TA7259P_06 [TOSHIBA]

3-PHASE BRUSHLESS DC MOTOR DRIVER IC; 3相无刷直流电动机驱动器IC
TA7259P_06
型号: TA7259P_06
厂家: TOSHIBA    TOSHIBA
描述:

3-PHASE BRUSHLESS DC MOTOR DRIVER IC
3相无刷直流电动机驱动器IC

驱动器
文件: 总18页 (文件大小:423K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
TA7259P/F/FG  
TOSHIBA BIPOLAR LINEAR INTEGRATED CIRCUIT SILICON MONOLITHIC  
TA7259P, TA7259F/FG  
3-PHASE BRUSHLESS DC MOTOR DRIVER IC  
The TA7259P/F/FG is a 3phase Bi-directional motor driver IC.  
It designed as an output driver for motors in VTR (capstan,  
cylinder, and reel), tape deck, floppy disk, and record player  
applications.  
To detect position, use of a position sensing device is  
recommended.  
FEATURES  
z Wide operating supply voltage range: V  
MIN. = 7 V  
CC (opr.)  
z Forward and reverse rotation is controlled simply by means of a  
CW / CCW control signal fed into FRS.  
z High sensitivity of position sensing amplifier.  
(V = 10 mV (Typ.), TOSHIBA GaAs Hall sensor “THS” series  
H
is recommended.  
z 3phase Bi-directional driver and output current up to ±1.2 A.  
z Few external parts required.  
z Surge-protect diode connected for all input terminals (position  
sensing, control, CW / CCW control inputs).  
Weight  
The TA7259FG is a Pb free product.  
The TA7259P is an Sn-plated product including Pb.  
The following conditions apply to solderability:  
*Solderability  
HDIP14P5002.54A : 3.00 g (Typ.)  
HSOP20P4501.00 : 0.79 g (Typ.)  
1. Use of Sn-37Pb solder bath  
*solder bath temperature = 230°C  
*dipping time = 5 seconds  
*number of times = once  
*use of R-type flux  
2. Use of Sn-3.0Ag-0.5Cu solder bath  
*solder bath temperature = 245°C  
*dipping time = 5 seconds  
*the number of times = once  
*use of R-type flux  
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TA7259P/F/FG  
BLOCK DIAGRAM  
TA7259P/TA7259F/FG  
Control input  
CW/CCW switch  
Position sensing input  
PIN FUNCTION  
PIN No.  
SYMBOL  
H +  
FUNCTION DESCRIPTION  
bphase Hall Amp. positive input terminal  
P TYPE  
1
F/FG TYPE  
1
2
b
2
3
H
b
bphase Hall Amp. negative input terminal  
cphase Hall Amp. positive input terminal  
cphase Hall Amp. negative input terminal  
Output current detection terminal  
cphase drive output terminal  
3
H +  
c
4
5
H −  
5
10  
6
R
F
c
6
L
L
7
11  
12  
13  
15  
16  
18  
19  
20  
Fin  
bphase drive output terminal  
b
8
V
Power supply input terminal  
CC  
9
L
aphase drive output terminal  
a
10  
11  
12  
13  
14  
Fin  
FRS  
Forward / Reverse / Stop switch terminal  
Control Amp, negative input terminal  
Control Amp, positive input terminal  
aphase Hall Amp. positive input terminal  
aphase Hall Amp. negative input terminal  
GND Terminal  
V
IN  
IN  
V
+
H +  
a
H
a
GND  
F/FG type: NO. 4, 7, 8, 9, 14, 17 pins are no connection.  
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TA7259P/F/FG  
INPUT vs. OUTPUT  
V
NF  
declares R voltage drop.  
F
In star-connection;  
=R × I  
V
(I : Coil current)  
L
NF  
F
L
Refer to the diagram below.  
When V  
and V pins short-circuit or when V is equal to or greater than V , rotating becomes zero torque.  
