SSM3K09FU(TE85L) [TOSHIBA]

TRANSISTOR,MOSFET,N-CHANNEL,30V V(BR)DSS,400MA I(D),SC-70;
SSM3K09FU(TE85L)
型号: SSM3K09FU(TE85L)
厂家: TOSHIBA    TOSHIBA
描述:

TRANSISTOR,MOSFET,N-CHANNEL,30V V(BR)DSS,400MA I(D),SC-70

文件: 总5页 (文件大小:210K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
SSM3K09FU  
TOSHIBA Field Effect Transistor Silicon N Channel MOS Type  
SSM3K09FU  
High Speed Switching Applications  
Unit: mm  
Small package  
Low on resistance  
: R = 0.7 (max) (@V  
= 10 V)  
= 4 V)  
on  
GS  
: R = 1.2 (max) (@V  
on  
GS  
Absolute Maximum Ratings (Ta = 25°C)  
Characteristics  
Drain-Source voltage  
Symbol  
Rating  
Unit  
V
30  
±20  
V
V
DS  
Gate-Source voltage  
V
GSS  
DC  
I
400  
D
Drain current  
mA  
Pulse  
I
800  
DP  
Drain power dissipation (Ta = 25°C)  
Channel temperature  
P
(Note 1)  
150  
mW  
°C  
D
T
ch  
150  
Storage temperature  
T
55~150  
°C  
JEDEC  
JEITA  
stg  
SC-70  
2-2E1E  
Note: Using continuously under heavy loads (e.g. the application of  
high temperature/current/voltage and the significant change in  
temperature, etc.) may cause this product to decrease in the  
reliability significantly even if the operating conditions (i.e.  
operating temperature/current/voltage, etc.) are within the  
absolute maximum ratings.  
TOSHIBA  
Weight: 0.006 g (typ.)  
Please design the appropriate reliability upon reviewing the Toshiba Semiconductor Reliability Handbook  
(“Handling Precautions”/“Derating Concept and Methods”) and individual reliability data (i.e. reliability test  
report and estimated failure rate, etc).  
Note 1: Mounted on FR4 board  
(25.4 mm × 25.4 mm × 1.6 t, Cu Pad: 0.6 mm × 3) Figure 1.  
2
Marking  
Equivalent Circuit  
(top view)  
25.4 mm × 25.4 mm × 1.6 t,  
Cu Pad: 0.6 mm2 × 3  
Figure 1:  
3
3
0.6 mm  
1.0 mm  
D J  
1
2
1
2
Handling Precaution  
When handling individual devices (which are not yet mounting on a circuit board), be sure that the environment is  
protected against electrostatic electricity. Operators should wear anti-static clothing, and containers and other  
objects that come into direct contact with devices should be made of anti-static materials.  
1
2007-11-01  
SSM3K09FU  
Electrical Characteristics (Ta = 25°C)  
Characteristics  
Gate leakage current  
Symbol  
Test Condition  
Min  
Typ.  
Max  
Unit  
I
V
= ±16 V, V  
= 0  
30  
±1  
μA  
V
GSS  
GS  
I = 1 mA, V  
D
DS  
Drain-Source breakdown voltage  
Drain cut-off current  
V
= 0  
(BR) DSS  
GS  
= 30 V, V  
I
V
V
V
= 0  
1
μA  
V
DSS  
DS  
DS  
DS  
GS  
Gate threshold voltage  
V
= 5 V, I = 0.1 mA  
1.1  
270  
1.8  
th  
D
Forward transfer admittance  
Y ⏐  
= 5 V, I = 200 mA  
(Note2)  
(Note2)  
(Note2)  
(Note2)  
mS  
fs  
D
I
I
I
= 200 mA, V  
= 10 V  
= 4 V  
0.5  
0.8  
1.0  
20  
7
0.7  
1.2  
1.7  
D
D
D
GS  
GS  
GS  
Drain-Source ON resistance  
R
Ω
= 200 mA, V  
= 200 mA, V  
DS (ON)  
= 3.3 V  
Input capacitance  
C
V
V
V
V
V
= 5 V, V  
= 5 V, V  
= 5 V, V  
= 0, f = 1 MHz  
= 0, f = 1 MHz  
= 0, f = 1 MHz  
pF  
pF  
pF  
ns  
ns  
iss  
rss  
oss  
on  
DS  
DS  
DS  
DD  
GS  
GS  
GS  
GS  
Reverse transfer capacitance  
Output capacitance  
C
C
t
16  
72  
68  
Turn-on time  
Switching time  
= 5 V, I = 200 mA,  
D
= 0~4 V  
Turn-off time  
t
off  
Note2: Pulse test  
Switching Time Test Circuit  
(a) Test circuit  
(b) V  
IN  
4 V  
Output  
90%  
4 V  
Input  
10%  
0
0 V  
DD  
10 μs  
V
DD  
(c) V  
V
OUT  
10%  
90%  
V
= 5 V  
DD  
<
D.U. 1%  
=
Input: t , t < 5 ns  
(Z  
out  
V
r
f
DS (ON)  
t
t
f
r
= 50 Ω)  
Common Source  
t
t
off  
on  
Ta = 25°C  
Precaution  
V
th  
can be expressed as voltage between gate and source when low operating current value is I = 100 μA for this  
D
product. For normal switching operation, V  
requires higher voltage than V and V  
(off) requires lower  
GS (on)  
th  
GS  
voltage than V  
.
