CUS04(TE85R,Q) [TOSHIBA]
Diode Schottky 60V 0.7A 2-Pin US-FLAT T/R;
| 型号： | CUS04(TE85R,Q) |
| 厂家： | 
TOSHIBA |
| 描述： | Diode Schottky 60V 0.7A 2-Pin US-FLAT T/R 测试 光电二极管 |
| 文件： | 总5页 (文件大小：169K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
CUS04
TOSHIBA Schottky Barrier Rectifier Schottky Barrier Type
CUS04
Switching Mode Power Supply Applications
Unit: mm
Portable Equipment Battery Applications
+ 0.2
− 0.1
1.25
+ 0.05
0.13
0.88 ± 0.1
− 0.03
•
•
•
•
Forward voltage: V
= 0.58 V@I = 0.7 A
FM F
②
Average forward current: I
= 0.7 A
F (AV)
Repetitive peak reverse voltage: V
= 60 V
RRM
Suitable for high-density board assembly due to the use of a small
surface-mount package, US−FLATTM
①
Absolute Maximum Ratings (Ta = 25°C)
0.6 ± 0.1
Characteristics
Symbol
Rating
Unit
V
0.88 ± 0.1
Repetitive peak reverse voltage
V
60
RRM
0.6 ± 0.1
0.7
(Note 1)
Average forward current
I
A
A
F (AV)
Peak one cycle surge forward current
(Non-repetitive)
I
20 (50 Hz)
FSM
0.78 ± 0.1
① ANODE
Junction temperature
T
j
−40 to 150
−40 to 150
°C
°C
② CATHODE
Storage temperature range
T
stg
0.6 ± 0.1
JEDEC
―
―
Note 1: Ta = 27°C: Device mounted on a glass-epoxy board
Board size: 50 mm × 50 mm,
JEITA
Land size: 6 mm × 6 mm
TOSHIBA
3-2B1A
Rectangular waveform (α = 180°), V = 30 V
R
Note 2: Using continuously under heavy loads (e.g. the application of
high temperature/current/voltage and the significant change in
Weight: 0.004 g (typ.)
temperature, etc.) may cause this product to decrease in the reliability significantly even if the operating
conditions (i.e. operating temperature/current/voltage, etc.) are within the absolute maximum ratings.
Please design the appropriate reliability upon reviewing the Toshiba Semiconductor Reliability Handbook
(“Handling Precautions”/“Derating Concept and Methods”) and individual reliability data (i.e. reliability test
report and estimated failure rate, etc).
Electrical Characteristics (Ta = 25°C)
Characteristics
Symbol
Test Condition
Min
Typ.
Max
Unit
V
V
V
I
I
= 0.1 A
= 0.7 A
―
―
―
―
―
0.40
0.55
0.3
―
0.58
―
FM (1)
FM (2)
FM
FM
Peak forward voltage
I
V
V
V
= 5 V
RRM (1)
RRM (2)
RRM
RRM
Repetitive peak reverse current
Junction capacitance
μA
I
= 60 V
3.0
100
―
C
= 10 V, f = 1.0 MHz
R
38
pF
j
Device mounted on a ceramic board
(board size: 50 mm × 50 mm)
(soldering land: 2 mm × 2 mm)
(board thickness: 0.64 mm)
―
―
75
Thermal resistance
(junction to ambient)
R
°C/W
th (j-a)
Device mounted on a glass-epoxy board
(board size: 50 mm × 50 mm)
(soldering land: 6 mm × 6 mm)
(board thickness: 1.6 mm)
―
―
―
―
150
30
Thermal resistance (junction to lead)
R
Junction to lead of cathode side
°C/W
th (j-ℓ)
1
2008-05-13
CUS04
Marking
Abbreviation Code
Part No.
CUS04
4
Standard Soldering Pad
Unit: mm
2.0
0.5
0.8
1.1
0.8
Handling Precaution
1) Schottky barrier diodes have reverse current characteristics compared to other diodes.
There is a possibility SBD may cause thermal runaway when it is used under high temperature or high voltage.
Please take forward and reverse loss into consideration during design.
2) The absolute maximum ratings denote the absolute maximum ratings, which are rated values and must not be
exceeded during operation, even for an instant. The following are the general derating methods that we
recommend for designing a circuit using this device.
V
RRM
: Use this rating with reference to (1) above. V
has a temperature coefficient of 0.1%/°C. Take
RRM
this temperature coefficient into account designing a device at low temperature.
