TB62216FTG_技术文档

・Built-in regulator allows the TB62216FTG to function with only VM power supply.

・Able to customize PWM signal frequency by external condenser.

・Package: QFN48-P-0707-0.50

Note) Please be careful about thermal conditions during use.

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TB62216FTG

Block Diagram

IN_A1

IN_A2

PWM_A

PWM_B

IN_B1

VMR

VCC

VCC_REG

Control Logic

IN_B2

Chopper OSC

OSC

OSCM

TBLK_A

TBLK_B

VREF

Current Level Control

CR-CLK

Converter

Current Feedback

VM

VRS

Output Control

RS COMP

RS_A

RS_B

ISD

TSD

Output

(H-Bridge ×2)

ENABLE

VMR

Detect

VM

Detection Circuit

Stepping

Motor

* Please note that in the block diagram, functional blocks or constants may be omitted or simplified for explanatory purposes.

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TB62216FTG

Notes:

All the grounding wires of the TB62216FTG must run on the solder within the mask of the PCM. It must also be

externally terminated at a single point. Also, the grounding method should be considered for efficient heat

dissipation.

Logic input pins must be correctly wired. While using switches to control input levels, make sure to pull up to VCC

or pull down to GND to avoid high impedance.

Please take extra care while tracing the layout of the VM, GND and output patterns to avoid shortage across output, GND

or power supplies. If such shortage occurs, the TB62216FTG may be permanently damaged.

The utmost care should also be taken for pattern designing and implementation of the TB62216FTG. If power-relevant pins such as

VM, RS, OUT, and GND (which is capable of running particularly large current) are wired incorrectly, an operation error may occur or

the TB62216FTG may be destroyed.

The logic input pins must also be wired correctly. Otherwise, the TB62216FTG may be damaged by a current

larger than the specified current running through the IC.

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TB62216FTG

Pin assignment (TB62216FTG)

(Top View)

34

31

28

30 29 27 26 25

33 32

36

35

24

23

22

NC

37

38

39

NC

GND

21

20

19

18

17

16

15

14

13

OUT_B-

40

41

42

43

44

45

46

47

48

GND

OUT_B-

GND

VREF

TBLK_A

OSCM

TB62216FTG

GND

OUT_A-

IN_A1

IN_A2

GND

NC

PWM_A

PWM_B

NC

3

6

9

12

10 11

1

2

4

5

7

8

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TB62216FTG

Pin Function

TB62216FTG (QFN48)

Function explanation

Pin No.

Pin Name

Function

Pin No.

Pin Name

NC

Function

1

25

26

27

28

29

30

31

32

33

34

35

36

37

38

39

40

41

42

43

44

45

46

47

48

NC

IN_B1

IN_B2

TBLK_B

GND

NC

Not connected

2

Bridge B excitation control input

Bridge B Digital tBLK input

Ground pin for Logic input

Not connected

OUT_B Bridge B + output

3

4

NC

RS_B

NC

Not connected

5

Bridge B sense output

Not connected

6

7

RS_A

NC

Bridge A sense output

Not connected

8

VM

Motor Voltage supply

Not connected

9

NC

10

11

12

13

14

15

16

17

18

19

20

21

22

23

24

OUT_A

NC

Bridge A + output

VCC

NC

Internal regulator voltage monitor

Not connected

Bridge A + output

Not connected

NC

Not connected

NC

Not connected

NC

Not connected

NC

Not connected

NC

Not connected

GND

Ground pin for Bridge A

NC

Not connected

OUT_A- Bridge A – output

GND

VREF

Ground pin for Logic input

Current customize for Bridge A and B

GND

Ground pin for Bridge A

Ground pin for Bridge B

TBLK_A Bridge A Digital tBLK input

OSCM

IN_A1

IN_A2

Oscillator pin for internal PWM signal

OUT_B- Bridge B - output

Bridge A excitation control input

GND

NC

Ground pin for Bridge B

PWM_A Bridge A short brake input

PWM_B Bridge B short brake input

Not connected

NC

Not connected

・Please do not connect any pattern to the NC pin.

・Please connect the pins with the same names, at the nearest point of the device.

