KSG60ZSV1T02_技术文档

ｆ

SSD

SG6 SERIES (Non-SED Model)

CLIENT SSD

SG6 Series is a Client SATA SSD lineup using 64-layer, 3-bit-per-cell(TLC) BiCS

FLASH^TM

.

The SG6 series SSDs with up to 1024GB capacity, delivers performance of up to

550MB/s sequential read and 535MB/s sequential write. Furthermore, active power

consumption was decreased by up to 40% compared to previous SG5 series,

enabling increased battery life for mobile computing.

Offered in both traditional 2.5-type(7mm height) and compact M.2 2280 form factors,

SG6 series is engineered for mainstream desktop PCs and notebook PCs as well as

consumer upgrades.

Product image may represent a design model

KEY FEATURES

APPLICATIONS

 64-layer, 3-bit-per-cell (TLC) BiCS FLASH™

 Desktop PCs

 Notebook PCs

 Capacities up to 1024GB

 SATA Revision 3.3, 6.0 Gbit/s interface

 2.5-type and M.2 2280 form factor options

SPECIFICATIONS

2.5-type

(7.0 mm height)

M.2 2280-S2

Single-sided

M.2 2280-D2

Double-sided

Standard Models

Model Number

KSG60ZSE256G

KSG60ZSE512G

KSG60ZSE1T02

KSG60ZMV256G

KSG60ZMV512G

KSG60ZM81T02

Memory

TLC (BiCS FLASH^TM

)

Interface

SATA Rev. 3.3

6.0 Gbit/s

ACS-4

Maximum Speed

Command

Connector Type

Formatted Capacity¹⁾

Standard SATA

512 GB

M.2 B-M

512 GB

256 GB

1024 GB

256 GB

1024 GB

Sequential

Read

550 MB/s {524 MiB/s}

Perfor-

mance²⁾

Sequential

Write

340 MB/s {324

MiB/s}

535 MB/s

{510 MiB/s}

340 MB/s

{324 MiB/s}

535 MB/s

{510 MiB/s}

5.0 V ±5 %

3.3 V ±5 %

Supply Voltage

3.5 W typ.

2.3 W typ.

3.1 W typ.

60 mW typ.

5 mW max.

3.5 W typ.

Active

2.3 W typ.

3.1 W typ.

65 mW typ.

6 mW max.

Power

Comsump-

tion

60 mW typ.

70 mW typ.

55 mW typ.

65 mW typ.

Idle

DevSleep

100.0 mm x

69.85 mm x

7.0 mm

80.0 mm x

22.0 mm x

2.23 mm

80.0 mm x

22.0 mm x

3.58 mm

Size

41 g typ.

42 g typ.

43 g typ.

6.9 g typ.

8.3 g typ.

Weight

Products and specifications discussed herein are for reference purposes

only and are subject to change without notice. All information discussed

herein is provided on an “as is” basis, without warranties of any kind.

Before creating and producing designs and using, customers must refer to

and comply with the latest versions of the product specifications.

1 / 21

Client SSD SG6 Series Brochure Rev.1.00

2.5-type

(7.0 mm Height)

M.2 2280-S2

Single-sided

M.2 2280-D2

Double-sided

Standard Models

0 to 70 °C

(Case Temperature)

0 to 80 °C

(Components Temperature)

Operating

Tempera-

ture

Non-

operating

-40 to 85 °C

Mean Time to Failure (MTTF): 1,500,000 hours

Product Life: Approximately 5 years

Reliability³⁾

Strong & highly-efficient ECC named QSBC^TMis supported.

Firmware security feature (only digitally signed firmware can be installed) is supported.

UL, cUL, TÜV, KC, FCC, BSMI, CE, RCM, ISED, VCCI

More Features

Compliance

Note: 1) Definition of capacity: Toshiba Memory Corporation defines a megabyte (MB) as 1,000,000 bytes, a gigabyte (GB) as

1,000,000,000 bytes and a terabyte (TB) as 1,000,000,000,000 bytes. A computer operating system, however, reports

storage capacity using powers of 2 for the definition of 1GB = 2³⁰= 1,073,741,824 bytes and therefore shows less

storage capacity. Available storage capacity (including examples of various media files) will vary based on file size,

formatting, settings, software and operating system, such as Microsoft Operating System and/or pre-installed software

applications, or media content. Actual formatted capacity may vary.

