TB6592FLG [TOSHIBA]
IC BRUSH DC MOTOR CONTROLLER, 0.8 A, PQCC24, 0.505 INCH, 0.5 MM PITCH, LEAD FREE, PLASTIC, QON-24, Motion Control Electronics;型号: | TB6592FLG |
厂家: | TOSHIBA |
描述: | IC BRUSH DC MOTOR CONTROLLER, 0.8 A, PQCC24, 0.505 INCH, 0.5 MM PITCH, LEAD FREE, PLASTIC, QON-24, Motion Control Electronics 电动机控制 |
文件: | 总11页 (文件大小:180K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
TB6592FL/FLG
Toshiba Bi-CD Integrated Circuit Silicon Monolithic
TB6592FL/FLG
DUAL-BRIDGE DRIVER IC FOR DC MOTORS
The TB6592FL/FLG is a dual-bridge driver IC for DC motors
with output transistors in an LD MOS structure with low
ON-resistance. Two input signals, IN1 and IN2, can be used to
select one of four modes such as CW, CCW, short brake, and stop
mode. A PWM drive system supports high heat efficiency
driving.
Features
•
•
•
•
Power supply voltage for motor: VM ≤ 6 V (max)
Power supply voltage for control: V = 2.7 V to 6.0 V
Weight: 0.05 g (typ.)
CC
= 0.8 A (max)
Output current: I
OUT
Low ON- resistor: 1.5 Ω (typ.)
(Upper side + lower side combined @ VM = 5 V, V
= 5 V)
CC
•
•
•
•
•
Direct PWM control
Standby system (power saving)
CW/CCW/short brake/stop function modes
Built-in thermal shutdown circuit
Small-size leadless package: QON24-P-0505-0.50
TB6592FLG:
The TB6592FLG is a Pb-free product.
The following conditions apply to solderability:
*Solderability
1. Use of Sn-63Pb solder bath
*solder bath temperature = 230°C
*dipping time = 5 seconds
*number of times = once
*use of R-type flux
2. Use of Sn-3.0Ag-0.5Cu solder bath
*solder bath temperature = 245°C
*dipping time = 5 seconds
*number of times = once
*use of R-type flux
*
This product has a MOS structure and is sensitive to electrostatic discharge. When handling this product,
ensure that the environment is protected against electrostatic discharge by using an earth strap, a conductive mat
and an ionizer. Ensure also that the ambient temperature and relative humidity are maintained at reasonable
levels.
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TB6592FL/FLG
Block Diagram
V
BIN1
1
BIN2
2
BPWM
3
BSTBY
4
BO1
5
BO2
8
VM
14
CC
22
Control logic (Channel B)
Bridge Driver
(Channel B)
TSD
Bridge Driver
(Channel A)
Control logic (Channel A)
21
18
17
16
15
13
11
10
GND
AIN1
AIN2
APWM
ASTBY
AO1
AO2
PGND
Pin Functions
Pin Name
Pin No
Functional Description
Remarks
GND for small-signal power supply (V
GND
AIN1
21
18
17
16
Small-signal GND pin
)
CC
Control signal input 1 (Channel A)
Control signal input 2 (Channel A)
AIN2
APWM
PWM control signal input pin (Channel A) Input PWM signal
Channel A circuit is in standby (power save) state
while this signal is Low.
ASTBY
15
Standby control input pin (Channel A)
AO1
AO2
PGND
VM
13
11
10
14
8
Output pin 1 (Channel A)
Output pin 2 (Channel A)
GND pin for motor
Channel A connect to motor coil pin
Channel A connect to motor coil pin
GND for motor power supply (VM)
VM (ope) = 2.5 V to 5.5 V
Motor power supply pin
Output pin 2 (Channel B)
Output pin 1 (Channel B)
BO2
BO1
Channel B connect to motor coil pin
Channel B connect to motor coil pin
5
Channel B circuit is in standby (power save) state
while this signal is Low.
