TA8207K [TOSHIBA]

TOSHIBA Bipolar Linear Integrated Circuit Silicon Monolithic; 东芝双极型线性集成电路硅单片
TA8207K
型号: TA8207K
厂家: TOSHIBA    TOSHIBA
描述:

TOSHIBA Bipolar Linear Integrated Circuit Silicon Monolithic
东芝双极型线性集成电路硅单片

消费电路 商用集成电路 音频放大器 视频放大器 局域网
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TA8207K  
TOSHIBA Bipolar Linear Integrated Circuit Silicon Monolithic  
TA8207K  
Low Frequency Power Amplifier  
TA8207K is an audio power IC with builtin two channels  
developed for portable radio cassette tape recorder with power on  
/ off switch.  
Because of the parts reduction and SIP (single inline package),  
space merit is remarkable.  
Thermal shut down protection circuit is built in.  
Features  
·
High power: P  
= 2.5W (typ.)  
OUT  
(V  
= 9V, R = 4, f = 1kHz, THD = 10%)  
CC  
L
P
(V  
= 4.6W (typ.)  
OUT  
CC  
Weight: 3.2g (typ.)  
= 12V, R = 4, f = 1kHz, THD = 10%)  
L
·
·
·
·
·
·
Low popping noise at power on  
Small quiescent current: I  
Soft clip  
= 21mA (typ.) (V  
CC  
= 9V, V = 0)  
IN  
CCQ  
Builtin thermal shut down protection circuit  
Best for supply voltage 9V, 12V  
Operation supply voltage range: V  
= 6~15V  
CC  
1
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TA8207K  
Maximum Ratings (Ta = 25°C)  
Characteristic  
Symbol  
Rating  
Unit  
Supply voltage  
V
20  
2.5  
V
A
CC  
I
O (peak)  
Output current (peak / CH)  
Power dissipation  
P
12.5  
W
°C  
°C  
D
Operating temperature  
Storage temperature  
T
-20~75  
-55~150  
opr  
T
stg  
Electrical Characteristics  
(unless otherwise specified, V = 9V, R = 4, Rg = 600, f = 1kHz, Ta = 25°C, R = 120)  
CC  
L
f
Test  
Cir-  
cuit  
Characteristic  
Quiescent current  
Symbol  
Test Condition  
Min.  
Typ.  
Max.  
Unit  
mA  
W
I
V
= 0  
IN  
2.0  
21  
2.5  
4.6  
45  
CCQ  
P
P
THD = 10%  
THD = 10%, V  
OUT (1)  
OUT (2)  
Output power  
= 12V  
CC  
Total harmonic  
distortion  
THD  
P
= 0.4W / ch  
0.2  
45  
1.0  
47  
%
OUT  
R = 120,  
f
G
43  
V (1)  
V (2)  
V
= 0.775V  
(0 dBm)  
(0 dBm)  
OUT  
rms  
rms  
Voltage gain  
dB  
R = 0,  
f
G
56.5  
30  
V
= 0.775V  
OUT  
Input resistance  
R
IN  
kΩ  
R = 10k,  
g
Output noise voltage  
Ripple rejection ratio  
V
0.3  
52  
1.0  
mV  
rms  
NO  
BW = 20Hz~20kHz  
R = 600, f = 100Hz  
R.R.  
C.T.  
dB  
dB  
g
ripple  
R = 600, アンプ 12,  
g
Cross talk  
V = 0.775V  
o
(0 dBm),  
50  
rms  
f = 1kHz  
Input offset voltage  
V6, V7  
30  
1
60  
mV  
µA  
Stand-by current  
I
SW off  
1
OFF  
Typical DC Voltage Of Each Terminal (V = 9V, Ta = 25°C)  
CC  
Terminal no.  
DC voltage  
1
2
3
4
5
6
7
8
9
10  
4.5  
11  
12  
8.7  
4.5  
V
5.0  
0.7  
0.03  
0.03  
0.7  
GND  
8.7  
V
CC  
CC  
2
2002-10-30  
TA8207K  
Block Diagram / Test Circuit  
(*1): This IC can be used without coupling capacitor (C ). If volume slide noise occured by input offset voltage is  
IN  
undesirable, it needs to use the capacitor (C ).  
IN  
(*2): The condenser between the (3) pin and the GND (C ) is for reducing pop noise when the power on / off switch  
11  
(SW ) is set to on / off.  
1
3
2002-10-30  
TA8207K  
Application Information And Application Method  
1. Adjustment of voltage gain  
The voltage gain G is obtained as follows by R ,  
V
1
R and R in Fig. 1.  
2
f
R
+ R + R  
1
f
f
2
G
= 20log  
V
R
+ R  
1
When R = 0Ω  
G
V
G
V
= 56.5dB (typ.)  
= 45dB (typ.)  
f
When R = 120Ω  
f
By increasing R , reduction of G is possible. However, since the feedback increase is liable to produce  
f
V
oscillation, it is recommended to use this at 40dB or over.  
2. Thermal shut-down circuit  
The thermal shut-down circuit is built in for the purpose of preventing the destruction of IC due to the  
abnormal temperature rise when the heat radiation is insufficient.  
The operation temperature is set at radiation fin temperature 175°C (typ.).  
At this temperature or over the bias is interrupted to prevent the destruction of IC.  
3. Input stage  
The input circuit of this IC is as shown  
in Fig.2.  
PNP Tr: Q1 is provided in the input  
circuit so as to make its usage possible  
without the input coupling capacitor.  
However, at pin(6) and (7), max 60mV  
offset voltage is produced.  
Application after checking volume slide  
noise is recommended.  
For cutting the volume slide noise,  
insert the input capacitor: C in series  
IN  
to interrupt the DC component.  
4. Oscillation preventive measures  
For oscillation preventive capacitor C and C between the output terminal and GND, it is recommended to  
6
7
use polyester film capacitor having good characteristics for temperature and for high frequency.  