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TB62216FTG

Logic Input Function Table

(1) IN_A1, IN_A2 (Bridge A Controller)

Setting the drive mode of Bridge A

PWM_A

IN_A1

IN_A2

L

OUT_A

OUT_A-

Function

L

H

L

OFF

(High impedance)

OFF

(High impedance)

L

STOP(OFF)

L

H

L

H

L

Short brake

CCW

L

H

L

H

L

INPUT

Short brake

CW

H

L

H

L

Short brake

H

(2) IN_B1, IN_B2 (Bridge B Controller)

Setting the drive mode of Bridge B

PWM_B

IN_B1

IN_B2

L

OUT_B

OUT_B-

Function

L

H

L

OFF

(High impedance)

OFF

(High impedance)

L

Stop(OFF)

L

H

L

H

L

Short brake

CCW

L

H

L

H

L

INPUT

Short brake

CW

H

L

H

L

Short brake

H

(3) TBLK_A,B (Digital tBLK Controller)

Setting the noise reject timer

Name

Function

Input

Low

High

Note

OSCM*4clk

OSCM*6clk

TBLK_A,B

Digital tBLK (Noise Reject timer)

Equivalent Input Circuit

CC

INPUT

IN_A1

IN_A2

150 Ω ±30%

IN_B1

INPUT

IN_B2

PWM_A

PWM_B

TBLK_A

TBLK_B

100k Ω ±30%

GND

Please note that in the equivalent input circuit, functional blocks or constants may be omitted or simplified for explanatory purposes.

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TB62216FTG

■The example of combination of H-SW in each motor drive mode (the H-SW Connection)

●Connection example for 1 DC Motor

VM

Bridge A

R

RS

RS_A

OUT_A

OUT_A-

GND

Please note that the functional blocks or constants may be omitted or simplified for explanatory purposes.

・Current feedback and current level set circuits

Note: Logic input pins are pulled down by 100k Ω internally; be sure to short unused logic pins to GND to avoid operation error.

VCC Power

on Reset

VM Power on

Reset

Internal

VM

Regulator

VREF

RS_A/B

RS Comparator

VRS Detect

Current

Feedback

Circuit

IN_A1/A2

IN_B1/B2

TBLK_A/B

PWM_A

PWM_B

Logic

OSCM

Oscillator

ISD

H-Bridge

Controller

Motor

Output

TSD

Error detect

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TB62216FTG

Equivalent Output Circuit (Bridge A, B)

VM

RS_A

RRS_A

U1

U2

From Logic

PreDriver

OUT_A

M

L1

L2

OUT_A-

RS_B

RRS_B

U1

U2

From Logic

PreDriver

OUT_B

M

L1

L2

OUT_B-

GND

Please note that the functional blocks or constants may be omitted or simplified for explanatory purposes.

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TB62216FTG

1．Digital tBLK Function

TBLK

Blanking time

L

Digital tBLK = OSCM×4clk

Digital tBLK = OSCM×6clk

H

Count synchronize

timing

IN_1/IN_2

OSCM

TBLK

count

0

2

3

1

4

5

6

Digital tBLK

signal

Digital tBLK

(TBLK=L)

Digital tBLK

signal

Digital tBLK

(TBLK=H)

Please note that the timing charts or constants may be omitted or simplified for explanatory purposes.

The digital tBLK is used to avoid error judgment of varistor recovery current that occurs in charge

drive mode when H-bridges are used with DC motors. The digital tBLK time can be controlled through

TBLK_A and TBLK_B pins.

By setting digital tBLK, direct PWM control and constant-current control is possible, but the

motor current will rise above the predefined current level (NF) while digital tBLK is active.

Besides digital tBLK, analog tBLK settled by an internal constant of IC is also attached.

2．DC Motor Control Signal Function

PWM_A

IN_A1

L

IN_A2

L

OUT_A

OUT_A-

Function

L

H

L

OFF

(High impedance)

OFF

(High impedance)

STOP(OFF)

L

H

L

H

L

Short brake

CCW

L

H

L

H

L

INPUT

Short brake

CW

H

L

H

L

Short brake

H

OUT_X

OUT_X-

CW

CCW

Please note that the functional blocks or constants may be omitted or simplified for explanatory purposes.

