TBD62004AFWG_技术文档

TBD62003A series, TBD62004A series

TOSHIBA BiCD Integrated Circuit Silicon Monolithic

TBD62003APG, TBD62003AFG, TBD62003AFNG, TBD62003AFWG

TBD62004APG, TBD62004AFG, TBD62004AFNG, TBD62004AFWG

7channel sink type DMOS transistor array

TBD62003APG,TBD62004APG

TBD62003A series and TBD62004A series are DMOS

transistor array with 7 circuits. It has a clamp diode for

switching inductive loads built-in in each output. Please be

careful about thermal conditions during use.

Features

• 7 circuits built-in

• High voltage

• High current

• Input voltage(output on) : TBD62003A series 2.5 V (MIN)

TBD62004A series 7.0 V (MIN)

DIP16-P-300-2.54A

: V_OUT= 50 V (MAX)

: I_OUT= 500 mA/ch (MAX)

TBD62003AFG,TBD62004AFG

• Input voltage(output off) : TBD62003A series 0.6 V (MAX)

TBD62004A series 1.0 V (MAX)

• Package

: PG type DIP16-P-300-2.54A

FG type SOP16-P-225-1.27

FNG type SSOP16-P-225-0.65B

FWG type P-SOP16-0410-1.27-002

SOP16-P-225-1.27

TBD62003AFNG,TBD62004AFNG

Pin connection (top view)

SSOP16-P-225-0.65B

TBD62003AFWG,TBD62004AFWG

Pin connection may be simplified for explanatory purpose.

P-SOP16-0410-1.27-002

Weight

DIP16-P-300-2.54A

SOP16-P-225-1.27

: 1.11 g (Typ.)

: 0.16 g (Typ.)

SSOP16-P-225-0.65B : 0.07 g (Typ.)

P-SOP16-0410-1.27-002 : 0.15 g (Typ.)

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TBD62003A series, TBD62004A series

Pin explanations

Pin No. Pin name

Function

1

2

I1

I2

Input pin

3

I3

Input pin

4

I4

Input pin

5

I5

Input pin

6

I6

Input pin

7

I7

Input pin

8

9

GND

COMMON

O7

GND pin

Common pin

Output pin

10

11

12

13

14

15

16

O6

O5

O4

O3

O2

O1

Equivalent circuit (each driver)

COMMON

Clamp diode

OUTPUT

INPUT

Clamp

Equivalent circuit may be simplified for explanatory purpose.

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Absolute Maximum Ratings (Ta = 25°C)

Characteristics

Symbol

Rating

Unit

Output voltage

COMMON pin voltage

Output current

V_OUT

V_COM

I_OUT

V_IN

50

−0.5 to 50

500

V

mA/ch

V

Input voltage

−0.5 to 30

50

Clamp diode reverse voltage

Clamp diode forward current

PG (Note 1)

V_R

V

I_F

500

mA

1.47

FG (Note 2)

Power

0.625

P_D

W

dissipation

FNG (Note 3)

0.78

FWG (Note 4)

Operating temperature

Storage temperature

1.25

T_opr

T_stg

−40 to 85

−55 to 150

°C

Note 1: Device alone. When Ta exceeds 25°C, it is necessary to do the derating with 11.8 mW/°C.

Note 2: On PCB (Size: 30 mm × 30 mm × 1.6 mm, Cu area: 50%, single-side glass epoxy).

When Ta exceeds 25°C, it is necessary to do the derating with 5 mW/°C.

Note 3: On PCB (Size: 50 mm × 50 mm × 1.6 mm, Cu area: 40%, single-side glass epoxy).

When Ta exceeds 25°C, it is necessary to do the derating with 6.24 mW/°C.

Note 4: On PCB (JEDEC 2s2p).

When Ta exceeds 25°C, it is necessary to do the derating with 10 mW/°C.

