TCD1254GFG(8Z,AA) [TOSHIBA]
CCD Sensor, 1.5-3.0V, Rectangular, Surface Mount;
| 型号： | TCD1254GFG(8Z,AA) |
| 厂家： | 
TOSHIBA |
| 描述： | CCD Sensor, 1.5-3.0V, Rectangular, Surface Mount CD 传感器 换能器 |
| 文件： | 总18页 (文件大小：487K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
TOSHIBA CCD Linear Image Sensor CCD (Charge Coupled Device)
TCD1254GFG
TCD1254GFG
TOSHIBA CCD Linear Image Sensor CCD (Charge Coupled Device)
TCD1254GFG
The TCD1254GFG is a high sensitive and low dark current 2500
elements CCD linear image sensor.
This device consists of sensitivity CCD chip.
The TCD1254GFG has electronic shutter function (ICG).
Electronic shutter function can keep always output voltage constant
that vary with intensity of lights.
Features
WQFN16X-240A
Number of Image Sensing Elements: 2500 elements
Image Sensing Element Size: 5.25m by 64m on 5.25 m
center
Photo Sensing Region: High sensitive PN photodiode
Power Supply Voltage: 3.0 V (min)
Internal Circuit: CCD drive circuit
Package: 16 pin GLCC
Function: Electronic shutter, Sample and hold circuit
ABSOLUTE MAXIMUM RATINGS (Note 1)
Pin Connections (top view)
Information in this datasheet is preliminary and should not be relied on in undertaking system design.
Characteristic
Symbol
Rating
Unit
V
Master clock pulse voltage
Shift pulse voltage
V
V
M
SH
Integration clear pulse voltage
Digital power supply voltage
Analog power supply voltage
Operating temperature
V
-0.3 to +7.0
ICG
V
V
DD
AD
opr
T
-25 to +60
-40 to +85
°C
°C
Storage temperature
T
stg
Note 1: All voltages are with respect to SS terminals (ground).
None of the ABSOLUTE MAXIMUM RATINGS must be exceeded,
even instantaneously.
If any one of the ABSOLUTE MAXIMUM RATINGS is exceeded,
the electrical characteristics, reliability and life time of the device
cannot be guaranteed. If the ABSOLUTE MAXIMUM RATINGS are
exceeded, the device can be permanently damaged or degraded.
Create a system design in such a manner that any of the
ABSOLUTE MAXIMUM RATINGS will not be exceeded under any
circumstances.
© 2017
Toshiba Electronic Devices & Storage Corporation
1
Rev.1.3 2019-01-24
TCD1254GFG
Circuit Diagram
CCD analog shift register 2
Shift gate 2
Integration clear gate 2
Signal
Photodiode
output
buffer
Integration clear gate 1
Shift gate 1
CCD analog shift register 1
Logic circuit
Information in this datasheet is preliminary and should not be relied on in undertaking system design.
Pin Names
Pin No.
Symbol
OS
Name
Pin No.
Symbol
NC
Name
1
2
3
4
5
6
7
8
Output signal
Ground
16
15
14
13
12
11
10
9
Non connection*
Non connection*
Non connection*
Non connection*
Non connection*
Non connection*
Non connection*
Non connection*
SS
VAD
VDD
M
NC
Power supply (Analog)
Power supply (Digital)
Master clock
NC
NC
NC
ICG
SH
Integration clear gate
Shift gate
NC
NC
NC
Non connection*
NC
* All NC pins should be kept open, or connected to ground on PCB.
© 2017
Toshiba Electronic Devices & Storage Corporation
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Rev.1.3 2019-01-24
TCD1254GFG
Optical/Electrical Characteristics
Ta 25°C, VAD VDD 4.0 V, V 4.0 V (pulse), f M 2.0 MHz (data rate 1.0 MHz),
tINT (integration time) 10 ms, light source daylight fluorescent lamp
Characteristics
Symbol
Min
Typ.