IN- 11 12  
IN+  
However, zero torque status is also achieved by setting the FRS input pin to the specified voltage or open status. In  
this case, power consumption is reduced.  
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TA7259P/F/FG  
FUNCTION  
FRS  
POSITION SENSING INPUT  
COIL OUTPUT  
(10 PIN)  
H
a
H
b
H
c
L
L
L
c
a
b
1
0
1
H
L
M
L
1
1
0
0
0
1
1
1
0
0
0
1
1
1
0
0
0
0
1
1
1
0
0
0
1
1
1
0
0
0
1
1
1
0
0
0
0
1
1
1
0
0
0
1
1
1
0
0
0
1
1
H
M
L
M
H
H
M
L
L
L
M
H
H
M
H
H
M
L
L
M
L
H
M
L
L
M
H
H
M
H
L
M
H
L
M
High Impedance  
Notes)  
Position sensing input;  
“1”: Energizing +10mV or more to the positive side of each position sensing input.  
“0”: Energizing 10mV or less to the negative side of each position sensing input.  
In this case, DC voltage must be within the same-phase voltage range of the position sensing input.  
Coil output;  
1
“H”: V  
“M”: V  
“L”: V  
V
SAT1  
CC  
2
CC  
SAT2  
FRS input;  
“L”: Applied voltage within the specified range of V .  
F
“H”: Applied voltage within the specified range of V .  
R
“M”: Applied voltage within the specified range of V .  
S
During testing, necessary voltage must be applied to the control input (V , V ) and the circuit must be  
IN+ IN-  
driven status.  
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TA7259P/F/FG  
Control signal input  
In the initial state of the TA7259P/F/FG, the control voltage is usually input either by an F/V inverter or  
such like, where the voltage is in proportion or inverse proportion to the number of rotations, or independently.  
Though output (R pin) gain from the TA7259 control is specified in the table as 15 times, it can be reduced  
F
to improve the characteristics of W/F etc. by applying NF.  
An example of the application is shown below.  
Whether NF is applied or not, the DC voltage (V  
V
) of the control input (V + pin and V pin)  
IN+ and IN IN IN  
must be within the specified range (2.0 to V 2.5V). When the input DC level and F/V conversion output  
CC  
(control output) cannot interface with the IC input, input DC level shift and attenuator before IC input.  
One example is shown in Figure 1c.  
a) Positive input  
TA7259P/F/FG  
VZ(5V is recommended)  
Figure 1-a  
b) Negative input  
TA7259P/F/FG  
Figure 1-b  
Control input  
Input pin  
Figure 1-c  
Control output is level shifted with DC content by zenner diode and attenuator, with control signal content by R  
1
and R .  
2
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TA7259P/F/FG  
Position sensing drive  
Both constant current drive and constant voltage drive are available because the same-phase voltage range  
of the position sensing device is wide. (Spec.: 2V 2.5V. When V 12V, the range is 2 to 9.5V).  
CC  
CC is  
We recommend use of the TOSHIBA THS series of Ga-As position sensing devices.  
In comparison with an In-Sb position sensor, the GaAs sensor is mechanically stronger, has better  
temperature characteristics, and is less prone to saturation by magnetism or current. However, its application  
has been limited by its lower sensitivity when compared with the In-Sb type.  
As for the TA7259, a Ga-As position sensor can be applied by improving the sensitivity of its input amp and  
reducing the offset. When W/F characteristics are poor, increasing the position sensing input may be effective.  
However, take care not to exceed the maximum permissible input.  
Position sensing drive (1)  
(For details, refer to the technical documents of the Toshiba THS series of Ga-As position sensing devices.)  
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TA7259P/F/FG  
ABSOLUTE MAXIMUM RATINGS (Ta = 25°C)  
CHARACTERISTIC  
Supply Voltage  
SYMBOL  
RATING  
UNIT  
V
26  
1.2  
V
A
CC  
Output Current  
I
O
TA7259P  
2.3  
Power Dissipation  
P (Note)  
D
W
TA7259F/FG  
1.0  
Operating Temperature  
Storage Temperature  
T
30~75  
55~150  
°C  
°C  
opr  
T
stg  
Note: IC only.  