BSTBY
4
Standby control input pin (Channel B)
BPWM
BIN2
3
2
PWM control signal input pin (Channel B) Input PWM signal
Control signal input 2 (Channel B)
BIN1
1
Control signal input 1 (Channel B)
V
CC
22
Small-signal power supply pin
V
= 2.7 V to 5.5 V
CC (ope)
Note: Pins 6, 7, 9, 12, 19, 20, 23 and 24 are NC (not connected) pins.
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TB6592FL/FLG
Input/Output Function (common for channel A and B)
Input
Output
IN1
H
IN2
H
STBY
H
PWM
O1
L
O2
L
Mode
H
L
Short brake
H
L
L
L
H
L
L
L
CW/CCW
Short brake
CCW/CW
L
H
H
L
H
H
H
L
H
L
H
L
Short brake
H
L
OFF
(high impedance)
L
L
Stop
H
L
OFF
(high impedance)
H/L
H/L
Standby
Operating Description
•
PWM control function
Speed can be controlled by inputting the high-level or low-level PWM signal to the pin PWM.
When PWM control is provided, normal operation and short brake operation are repeated.
To prevent penetrating current, dead time (t2 and t4) is provided in the IC.
VM
VM
VM
OUT1
M
OUT2
OUT1
M
OUT2
OUT1
M
OUT2
GND
GND
GND
PWM ON
t1
PWM ON → OFF
t2 = 400 ns (typ.)
PWM OFF
t3
VM
VM
OUT1
M
OUT2
OUT1
M
OUT2
GND
GND
PWM OFF → ON
t4 = 400 ns (typ.)
PWM ON
t5
V
M
t1
t5
Output voltage waveform
(OUT1)
t3
GND
t2
t4
Note: Be sure to set the PWM pin to high if the PWM control function is not used.
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TB6592FL/FLG
•
Switching characteristics of output transistors
The switching characteristics between the PWM input and the output transistors are shown below.
PWM Input
(APWM, BPWM)
t
t
pLH
pHL
90%
50%
90%
50%
Output Voltage
(A01, A02, B01, B02)
10%
10%
t
t
f
r
<Typical Value>
Item
Typical Value
Unit
ns
t
t
1000
1000
100
pLH
pHL
t
r
t
100
f
•
Input pins
Input pins AIN1, AIN2, PWM, STBY have internal pull-down resistors that are connected to ground.
IN1, IN2, PWM
STBY
V
V
CC
CC
To next circuit
To next circuit
100 kΩ
100 kΩ
100 kΩ
100 kΩ
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TB6592FL/FLG
Maximum Ratings (Ta = 25°C)
Characteristics
Symbol
VM
Rating
Unit
V
Remarks
6
6
Supply voltage
V
CC
Input voltage
V
−0.2 to 6
0.8
V
A
IN1, 2, STBY and PWM pins
IN
Output current
I
OUT
0.78
(Note 1)
Power dissipation
P
W
D
Operating temperature
Storage temperature
T
−20 to 85
°C
°C
opr
T
−55 to 150
stg
Note 1: This rating is obtained when the product is mounted on a 50 × 30 × 1.6 mm glass-epoxy PCB of which 40%
or more is occupied by copper.
Operating Range (Ta = −20 to 85°C)
Characteristics
Supply voltage (V
Symbol
Min
Typ.
Max
Unit
)
V
CC
2.7
2.2
⎯
3.0
⎯
⎯
⎯
5.5
5.5
0.6
100
V
V
CC
Supply voltage (VM)
Output current
VM
Iout
A
PWM frequency
fPWM
⎯
kHz
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TB6592FL/FLG
Electrical Characteristics (unless otherwise specified, V = 3 V, VM = 5 V, Ta = 25°C)
CC
Characteristics
Symbol
Test Condition
Min
Typ.