2) 1 MiB (mebibyte) = 2²⁰bytes = 1,048,576 bytes, and 1 MB (megabyte) = 1,000,000 bytes.

3) MTTF (Mean Time to Failure) is not a guarantee or estimate of product life; it is a statistical value related to mean

failure rates for a large number of products which may not accurately reflect actual operation. Actual operating life of the

product may be different from the MTTF.

* Product image may represent a design model.

* Read and write speed may vary depending on the host device, read and write conditions, and file size.

* Company names, product names, and service names mentioned herein may be trademarks of their respective companies.

Products and specifications discussed herein are for reference purposes

only and are subject to change without notice. All information discussed

herein is provided on an “as is” basis, without warranties of any kind.

Before creating and producing designs and using, customers must refer to

2 / 21

Client SSD SG6 Series Brochure Rev.1.00

and comply with the latest versions of the product specifications.

ORDERING INFORMATION

K

1

XX

2

X

3

X

4

X

5

X

6

X

7

XXXX

8

1. Product Name

2. Prodct Category

K: SSD product

SG: SG Series

3. Development Generation

4. Option Code 1

6: Generation 6

0: Non-SED

5. Option Code 2

Z: No-option

6. Connector Type

S: Standard SATA

M: M.2 B-M

7. Form Factor

E: 2.5-type 7 mm H

V: M.2 2280 Single Sided

8: M.2 2280 Double Sided

256G / 512G /1T02

8. Capacity

256G is 256 GB, 512G is 512 GB and 1T02 is 1024 GB

(1 GB = 1,000,000,000 bytes)

Products and specifications discussed herein are for reference purposes

only and are subject to change without notice. All information discussed

herein is provided on an “as is” basis, without warranties of any kind.

Before creating and producing designs and using, customers must refer to

and comply with the latest versions of the product specifications.

3 / 21

Client SSD SG6 Series Brochure Rev.1.00

PRODUCT LINE UP

Function

Note

Formatted

Capacity

Model Number

Form Factor/Connect Type

KSG60ZSE256G

KSG60ZSE512G

KSG60ZSE1T02

KSG60ZMV256G

KSG60ZMV512G

KSG60ZM81T02

256 GB

512 GB

2.5-type¹⁾Standard SATA

Non-SED

1,024 GB

256 GB

M.2 2280-S2²⁾-B-M

M.2 2280-D2³⁾-B-M

512 GB

1,024 GB

Note: 1) 7mm Height

2) Single Sided

3) Double Sided

CAPACITY

Total Number of User Addressable Sectors in LBA Mode

512 bytes sector

Capacity

256 GB

512 GB

500,118,192

1,000,215,216

2,000,409,264

1,024 GB

Note: 1 GB (Gigabyte) = 1,000,000,000 bytes

PERFORMANCE

KSG60ZSE256G

Standard Models

KSG60ZSE512G

KSG60ZMV512G

KSG60ZSE1T02

KSG60ZM81T02

KSG60ZMV256G

Interface Speed

6.0 Gbit/s max.

550 MB/s

{524 MiB/s}

Sequential Read¹⁾

340 MB/s

Sequential Write¹⁾

535 MB/s

{510 MiB/s}

535 MB/s

{510 MiB/s}

{324 MiB/s}

Note: 1) Under the condition of measurement with 128 KiB unit sequential access and 4KiB align and queue depth is 32.

(1KiB=1024 bytes.)

Products and specifications discussed herein are for reference purposes

4 / 21

only and are subject to change without notice. All information discussed

herein is provided on an “as is” basis, without warranties of any kind.

Before creating and producing designs and using, customers must refer to

and comply with the latest versions of the product specifications.

Client SSD SG6 Series Brochure Rev.1.00

SUPPLY VOLTAGE

Standard Models

2.5-type

M.2 2280 Module

Allowable voltage

5.0 V ±5 %

3.3 V ±5 %

Allowable noise/ripple

Allowable supply rise time

100 mV p-p or less

2 –100 ms

Note: The drive has over current protection circuit. (Rated current: 3.15A)

POWER CONSUMPTION

2.5-type

Operation

(Ta¹⁾=25°C)

KSG60ZSE256G

2.0 W typ.

KSG60ZSE512G

KSG60ZSE1T02

2.2 W typ.

Read²⁾

2.1 W typ.

3.1 W typ.

65 mW typ.