Max
Unit
Note
Sensitivity
R
PRNU
RI
72
103
10
3
V/lxs
%
(Note 2)
(Note 3)
(Note 4)
(Note 5)
(Note 6)
(Note 7)
Photo response non uniformity
Register imbalance
1.5
1.0
0.01
2.5
24
%
Saturation output voltage
Saturation exposure
V
0.7
15
60
1.0
3.0
V
SAT
SE
lxs
mV
mW
%
Dark signal voltage
V
MDK
DC power dissipation
Total transfer efficiency
P
D
TTE
92
92
83
95
(Note 8)
(Note 9)
(Note 10)
95
%
Low voltage total transfer efficiency
LVTTE
88
%
Output impedance
DC output signal voltage
Dynamic range
Z
O
0.5
2.3
400
k
V
V
1.5
(Note 11)
(Note 12)
OS
DR
Note 2: Sensitivity is defined for signal outputs average when the photosensitive surface is applied with the light of
uniform illumination and uniform color temperature.
Note 3: PRNU is defined for a single chip by the expressions below when the photosensitive surface is applied with
the light of uniform illumination and uniform color temperature, where measured approximately 500 mV of
signal output.
X
X
Information in this datasheet is preliminary and should not be relied on in undertaking system design.
PRNU
100 (%)
X
: Average of total signal outputs
X: The maximum deviation from
X
Note 4: Register imbalance is defined as follows.
Y
×100 (%)
RI
X
X
: Average of total signal outputs
Y: | average of odd effective signal outputs average of even effective signal outputs |
Note 5:
V
SAT
is defined as the minimum saturation output voltage of all effective pixels.
Note 6: Definition of SE:
V
SAT
SE
R
Note 7:
V
MDK
is defined as the maximum dark signal voltage of all effective pixels.
OS
V
MDK
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TCD1254GFG
Note 8: Total transfer efficiency is defined as follows.
* Q0 500 mV
Average of dummy outputs
Q1’
Q0
Q0’
Q1
Q0
Q0 Q1
TTE
100
Use Q0’ and Q1’ instead of Q0 and Q1 if Q1’ Q1.
Note 9: Definition of low voltage total transfer efficiency is the same as Note 8 without power supply and Q0.
* 4 V Power supply 5 V
* Q0 50 mV
Note 10: Definition is the same as Note 9 without power supply as follows.
* 3 V Power supply 4 V
Note 11: DC output signal voltage is defined as follows.
OS
V
OS
Information in this datasheet is preliminary and should not be relied on in undertaking system design.
SS
Note 12: Definition of DR:
V
SAT
DR
V
MDK
V
MDK
is proportional to t
(integration time). So the shorter integration time makes wider dynamic range.
INT
© 2017
Toshiba Electronic Devices & Storage Corporation
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Rev.1.3 2019-01-24
TCD1254GFG
Recommended Operating Conditions (Ta 25°C)
For best performance, the device should be used within the Recommended Operating Conditions.
Characteristics
Symbol
Min
Typ.
Max
Unit
Note
“H” level
“L” level
“H” level
“L” level
“H” level
“L” level
3.0
0
4.0
0
5.0
0.44
5.0
Master clock pulse voltage
V
V
(Note 13)
M
SH
3.0
0
4.0
0
Shift pulse voltage
V
V
V
(Note 13)
(Note 13)
0.44
5.0
3.0
0
4.0
0
Integration clear pulse voltage
V
ICG
0.44
5.0
Power supply voltage (Digital)
Power supply voltage (Analog)
V
V
3.0
3.0
4.0
4.0
V
V
(Note 14)
(Note 14)
DD
5.0
AD
Note 13: “H” level of the maximum pulse voltage V
V
0.5 V “H” level of the minimum pulse voltage.
DD
DD
Note 14: V
V
DD
AD
Clock Characteristics (Ta 25°C) (3.0 V VAD VDD 5.0 V)
For best performance, the device should be used within the Recommended Operating Conditions.
Characteristics
Symbol
Min
Typ.
Max
Unit
Master clock pulse frequency
Data rate
f
0.4
0.2
2.0
1.0
10
4.0
2.0
MHz
MHz
pF
M
f
DATA
Information in this datasheis preliminary and should not be relied on in undertaking system dsign.