ELECTRICAL CHARACTERISTICS (Unless otherwise specified, V = 12 V, Ta = 25°C)  
CC  
TEST  
CIR−  
CUIT  
CHARACTERISTIC  
SYMBOL  
TEST CONDITION  
MIN  
TYP.  
MAX  
UNIT  
I
I
I
FRS open  
FRS = 5 V  
2
4
5
7
9
CC1  
CC2  
CC3  
Quiescent Current  
1
mA  
2
V
= 22 V, FRS = GND  
2
5
9
CC  
Input Offset Voltage  
Residual Output Voltage  
Voltage Gain  
V
1
1
40  
0
10  
1.5  
1.0  
20  
20  
mV  
mV  
IO  
V
V
IN  
= V + = 7 V  
IN  
OR  
G
1
15.0  
1.0  
0.4  
10  
V
Upper  
Lower  
Upper  
Lower  
V
V
I
2
SAT1  
SAT2  
OC1  
Saturation Voltage  
I = 400 mA  
L
V
2
1
Cutoff Current  
V
= 20 V  
µA  
C
I
OC2  
Position Sensing Input Sensitivity  
V
mA  
H
Maximum Position Sensing Input  
Voltage  
V
MAX.  
1
400  
mV  
pp  
H
Position  
Input Operating Voltage  
Control  
CMR  
CMR  
1
1
1
1
1
2.0  
2.0  
V
V
2.5  
H
CC  
V
2.5  
C
CC  
CW  
V
V
0
0.4  
F
S
R
Rotation Control Input  
Voltage (FRS input)  
V
STOP  
2.5  
4.5  
3.0  
5.0  
3.5  
5.8  
CCW  
V
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TA7259P/F/FG  
Test circuit 1  
Control input  
(OFF in testing Icc)  
TA7259  
P/F/FG  
Position  
sensing  
device  
FRS input  
Test circuit 2  
Control input  
Testing upper  
Testing under  
TA7259  
P/F/FG  
Position  
sensing  
device  
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TA7259P/F/FG  
Notes on handling the IC  
Motor drive ICs are easily affected by parasitic vibration and unnecessary feedback. This is because the  
number of high impedance pins, such as position sensing inputs and control signal inputs, is large, and the  
output current value is high and switched.  
Moreover, because it is coil loading, care must be taken not to allow the impulse to destroy the IC during  
ON/OFF switching. Especially when using a high voltage supply (Vcc is 18V or more), care must be taken not to  
apply voltage and current to the output transistor which exceed the specification. Use of a supply voltageof 18V  
or less is recommended. Pay particular attention to the notes above when using a supply voltage over 18V.  
(1) Notes in designing reliability  
) Do not expose the output transistor of the internal IC to high voltage and current,  
especially, in motor lock status, ON/OFF switching of Vcc, output short-circuiting, etc.)  
) The output condenser for ringing absorption should be as small as possible because the output  
transistor can be destroyed by the charge-discharge current of this condenser. When there is a  
problem, adjusting the capacity of the condenser, the connecting position and the connecting method  
(delta or star), and inserting a series resistor (of a few to dozens of ) to the condenser and series  
should provide the oscillating protection explained later.  
) In mounting to the print-board, do not stress the FIN, and solder for only a few seconds at 260.  
) Using the large earth area of the print-board to release heat from the FIN is effective in ensuring  
reliability.  
(2) Notes in wiring  
To protect from parasitic vibration, design the print-pattern following the method below.  
) The output coil current path must be separated from other GND lines because a switched high  
current flows in this path. It is very important that the line (R pinR resisterGND) should not  
F
F
be of a common impedance with other circuits.  
If the above is impossible or the oscillation cannot be removed completely, connect the condenser  
(0.010.1µF) and R in parallel.  