6 mW max.

Write²⁾

2.3 W typ.

3.5 W typ.

Idle 3³⁾⁴⁾

Standby³⁾⁴⁾

Sleep³⁾

60 mW typ.

70 mW typ.

DevSleep

M.2 2280 Module

KSG60ZMV512G

Operation

(Ta ¹⁾=25°C)

Read²⁾

KSG60ZMV256G

KSG60ZM81T02

2.0 W typ.

2.3 W typ.

55 mW typ.

2.1 W typ.

3.1 W typ.

60 mW typ.

5 mW max.

2.2 W typ.

3.5 W typ.

65 mW typ.

Write²⁾

Idle 3³⁾⁴⁾

Standby³⁾⁴⁾

Sleep³⁾

DevSleep

Note: 1) Ambient Temperature

2) The values are specified at the condition causing maximum power consumption, i.e., maximum workload, default

maximum parallel number of flash memory operation and no thermal control effect.

3) The values are based on using SATA power management features. The Slumber mode is used for the power

consumption measurements.

4) The drive may internally write to flash memory. Therefore, drive power consumption may temporally change up to

write power.

Products and specifications discussed herein are for reference purposes

5 / 21

only and are subject to change without notice. All information discussed

herein is provided on an “as is” basis, without warranties of any kind.

Before creating and producing designs and using, customers must refer to

and comply with the latest versions of the product specifications.

Client SSD SG6 Series Brochure Rev.1.00

ENVIRONMENTAL CONDITIONS

TEMPERATURE

Range

Condition

2.5-type

Gradient

M.2 2280 Module

0 °C (Tc) – 70 °C (Tc)

(Case Temperature)

0 °C (Tc) – 80 °C (Tc)

(Components Temperature)

Operating¹⁾

30 °C (Ta) / h maximum

Non-operating

-40 °C – 85 °C

30 °C / h maximum

Under Shipment²⁾

Note: 1) Ta: Ambient Temperature, Tc: Case or Components Temperature

2) Packaged in Toshiba Memory Corporation’s original shipping package

HUMIDITY

Condition

Operating

Range

8 % – 90 % R.H. (No condensation)

Non-operating

8 % – 95 % R.H. (No condensation)

5 % – 95 % R.H.

Under Shipment¹⁾

32.5 °C (Operating)

40.0 °C (Non-operating / Shipping)

Max. wet bulb

Note: 1) Packaged in Toshiba Memory Corporation’s original shipping package

SHOCK

Condition

Operating

Range

14.709 km/s²{1,500 G}, 0.5 ms half sine wave

Non-operating

Under Shipment¹⁾

100 cm free drop

Note: 1) Apply shocks in each direction of the drive’s three mutually perpendicular axes, one axis at a time.

Packaged in Toshiba Memory Corporation’s original shipping package

VIBRATION

Condition

Operating

Range

196 m/s²{20 G} Peak, 10 - 2,000 Hz

(20 minutes per axis) x 3 axis

Non-operating

Products and specifications discussed herein are for reference purposes

only and are subject to change without notice. All information discussed

herein is provided on an “as is” basis, without warranties of any kind.

Before creating and producing designs and using, customers must refer to

and comply with the latest versions of the product specifications.

6 / 21

Client SSD SG6 Series Brochure Rev.1.00

COMPLIANCE

SAFETY / EMI STANDARDS

Title

Description

Region

UL

UL 60950-1

USA¹⁾

(Underwriters Laboratories)

cUL

CSA-C22.2 No.60950-1-07

Canada

(Underwriters Laboratories of Canada)

TÜV

EN 60950-1

EURO

(Technischer Überwachungs Verein)

KC

KN32, KN35

Korea

USA

FCC

FCC part 15 Subpart B

BSMI

CNS13438 (CISPR Pub. 22)

Taiwan

(Bureau of Standards, Metrology and Inspection)

CE

EN 55032, EN 55024

AS/NZS CISPR 32

EURO

Australia, New Zealand

Canada

RCM

ISED

ICES-003

Class B

VCCI

Japan

Note: 1) UL certification is basically on a voluntary basis.

RELIABILITY

Parameter

Mean Time to Failure

Product Life

Value

1,500,000 hours

Approximately 5 years

Products and specifications discussed herein are for reference purposes

only and are subject to change without notice. All information discussed

herein is provided on an “as is” basis, without warranties of any kind.