Master clock capacitance
Shift gate capacitance
Integration clear gate capacitance
C
C
M
200
50
pF
SH
C
pF
ICG
Power-on Characteristics
CCD sensor has the characteristics that a correct output signal will be appeared after power supply reached to regular
voltage. It is required to 10 cycles of read out time at least after power supply reached to regular voltage. This
characteristics should be considered, when circuit designs.
© 2017
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Rev.1.3 2019-01-24
Toshiba Electronic Devices & Storage Corporation
TCD1254GFG
Timing Chart 1
t
（integration time）
INT
SH
ICG
M
Information in this datasheet is preliminary and should not be relied on in undertaking system design.
OS
Light shielded outputs
(13 elements)
Dummy outputs
(16 elements)
(3 elements)
Effective outputs
(2500 elements)
Dummy outputs (32 elements)
Dummy outputs (15 elements)
1 line readout period (2547 elements)
© 2017
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Rev.1.3 2019-01-24
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TCD1254GFG
Timing Chart 2 (Use Electronic Shutter Function)
t
(integration time)
INT
Readout time
SH
ICG
M
Information in this datasheet is preliminary and should not be relied on in undertaking system design.
OS
Light shielded outputs
(13 elements)
Dummy outputs
(16 elements)
(3 elements)
Effective outputs
(2500 elements)
Dummy outputs (32 elements)
Dummy outputs (15 elements)
1 line readout period (2547 elements)
© 2017
Toshiba Electronic Devices & Storage Corporation
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Rev.1.3 2019-01-24
TCD1254GFG
Timing Requirements
t2
t3
t1
t4
SH
ICG
M
D1
D2
OS
D0
Characteristics
ICG pulse delay
Symbol
Min
Typ.
Max
Unit
t1
t2
t3
t4
1000
100
1000
0
5000
500
1000
ns
ns
ns
ns
Pulse timing of ICG and SH
Shift pulse width
Pulse timing of ICG and M
20
*: To keep M “H” level when ICG switch from “L” to “H” level.
Information in this datasheet is preliminary and should not be relied on in undertaking system design.
Use Electronic Shutter
Pulse timing of SH and ICG
t3 ** ***
t
(integration time)
****
INT
***
***
・・・・・・・・・・・
SH
ICG
Readout time
** : Each SH high pulse have to keep always the same value with “t3“. (t3 1000 ns (min))
*** : SH pulse cycle have to keep the same cycle (SH cycle period 10 s) except t period.
INT
**** : t
Note:
10 s (min)
INT
The illumination of light source must be used with less than 1000 times based on 0.7 V signal output with10
ms t
.
INT
© 2017
Toshiba Electronic Devices & Storage Corporation
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Rev.1.3 2019-01-24
TCD1254GFG
Typical Performance Curves
Spectral Response
Wavelength [nm]
Sensitivity Response
200
150
100
50
ft
0
3
3.5
4
4.5
5
Power supply V , V [V]
AD DD
© 2017
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Rev.1.3 2019-01-24
Toshiba Electronic Devices & Storage Corporation
TCD1254GFG
Typical Performance Curves
DC Output Signal Voltage –
Power Supply Voltage
Power supply V , V
AD DD
[V]
Information in this datasheet is preliminary and should not be relied on in undertaking system design.
© 2017
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Rev.1.3 2019-01-24
Toshiba Electronic Devices & Storage Corporation
TCD1254GFG
Typical Drive Circuit
* All NC pins should be kept open, or connected to ground on PCB.
4.0 V
4.0 V
10 F/25 V
ft
© 2017
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Rev.1.3 2019-01-24
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TCD1254GFG
Cautions
1. Electrostatic Breakdown
Store in shorting clip or in conductive foam to avoid electrostatic breakdown.
CCD Image Sensor is protected against static electricity, but inferior puncture mode device due to static electricity
is sometimes detected. In handing the device, it is necessary to execute the following static electricity preventive
measures, in order to prevent the trouble rate increase of the manufacturing system due to static electricity.
a.
b.
Prevent the generation of static electricity due to friction by making the work with bare hands or by putting
on cotton gloves and non-charging working clothes.
