weapons or missile  
technology products (mass destruction weapons). Product and related software and technology may be controlled under the  
Japanese Foreign Exchange and Foreign Trade Law and the U.S. Export Administration Regulations. Export and re-export of Product  
or related software or technology are strictly prohibited except in compliance with all applicable export laws and regulations.  
Please contact your TOSHIBA sales representative for details as to environmental matters such as the RoHS compatibility of Product.  
Please use Product in compliance with all applicable laws and regulations that regulate the inclusion or use of controlled substances,  
including without limitation, the EU RoHS Directive. TOSHIBA assumes no liability for damages or losses occurring as a result of  
noncompliance with applicable laws and regulations.  
5
2011-06-20  

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