SSM6K34TU [TOSHIBA]

High Current Switching Applications; 大电流开关应用
SSM6K34TU
型号: SSM6K34TU
厂家: TOSHIBA    TOSHIBA
描述:

High Current Switching Applications
大电流开关应用

开关
文件: 总5页 (文件大小:196K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
SSM6K34TU  
TOSHIBA Field Effect Transistor Silicon N Channel MOS Type  
SSM6K34TU  
High Current Switching Applications  
Power Management Switch Applications  
Unit: mm  
4.5Vdrive  
Low on resistance:  
:R = 77 m(max) (@V  
= 4.5 V)  
= 10 V)  
on  
GS  
GS  
:R = 50 m(max) (@V  
on  
Absolute Maximum Ratings (Ta = 25°C)  
Characteristics  
Drain-Source voltage  
Symbol  
Rating  
Unit  
V
30  
±20  
3
V
V
DS  
Gate-Source voltage  
V
GSS  
DC  
I
D
Drain current  
A
Pulse  
I
6
DP  
P
D
Drain power dissipation  
Channel temperature  
500  
mW  
(Note 1)  
T
ch  
150  
°C  
°C  
1,2,5,6 : Drain  
3
4
: Gate  
Storage temperature range  
T
stg  
55~150  
: Source  
Note: Using continuously under heavy loads (e.g. the application of  
high temperature/current/voltage and the significant change in  
temperature, etc.) may cause this product to decrease in the  
reliability significantly even if the operating conditions (i.e.  
operating temperature/current/voltage, etc.) are within the  
absolute maximum ratings.  
JEDEC  
JEITA  
Please design the appropriate reliability upon reviewing the  
Toshiba Semiconductor Reliability Handbook (“Handling  
Precautions”/“Derating Concept and Methods”) and individual  
reliability data (i.e. reliability test report and estimated failure  
rate, etc).  
TOSHIBA  
2-2T1D  
Weight: 7.0 mg (typ.)  
Note 1: Mounted on FR4 board.  
2
(25.4 mm × 25.4 mm × 1.6 t, Cu Pad: 645 mm )  
Electrical Characteristics (Ta = 25°C)  
Characteristics  
Symbol  
Test Condition  
Min  
Typ.  
Max  
Unit  
V
V
V
I
I
= 10 mA, V  
= 10 mA, V  
= 0  
30  
15  
6.8  
(BR) DSS  
(BR) DSX  
D
D
GS  
GS  
Drain-Source breakdown voltage  
= −20 V  
= 0  
Drain cut-off current  
I
V
V
V
V
= 30 V, V  
10  
μA  
μA  
V
DSS  
GSS  
DS  
GS  
DS  
DS  
GS  
Gate leakage current  
Gate threshold voltage  
Forward transfer admittance  
I
= ±16 V, V  
= 0  
±10  
2.5  
DS  
V
= 10 V, I = 1 mA  
1.3  
3.4  
th  
D
Y ⏐  
= 10 V, I = 2 A  
(Note2)  
(Note2)  
(Note2)  
S
fs  
D
I
I
= 2 A, V  
= 4.5 V  
= 10 V  
58  
77  
D
D
GS  
GS  
Drain-Source ON resistance  
R
mΩ  
DS (ON)  
= 2 A, V  
38  
470  
60  
50  
Input capacitance  
C
C
iss  
V
= 10 V, V  
= 0, f = 1 MHz  
GS  
pF  
Reverse transfer capacitance  
Output capacitance  
Total gate charge  
DS  
rss  
C
80  
oss  
Q
g
10  
V
V
= 24 V, I = 3.0 A  
DS  
DS  
GS  
Gatesource charge  
Gatedrain charge  
Q
gs  
7.6  
2.4  
8.3  
22  
nC  
= 10 V  
Q
gd  
Turn-on time  
Turn-off time  
t
t
V
V
= 15 V, I = 2 A,  
on  
off  
DD  
GS  
D
Switching time  
ns  
V
= 0~10 V, R = 4.7 Ω  
G
Drain-Source forward voltage  
V
I
= -3A, V = 0V  
GS  
(Note2)  
0.8  
1.2  
DSF  
D
Note2: Pulse test  
1
2007-11-01  
SSM6K34TU  
Switching Time Test Circuit  
(a) Test Circuit  
(b) V  
(c) V  
IN  
10 V  
0 V  
90%  
OUT  
10 V  
IN  
10%  
0
V
DD  
OUT  
10 μs  
90%  
10%  
V
DD  
V
= 15 V  
DD  
V
DS (ON)  
R
= 4.7 Ω  
t
f
t
r
G
<
D.U. 1%  
=
t
t
off  
on  
V
: t , t < 5 ns  
IN  
r
f
Common Source  
Ta = 25°C  
Marking  
Equivalent Circuit (Top View)  
6
5
4
3
6
5
4
K N C  
1
2
1
2
3
Precaution  
V
th  
can be expressed as the voltage between gate and source when the low operating current value is I = 1 mA for  
D
this product. For normal switching operation, V  
requires a higher voltage than V and V  
requires a lower  
GS (off)  
GS (on)  
th  
voltage than V  
th.  
(The relationship can be established as follows: V  
< V < V  
)
GS (off)  
th  
GS (on).  
Take this into consideration when using the device.  
Handling Precaution  
When handling individual devices that are not yet mounted on a circuit board, make sure that the environment is  
protected against electrostatic discharge. Operators should wear antistatic clothing, and containers and other objects that  
come into direct contact with devices should be made of antistatic materials.  
2
2007-11-01  
SSM6K34TU  
I
– V  
DS  
I
– V  
D
D
DS  
5
4
3
2
10  
8
10  
4.5  
10  
Common source  
3.8  
3.5  
8.0  
6.0  
4.5  
Ta = 25°C  
8.0  
3.8  
Common source  
Ta = 25°C  
Pulse test  
6.0  
Pulse test  
6
4
3.5  
3.2  
3.0  
3.2  
1
0
2
0
3.0  
V
= 2.8 V  
GS  
V
= 2.8 V  
GS  
4
0
1.0  
0.4  
0
5
0.2  
0.6  
0.8  
2
1
3
Drain-source voltage  
V
DS  
(V)  
Drain-source voltage  
V
(V)  
DS  
I
D
– V  
V
– V  
DS GS  
GS  
8
6
2.0  
1.6  
Common source  