Discharge the static electricity by providing earth plate or earth wire on the floor, door or stand of the work
room.
c.
d.
e.
Ground the tools such as cutting pliers, tweezers or pincer.
When the product is handed, please use tweezers to avoid the damage of CCD image sensor.
Ionized air is recommended for discharge when handling CCD image sensors.
It is not necessarily required to execute all precaution items for static electricity.
It is all right to mitigate the precautions by confirming that the trouble rate within the prescribed range.
2. Incident Light
CCD sensor is sensitive to infrared light. Note that infrared light component degrades resolution and PRNU of
CCD sensor.
3. Ultrasonic Cleaning
Ultrasonic cleaning should not be used with such hermetically-sealed ceramic package as CCD because the
bonding wires can become disconnected due to resonance during the cleaning process.
4. Window Glass
Information in this datasheet is preliminary and should not be relied on in undertaking system design.
The dust and stain on the glass window of the package degrade optical performance of CCD sensor.
Keep the glass window clean by saturating a cotton swab in alcohol and lightly wiping the surface, and allow the
glass to dry, by blowing with filtered dry N . Care should be taken to avoid mechanical or thermal shock because
2
the glass window is easily to damage.
© 2017
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Rev.1.3 2019-01-24
TCD1254GFG
5. Cleaning Method of the Window Glass Surface
Wiping Cloth
a.
b.
c.
Use soft cloth with a fine mesh.
The wiping cloth must not cause dust from itself.
Use a clean wiping cloth necessarily.
Cleaner
When using solvents, such as alcohol, unavoidably, it is cautious of the next.
a.
b.
c.
A clean thing with quick-drying.
After liquid dries, there needs to be no residual substance.
A thing safe for a human body.
And, please observe the use term of a solvent and use the storage container of a solvent to be clean.
Be cautious of fire enough.
Way of Cleaning
First, the surface of window glass is wiped with the wiping cloth into which the cleaner was infiltrated. Please wipe
down the surface of window glass at least 2 times or more.
Next, the surface of window glass wipes with the dry wiping cloth. Please wipe down the surface of window glass
at least 3 times or more.
Finally, blow cleaning is performed by dry N filtered.
2
If operator wipes the surface of the window glass with the above-mentioned process and dirt still remains,
TOSHIBA recommends repeating the clean operation from the beginning.
Be cautious of the next thing.
a.
b.
c.
d.
Don't infiltrate the cleaner too much.
A wiping portion is performed into the optical range and don't touch the edge of window glass.
Be sure to wipe in a long direction and the same direction.
A wiping cloth always uses an unused portion.
Information in this datasheet is preliminary and should not be relied on in undertaking system design.
Wiper
© 2017
Toshiba Electronic Devices & Storage Corporation
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Rev.1.3 2019-01-24
TCD1254GFG
The Standard Reflow Condition for GLCC (Surface Mount Device)
1. Storage Precautions
1) CCD surface mount products may have a haze on the inside of glass, so be careful about following. Even if
the haze arises inside of glass, when it is not on the pixel area, there is no problem in quality.
2) Do not drop or toss device packaging. The laminated aluminum material in it can be rendered ineffective by
rough handling.
3) Ensure devices should be stored in a 30°C·90 %RH or better environment. Use devices within 12 months;
do not store them longer than that.
4) In the following cases, in order to remove humidity from a device, bake for 24 hours at 125°C. When a
"30 % humidity indicator" has become pink after the package opened, or when the effective period of the
indicator has passed.
5) Prevent destruction of the device by static electricity in the case of the bake processing for removing
humidity.
6) After opening moisture-proof packing, store a product in 30°C·60 %RH or better environment and use them
within five days. If the effective usage period passed after opening the moisture-proof packing, baking
should be done before use at 125°C for 24 hours.
2. Mounting Conditions Using Reflow
1) Mounting method:
(a) Hot air reflow
(b) Infrared ray reflow
150 to 180°C, 60 to 120 s
(a) Maximum 240°C
(b) Over 230°C, within 30 to 50 s
Only 1 time
2) Preheating condition:
3) Reflow condition:
4) Heating times:
* The temperature profile is specified in terms of the temperature of top surface of the device.