th  
(relationship can be established as follows: V  
< V < V  
)
GS (off)  
th  
GS (on)  
Please take this into consideration for using the device.  
2
2007-11-01  
SSM3K09FU  
I
– V  
R
– I  
DS (ON) D  
D
DS  
1000  
800  
600  
400  
200  
0
2
1.8  
1.6  
1.4  
1.2  
1
Common Source  
Common Source  
Ta = 25°C  
Ta = 25°C  
10  
4
3.3  
V
= 3.3 V  
GS  
3.0  
4 V  
0.8  
0.6  
0.4  
0.2  
0
2.8  
2.6  
10 V  
V
= 2.4 V  
GS  
0
0.5  
1
1.5  
2
0
200  
400  
600  
D
800  
1000  
Drain-Source voltage  
V
(V)  
Drain current  
I
(mA)  
DS  
I
D
– V  
R
– V  
GS  
DS (ON) GS  
1000  
100  
10  
2
1.8  
1.6  
1.4  
1.2  
1
Common Source  
= 5 V  
Common Source  
V
I
= 200 mA  
DS  
D
25°C  
Ta = 100°C  
Ta = 100°C  
25°C  
1
0.8  
0.6  
0.4  
0.2  
0
25°C  
25°C  
0.1  
0.01  
0
1
2
3
4
0
2
4
6
8
10  
Gate-Source voltage  
V
(V)  
Gate-Source voltage  
V
(V)  
GS  
GS  
Y – I  
fs  
D
1000  
R
Ta  
DS (ON)  
Common Source  
= 5 V  
2
1.8  
1.6  
1.4  
1.2  
1
V
DS  
500  
300  
Common Source  
= 200 mA  
Ta = 25°C  
I
D
V
= 3.3 V  
GS  
100  
4 V  
0.8  
0.6  
0.4  
0.2  
0
50  
30  
10 V  
10  
10  
25  
0
25  
50  
75  
100  
125  
150  
30  
50  
100  
300 500  
1000  
Ambient temperature Ta (°C)  
Drain current  
I
(mA)  
D
3
2007-11-01  
SSM3K09FU  
V
Ta  
I
– V  
DR DS  
th  
2
1.8  
1.6  
1.4  
1.2  
1
1000  
800  
600  
400  
200  
0
Common Source  
= 0  
Common Source  
= 0.1 mA  
V
GS  
Ta = 25°C  
I
D
V
= 5 V  
DS  
D
G
I
DR  
S
0.8  
0.6  
0.4  
0.2  
0
25  
0
25  
50  
75  
100  
125  
150  
0
0.2  
0.4  
0.6  
0.8  
1  
1.2  
1.4  
Ambient temperature Ta (°C)  
Drain-Source voltage  
V
DS  
(V)  
C – V  
t – I  
D
DS  
500  
100  
5000  
1000  
Common Source  
= 0 V  
f = 1 MHz  
Ta = 25°C  
Common Source  
V
V
V
= 5 V  
= 0~4 V  
GS  
DD  
GS  
Ta = 25°C  
t
off  
C
iss  
t
f
10  
100  
C
oss  
t
on  
t
r
C
rss  
1
0.1  
10  
1
1
10  
100  
10  
100  
1000  
Drain-Source voltage  
V
DS  
(V)  
Drain current  
I
(mA)  
D
P
Ta  
D
200  
150  
100  
50  
Mounted on FR4 board  
(25.4 mm × 25.4 mm ×1.6 t  
2
Cu pad: 0.6 mm × 3) Figure 1  
0
0
20  
40  
60  
80  
100  
120  
140  
160  
Ambient temperature Ta (°C)  
4
2007-11-01  
SSM3K09FU  
RESTRICTIONS ON PRODUCT USE  
Toshiba Corporation, and its subsidiaries and affiliates (collectively “TOSHIBA”), reserve the right to make changes to the information  
in this document, and related hardware, software and systems (collectively “Product”) without notice.  