Before creating and producing designs and using, customers must refer to

and comply with the latest versions of the product specifications.

7 / 21

Client SSD SG6 Series Brochure Rev.1.00

MECHANICAL SPECIFICATIONS

2.5 TYPE

Model Number

KSG60ZSE256G

KSG60ZSE512G

KSG60ZSE1T02

Weight

Width

Height

Length

41 g typ.

42 g typ.

43 g typ.

69.85 mm

7.0 mm

100.0 mm

Figure 1: Dimensions of KSG60ZSExxxx (2.5-type)

Products and specifications discussed herein are for reference purposes

8 / 21

only and are subject to change without notice. All information discussed

herein is provided on an “as is” basis, without warranties of any kind.

Before creating and producing designs and using, customers must refer to

and comply with the latest versions of the product specifications.

Client SSD SG6 Series Brochure Rev.1.00

DIMENSIONS OF KSG60ZSExxxx

SFF-8200 Rev3.2¹⁾

SG6 Series SSD

(Differences only)

SFF-8201 Rev3.3

Dimension

SFF-8223 Rev2.5

Millimeters

7.00

Inches

Millimeters

Inches

A1

A2

0.276

0.008

0.020

2.750

0.010

3.955*

0.138

0.370

-

0.20

0.00

0.000

A3

0.50

A4

69.85

0.25

A5

A6²⁾

100.45*

3.5

100.00 ± 0.41

3.937 ± 0.016

A7

A8

9.40

-

9.40 ± 0.51

0.370 ± 0.020

1.186 ± 0.011

A10³⁾

A12

A23

A26

A28

A29

A32

A38

A41

A50²⁾

30.125 ± 0.28

0.38

3.00

M3

0.015

0.118

N/A

3.00 ± 0.20

0.118 ± 0.007

4.07

61.72

M3

3^#

2.5^#

0.160

2.430

N/A

3^#

2.5^#

4.07 + 0.295/-0.305

61.72 ± 0.25

0.060 +0.011/-0.012

2.430 ± 0.010

14.00

0.551

14.00 ± 0.25

90.60 ± 0.30

14.00 ± 0.25

90.60 ± 0.30

0.551 ± 0.010

3.567 ± 0.012

0.551 ± 0.010

3.567 ± 0.012

A51²⁾

A52²⁾

A53²⁾

90.60

14.00

90.60

3.567

0.551

3.567

* = maximum

# = minimum number of threads

Note:1) SFF-8200: Small Form Factor Standard

2) PCA, Connector not included

3) Connector center defined the same as SFF-8223 All

Products and specifications discussed herein are for reference purposes

only and are subject to change without notice. All information discussed

herein is provided on an “as is” basis, without warranties of any kind.

Before creating and producing designs and using, customers must refer to

and comply with the latest versions of the product specifications.

9 / 21

Client SSD SG6 Series Brochure Rev.1.00

M.2 2280 MODULE

Model Number

Weight

6.9 g typ.

8.3 g typ.

Width

Height

2.23 mm

3.58 mm

Length

KSG60ZMV256G

KSG60ZMV512G

KSG60ZM81T02

22.00 mm

80.00 mm

Unit:mm

Figure 2: Dimensions of KSG60ZMVxxxx (M.2 2280-S2 Module)

Products and specifications discussed herein are for reference purposes

10 / 21

only and are subject to change without notice. All information discussed

herein is provided on an “as is” basis, without warranties of any kind.

Before creating and producing designs and using, customers must refer to

and comply with the latest versions of the product specifications.

Client SSD SG6 Series Brochure Rev.1.00

Unit:mm

Figure 3: Dimensions of KSG60ZM81T02 (M.2 2280-D2 Module)

Products and specifications discussed herein are for reference purposes

11 / 21

only and are subject to change without notice. All information discussed

herein is provided on an “as is” basis, without warranties of any kind.

Before creating and producing designs and using, customers must refer to

and comply with the latest versions of the product specifications.

Client SSD SG6 Series Brochure Rev.1.00

INTERFACE CONNECTOR

2.5 TYPE

Unit:mm

Figure 4: 2.5-type Serial ATA Interface Connector

Products and specifications discussed herein are for reference purposes

only and are subject to change without notice. All information discussed

herein is provided on an “as is” basis, without warranties of any kind.