This temperature profile shows the maximum guaranteed device temperature. Please set up the
optimum temperature profile conditions within the fig.1 profile.
ft
Reflow Profile
Main-Heat
30 to 50 [s]
Pre-Heat
60 to 120 [s]
Time [s]
fig.1 Example of recommended temperature profile for reflows
In addition, in case of the repair work accompanied by IC removal, since the degree of parallel may be spoiled
with the left solder, please do not carry out.
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TCD1254GFG
3. Mounting
1) In the case of solder mounting, the devices should be mounted with the window glass protective tape in
order to avoid dust or dirt included in reflow machine.
2) The window glass protective tape is manufactured from materials in which static charges tend to build up.
When removing the tape from CCD sensor after solder mounting, install an ionizer to prevent the tape from
being charged with static electricity.
3) When the tape is removed, adhesives will remain in the glass surface. Since these adhesives appear as
black or white flaws on the image, please wipe the window glass surface with the cloth into which the
organic solvent was infiltrated. Then please attach CCD to a product.
4) Do not reuse the window glass protective tape.
5) The parts of glass seal area have possibility to be became clouded by reflow process, however, there is no
problem in quality.
4. Foot Pattern on the PCB
We recommend fig.2’s foot pattern for your PCB (Printed Circuit Board).
Unit: mm
ft
fig.2 Foot pattern
5. Mask for Solder Paste Application
We recommend metal mask that have the following thickness.
Thickness: 0.1 mm.
And we recommend that the opened area size on the metal mask is 100 % for pads on solder.
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TCD1254GFG
Package Dimensions
WQFN16X-240A
Unit: mm
13.13(5.25 µm 2500)
ft
Note 1: Distance between the edge of the package and the first pixel (S1)
Note 2: Distance between the top of chip and bottom of the package
Note 3: Distance between the edge of the package and the chip center
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TCD1254GFG
RESTRICTIONS ON PRODUCT USE
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Hardware, software and systems described in this document are collectively referred to as “Product”.
TOSHIBA reserves the right to make changes to the information in this document and related Product without notice.
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TOSHIBA's written permission, reproduction is permissible only if reproduction is without alteration/omission.
Though TOSHIBA works continually to improve Product's quality and reliability, Product can malfunction or fail. Customers are
responsible for complying with safety standards and for providing adequate designs and safeguards for their hardware, software and
systems which minimize risk and avoid situations in which a malfunction or failure of Product could cause loss of human life, bodily
injury or damage to property, including data loss or corruption. Before customers use the Product, create designs including the Product,
or incorporate the Product into their own applications, customers must also refer to and comply with (a) the latest versions of all
relevant TOSHIBA information, including without limitation, this document, the specifications, the data sheets and application notes for
Product and the precautions and conditions set forth in the "TOSHIBA Semiconductor Reliability Handbook" and (b) the instructions for
the application with which the Product will be used with or for. Customers are solely responsible for all aspects of their own product
design or applications, including but not limited to (a) determining the appropriateness of the use of this Product in such design or
applications; (b) evaluating and determining the applicability of any information contained in this document, or in charts, diagrams,
programs, algorithms, sample application circuits, or any other referenced documents; and (c) validating all operating parameters for
such designs and applications. TOSHIBA ASSUMES NO LIABILITY FOR CUSTOMERS' PRODUCT DESIGN OR APPLICATIONS.
PRODUCT IS NEITHER INTENDED NOR WARRANTED FOR USE IN EQUIPMENTS OR SYSTEMS THAT REQUIRE
EXTRAORDINARILY HIGH LEVELS OF QUALITY AND/OR RELIABILITY, AND/OR A MALFUNCTION OR FAILURE OF WHICH
MAY CAUSE LOSS OF HUMAN LIFE, BODILY INJURY, SERIOUS PROPERTY DAMAGE AND/OR SERIOUS PUBLIC IMPACT
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limitation, equipment used in nuclear facilities, equipment used in the aerospace industry, lifesaving and/or life supporting medical
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Information in this datasheet is preliminary and should not be relied on in undertaking system design.
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