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Operating Ranges (Ta = −40 to 85°C)

Characteristics

Symbol

Condition

Min Typ. Max

Unit

Output voltage

V_OUT

V_COM

―

0

―

50

V

COMMON pin voltage

―

1 circuits ON, Ta = 25°C

0

400

Duty = 10%

0

t_pw= 25 ms

PG(Note 1)

FG(Note 2)

7 circuits ON

Ta = 85°C

T_j= 120°C

Duty = 50%

0

―

190

1 circuits ON, Ta = 25°C

0

―

400

270

Duty = 10%

t_pw= 25 ms

7 circuits ON

Ta = 85°C

Duty = 50%

0

―

120

T_j= 120°C

Output

current

I_OUT

mA/ch

1 circuits ON, Ta = 25°C

0

―

400

300

Duty = 10%

t_pw= 25 ms

FNG(Note 3)

7 circuits ON

Ta = 85°C

Duty = 50%

0

―

130

T_j= 120°C

1 circuits ON, Ta = 25°C

0

―

400

390

Duty = 10%

t

_pw= 25 ms

FWG(Note 4)

TBD62003A

7 circuits ON

Ta = 85°C

Duty = 50%

0

―

170

T_j= 120°C

I_OUT= 100 mA or upper, V_OUT= 2 V 2.5

I_OUT= 100 mA or upper, V_OUT= 2 V 7.0

―

25

series

Input voltage

(Output on)

V_IN

(ON)

V

TBD62004A

series

TBD62003A

series

I_OUT= 100 μA or less, V_OUT= 2 V

0

0.6

Input voltage

(Output off)

V_IN

V

(OFF)

TBD62004A

series

I_OUT= 100 μA or less, V_OUT= 2 V

0

―

1.0

Clamp diode forward current

I_F

―

400

mA

Note 1: Device alone.

Note 2: On PCB (Size: 30 mm × 30 mm × 1.6 mm, Cu area: 50%, single-side glass epoxy).

Note 3: On PCB (Size: 50 mm × 50 mm × 1.6 mm, Cu area: 40%, single-side glass epoxy).

Note 4: On PCB (JEDEC 2s2p).

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Electrical Characteristics (Ta = 25°C unless otherwise noted)

Test

Circuit

Characteristics

Symbol

I_leak

Condition

V_OUT= 50V,

Ta = 85 °C

Min

Typ. Max

Unit

Output leakage current

1

―

1.0

μA

V

_IN= 0 V

I_OUT= 350 mA,

V_IN=5.0V

0.7

1.14

―

(2.0) (3.25)

I_OUT= 200 mA,

V_IN=5.0V

0.4 0.65

(2.0) (3.25)

TBD62003A

series

I_OUT= 100 mA,

V_IN=5.0V

0.2 0.325

(2.0) (3.25)

Output voltage

V_DS

V

2

(Output

(Ω)

(R_ON)

I_OUT= 350 mA,

V_IN=7.0V

0.7

1.14

ON-resistance)

(2.0) (3.25)

I_OUT= 200 mA,

V_IN=7.0V

0.4 0.65

(2.0) (3.25)

TBD62004A

series

I_OUT= 100 mA,

V_IN=7.0V

0.2 0.325

(2.0) (3.25)

―

TBD62003A

V_IN= 2.5 V

―

0.1

series

Input current

(Output on)

I_{IN (ON)}

I_{IN (OFF)}

V_{IN (ON)}

3

4

5

mA

μA

V

TBD62004A

series

V_IN= 7.0 V

―

0.5

1.0

2.5

Input current(Output off)

TBD62003A

Input voltage

V_IN= 0 V, Ta = 85°C

series

I_OUT= 100 mA,

(Output on)