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TB62216FTG

● Absolute Maximum Ratings (Ta=25°C)

Characteristics

Symbol

Rating

Unit

Note

Motor power supply

Motor output voltage

VM

40

V

V_OUT

2.5

A

* 1: per 1 H-SW

I_OUT

Motor output current

RS pin voltage

5.0

A

V

*2: (tw≤500ns)

I_OUT(peak)

VRS

VM ± 4.5

Logic power supply

Logic input voltage

VCC

VIN

6

V

-0.4 to 6.0

GND to 4.2V

*3

*4

VREF reference voltage

VREF

Power dissipation

Operating temperature

Storage temperature

Junction temperature

PD

1.3

W

°C

−20 to 85

−55 to 150

150

Topr

Tstg

Tj

*1: Motor output current is per 1 H-SW. While in use, please make sure that the motor current is controlled to be under 80 %

of the absolute maximum ratings. (In this case, about 2.0A (max) per 1 H-SW).

*2: Motor output current peak width must be less than 500ns

*3: Logic input voltage must be input less than 6.0V

*4: The value in the state where it is not mounted on the board

Ta: Ambient temperature.

Topr: Operating ambient temperature.

Tj: Operating junction temperature. The maximum junction temperature is limited by the thermal shutdown.

Note: The absolute maximum ratings

The absolute maximum ratings are a specification that must not be exceeded, even for a moment.

Exceeding the ratings may cause device breakdown, damage or deterioration, and may result in injury by

explosion or combustion.

Operating Ranges (Ta=0 to 85°C)

Characteristics

Symbol

VM

Note

Min

10

Typ

24

Max

38

Unit

V

Motor power supply

Ta=25°C, per 1 H-SW

(tw≤500ns)

－

1.2

2.0

4.0

A

I_OUT

Motor output current

Logic input voltage

-

I

_OUT(peak)

VIN(H)

VIN(L)

Logic [High] level

Logic [Low] level

2.0

3.3

-

5.5

0.8

V

GND

PWM signal frequency

VREF reference voltage

fchop

VM=24V

40

100

3.0

150

4.0

kHz

V

VREF

GND

Note: Use the maximum junction temperature (Tj) at 120°C or less.

The maximum current cannot be used under certain thermal conditions.

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TB62216FTG

Electrical Specifications 1 (Ta=25°C, VM=24V, unless specified otherwise)

Characteristics

Symbol

VIN(H)

VIN(L)

Test condition

Min

2.0

Typ

－

Max

5.4

Unit

V

High

Low

Logic input voltage

Logic input pins

GND

-0.4

GND

0.8

Logic input hysteresis voltage

Logic input current

Hys

Logic input pins

VIN(H)

0.1

－

0.2

50

－

0.3

70

V

IIN(H)

IIN(L)

μA

VIN(L)

1.0

Outputs: open

IN_A1/A2/B1/B2:L

fchop=100kHz

Output off

Power consumption

IM

－

5.0

7.0

mA

VRS=VM=24V, Vout=0V,

(IN_A1,IN_A2)=(L,L)

(IN_B1,IN_B2)=(L,L)

μA

High-side

IOH

−1

－

Output leakage current

VRS=VM=Vout=24V,

(IN_A1,IN_A2)=(L,L)

(IN_B1,IN_B2)=(L,L)

μA

Low-side

IOL

1

5

－

Bridge A,B current

differential, Iout=2.0A

Bridge-to-Bridge current differential

⊿Iout1

−5

%

Output current error relative to the

predetermined value

⊿Iout2

⊿VRS

Iout=2.0A

-

−5

－

5

%

V

RS pin voltage

0

0.6

0.8

VM=VRS=24V

IN_A1/A2/B1/B2:L

μA

RS pin current

IRS

－

10

Drain-source ON-resistance

(The sum of high side & low side)

Ron(D-S)

Iout=2.0A, Tj=25°C

1.0

1.5

Ω

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TB62216FTG

Electrical Specifications 2 (Ta=25°C, VM=24V, unless specified otherwise)