This document and any information herein may not be reproduced without prior written permission from TOSHIBA. Even with  
TOSHIBA’s written permission, reproduction is permissible only if reproduction is without alteration/omission.  
Though TOSHIBA works continually to improve Product’s quality and reliability, Product can malfunction or fail. Customers are  
responsible for complying with safety standards and for providing adequate designs and safeguards for their hardware, software and  
systems which minimize risk and avoid situations in which a malfunction or failure of Product could cause loss of human life, bodily  
injury or damage to property, including data loss or corruption. Before creating and producing designs and using, customers must  
also refer to and comply with (a) the latest versions of all relevant TOSHIBA information, including without limitation, this document,  
the specifications, the data sheets and application notes for Product and the precautions and conditions set forth in the “TOSHIBA  
Semiconductor Reliability Handbook” and (b) the instructions for the application that Product will be used with or for. Customers are  
solely responsible for all aspects of their own product design or applications, including but not limited to (a) determining the  
appropriateness of the use of this Product in such design or applications; (b) evaluating and determining the applicability of any  
information contained in this document, or in charts, diagrams, programs, algorithms, sample application circuits, or any other  
referenced documents; and (c) validating all operating parameters for such designs and applications. TOSHIBA ASSUMES NO  
LIABILITY FOR CUSTOMERS’ PRODUCT DESIGN OR APPLICATIONS.  
Product is intended for use in general electronics applications (e.g., computers, personal equipment, office equipment, measuring  
equipment, industrial robots and home electronics appliances) or for specific applications as expressly stated in this document.  
Product is neither intended nor warranted for use in equipment or systems that require extraordinarily high levels of quality and/or  
reliability and/or a malfunction or failure of which may cause loss of human life, bodily injury, serious property damage or serious  
public impact (“Unintended Use”). Unintended Use includes, without limitation, equipment used in nuclear facilities, equipment used  
in the aerospace industry, medical equipment, equipment used for automobiles, trains, ships and other transportation, traffic signaling  
equipment, equipment used to control combustions or explosions, safety devices, elevators and escalators, devices related to electric  
power, and equipment used in finance-related fields. Do not use Product for Unintended Use unless specifically permitted in this  
document.  
Do not disassemble, analyze, reverse-engineer, alter, modify, translate or copy Product, whether in whole or in part.  
Product shall not be used for or incorporated into any products or systems whose manufacture, use, or sale is prohibited under any  
applicable laws or regulations.  
The information contained herein is presented only as guidance for Product use. No responsibility is assumed by TOSHIBA for any  
infringement of patents or any other intellectual property rights of third parties that may result from the use of Product. No license to  
any intellectual property right is granted by this document, whether express or implied, by estoppel or otherwise.  
ABSENT A WRITTEN SIGNED AGREEMENT, EXCEPT AS PROVIDED IN THE RELEVANT TERMS AND CONDITIONS OF SALE  
FOR PRODUCT, AND TO THE MAXIMUM EXTENT ALLOWABLE BY LAW, TOSHIBA (1) ASSUMES NO LIABILITY  
WHATSOEVER, INCLUDING WITHOUT LIMITATION, INDIRECT, CONSEQUENTIAL, SPECIAL, OR INCIDENTAL DAMAGES OR  
LOSS, INCLUDING WITHOUT LIMITATION, LOSS OF PROFITS, LOSS OF OPPORTUNITIES, BUSINESS INTERRUPTION AND  
LOSS OF DATA, AND (2) DISCLAIMS ANY AND ALL EXPRESS OR IMPLIED WARRANTIES AND CONDITIONS RELATED TO  
SALE, USE OF PRODUCT, OR INFORMATION, INCLUDING WARRANTIES OR CONDITIONS OF MERCHANTABILITY, FITNESS  
FOR A PARTICULAR PURPOSE, ACCURACY OF INFORMATION, OR NONINFRINGEMENT.  
Do not use or otherwise make available Product or related software or technology for any military purposes, including without  
limitation, for the design, development, use, stockpiling or manufacturing of nuclear, chemical, or biological weapons or missile  
technology products (mass destruction weapons). Product and related software and technology may be controlled under the  
Japanese Foreign Exchange and Foreign Trade Law and the U.S. Export Administration Regulations. Export and re-export of Product  
or related software or technology are strictly prohibited except in compliance with all applicable export laws and regulations.  
Please contact your TOSHIBA sales representative for details as to environmental matters such as the RoHS compatibility of Product.  
Please use Product in compliance with all applicable laws and regulations that regulate the inclusion or use of controlled substances,  
including without limitation, the EU RoHS Directive. TOSHIBA assumes no liability for damages or losses occurring as a result of  
noncompliance with applicable laws and regulations.  
5
2007-11-01  

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