V

_OUT= 2 V

TBD62004A

―

7.0

1.0

2.0

series

Clamp diode

reverse current

V_R= 50 V,

6

7

μA

I_R

Ta = 85°C

Clamp diode

forward voltage

Turn−on delay

V_F

I = 350 mA

F

V

t_ON

―

0.4

0.8

―

V_OUT= 50 V

R_L= 125 Ω

C_L= 15 pF

8

μs

Turn−off delay

t_OFF

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TBD62003A series, TBD62004A series

Test circuit

1. I_leak

2. V_DS(R_ON)

COMMON

OUTPUT

INPUT

I_leak

I_OUT

V_OUT

V_IN

V_DS

GND

R_ON= V_DS/ I_OUT

3. I_{IN (ON)}

4. I_{IN (OFF)}

COMMON

OUTPUT

COMMON

OUTPUT

INPUT

I_IN(ON)

V_IN

INPUT

I_IN(OFF)

GND

5. V_{IN (ON)}

6. I_R

COMMON

I_R

V_R

OUTPUT

INPUT

I_OUT

V_OUT

OUTPUT

V_IN(ON)

GND

7. V_F

COMMON

I_F

INPUT

V_F

OUTPUT

GND

Test circuit may be simplified for explanatory purpose.

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TBD62003A series, TBD62004A series

8. t_ON, t_OFF

(Note 1)

(Note 2)

Note 1: Pulse width 50 μs, Duty cycle 10%

Output impedance 50 Ω, t_r≤ 5 ns, t_f≤ 10 ns

Please refer to the following table for the V_IHcondition.

Product

V_IH

TBD62003A series

TBD62004A serise

5.0 V

7.0 V

Note 2: C_Lincludes the probe and the test board capacitance.

Test circuit and timing chart may be simplified for explanatory purpose.

Precautions for Using

This IC does not include built-in protection circuits for excess current or overvoltage.

If this IC is subjected to excess current or overvoltage, it may be destroyed.

Hence, the utmost care must be taken when systems which incorporate this IC are designed.

Utmost care is necessary in the design of the output line, COMMON and GND line since IC may be

destroyed due to short−circuit between outputs, air contamination fault, or fault by improper grounding.

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TBD62003A series, TBD62004A series

Package Dimensions

DIP16-P-300-2.54A

Unit: mm

Weight: 1.11 g (Typ.)

SOP16-P-225-1.27

Unit: mm

Weight: 0.16 g (Typ.)

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TBD62003A series, TBD62004A series

SSOP16-P-225-0.65B

Unit: mm

Weight: 0.07 g (Typ.)

P-SOP16-0410-1.27-002

Unit: mm

Weight: 0.15 g (Typ.)

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TBD62003A series, TBD62004A series

Notes on Contents

1. Pin connection

Pin connection may be simplified for explanatory purpose.

2. Equivalent Circuits

Equivalent circuit may be simplified for explanatory purpose.

3. Test circuit

Test circuit may be simplified for explanatory purpose.

4. Timing chart

Timing charts may be simplified for explanatory purposes.

IC Usage Considerations

Notes on handling of ICs

(1) The absolute maximum ratings of a semiconductor device are a set of ratings that must not be exceeded, even for

a moment. Do not exceed any of these ratings.Exceeding the rating(s) may cause device breakdown, damage or

deterioration, and may result in injury by explosion or combustion.

(2) Do not insert devices in the wrong orientation or incorrectly.Make sure that the positive and negative terminals

of power supplies are connected properly.Otherwise, the current or power consumption may exceed the absolute

maximum rating, and exceeding the rating(s) may cause device breakdown, damage or deterioration, and may

result in injury by explosion or combustion.In addition, do not use any device inserted in the wrong orientation

or incorrectly to which current is applied even just once.

(3) Use an appropriate power supply fuse to ensure that a large current does not continuously flow in the case of

overcurrent and/or IC failure. The IC will fully break down when used under conditions that exceed its absolute

maximum ratings, when the wiring is routed improperly or when an abnormal pulse noise occurs from the

wiring or load, causing a large current to continuously flow and the breakdown can lead to smoke or ignition. To

minimize the effects of the flow of a large current in the case of breakdown, appropriate settings, such as fuse

capacity, fusing time and insertion circuit location, are required.