F
TA7259P/F/FG  
Avoid common impedance with other circuits  
Fig. 2  
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TA7259P/F/FG  
) The drive current path of the position sensing device should be connected to the GND independently.  
It should be separated especially from the output current path.  
If there is a plunge in position sensing device, insert the condenser (0.05~1µF) between + pin and –  
pin of each position sensing device.  
If there is a plunge in control input, insert the condenser (0.0010.1µF) between this pin and the  
GND.  
TA7259P/F/FG  
Do not have common impedance with other  
circuits.  
Fig. 3  
) If upper oscillation (5MHz or more) is found, connect the condensers commonly from each coil output  
and then insert the condenser (C = 0.010.1µF) between this connecting point and R pin. (Fig.4a)  
F
Aside from using a ringing absorbing condenser, consider a different method to connect the  
condenser between each coil output and R pin. (Fig 4b)  
F
TA7259  
P/F/FG  
Fig. 4-a  
Fig. 4-b  
) Make sure to take the power supply from V  
pin  
CC  
(“8” pin) directly. Design the circuit not to have the  
common impedance toward GND.  
TA7259  
P/F/FG  
Use of C (0.010.1µF) is also effective.  
2
Fig. 5  
10  
2006-4-14  
TA7259P/F/FG  
(3) Connecting condenser for output ringing absorption  
We recommend connecting a condenser between each coil and the GND for output ringing absorption .  
However, other methods below can be also applied to prevent oscillation and destruction.  
) Changing capacity.  
) Delta connection (Fig.6a)  
) Connect to V  
not to the GND. (Fig. 6b) In this case; take care not to let the IC be destroyed.  
CC,  
If voltage-current locus is beyond the ASO, series resistance or equivalent must be inserted.  
) Connect to R pin.  
F
) Insert a resistance between condenser and series. (Fig. 6c)  
) Combination of ), ), ), and ).  
TA7259  
P/F/FG  
TA7259  
P/F/FG  
Use bipolar condenser.  
Fig. 6-a  
Fig. 6-b  
TA7259  
P/F/FG  
Fig. 6-c  
Others  
The output transistor of the IC can be destroyed when the capacity of the output condenser or its connection is  
not appropriate. To prevent destruction, confirm the voltage-current locus of the output transistor gained from  
the test (see the figure below) is within the ASO. It is especially important to measure the output transistor in  
SW’s ON/OFF timing and the sequence of normal rotation, reverse rotation, and normal rotation.  
Current probe  
To Y-axis of oscilloscope  
Current- voltage locus  
Applying not only La but Lb  
and Lc is recommended.  
To X-axis of oscilloscope  
Fig. 7  
11  
2006-4-14  
TA7259P/F/FG  
Application circuit 1  
Control signal input  
Normal/Reverse SW  
TA7259  
P/F/FG  
Position detection.  
Constant voltage/  
constant current drive.  
(Constant current drive  
is shown in this figure.)  
Coil current  
Hall supply  
1:  
V of zenner diode should correspond to DC level of control signal input.  
Z
(V = 2.59V. In considering temperature characteristics, applying 5V is recommended. DC voltage of  
Z
negative control input (V pin) equals V +R I  
L.  
IN  
Z
F
2:  
3:  
R is determined by the coil impedance, F/V converter voltage (control input), and necessary starting torque.  
F
However, please apply within the range of 0.3 to 5.  
Connect this condenser when there is a plunge in control input.  
Application circuit 2  
Control signal input  
TA7259  
P/F/FG  
Position sensing device  
Normal/Reverse SW  
Note:  
Utmost care is necessary in the design of the output, V , V , and GND lines since the IC may be  
CC  
M
destroyed by short-circuiting between outputs, air contamination faults, or faults due to improper grounding, or  
by short-circuiting between contiguous pins.  