Characteristics

Internal regulator voltage

Internal regulator current

VREF input voltage

Symbol

VCC

Test condition

ICC=5.0mA

Min

4.75

-

Typ

5.0

2.5

3.0

－

Max

5.25

5.0

4.0

10

Unit

V

ICC

-

mA

V

VREF

VM=24V, Output: OFF

VREF=3.0V, Output: ON

(Note 1)

GND

0

μA

－

°C

V

VREF input current

IREF

VREF gain rate

VREF(gain)

Tj TSD

VCCPOR

VMPOR

ISD

1/5.3

140

2.0

1/5.1

150

3.0

-

1/4.9

160

4.0

8.0

4.6

-

TSD threshold

VCC power on reset voltage

VM power on reset voltage

Over current threshold

Over voltage threshold

VM=24V

6.0

V

Fchop=100kHz (Note 2)

VM-RS pin voltage

2.6

3.6

1.5

A

VRS det

0.9

V

Note 1:

Note 2:

Thermal shutdown (TSD) circuit

When the junction temperature of the device reaches the TSD threshold, the TSD circuit is triggered; the

internal reset circuit then turns off the output transistors. The TSD circuit threshold is between 140 ^oC (min) and

160 ^oC (max). Once the TSD circuit is triggered, the device keeps the output off until power-on reset (POR), is

reasserted.

Over-current/voltage shutdown (ISD/VRS) circuit

When the output current or the RS pin voltage reaches the threshold, the ISD circuit is triggered; the internal

reset circuit then turns off the output transistors. Once the ISD circuit is triggered, the device keeps the output

off until power-on reset (POR), is reasserted. For fail-safe, please insert a fuse to avoid secondary trouble.

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TB62216FTG

AC Electrical Specifications (Ta=25°C, VM=24V, 6.8mH+5.7 Ω )

Characteristics

Symbol

f_Logic

Test condition

Min

－

Typ

－

0.2

1

Max

200

－

Unit

kHz

Logic input frequency

f_OSCM=1600kHz

tw(tLogic)

twp

100

50

Minimum phase pulse width

ns

－

twn

50

－

ｔr

－

-

ｔf

－

tpLH(IN_X)

tpHL(IN_X)

tpLH(OSC)

tpHL(OSC)

－

Output transistor switching

characteristics

Phase to OUT

OSC to OUT

µs

1.5

0.5

1

－

Iout=0.6A,VM=24V

Analog tBLK

Analog blanking time for current

spike elimination

AtBLK

250

400

2.5

550

ns

µs

TBLK:L, ｆ_OSCM=1600kHz

DtBLK(L)

DtBLK(H)

-

Digital tBLK

Digital blanking time for current

spike elimination

TBLK:H, ｆ_OSCM=1600kHz

3.75

Digital tBLK

OSC oscillation reference frequency

Chopping frequency

fOSCM

Ω

1.2

1.6

2.0

MHz

kHz

C＝270pF, R=3.6k

fchop

100

－

f_OSCM=1.6MHz

twp

twn

90%

twLOGIC

VIN/OSCM

50%

10%

tpLH

90%

50%

10%

90%

50%

tPHL

10%

tr

GND

tf

Fig.1 Timing Charts of Input Phase Signal and Output Transistor Switching

Timing charts may be simplified for explanatory purpose.

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TB62216FTG

Calculation of the Predefined Output Current

The peak output current can be set via the current-sensing resistor (RRS) and the reference voltage (VREF), as follows:

VREF ×VREF(gain)

I_OUT

=

RRS

VREF (gain) is Vref reduction rate that is a fixed value of 1/5.1. For example, to calculate the motor output current threshold:

3.0(V)×1/5.1

I_OUT

=

=1.15(A)

0.51(Ω)

1/5.1 is the VREF gain rate. For the value of VREF gain rate, see the Electrical Characteristics Table.