Since the characteristics of the capacitor is liable to be influenced by the temperature, use this capacitor  
after the temperature test to check the oscillation allowance.  
In addition, as the position of the electrolytic capacitor has remarkable influence on the oscillation, connect  
C
10  
to V at the nearest possible position from power GND.  
CC  
At using this application with the voltage gain reduced, oscillation is liable to be produced.  
Apply the capacitor after checking enough for its capacity, type and mounting position.  
(*): As the oscillation allowance varies according to the printed pattern layout, the standard printed board of TOSHIBA  
is recommended to be referrend to design it.  
4
2002-10-30  
TA8207K  
5. Power on / off switch  
There is power on / off switch at (3) pin. However, output power is changed by (3) pin supply voltage when (3)  
pin supply voltage is not same (12) pin supply voltage, after referring to attached date, select (3) pin supply  
voltage.  
6. Input voltage  
When the excessive signal is input, turning-up is produced in the clip waveform. The turning-up point is  
V
IN  
= 300mV  
rms  
(typ.): V = 9V, R = 4, f = 1kHz: Enough care must be taken for this phenomenon.  
CC L  
7. GND line  
GND pin is not separated for pre-GND and for PW-GND. That is liable to cause distortion and cross talk  
worse. Before use this IC, please check it.  
Standard Print Pattern  
5
2002-10-30  
TA8207K  
6
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TA8207K  
7
2002-10-30  
TA8207K  
8
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TA8207K  
Package Dimensions  
Weight: 3.2g (typ.)  
9
2002-10-30  
TA8207K  
RESTRICTIONS ON PRODUCT USE  
000707EBF  
· TOSHIBA is continually working to improve the quality and reliability of its products. Nevertheless, semiconductor  
devices in general can malfunction or fail due to their inherent electrical sensitivity and vulnerability to physical  
stress. It is the responsibility of the buyer, when utilizing TOSHIBA products, to comply with the standards of  
safety in making a safe design for the entire system, and to avoid situations in which a malfunction or failure of  
such TOSHIBA products could cause loss of human life, bodily injury or damage to property.  
In developing your designs, please ensure that TOSHIBA products are used within specified operating ranges as  
set forth in the most recent TOSHIBA products specifications. Also, please keep in mind the precautions and  
conditions set forth in the “Handling Guide for Semiconductor Devices,” or “TOSHIBA Semiconductor Reliability  
Handbook” etc..  
· The TOSHIBA products listed in this document are intended for usage in general electronics applications  
(computer, personal equipment, office equipment, measuring equipment, industrial robotics, domestic appliances,  
etc.). These TOSHIBA products are neither intended nor warranted for usage in equipment that requires  
extraordinarily high quality and/or reliability or a malfunction or failure of which may cause loss of human life or  
bodily injury (“Unintended Usage”). Unintended Usage include atomic energy control instruments, airplane or  
spaceship instruments, transportation instruments, traffic signal instruments, combustion control instruments,  
medical instruments, all types of safety devices, etc.. Unintended Usage of TOSHIBA products listed in this  
document shall be made at the customer’s own risk.  
· This product generates heat during normal operation. However, substandard performance or malfunction may  
cause the product and its peripherals to reach abnormally high temperatures.  
The product is often the final stage (the external output stage) of a circuit. Substandard performance or  
malfunction of the destination device to which the circuit supplies output may cause damage to the circuit or to the  
product.  
· The products described in this document are subject to the foreign exchange and foreign trade laws.  
· The information contained herein is presented only as a guide for the applications of our products. No  
responsibility is assumed by TOSHIBA CORPORATION for any infringements of intellectual property or other  
rights of the third parties which may result from its use. No license is granted by implication or otherwise under  
any intellectual property or other rights of TOSHIBA CORPORATION or others.  
· The information contained herein is subject to change without notice.  
10  
2002-10-30  

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