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TA7259P/F/FG  
TA7259F/FG  
TA7259P  
13  
2006-4-14  
TA7259P/F/FG  
PACKAGE DIMENSIONS  
HDIP14P5002.54A  
Unit: mm  
Weight: 3.00 g (Typ.)  
14  
2006-4-14  
TA7259P/F/FG  
HSOP20P4501.00  
Unit: mm  
Weight: 0.79 g (Typ.)  
15  
2006-4-14  
TA7259P/F/FG  
Notes on Contents  
1. Block Diagrams  
Some of the functional blocks, circuits, or constants in the block diagram may be omitted or simplified  
for explanatory purposes.  
2. Equivalent Circuits  
The equivalent circuit diagrams may be simplified or some parts of them may be omitted for  
explanatory purposes.  
3. Timing Charts  
Timing charts may be simplified for explanatory purposes.  
4. Application Circuits  
The application circuits shown in this document are provided for reference purposes only. Thorough  
evaluation is required, especially at the mass production design stage.  
Toshiba does not grant any license to any industrial property rights by providing these examples of  
application circuits.  
5. Test Circuits  
Components in the test circuits are used only to obtain and confirm the device characteristics. These  
components and circuits are not guaranteed to prevent malfunction or failure from occurring in the  
application equipment.  
IC Usage Considerations  
Notes on handling of ICs  
[1] The absolute maximum ratings of a semiconductor device are a set of ratings that must not be  
exceeded, even for a moment. Do not exceed any of these ratings.  
Exceeding the rating(s) may cause device breakdown, damage or deterioration, and may result in  
injury by explosion or combustion.  
[2] Use an appropriate power supply fuse to ensure that a large current does not continuously flow in  
case of over-current and/or IC failure. The IC will break down completely when used under  
conditions that exceed its absolute maximum ratings, when the wiring is routed improperly or when  
an abnormal pulse noise occurs from the wiring or load, causing a large current to continuously flow  
and the breakdown lead to smoke or ignition. To minimize the effects of the flow of a large current  
in case of breakdown, appropriate settings, such as fuse capacity, fusing time and insertion circuit  
location, are required.  
[3] If your design includes an inductive load such as a motor coil, incorporate a protection circuit into  
the design to prevent device malfunction or breakdown caused by the current resulting from the  
inrush current at power ON or the negative current resulting from the back electromotive force at  
power OFF. IC breakdown may cause injury, smoke or ignition.  
Use a stable power supply with ICs with built-in protection functions. If the power supply is  
unstable, the protection function may not operate, causing IC breakdown. IC breakdown may cause  
injury, smoke or ignition.  
[4] Do not insert devices in the wrong orientation or incorrectly.  
Make sure that the positive and negative terminals of power supplies are connected properly.  
Otherwise, the current or power consumption may exceed the absolute maximum rating, and  
exceeding the rating(s) may cause device breakdown, damage or deterioration, and may result in  
injury by explosion or combustion.  
In addition, do not apply current to any device that is incorrectly inserted or oriented, even for an  
instant.  
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2006-4-14  
TA7259P/F/FG  
Points to remember on handling of ICs  
(1) Heat Radiation Design  
In using an IC with large current flow such as a power amp, regulator or driver, please design the  
device so that heat is appropriately radiated, so as not to exceed the specified junction temperature  
(TJ) at any time and condition. These ICs generate heat even during normal use. An inadequate IC  
heat radiation design can lead to a decrease in IC life, deterioration of IC characteristics or IC  
breakdown. In addition, please design the device taking into consideration the effect of IC heat  
radiation on peripheral components.  
(2) Back-EMF  
When a motor rotates in the reverse direction, stops or slows down abruptly, a current flows back to the motor’s  
power supply due to the effect of back-EMF. If the current sink capability of the power supply is small, the  
device’s motor power supply and output pins might be exposed to conditions beyond maximum ratings. To avoid  
this problem, take the effect of back-EMF into consideration in system design.  
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TA7259P/F/FG  
18  
2006-4-14  

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