Calculation of the chopping frequency

The chopping frequency is 1/16 of f_OSCM. When f_OSCMis 1600 kHz, the chopping frequency is as follows:

fchop = f_OSCM/ 16 = 1600/16 = 100 (kHz)

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TB62216FTG

IC Power Consumption

The power consumed by the TB62216FTG is approximately the sum of the following:

(1) the power consumed by the output transistors

(2) the power consumed by the digital logic and pre-drivers.

(1) The power consumed by the output transistors is calculated, using the R_ON(D-S) value of 1.0 Ω .

Whether in Charge, Fast Decay or Slow Decay mode, two of the four transistors comprising each H-bridge contribute to its power

consumption at a given time.

Thus the power consumed by each H-bridge is given by:

P OUT=H-Bridge(ch)×I_OUT(A)×VDS(V)= 1×I_OUT²×RON................................. (1)

In two-phase excitation mode (in which two phases have a phase difference of 90°), the average power consumption

in the output transistors is calculated as follows:

RON=1.0 Ω

I

_OUT(peak:typ)=1.0A

P OUT=1( ch )×1.0²(A)×1.0( Ω )=1.0(W) .............................................................. (2)

(2) The power consumption in the IM domain is calculated separately for normal operation and standby modes:

Normal operation mode: IM=5.0mA (typ.)

The current consumed in the digital logic portion of the TB62216FTG is indicated as IM. The digital logic operates off a voltage

regulator internally connected to the VM power supply. It consists of the digital logic connected to VM(24V) and the network affected

by the switching of the output transistors. The total power consumed by IM can be estimated as:

P IM=24(V)×0.005(A)=0.12(W) .............................................................................. (3)

3)The total power consumption of the TB62216FTG

From the result of the two above-mentioned formulas

P=P OUT+P(IM)=1.12(W)

Board design should be fully verified, taking thermal dissipation into consideration.

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TB62216FTG

Current figures of Mixed Decay Mode

The regeneration after reaching setup current is controlled in the order of Fast->Slow (fast decay Æ slow decay).

The timing from fast regeneration to slow regeneration is 37.5% fixation of fchop.

fchop (OSCM×16)

OSCM

Fchop

11

12 13

14

15

0

2

3

8

9

10

1

4

5

6

7

count

MDT:16clk×37.5%=6clk

NF

Motor

Output

Current

MDT

Charge Mode → NF: (set-up current value) → Slow

Mode → Mixed Decay Timing → Fast Mode

*

NF

Motor

Output

Current

MDT

Charge Mode → NF: (set-up current value)

→ Mixed Decay Timing → Fast Mode

Note: About Mixed Decay Timing

Mixed Decay Timing (MDT) is a unique value of the TB62216FTG (fchop×37.5%), but when the motor output current

reaches NF (Itrip) threshold after MDT, the rest of fchop (*) becomes fast decay mode.

Timing charts may be simplified for explanatory purposes.

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TB62216FTG

Output Transistor Operation Mode

VM

RS

VM

RRS

RS

U1

U2

L2

U1

U2

U1

U2

L1

L2

L1

L2

GND

Charge

Short brake

Power supply recovery

Some of the functional blocks, circuits, or constants omitted or simplified for explanatory purpose.

Output Transistor Operational Function

Mode

U1

L1

U2

L2

Charge

ON

OFF

ON

OFF

ON

Slow/Short brake

Power supply recovery

OFF

Note: The parameters shown in the table above are examples when the current flows in the directions shown in the figures above.

For the current flowing in the reverse direction, the parameters change as shown in the table below.

Mode

U1

L1

U2

L2

Charge

OFF

ON

OFF

ON

Slow/Short brake

Power supply recovery

OFF

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TB62216FTG

Over Current Detection (ISD) and Over Voltage of RS detection of (VRS) features

・Detect timing

Count synchronize

timing

ISD/VRS

detect signal

OSCM

ISD/VRS

count

3

0

1

4

5

2

Output transistor

off signal

OFF

(TBLK=L)

Output transistor

off signal

OFF

(TBLK=H)

Timing charts may be simplified for explanatory purpose.

Over Current Eetection (ISD) and Over Voltage of RS detection (VRS) have blanking time to reject irr, switching noise

and inrush current. This blanking time is based on the internal OSC (OSCM) frequency.