= 10 V  
Common source  
Ta= 25℃  
V
DS  
Pulse test  
Pulse tset  
1.2  
0.8  
4
2
0
25  
0.4  
0
2
6
100  
I
= 4A  
D
1
Ta = −55°C  
0
10  
4
0
5
2
8
2
1
3
4
Gate-source voltage  
V
GS  
(V)  
Gate-source voltage  
V
GS  
(V)  
Y – I  
fs  
R
– I  
DS (ON) D  
D
100  
100  
10  
Common source  
= 10 V  
V
DS  
Pulse test  
4.5  
Ta = −55°C  
100  
V
= 10V  
GS  
25  
30  
1
Common source  
Ta = 25°C  
Pulse test  
0.1  
10  
0.1  
0
1
10  
0.3  
3
1
10  
Drain current  
I
(A)  
Drain current  
I
(A)  
D
D
3
2007-11-01  
SSM6K34TU  
R
Ta  
I
– V  
DS (ON)  
DR  
DS  
3.0  
10  
120  
100  
Common source  
Pulse test  
10  
5.0  
5
3
I
= 4A  
D
1.0  
2A  
80  
V
= 0 V  
GS  
1A  
V
= 4.5V  
GS  
1
60  
40  
0.5  
0.3  
V
= 10V  
GS  
I
= 4, 2, 1A  
D
Common source  
Ta = 25°C  
20  
0
Pulse test  
0.1  
0
-1.0  
80  
40  
0
40  
80  
120  
160  
-0.2  
-0.4  
-0.6  
-0.8  
-1.2  
Ambient temperature Ta (°C)  
Drain-source voltage  
V
DS  
(V)  
Capacitance – V  
V
Ta  
th  
DS  
1000  
100  
10  
3
2
1
C
iss  
C
oss  
C
rss  
Common source  
= 10 V  
Common source  
= 0 V  
V
DS  
= 1mA  
V
GS  
I
D
f = 1 MHz  
Ta = 25°C  
Pulse test  
1
0.1  
0
80  
1
3
5
10  
30 50 100  
40  
0
40  
80  
120  
160  
0.3  
Drain-source voltage  
V
DS  
(V)  
Ambient temperature Ta (°C)  
r
th  
– t  
w
Dynamic Input Characteristic  
100  
10  
8
Common Source  
= 3.0 A  
I
D
Ta = 25°C  
100  
10  
1
6
VDD = 15V  
VDD = 24V  
4
2
0
Single Pulse  
Mounted on FR4 board  
(25.4 mm × 25.4 mm × 1.6 t,  
2
Cu Pad: 645 mm )  
0
2
4
6
8
10  
0.00  
0.01  
0.1  
1
10  
100  
1000  
Pulse width  
t
(s)  
w
Total Gate Charge Qg (nC)  
4
2007-11-01  
SSM6K34TU  
RESTRICTIONS ON PRODUCT USE  
20070701-EN GENERAL  
The information contained herein is subject to change without notice.  
TOSHIBA is continually working to improve the quality and reliability of its products. Nevertheless, semiconductor  
devices in general can malfunction or fail due to their inherent electrical sensitivity and vulnerability to physical  
stress. It is the responsibility of the buyer, when utilizing TOSHIBA products, to comply with the standards of  
safety in making a safe design for the entire system, and to avoid situations in which a malfunction or failure of  
such TOSHIBA products could cause loss of human life, bodily injury or damage to property.  
In developing your designs, please ensure that TOSHIBA products are used within specified operating ranges as  
set forth in the most recent TOSHIBA products specifications. Also, please keep in mind the precautions and  
conditions set forth in the “Handling Guide for Semiconductor Devices,” or “TOSHIBA Semiconductor Reliability  
Handbook” etc.  
The TOSHIBA products listed in this document are intended for usage in general electronics applications  
(computer, personal equipment, office equipment, measuring equipment, industrial robotics, domestic appliances,  
etc.).These TOSHIBA products are neither intended nor warranted for usage in equipment that requires  
extraordinarily high quality and/or reliability or a malfunction or failure of which may cause loss of human life or  
bodily injury (“Unintended Usage”). Unintended Usage include atomic energy control instruments, airplane or  
spaceship instruments, transportation instruments, traffic signal instruments, combustion control instruments,  
medical instruments, all types of safety devices, etc.. Unintended Usage of TOSHIBA products listed in his  
document shall be made at the customer’s own risk.  
The products described in this document shall not be used or embedded to any downstream products of which  
manufacture, use and/or sale are prohibited under any applicable laws and regulations.  
The information contained herein is presented only as a guide for the applications of our products. No  
responsibility is assumed by TOSHIBA for any infringements of patents or other rights of the third parties which  
may result from its use. No license is granted by implication or otherwise under any patents or other rights of  
TOSHIBA or the third parties.  
Please contact your sales representative for product-by-product details in this document regarding RoHS  
compatibility. Please use these products in this document in compliance with all applicable laws and regulations  
that regulate the inclusion or use of controlled substances. Toshiba assumes no liability for damage or losses  
occurring as a result of noncompliance with applicable laws and regulations.  
5
2007-11-01  

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