I : We recommend that the worst-case current be no greater than 80% of the absolute maximum
F (AV)
rating of
I
and T be below 120°C. When using this device, take the margin into consideration by
j
F (AV)
using an allowable Ta max-I
curve.
F (AV)
I
: This rating specifies the non-repetitive peak current. This is only applied for an abnormal
operation, which seldom occurs during the lifespan of the device.
FSM
T : Derate this rating when using a device to ensure high reliability.
j
We recommend that the device be used at T below 120°C.
j
3) Thermal resistance between junction and ambient fluctuates depending on the device’s mounting condition.
When using a device, design a circuit board and a soldering land size to match the appropriate thermal
resistance value.
4) Refer to the Rectifiers databook for further information.
2
2008-05-13
CUS04
i
– v
P
– I
F (AV) F (AV)
F
F
10
0.6
0.5
0.4
0.3
0.2
0.1
0
DC
T = 150°C
j
180°
1
120°
100°C
75°C
25°C
α = 60°
Rectangular
waveform
0.1
0.01
0° α 360°
Conduction
angle: α
0.0
0.2
0.4
0.6
0.8
1.0
1.2
0.0
0.2
0.4
0.6
0.8
1.0
1.2
Instantaneous forward voltage
v
F
(V)
Average forward current
I
(A)
F (AV)
Ta max – I
F (AV)
Ta max – I
F (AV)
160
140
120
100
80
160
140
120
100
80
Device mounted on a ceramic board
(board size: 50 mm × 50 mm,
land size: 2 mm × 2 mm)
Device mounted on a glass-epoxy board
(board size: 50 mm × 50 mm,
land size: 6 mm × 6 mm)
α = 60°
DC
120°
180°
DC
Rectangular
waveform
Rectangular
waveform
60
60
40
40
0° α 360°
0° α 360°
α = 60°
120°
0.4
180°
0.6
20
20
Conduction
Conduction
angle: α
angle: α
V
= 30 V
V
= 30 V
R
R
0
0.0
0
0.0
0.2
0.4
0.6
0.8
1.0
1.2
0.2
0.8
1.0
1.2
Average forward current
I
(A)
Average forward current
I
(A)
F (AV)
F (AV)
r
– t
th (j-a)
Tℓ max – I
F (AV)
10000
1000
100
10
160
140
120
100
80
(2) Device mounted on a glass-epoxy board:
board size:50 mm × 50 mm
Soldering land: 6.0 mm × 6.0 mm
board thickness:1.6 mm
(3) Device mounted on a glass-epoxy board:
Board size: 50 mm × 50 mm
Standard Soldering pad
(3)
board thickness:1.6 mm
(2)
(1)
α = 60°
120°
180°
DC
Rectangular
waveform
60
(1) Device mounted on a ceramic board:
board size:50 mm × 50 mm
Soldering land: 2.0 mm × 2.0 mm
board thickness : 0.64 mm
40
0° α 360°
20
Conduction
1
angle: α
V
= 30 V
0.2
0.001
0.01
0.1
1
10
100
1000
R
0
0.0
0.4
0.6
0.8
1.0
1.2
Time
t (s)
Average forward current
I
(A)
F (AV)
3
2008-05-13
CUS04
Surge forward current (non-repetitive)
C – V
j
(typ.)
R
24
20
16
12
8
1000
100
10
Ta = 25°C
f = 50 Hz
Ta = 25°C
f = 1 MHz
4
0
1
10
100
1
10
100
Number of cycles
Reverse voltage
V
(V)
R
I
– T
(typ.)
P
– V
R
(typ.)
R
j
R (AV)
0.8
0.7
0.6
0.5
0.4
0.3
0.2
0.1
0.0
100
Rectangular
waveform
Pulse test
10
1
V
= 60 V
R
0° α 360°
DC
50 V
Conduction
angle: α
40 V
T = 150°C
j
300°
240°
30 V
0.1
180°
20 V
120°
0.01
0.001
0.0001
10 V
5 V
60°
0
10
20
30
40
50
60
0
20
40
60
80
100
120
140
160
Junction temperature
T
j
(°C)
Reverse voltage
V
(V)
R
4
2008-05-13
CUS04
RESTRICTIONS ON PRODUCT USE
•
•
•
Toshiba Corporation, and its subsidiaries and affiliates (collectively “TOSHIBA”), reserve the right to make changes to the information
in this document, and related hardware, software and systems (collectively “Product”) without notice.
This document and any information herein may not be reproduced without prior written permission from TOSHIBA. Even with
TOSHIBA’s written permission, reproduction is permissible only if reproduction is without alteration/omission.