ISD, VRS blanking time = OSCM × 3CLK

After detecting ISD / VRS, the detect signal and the internal OSC (OSCM) synchronizes for count up; therefore,

the output transistor is turned off after additional 1 CLK (max).

ISD, VRS detection time = OSCM × 4CLK

ISD and VRS do not necessarily guarantee complete IC safety. If the device is used beyond the specified

operating ranges, these circuits may not operate properly; then the device may be owing to an output

short circuit.

To avoid secondary trouble, please insert fuse to VM line for fail-safe.

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TB62216FTG

●tBLK (blanking time for noise cancellation) features

Two types of dead time (blanking time) are incorporated according to the motor driver structures mainly to prevent error operation due

to noise caused by switching.

The digital tBLK is used to avoid error judgment of varistor recovery current that occurs in charge drive mode when H-bridges are used

with DC motors. The digital tBLK time can be controlled through TBLK_A and TBLK_B pins.

・TBLK_A/B=Low level: OSCM×4clk

・TBLK_A/B=High level: OSCM×6clk

The digital tBLK is based on the internal oscillator (OSCM) frequency; therefore if the OSCM is changed by the

constant(s), the digital tBLK time will also change.

“The dead time for noise cancellation (analog tBLK)” specified according to the motor block AC characteristics is a fixed time

incorporated in the TB62216FTG. This is mainly used for avoiding error judgment of irr (diode recovery current). The analog tBLK time

is a unique value of the TB62216FTG (internal timer of the TB62216FTG) controlled by an inserted low-pass filter with a fixed time of

400 ns (typ.).

● Digital tBLK timing for DC motor

IN1

IN2

Iout

Digital tBLK

The digital tBLANK is inserted at the beginning of each charge period of the constant current chopping, and also when

the IN_1 or IN_2 is switched.

Timing charts may be simplified for explanatory purpose.

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TB62216FTG

Application Circuit Example

TB62216FTG (QFN48)

0.51 Ω

0.1µF

3.6k Ω

NC

GND

270pF

OUT_B-

GND

VREF

OUT_B-

GND

100µF

TBLK_A

OSCM

TB62216FTG

GND

OUT_A-

0.1µF

IN_A1

IN_A2

H

L

GND

NC

PWM_A

PWM_B

NC

H

L

0.51 Ω

The application circuit above is an example; therefore, mass-production design is not guaranteed.

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TB62216FTG

Package Dimensions

QFN48-P-0707-0.50

Unit :mm

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21

TB62216FTG

Notes on Contents

Block Diagrams

Some of the functional blocks, circuits, or constants in the block diagram may be omitted or simplified for explanatory

purposes.

Equivalent Circuits

The equivalent circuit diagrams may be simplified or some parts of them may be omitted for explanatory purposes.

Timing Charts

Timing charts may be simplified for explanatory purposes.

Application Circuits

The application circuits shown in this document are provided for reference purposes only. Thorough evaluation is

required at the mass production design stage. Toshiba does not grant any license to any industrial property rights by

providing these examples of application circuits.

Test Circuits

Components in the test circuits are used only to obtain and confirm the device characteristics. These components and

circuits are not guaranteed to prevent malfunction or failure from occurring in the application equipment.

IC Usage Considerations

Notes on handling of ICs

The absolute maximum ratings of a semiconductor device are a set of ratings that must not be exceeded, even for a

moment. Do not exceed any of these ratings.Exceeding the rating(s) may cause device breakdown, damage or

deterioration, and may result in injury by explosion or combustion.

Use an appropriate power supply fuse to ensure that a large current does not continuously flow in the case of

over-current and/or IC failure. The IC will fully break down when used under conditions that exceed its absolute

maximum ratings, when the wiring is routed improperly or when an abnormal pulse noise occurs from the wiring or

load, causing a large current to continuously flow and the breakdown can lead to smoke or ignition. To minimize the

effects of the flow of a large current in the case of breakdown, appropriate settings, such as fuse capacity, fusing time

and insertion circuit location, are required.

