TCD2913BFG [TOSHIBA]
CCD Imaging ICs; Target Application: MFP/Scanner; Number of Pixels x Lines: 5400x8; Pixel Size (Micron): 5.25um; Resolution (dpi): 1200; Data Rate (Color/BW) (MHz): 10 ; 20; Sensitivity (G; BW) (V/lx.s): 6.7 ; 22.4;
| 型号： | TCD2913BFG |
| 厂家： | 
TOSHIBA |
| 描述： | CCD Imaging ICs; Target Application: MFP/Scanner; Number of Pixels x Lines: 5400x8; Pixel Size (Micron): 5.25um; Resolution (dpi): 1200; Data Rate (Color/BW) (MHz): 10 ; 20; Sensitivity (G; BW) (V/lx.s): 6.7 ; 22.4 CD |
| 文件： | 总28页 (文件大小：650K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
TCD2913BFG
TOSHIBA CCD Image Sensor CCD (charge coupled device)
TCD2913BFG
The TCD2913BFG is a high sensitive and low dark current
5400 elements × 8 line CCD color image sensor which includes
CCD drive circuit and clamp circuit. The sensor is designed for
scanner.
The device contains a row of 5400 elements × 8 line staggered
photodiodes which provide a 48 lines/mm (1200 dpi) across a A4
size paper. The device is operated by 5 V pulse and
12 V power supply.
Features
Weight: 2.0g (typ.)
•
•
•
•
Number of Image Sensing Elements: 5400 elements × 8 line
Image Sensing Element Size: 5.25 µm by 5.25 µm on 5.25 µm
Photo Sensing Region: High sensitive and low dark current PN photodiode
Distanced Between Photodiode Array: 63 µm (12 lines) R array – G array, G array – B array
84 µm (16 lines) B array – B/W array
10.5 µm (2 lines) Odd array – Even array
•
•
•
•
•
Clock: 2 phase (5 V)
Pin Connections (top view)
Power Supply:12 V Power Supply Voltage
Internal Circuit: Clamp Circuit
Package: 22 pin CLCC Package
Color Filter: Red, Green, Blue
OS3
SS
1
2
3
4
5
6
7
8
9
22 OS2
21
20
19
18
17
16
NC
OS1
OD
RS
Maximum Ratings (Note1)
CP
φ1B1
φ2B1
NC
Characteristic
Symbol
Rating
Unit
V
1
SW
SW
NC
Clock pulse voltage
Shift pulse voltage
V
V
φA, φB
2
V
V
V
SH
−0.3~8.0
Reset pulse voltage
Clamp pulse voltage
Switch pulse voltage
Power supply voltage
Operating temperature
Storage temperature
RS
CP
SW
OD
opr
φ2B2
φ1B2
15 φ2A1
14 φ1A1
13 NC
V
V
T
−0.3~15
0~60
V
SH1 10
SS 11
°C
°C
T
stg
−25~85
12 SH0
Note 1: All voltage are with respect to SS terminals (ground).
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2005-8-29
TCD2913BFG
Block Diagram
φ
φ
OD
19
2A1
1A1
14
15
CCD ANALOG SHIFT REGISTER 1
SHIFT GATE 1
CLAMP
CLAMP
SH0
12
PHOTO
… DIODE(B/W) …
(odd line)
……
…
CCD ANALOG SHIFT REGISTER 2
SHIFT GATE 2
PHOTO
… DIODE (B/W) …
(even line)
…
……
……
SHIFT GATE 3
φ
2B1
CCD ANALOG SHIFT REGISTER 3
CLAMP
6
5
φ
1B1
CCD ANALOG SHIFT REGISTER 1
SHIFT GATE 1
PHOTO
… DIODE (B) …
(odd line)
……
…
OS1
20
CLAMP
CLAMP
CLAMP
PHOTO
… DIODE (B) …
(even line)
……
…
SHIFT GATE 2
CCD ANALOG SHIFT REGISTER 2
CCD ANALOG SHIFT REGISTER 3
SHIFT GATE 3
SH1
10
PHOTO
… DIODE (G) …
(odd line)
……
…
OS2
22
PHOTO
… DIODE (G) …
(even line)
……
…
SHIFT GATE 4
CCD ANALOG SHIFT REGISTER 4
CCD ANALOG SHIFT REGISTER 5
SHIFT GATE 5
PHOTO
… DIODE (R) …
(odd line)
……
…
OS3
1
PHOTO
… DIODE (R) …
(even line)
……
…
SHIFT GATE 6
CCD ANALOG SHIFT REGISTER 6
18
SW
17
SW
4
CP
3
RS
8
2B2
9
1B2
φ
φ
1
2
2
2005-8-29
TCD2913BFG
Pin Names
Pin No.