Max
Unit
mA
I
Stop mode
⎯
⎯
⎯
⎯
⎯
0.7
0.7
0.7
⎯
1.2
1.2
1.2
10
1
CC (STP)
I
CW/CCW mode
CC (W)
Supply current
I
Short break mode
CC (SB)
CC (STB)
I
(Standby mode)
(Not tested)
µA
V
I
⎯
M (STB)
V
0.2 V
+
CC
V
INH
2
⎯
Input voltage
V
INL
−0.2
⎯
⎯
0.2
15
⎯
0.8
⎯
25
1
Control circuit
Hysteresis voltage
Input current
V
IN (HIS)
I
5
INH
µA
I
⎯
INL
V
0.2 V
+
CC
V
2
⎯
INSH
Input voltage
Input current
V
V
−0.2
5
⎯
10
⎯
0.3
0.9
⎯
⎯
1
0.8
20
1
INSL
Standby circuit
I
µA
INSH
I
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
INSL
I
I
= 0.2 A, V
= 0.6 A, V
= VM = 5 V
0.4
1.2
1
O
CC
Output saturating voltage
Output leakage current
Diode forward voltage
V
V
µA
V
sat (U + L)
= VM = 5 V
O
CC
I
L (U)
VM = 6 V
I
1
L (L)
V
F (U)
I
I
= 0.6 A
= 0.6 A
⎯
⎯
100
O
V
1
F (L)
O
PWM frequency
f
⎯
kHz
PWM
PWM control
circuit
Minimum clock
pulse width
t
⎯
⎯
10
µs
w (PWM)
Tr
Tf
⎯
⎯
⎯
⎯
100
100
⎯
⎯
⎯
⎯
Output transistor switching
(Not tested)
ns
t
t
1000
1000
pLH (PWM)
pHL (PWM)
Thermal shutdown circuit operating
temperature
T
(Not tested)
(Not tested)
⎯
⎯
170
20
⎯
⎯
°C
°C
SD
Thermal shutdown hysteresis
∆T
SD
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TB6592FL/FLG
Typical Application Diagram
3 V
3~5 V
Note 1
VM
Note 1
V
DD
V
CC
VM
PWM
PORT1
PORT2
PORT3
PORT4
APWM
AIN1
AO1
M
AIN2
AO2
Note 2
ASTBY
Microcontroller
PORT5
TB6592
PWM
BPWM
BIN1
BO1
BO2
PORT6
PORT7
PORT8
M
BIN2
BSTBY
Note 2
GND
GND
PGND
Note 3
Note 1: The power supply capacitor should be connected as close as possible to the IC.
Note 2: When connecting the motor pins through the capacitor for reducing noise, connect a resistor to the capacitor
to limit the charge current.
Note 3: Avoid using common impedance for GND and PGND.
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TB6592FL/FLG
Requests Concerning Use of QON
Outline Drawing of Package
Upper surface
Lower surface
When using QON, take into account the following items.
Caution
(1) Do not carry out soldering on the island sections in the four corners of the package (indicated by the
hatched sections in the figure for the lower surface, above left) with the aim of increasing mechanical
strength.
(2) The projecting island sections on the package surfaces (indicated by the hatched sections in the
figures for the upper and lower surfaces above) must be electrically insulated from outside when used.
Note: Ensure that the island sections (indicated by the hatched sections in the figure for the lower surface,
above left) do not come into contact with solder from through-holes on the board layout.
•
•
When mounting or soldering, take care to ensure that neither static electricity nor electrical
overstress is applied to the IC. (Measures to prevent electrostatic discharge, leaks, etc.)
When incorporating the IC into a set, adopt a set design that does not apply voltage directly to the
island section.
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TB6592FL/FLG
Package Dimensions
Do not carry out soldering at the four corners of the
package.
Weight: 0.05 g (typ.)
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TB6592FL/FLG
Notes on contents
1. Block Diagrams
Some of the functional blocks, circuits, or constants in the block diagram may be omitted or simplified for
explanatory purposes.
2. Equivalent Circuits
The equivalent circuit diagrams may be simplified or some parts of them may be omitted for explanatory
purposes.
3. Timing Charts
Timing charts may be simplified for explanatory purposes.