(4) If your design includes an inductive load such as a motor coil, incorporate a protection circuit into the design to

prevent device malfunction or breakdown caused by the current resulting from the inrush current at power ON

or the negative current resulting from the back electromotive force at power OFF. IC breakdown may cause

injury, smoke or ignition.Use a stable power supply with ICs with built-in protection functions. If the power

supply is unstable, the protection function may not operate, causing IC breakdown. IC breakdown may cause

injury, smoke or ignition.

(5) Carefully select external components (such as inputs and negative feedback capacitors) and load components

(such as speakers), for example, power amp and regulator.If there is a large amount of leakage current such as

from input or negative feedback condenser, the IC output DC voltage will increase. If this output voltage is

connected to a speaker with low input withstand voltage, overcurrent or IC failure may cause smoke or ignition.

(The overcurrent may cause smoke or ignition from the IC itself.) In particular, please pay attention when using

a Bridge Tied Load (BTL) connection-type IC that inputs output DC voltage to a speaker directly.

Points to remember on handling of ICs

Heat Radiation Design

When using an IC with large current flow such as power amp, regulator or driver, design the device so that heat is

appropriately radiated, in order not to exceed the specified junction temperature (TJ) at any time or under any condition.

These ICs generate heat even during normal use. An inadequate IC heat radiation design can lead to decrease in IC life,

deterioration of IC characteristics or IC breakdown. In addition, when designing the device, take into consideration the

effect of IC heat radiation with peripheral components.

Back-EMF

When a motor rotates in the reverse direction, stops or slows abruptly, current flows back to the motor’s power supply

owing to the effect of back-EMF. If the current sink capability of the power supply is small, the device’s motor power

supply and output pins might be exposed to conditions beyond the absolute maximum ratings. To avoid this problem, take

the effect of back-EMF into consideration in system design.

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TBD62003A series, TBD62004A series

RESTRICTIONS ON PRODUCT USE

• Toshiba Corporation, and its subsidiaries and affiliates (collectively "TOSHIBA"), reserve the right to make changes to the information in

this document, and related hardware, software and systems (collectively "Product") without notice.

• This document and any information herein may not be reproduced without prior written permission from TOSHIBA. Even with TOSHIBA's

written permission, reproduction is permissible only if reproduction is without alteration/omission.

• Though TOSHIBA works continually to improve Product's quality and reliability, Product can malfunction or fail. Customers are

responsible for complying with safety standards and for providing adequate designs and safeguards for their hardware, software and

systems which minimize risk and avoid situations in which a malfunction or failure of Product could cause loss of human life, bodily injury

or damage to property, including data loss or corruption. Before customers use the Product, create designs including the Product, or

incorporate the Product into their own applications, customers must also refer to and comply with (a) the latest versions of all relevant

TOSHIBA information, including without limitation, this document, the specifications, the data sheets and application notes for Product

and the precautions and conditions set forth in the "TOSHIBA Semiconductor Reliability Handbook" and (b) the instructions for the

application with which the Product will be used with or for. Customers are solely responsible for all aspects of their own product design or

applications, including but not limited to (a) determining the appropriateness of the use of this Product in such design or applications; (b)

evaluating and determining the applicability of any information contained in this document, or in charts, diagrams, programs, algorithms,

sample application circuits, or any other referenced documents; and (c) validating all operating parameters for such designs and

applications. TOSHIBA ASSUMES NO LIABILITY FOR CUSTOMERS' PRODUCT DESIGN OR APPLICATIONS.