Before creating and producing designs and using, customers must refer to

and comply with the latest versions of the product specifications.

12 / 21

Client SSD SG6 Series Brochure Rev.1.00

2.5 TYPE DRIVE CONNECTER PIN ASSIGNMENT¹⁾

Position

Segment

Name

Description

S1

GND

A+

2^ndMate

S2

Differential Signal Pair A (Device Rx), 3^rdMate

S3

A-

Signal

Segment

S4

GND

B-

2^ndMate

S5

Differential Signal Pair B (Device Tx), 3^rdMate

S6

B+

S7

GND

2^ndMate

Signal segment “L”

Central connector polarizer

Power segment “L”

P1

Retired²⁾

P2

P3

DEVSLP²⁾Enter/Exit DevSleep

P4

GND

V5

1^stMate

2^ndMate

5 V power, pre-charge³⁾, 2^ndMate

5 V power, 3^rdMate

P5

P6

P7

Power

P8

V5

Segment

P9

V5

5 V power, 3^rdMate

P10

P11

P12

P13

P14

P15

GND

DAS/DSS

GND

V12

2^ndMate

Drive Activity Signal / Disable Staggered Spin-up, 3^rdMate

1^stMate

12 V power, pre-charge, 2^ndMate (Unused)

12 V power (Unused), 3^rdMate

V12

Power segment key

Note: 1) The Mate orders are for backplane usage. Hot-Plug and OS-Aware Hot Removal are supported when using with a

backplane connector.

2) Previously, 3.3 V was assigned to pins P1, P2 and P3 by Serial ATA International Organization.

3) Direct connect to non pre-charge pins.

Products and specifications discussed herein are for reference purposes

only and are subject to change without notice. All information discussed

herein is provided on an “as is” basis, without warranties of any kind.

Before creating and producing designs and using, customers must refer to

13 / 21

Client SSD SG6 Series Brochure Rev.1.00

and comply with the latest versions of the product specifications.

M.2 2280 MODULE

Unit:mm

Figure 5: Interface Dimensions of KSG60ZMVxxxx (M.2 2280-S2 Module)

Products and specifications discussed herein are for reference purposes

14 / 21

only and are subject to change without notice. All information discussed

herein is provided on an “as is” basis, without warranties of any kind.

Before creating and producing designs and using, customers must refer to

and comply with the latest versions of the product specifications.

Client SSD SG6 Series Brochure Rev.1.00

Unit:mm

Figure 6: Interface Dimensions of KSG60ZM81T02 (M.2 2280-D2 Module)

Products and specifications discussed herein are for reference purposes

15 / 21

only and are subject to change without notice. All information discussed

herein is provided on an “as is” basis, without warranties of any kind.

Before creating and producing designs and using, customers must refer to

and comply with the latest versions of the product specifications.

Client SSD SG6 Series Brochure Rev.1.00

M.2 2280 MODULE CONNECTOR PIN ASSIGNMENT

#

Name

Description

Name

Description

3.3 V Source

#

1

3

5

7

CONFIG_3 Defines module type(GND)

2

4

6

8

+3.3V

GND

NC

3.3 V Source

Reserved

NC

Drive Activity Signal /

Disable Staggered Spin-up

9

Reserved

NC

10

DAS/DSS

11

Notch

20

22

24

26

28

30

32

34

36

38

40

42

44

46

48

50

52

54

56

58

Reserved

DEVSLP

Reserved

MFG1

NC

21

23

25

27

29

31

33

35

37

39

41

43

45

47

49

51

53

55

57

CONFIG_0 Defines module type(GND)

NC

Reserved

GND

NC

GND

NC

Reserved

GND

NC

GND

NC

Reserved

GND

NC

DEVSLP signal

GND

NC

B+

Host Receiver Differential

Signal Pair

B-

GND

A-

Host Transmitter

Differential Signal Pair

A+

GND

NC

Reserved

GND

NC

Manufacturing pin. Must be a

no-connect on the host board.

GND

MFG2

Notch

67

69

71

73

Reserved

NC

68

70

72

74

Reserved

+3.3V

NC

CONFIG_1 Defines module type(GND)

3.3 V Source

GND

+3.3V

75

CONFIG_2 Defines module type(GND)

Products and specifications discussed herein are for reference purposes

only and are subject to change without notice. All information discussed

herein is provided on an “as is” basis, without warranties of any kind.