If your design includes an inductive load such as a motor coil, incorporate a protection circuit into the design to

prevent device malfunction or breakdown caused by the current resulting from the inrush current at power ON or the

negative current resulting from the back electromotive force at power OFF. IC breakdown may cause injury, smoke or

ignition. Use a stable power supply with ICs with built-in protection functions. If the power supply is unstable, the

protection function may not operate, causing IC breakdown. IC breakdown may cause injury, smoke or ignition.

Do not insert devices in the wrong orientation or incorrectly. Make sure that the positive and negative terminals of

power supplies are connected properly. Otherwise, the current or power consumption may exceed the absolute

maximum rating, and exceeding the rating(s) may cause device breakdown, damage or deterioration, and may result

in injury by explosion or combustion. In addition, do not use any device that has been inserted incorrectly.

Please take extra care when selecting external components (such as power amps and regulators) or external devices (for

instance, speakers). When large amounts of leak current occurs from capacitors, the DC output level may increase. If the

output is connected to devices such as speakers with low resist voltage, overcurrent or IC failure may cause smoke or

ignition. (The over-current may cause smoke or ignition from the IC itself.) In particular, please pay attention when

using a Bridge Tied Load (BTL) connection-type IC that inputs output DC voltage to a speaker directly.

2012-03-29

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TB62216FTG

Points to remember on handling of ICs

Over current Protection Circuit

Over current protection circuits (referred to as current limiter circuits) do not necessarily protect ICs under all

circumstances. If the Over current protection circuits operate against the over current, clear the over current status

immediately.

Depending on the method of use and usage conditions, such as exceeding absolute maximum ratings can cause the over

current protection circuit to not operate properly or IC breakdown before operation. In addition, depending on the

method of use and usage conditions, if over current continues to flow for a long time after operation, the IC may

generate heat resulting in breakdown.

Thermal Shutdown Circuit

Thermal shutdown circuits do not necessarily protect ICs under all circumstances. If the thermal shutdown circuits

operate against the over temperature, clear the heat generation status immediately.

Depending on the method of use and usage conditions, such as exceeding absolute maximum ratings can cause the

thermal shutdown circuit to not operate properly or IC breakdown before operation.

Heat Radiation Design

In using an IC with large current flow such as power amp, regulator or driver, please design the device so that heat is

appropriately radiated, not to exceed the specified junction temperature (TJ) at any time and condition. These ICs

generate heat even during normal use. An inadequate IC heat radiation design can lead to decrease in IC life,

deterioration of IC characteristics or IC breakdown. In addition, please design the device taking into considerate the

effect of IC heat radiation with peripheral components.

Back-EMF

When a motor rotates in the reverse direction, stops or slows down abruptly, a current flow back to the motor’s power

supply due to the effect of back-EMF. If the current sink capability of the power supply is small, the device’s motor

power supply and output pins might be exposed to conditions beyond absolute maximum ratings. To avoid this problem,

take the effect of back-EMF into consideration in system design.

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TB62216FTG

RESTRICTIONS ON PRODUCT USE

•

Toshiba Corporation, and its subsidiaries and affiliates (collectively “TOSHIBA”), reserve the right to make changes to the information in

this document, and related hardware, software and systems (collectively “Product”) without notice.

This document and any information herein may not be reproduced without prior written permission from TOSHIBA. Even with TOSHIBA’s

written permission, reproduction is permissible only if reproduction is without alteration/omission.

Though TOSHIBA works continually to improve Product’s quality and reliability, Product can malfunction or fail. Customers are

responsible for complying with safety standards and for providing adequate designs and safeguards for their hardware, software and

systems which minimize risk and avoid situations in which a malfunction or failure of Product could cause loss of human life, bodily injury

or damage to property, including data loss or corruption. Before customers use the Product, create designs including the Product, or

incorporate the Product into their own applications, customers must also refer to and comply with (a) the latest versions of all relevant

TOSHIBA information, including without limitation, this document, the specifications, the data sheets and application notes for Product

and the precautions and conditions set forth in the “TOSHIBA Semiconductor Reliability Handbook” and (b) the instructions for the

application with which the Product will be used with or for. Customers are solely responsible for all aspects of their own product design or

applications, including but not limited to (a) determining the appropriateness of the use of this Product in such design or applications; (b)

evaluating and determining the applicability of any information contained in this document, or in charts, diagrams, programs, algorithms,

sample application circuits, or any other referenced documents; and (c) validating all operating parameters for such designs and

applications. TOSHIBA ASSUMES NO LIABILITY FOR CUSTOMERS’ PRODUCT DESIGN OR APPLICATIONS.