4. Maximum Ratings
The absolute maximum ratings of a semiconductor device are a set of specified parameter values that must not
be exceeded during operation, even for an instant.
If any of these ratings are exceeded during operation, the electrical characteristics of the device may be
irreparably altered, in which case the reliability and lifetime of the device can no longer be guaranteed.
Moreover, any exceeding of the ratings during operation may cause breakdown, damage and/or degradation in
other equipment. Applications using the device should be designed so that no maximum rating will ever be
exceeded under any operating conditions.
Before using, creating and/or producing designs, refer to and comply with the precautions and conditions set
forth in this document.
5. Application Circuits
The application circuits shown in this document are provided for reference purposes only. Thorough evaluation
is required in the mass production design phase.
In furnishing these examples of application circuits, Toshiba does not grant the use of any industrial property
rights.
6. Test Circuits
Components in test circuits are used only to obtain and confirm device characteristics. These components and
circuits are not guaranteed to prevent malfunction or failure in application equipment.
Handling of the IC
Ensure that the product is installed correctly to prevent breakdown, damage and/or degradation in the product
or equipment.
Over-current protection and heat protection circuits
These protection functions are intended only as a temporary means of preventing output short circuits or other
abnormal conditions and are not guaranteed to prevent damage to the IC.
If the guaranteed operating ranges of this product are exceeded, these protection features may not operate
and some output short circuits may result in the IC being damaged.
The over-current protection feature is intended to protect the IC from temporary short circuits only.
Short circuits persisting over long periods may cause excessive stress and damage the IC. Systems should
be configured so that any over-current condition will be eliminated as soon as possible.
Counter-electromotive force
When the motor reverses or stops, the effect of counter-electromotive force may cause the current to flow to the
power source.
If the power supply is not equipped with sink capability, the power and output pins may exceed the maximum
rating.
The counter-electromotive force of the motor will vary depending on the conditions of use and the features of
the motor. Therefore make sure there will be no damage to or operational problem in the IC, and no damage to
or operational errors in peripheral circuits caused by counter-electromotive force.
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TB6592FL/FLG
RESTRICTIONS ON PRODUCT USE
030619EBA
• The information contained herein is subject to change without notice.
• The information contained herein is presented only as a guide for the applications of our products. No
responsibility is assumed by TOSHIBA for any infringements of patents or other rights of the third parties which
may result from its use. No license is granted by implication or otherwise under any patent or patent rights of
TOSHIBA or others.
• TOSHIBA is continually working to improve the quality and reliability of its products. Nevertheless, semiconductor
devices in general can malfunction or fail due to their inherent electrical sensitivity and vulnerability to physical
stress. It is the responsibility of the buyer, when utilizing TOSHIBA products, to comply with the standards of
safety in making a safe design for the entire system, and to avoid situations in which a malfunction or failure of
such TOSHIBA products could cause loss of human life, bodily injury or damage to property.
In developing your designs, please ensure that TOSHIBA products are used within specified operating ranges as
set forth in the most recent TOSHIBA products specifications. Also, please keep in mind the precautions and
conditions set forth in the “Handling Guide for Semiconductor Devices,” or “TOSHIBA Semiconductor Reliability
Handbook” etc..
• The TOSHIBA products listed in this document are intended for usage in general electronics applications
(computer, personal equipment, office equipment, measuring equipment, industrial robotics, domestic appliances,
etc.). These TOSHIBA products are neither intended nor warranted for usage in equipment that requires
extraordinarily high quality and/or reliability or a malfunction or failure of which may cause loss of human life or
bodily injury (“Unintended Usage”). Unintended Usage include atomic energy control instruments, airplane or
spaceship instruments, transportation instruments, traffic signal instruments, combustion control instruments,
medical instruments, all types of safety devices, etc.. Unintended Usage of TOSHIBA products listed in this
document shall be made at the customer’s own risk.
• The products described in this document are subject to the foreign exchange and foreign trade laws.
• TOSHIBA products should not be embedded to the downstream products which are prohibited to be produced
and sold, under any law and regulations.
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