Before creating and producing designs and using, customers must refer to

and comply with the latest versions of the product specifications.

16 / 21

Client SSD SG6 Series Brochure Rev.1.00

COMMAND TABLE

Op-Code

Command Name

00h

06h

10h

20h

21h

24h

25h

27h

29h

2Fh

30h

31h

34h

35h

37h

39h

3Dh

3Fh

40h

41h

42h

45h

47h

57h

5Bh

5Ch

5Dh

5Eh

5Fh

60h

61h

70h

90h

91h

NOP

DATA SET MANAGEMENT

RECALIBRATE

READ SECTOR(S)

READ SECTOR(S) without retries

READ SECTOR(S) EXT

READ DMA EXT

READ NATIVE MAX ADDRESS EXT

READ MULTIPLE EXT

READ LOG EXT

WRITE SECTOR(S)

WRITE SECTOR(S) without retries

WRITE SECTOR(S) EXT

WRITE DMA EXT

SET MAX ADDRESS EXT

WRITE MULTIPLE EXT

WRITE DMA FUA EXT

WRITE LOG EXT

READ VERIFY SECTOR(S)

READ VERIFY SECTOR(S) without retries

READ VERIFY SECTOR(S) EXT

WRITE UNCORRECTABLE EXT

Create a pseudo-uncorrectable error with logging

Create a flagged error without logging

READ LOG DMA EXT

55h

AAh

WRITE LOG DMA EXT

TRUSTED NON-DATA

TRUSTED RECEIVE

TRUSTED RECEIVE DMA

TRUSTED SEND

TRUSTED SEND DMA

READ FPDMA QUEUED

WRITE FPDMA QUEUED

SEEK

EXECUTE DEVICE DIAGNOSTIC

INITIALIZE DEVICE PARAMETERS

Products and specifications discussed herein are for reference purposes

only and are subject to change without notice. All information discussed

herein is provided on an “as is” basis, without warranties of any kind.

Before creating and producing designs and using, customers must refer to

and comply with the latest versions of the product specifications.

17 / 21

Client SSD SG6 Series Brochure Rev.1.00

Op-Code

Feature Name

92h

DOWNLOAD MICROCODE

92h

03h

07h

0Eb

0Fb

Download with offsets and save microcode for immediate and future use

Download and save microcode for immediate and future use

Download with offsets and save microcode for future use

Activate downloaded microcode

93h

B0h

DOWNLOAD MICROCODE DMA

93h

03h

07h

0Eb

0Fb

Download with offsets and save microcode for immediate and future use

Download and save microcode for immediate and future use

Download with offsets and save microcode for future use

Activate downloaded microcode

SMART

B0h

D0h

D1h

D2h

D3h

D4h

D5h

D6h

D8h

D9h

DAh

DBh

SMART READ DATA

SMART READ ATTRIBUTE THRESHOLDS

SMART ENABLE/DISABLE ATTRIBUTE AUTOSAVE

SMART SAVE ATTRIBUTE VALUES

SMART EXECUTE OFF-LINE IMMEDIATE

SMART READ LOG

SMART WRITE LOG

SMART ENABLE OPERATIONS

SMART DISABLE OPERATIONS

SMART RETURN STATUS

SMART ENABLE/DISABLE AUTOMATIC OFF-LINE

DEVICE CONFIGURATION OVERLAY

DEVICE CONFIGURATION RESTORE

DEVICE CONFIGURATION FREEZE LOCK

DEVICE CONFIGURATION IDENTIFY

DEVICE CONFIGURATION SET

B1h

C0h

C1h

C2h

C3h

C4h

C5h

DEVICE CONFIGURATION IDENTIFY DMA

DEVICE CONFIGURATION SET DMA

SANITIZE DEVICE

B4h

00h

11h

12h

20h

SANITIZE STATUS EXT

CRYPTO SCRAMBLE EXT

BLOCK ERASE EXT

SANITIZE FREEZE LOCK EXT

Products and specifications discussed herein are for reference purposes

only and are subject to change without notice. All information discussed

herein is provided on an “as is” basis, without warranties of any kind.

Before creating and producing designs and using, customers must refer to

and comply with the latest versions of the product specifications.