•

Product is intended for use in general electronics applications (e.g., computers, personal equipment, office equipment, measuring

equipment, industrial robots and home electronics appliances) or for specific applications as expressly stated in this document. Product

is neither intended nor warranted for use in equipment or systems that require extraordinarily high levels of quality and/or reliability

and/or a malfunction or failure of which may cause loss of human life, bodily injury, serious property damage or serious public impact

(“Unintended Use”). Unintended Use includes, without limitation, equipment used in nuclear facilities, equipment used in the aerospace

industry, medical equipment, equipment used for automobiles, trains, ships and other transportation, traffic signaling equipment,

equipment used to control combustions or explosions, safety devices, elevators and escalators, devices related to electric power, and

equipment used in finance-related fields. Do not use Product for Unintended Use unless specifically permitted in this document.

•

Do not disassemble, analyze, reverse-engineer, alter, modify, translate or copy Product, whether in whole or in part.

Product shall not be used for or incorporated into any products or systems whose manufacture, use, or sale is prohibited under any

applicable laws or regulations.

•

The information contained herein is presented only as guidance for Product use. No responsibility is assumed by TOSHIBA for any

infringement of patents or any other intellectual property rights of third parties that may result from the use of Product. No license to any

intellectual property right is granted by this document, whether express or implied, by estoppel or otherwise.

ABSENT A WRITTEN SIGNED AGREEMENT, EXCEPT AS PROVIDED IN THE RELEVANT TERMS AND CONDITIONS OF SALE

FOR PRODUCT, AND TO THE MAXIMUM EXTENT ALLOWABLE BY LAW, TOSHIBA (1) ASSUMES NO LIABILITY WHATSOEVER,

INCLUDING WITHOUT LIMITATION, INDIRECT, CONSEQUENTIAL, SPECIAL, OR INCIDENTAL DAMAGES OR LOSS, INCLUDING

WITHOUT LIMITATION, LOSS OF PROFITS, LOSS OF OPPORTUNITIES, BUSINESS INTERRUPTION AND LOSS OF DATA, AND

(2) DISCLAIMS ANY AND ALL EXPRESS OR IMPLIED WARRANTIES AND CONDITIONS RELATED TO SALE, USE OF PRODUCT,

OR INFORMATION, INCLUDING WARRANTIES OR CONDITIONS OF MERCHANTABILITY, FITNESS FOR A PARTICULAR

PURPOSE, ACCURACY OF INFORMATION, OR NONINFRINGEMENT.

•

Do not use or otherwise make available Product or related software or technology for any military purposes, including without limitation,

for the design, development, use, stockpiling or manufacturing of nuclear, chemical, or biological weapons or missile technology

products (mass destruction weapons). Product and related software and technology may be controlled under the Japanese Foreign

Exchange and Foreign Trade Law and the U.S. Export Administration Regulations. Export and re-export of Product or related software or

technology are strictly prohibited except in compliance with all applicable export laws and regulations.

Please contact your TOSHIBA sales representative for details as to environmental matters such as the RoHS compatibility of Product.

Please use Product in compliance with all applicable laws and regulations that regulate the inclusion or use of controlled substances,

including without limitation, the EU RoHS Directive. TOSHIBA assumes no liability for damages or losses occurring as a result of

noncompliance with applicable laws and regulations.

2012-03-29

24


型号：	TB62216FTG
厂家：	TOSHIBA
描述：	Brushed DC Motor Driver ICs (Bridge Drivers), TB62216FTG 电动机控制 CD
文件：	总24页 (文件大小：482K)
中文：	中文翻译
下载：	下载PDF数据表文档文件

TB62216FTG [TOSHIBA]

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