•

PRODUCT IS NEITHER INTENDED NOR WARRANTED FOR USE IN EQUIPMENTS OR SYSTEMS THAT REQUIRE

EXTRAORDINARILY HIGH LEVELS OF QUALITY AND/OR RELIABILITY, AND/OR A MALFUNCTION OR FAILURE OF WHICH MAY

CAUSE LOSS OF HUMAN LIFE, BODILY INJURY, SERIOUS PROPERTY DAMAGE AND/OR SERIOUS PUBLIC IMPACT

("UNINTENDED USE"). Except for specific applications as expressly stated in this document, Unintended Use includes, without

limitation, equipment used in nuclear facilities, equipment used in the aerospace industry, medical equipment, equipment used for

automobiles, trains, ships and other transportation, traffic signaling equipment, equipment used to control combustions or explosions,

safety devices, elevators and escalators, devices related to electric power, and equipment used in finance-related fields. IF YOU USE

PRODUCT FOR UNINTENDED USE, TOSHIBA ASSUMES NO LIABILITY FOR PRODUCT. For details, please contact your TOSHIBA

sales representative.

• Do not disassemble, analyze, reverse-engineer, alter, modify, translate or copy Product, whether in whole or in part.

• Product shall not be used for or incorporated into any products or systems whose manufacture, use, or sale is prohibited under any

applicable laws or regulations.

• The information contained herein is presented only as guidance for Product use. No responsibility is assumed by TOSHIBA for any

infringement of patents or any other intellectual property rights of third parties that may result from the use of Product. No license to any

intellectual property right is granted by this document, whether express or implied, by estoppel or otherwise.

•

ABSENT A WRITTEN SIGNED AGREEMENT, EXCEPT AS PROVIDED IN THE RELEVANT TERMS AND CONDITIONS OF SALE

FOR PRODUCT, AND TO THE MAXIMUM EXTENT ALLOWABLE BY LAW, TOSHIBA (1) ASSUMES NO LIABILITY WHATSOEVER,

INCLUDING WITHOUT LIMITATION, INDIRECT, CONSEQUENTIAL, SPECIAL, OR INCIDENTAL DAMAGES OR LOSS, INCLUDING

WITHOUT LIMITATION, LOSS OF PROFITS, LOSS OF OPPORTUNITIES, BUSINESS INTERRUPTION AND LOSS OF DATA, AND

(2) DISCLAIMS ANY AND ALL EXPRESS OR IMPLIED WARRANTIES AND CONDITIONS RELATED TO SALE, USE OF PRODUCT,

OR INFORMATION, INCLUDING WARRANTIES OR CONDITIONS OF MERCHANTABILITY, FITNESS FOR A PARTICULAR

PURPOSE, ACCURACY OF INFORMATION, OR NONINFRINGEMENT.

• Do not use or otherwise make available Product or related software or technology for any military purposes, including without limitation,

for the design, development, use, stockpiling or manufacturing of nuclear, chemical, or biological weapons or missile technology

products (mass destruction weapons). Product and related software and technology may be controlled under the applicable export laws

and regulations including, without limitation, the Japanese Foreign Exchange and Foreign Trade Law and the U.S. Export Administration

Regulations. Export and re-export of Product or related software or technology are strictly prohibited except in compliance with all

applicable export laws and regulations.

• Please contact your TOSHIBA sales representative for details as to environmental matters such as the RoHS compatibility of Product.

Please use Product in compliance with all applicable laws and regulations that regulate the inclusion or use of controlled substances,

including without limitation, the EU RoHS Directive. TOSHIBA ASSUMES NO LIABILITY FOR DAMAGES OR LOSSES OCCURRING

AS A RESULT OF NONCOMPLIANCE WITH APPLICABLE LAWS AND REGULATIONS.

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型号：	TBD62004AFWG
厂家：	TOSHIBA
描述：	7channel sink type DMOS transistor array
文件：	总11页 (文件大小：351K)
中文：	中文翻译
下载：	下载PDF数据表文档文件

TBD62004AFWG [TOSHIBA]

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