18 / 21

Client SSD SG6 Series Brochure Rev.1.00

Op-Code

Feature Name

C4h

C5h

C6h

C8h

C9h

CAh

CBh

CEh

E0h

E1h

E2h

E3h

E4h

E5h

E6h

E7h

E8h

E9h

EAh

EBh

ECh

EFh

READ MULTIPLE

WRITE MULTIPLE

SET MULTIPLE MODE

READ DMA

READ DMA without retries

WRITE DMA

WRITE DMA without retries

WRITE MULTIPLE FUA EXT

STANDBY IMMEDIATE

IDLE IMMEDIATE

STANDBY

IDLE

READ BUFFER

CHECK POWER MODE

SLEEP

FLUSH CACHE

WRITE BUFFER

READ BUFFER DMA

FLUSH CACHE EXT

WRITE BUFFER DMA

IDENTIFY DEVICE

SET FEATURES

EFh

02h

03h

05h

10h

55h

66h

82h

85h

90h

AAh

CCh

Enable volatile write cache

Set transfer mode

Enable the APM feature set

Enable use of SATA feature set

Disable read look-ahead

Disable reverting to power-on defaults

Disable volatile write cache

Disable the APM feature set

Disable use of SATA feature set

Enable read look-ahead

Enable reverting to power-on defaults

Products and specifications discussed herein are for reference purposes

only and are subject to change without notice. All information discussed

herein is provided on an “as is” basis, without warranties of any kind.

Before creating and producing designs and using, customers must refer to

and comply with the latest versions of the product specifications.

19 / 21

Client SSD SG6 Series Brochure Rev.1.00

Op-Code

Feature Name

SECURITY SET PASSWORD

F1h

F2h

F3h

F4h

F5h

F6h

F8h

F9h

SECURITY UNLOCK

SECURITY ERASE PREPARE

SECURITY ERASE UNIT

SECURITY FREEZE LOCK

SECURITY DISABLE PASSWORD

READ NATIVE MAX ADDRESS

SET MAX ADDRESS

F9h

01h

02h

03h

04h

05h

06h

SET MAX SET PASSWORD

SET MAX LOCK

SET MAX UNLOCK

SET MAX FREEZE LOCK

SET MAX SET PASSWORD DMA

SET MAX UNLOCK DMA

Products and specifications discussed herein are for reference purposes

only and are subject to change without notice. All information discussed

herein is provided on an “as is” basis, without warranties of any kind.

Before creating and producing designs and using, customers must refer to

and comply with the latest versions of the product specifications.

20 / 21

Client SSD SG6 Series Brochure Rev.1.00

RESTRICTIONS ON PRODUCT USE

Toshiba Corporation and its subsidiaries and affiliates are collectively referred to as “TOSHIBA”.

Hardware, software and systems described in this document are collectively referred to as “Product”.



TOSHIBA reserves the right to make changes to the information in this document and related Product without notice.

This document and any information herein may not be reproduced without prior written permission from TOSHIBA. Even with TOSHIBA's written

permission, reproduction is permissible only if reproduction is without alteration/omission.



Though TOSHIBA works continually to improve Product's quality and reliability, Product can malfunction or fail. Customers are responsible for

complying with safety standards and for providing adequate designs and safeguards for their hardware, software and systems which minimize

risk and avoid situations in which a malfunction or failure of Product could cause loss of human life, bodily injury or damage to property, including

data loss or corruption. Before customers use the Product, create designs including the Product, or incorporate the Product into their own

applications, customers must also refer to and comply with (a) the latest versions of all relevant TOSHIBA information, including without

limitation, this document, the specifications, the data sheets and application notes for Product and the precautions and conditions set forth in the

"TOSHIBA Semiconductor Reliability Handbook" and (b) the instructions for the application with which the Product will be used with or for.

Customers are solely responsible for all aspects of their own product design or applications, including but not limited to (a) determining the

appropriateness of the use of this Product in such design or applications; (b) evaluating and determining the applicability of any information

contained in this document, or in charts, diagrams, programs, algorithms, sample application circuits, or any other referenced documents; and (c)

validating all operating parameters for such designs and applications. TOSHIBA ASSUMES NO LIABILITY FOR CUSTOMERS' PRODUCT

DESIGN OR APPLICATIONS.