Though TOSHIBA works continually to improve Product’s quality and reliability, Product can malfunction or fail. Customers are
responsible for complying with safety standards and for providing adequate designs and safeguards for their hardware, software and
systems which minimize risk and avoid situations in which a malfunction or failure of Product could cause loss of human life, bodily
injury or damage to property, including data loss or corruption. Before creating and producing designs and using, customers must
also refer to and comply with (a) the latest versions of all relevant TOSHIBA information, including without limitation, this document,
the specifications, the data sheets and application notes for Product and the precautions and conditions set forth in the “TOSHIBA
Semiconductor Reliability Handbook” and (b) the instructions for the application that Product will be used with or for. Customers are
solely responsible for all aspects of their own product design or applications, including but not limited to (a) determining the
appropriateness of the use of this Product in such design or applications; (b) evaluating and determining the applicability of any
information contained in this document, or in charts, diagrams, programs, algorithms, sample application circuits, or any other
referenced documents; and (c) validating all operating parameters for such designs and applications. TOSHIBA ASSUMES NO
LIABILITY FOR CUSTOMERS’ PRODUCT DESIGN OR APPLICATIONS.
•
Product is intended for use in general electronics applications (e.g., computers, personal equipment, office equipment, measuring
equipment, industrial robots and home electronics appliances) or for specific applications as expressly stated in this document.
Product is neither intended nor warranted for use in equipment or systems that require extraordinarily high levels of quality and/or
reliability and/or a malfunction or failure of which may cause loss of human life, bodily injury, serious property damage or serious
public impact (“Unintended Use”). Unintended Use includes, without limitation, equipment used in nuclear facilities, equipment used
in the aerospace industry, medical equipment, equipment used for automobiles, trains, ships and other transportation, traffic signaling
equipment, equipment used to control combustions or explosions, safety devices, elevators and escalators, devices related to electric
power, and equipment used in finance-related fields. Do not use Product for Unintended Use unless specifically permitted in this
document.
•
•
Do not disassemble, analyze, reverse-engineer, alter, modify, translate or copy Product, whether in whole or in part.
Product shall not be used for or incorporated into any products or systems whose manufacture, use, or sale is prohibited under any
applicable laws or regulations.
•
•
The information contained herein is presented only as guidance for Product use. No responsibility is assumed by TOSHIBA for any
infringement of patents or any other intellectual property rights of third parties that may result from the use of Product. No license to
any intellectual property right is granted by this document, whether express or implied, by estoppel or otherwise.
ABSENT A WRITTEN SIGNED AGREEMENT, EXCEPT AS PROVIDED IN THE RELEVANT TERMS AND CONDITIONS OF SALE
FOR PRODUCT, AND TO THE MAXIMUM EXTENT ALLOWABLE BY LAW, TOSHIBA (1) ASSUMES NO LIABILITY
WHATSOEVER, INCLUDING WITHOUT LIMITATION, INDIRECT, CONSEQUENTIAL, SPECIAL, OR INCIDENTAL DAMAGES OR
LOSS, INCLUDING WITHOUT LIMITATION, LOSS OF PROFITS, LOSS OF OPPORTUNITIES, BUSINESS INTERRUPTION AND
LOSS OF DATA, AND (2) DISCLAIMS ANY AND ALL EXPRESS OR IMPLIED WARRANTIES AND CONDITIONS RELATED TO
SALE, USE OF PRODUCT, OR INFORMATION, INCLUDING WARRANTIES OR CONDITIONS OF MERCHANTABILITY, FITNESS
FOR A PARTICULAR PURPOSE, ACCURACY OF INFORMATION, OR NONINFRINGEMENT.
•
•
Do not use or otherwise make available Product or related software or technology for any military purposes, including without
limitation, for the design, development, use, stockpiling or manufacturing of nuclear, chemical, or biological weapons or missile
technology products (mass destruction weapons). Product and related software and technology may be controlled under the
Japanese Foreign Exchange and Foreign Trade Law and the U.S. Export Administration Regulations. Export and re-export of Product
or related software or technology are strictly prohibited except in compliance with all applicable export laws and regulations.
Please contact your TOSHIBA sales representative for details as to environmental matters such as the RoHS compatibility of Product.
Please use Product in compliance with all applicable laws and regulations that regulate the inclusion or use of controlled substances,
including without limitation, the EU RoHS Directive. TOSHIBA assumes no liability for damages or losses occurring as a result of
noncompliance with applicable laws and regulations.
5
2008-05-13
相关型号：
©2020 ICPDF网 联系我们和版权申明