PRODUCT IS NEITHER INTENDED NOR WARRANTED FOR USE IN EQUIPMENTS OR SYSTEMS THAT REQUIRE EXTRAORDINARILY

HIGH LEVELS OF QUALITY AND/OR RELIABILITY, AND/OR A MALFUNCTION OR FAILURE OF WHICH MAY CAUSE LOSS OF HUMAN

LIFE, BODILY INJURY, SERIOUS PROPERTY DAMAGE AND/OR SERIOUS PUBLIC IMPACT ("UNINTENDED USE"). Except for specific

applications as expressly stated in this document, Unintended Use includes, without limitation, equipment used in nuclear facilities, equipment

used in the aerospace industry, medical equipment, equipment used for automobiles, trains, ships and other transportation, traffic signaling

equipment, equipment used to control combustions or explosions, safety devices, elevators and escalators, devices related to electric power, and

equipment used in finance-related fields. IF YOU USE PRODUCT FOR UNINTENDED USE, TOSHIBA ASSUMES NO LIABILITY FOR

PRODUCT. For details, please contact your TOSHIBA sales representative.



Do not disassemble, analyze, reverse-engineer, alter, modify, translate or copy Product, whether in whole or in part.

Product shall not be used for or incorporated into any products or systems whose manufacture, use, or sale is prohibited under any applicable

laws or regulations.



The information contained herein is presented only as guidance for Product use. No responsibility is assumed by TOSHIBA for any infringement

of patents or any other intellectual property rights of third parties that may result from the use of Product. No license to any intellectual property

right is granted by this document, whether express or implied, by estoppel or otherwise.

ABSENT A WRITTEN SIGNED AGREEMENT, EXCEPT AS PROVIDED IN THE RELEVANT TERMS AND CONDITIONS OF SALE FOR

PRODUCT, AND TO THE MAXIMUM EXTENT ALLOWABLE BY LAW, TOSHIBA (1) ASSUMES NO LIABILITY WHATSOEVER, INCLUDING

WITHOUT LIMITATION, INDIRECT, CONSEQUENTIAL, SPECIAL, OR INCIDENTAL DAMAGES OR LOSS, INCLUDING WITHOUT

LIMITATION, LOSS OF PROFITS, LOSS OF OPPORTUNITIES, BUSINESS INTERRUPTION AND LOSS OF DATA, AND (2) DISCLAIMS

ANY AND ALL EXPRESS OR IMPLIED WARRANTIES AND CONDITIONS RELATED TO SALE, USE OF PRODUCT, OR INFORMATION,

INCLUDING WARRANTIES OR CONDITIONS OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE, ACCURACY OF

INFORMATION, OR NONINFRINGEMENT.



Do not use or otherwise make available Product or related software or technology for any military purposes, including without limitation, for the

design, development, use, stockpiling or manufacturing of nuclear, chemical, or biological weapons or missile technology products (mass

destruction weapons). Product and related software and technology may be controlled under the applicable export laws and regulations

including, without limitation, the Japanese Foreign Exchange and Foreign Trade Law and the U.S. Export Administration Regulations. Export and

re-export of Product or related software or technology are strictly prohibited except in compliance with all applicable export laws and regulations.



Product may include products subject to foreign exchange and foreign trade control laws.

Please contact your TOSHIBA sales representative for details as to environmental matters such as the RoHS compatibility of Product. Please

use Product in compliance with all applicable laws and regulations that regulate the inclusion or use of controlled substances, including without

limitation, the EU RoHS Directive. TOSHIBA ASSUMES NO LIABILITY FOR DAMAGES OR LOSSES OCCURRING AS A RESULT OF

NONCOMPLIANCE WITH APPLICABLE LAWS AND REGULATIONS.

Products and specifications discussed herein are for reference purposes

only and are subject to change without notice. All information discussed

herein is provided on an “as is” basis, without warranties of any kind.

Before creating and producing designs and using, customers must refer to

and comply with the latest versions of the product specifications.

21 / 21

Client SSD SG6 Series Brochure Rev.1.00


型号：	KSG60ZSV1T02
厂家：	TOSHIBA
描述：	CLIENT SSD(Non-SED Model)
文件：	总21页 (文件大小：1828K)
中文：	中文翻译
下载：	下载PDF数据表文档文件

KSG60ZSV1T02 [TOSHIBA]

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