Symbol
Name
Pin No.
Symbol
Name
1
2
OS3
SS
Signal Output 3 (red)
Ground
12
13
14
15
16
17
18
19
20
21
22
SH0
NC
Shift Gate 0 for B/W
Non Connection
3
Reset Gate
φ1A1
φ2A1
NC
Clock 1A (phase 1) for B/W
Clock 1A (phase 2) for B/W
Non Connection
RS
4
Clamp Gate
CP
5
φ1B1
φ2B1
NC
Clock 1B (phase 1) for Color
Clock 1B (phase 2) for Color
Non Connection
6
SW 2
SW 1
OD
Switch Gate 2 for Color or B/W
Switch Gate 1 for Color Resolution
Power
7
8
φ2B2
φ1B2
SH1
SS
Clock 2B (phase 2) for Color
Clock 2B (phase 1) for Color
Shift Gate 1 for Color
Ground
9
OS1
NC
Signal Output 1 (blue)
Non Connection
10
11
OS2
Signal Output 2 (green)
Arrangement of The 1st Effective Pixel (S1)
S1
5.25 µm
1
3
5
7
B/W Photo Diode Arrays
(5400 pixels × 2 line)
26.25 µm
31.5 µm
5.25 µm
2
2
2
2
4
4
4
4
6
6
6
6
8
84 µm
63 µm
S1
5.25 µm
5.25 µm
5.25 µm
1
1
1
3
3
3
5
5
5
7
Blue Photo Diode Arrays
(5400 pixels × 2 line)
10.5 µm
8
63 µm
52.5 µm
S1
5.25 µm
5.25 µm
5.25 µm
7
Green Photo Diode Arrays
(5400 pixels × 2 line)
10.5 µm
8
63 µm
52.5 µm
S1
5.25 µm
5.25 µm
5.25 µm
7
Red Photo Diode Arrays
(5400 pixels × 2 line)
10.5 µm
8
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2005-8-29
TCD2913BFG
Optical/Electrical Characteristics
= 5 V, V = V = V = V
(Ta = 25°C, V
= 12 V, V
= 5 V (pulse), f = 1 MHz,
CP
OD
INT
SW
φ
SH
RS
φ
f
= 2 MHz, t
= 11 ms, light source = a light source + CM500S filter (t = 1 mm),
RS
load resistance = 100 kΩ)
Characteristics
Symbol
Min
Typ.
Max
Unit
Note
Black&White
R (B/W)
R (R)
17.9
3.4
4.6
2.5
22.4
4.9
6.7
3.6
10
26.9
6.4
8.7
4.7
20
Red
Sensitivity
V/lx･s
(Note2)
Green
Blue
R (G)
R (B)
PRNU (1)
PRNU (3)
RI
%
mV
%
(Note3)
(Note4)
(Note5)
(Note6)
(Note7)
(Note8)
(Note8)
Photo response non uniformity
3
12
Register imbalance(Color)
Saturation output voltage
Saturation exposure
Dark signal voltage
Dark signal non uniformity
DC power dissipation
Total transfer efficiency
Output impedance
1
V
3.2
0.11
3.5
0.15
0.8
2.0
420
98
V
SAT
SE
lx･s
mV
mV
mW
%
V
2.0
10.0
650
DRK
DSNU
PD
TTE
92
Z
O
－
0.3
6.0
0.3
0.9
1.0
7.0
kΩ
V
DC output voltage
V
5.0
(Note9)
(Note9)
(Note10)
OS
Reset noise
V
V
RSN
Random noise
N
Dσ
mV
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2005-8-29
TCD2913BFG
Note 2: Sensitivity is defined for each color of signal outputs average when the photosensitive surface is applied
with the light of uniform illumination and uniform color temperature.
Note 3: PRNU (1) is defined for each color on a single chip by the expressions below when the photosensitive
surface is applied with the light of uniform illumination and uniform color temperature.
∆X
X
PRNU (1) =
× 100 (%)
Where X is average of total signal output and ∆X is the maximum deviation from X . The amount of
incident light is shown below.
Red = 1/2･SE
Green = 1/2･SE
Blue = 1/4･SE
Note 4: PRNU (3) is defined as maximum voltage with next pixel, where measured at 5% of SE (typ.)
Note 5: Register imbalance is defined as follows.
10799
xn − x (n + 1)
∑
n =1
RI =
∗100 (%)
10799 ∗ X
Note 6: V
is defined as minimum saturation output of all effective pixels.
SAT
Note 7: Definition of SE
V
R
SAT
B/W
SE =
(lx･s)
Note 8: V
is defined as average dark signal voltage of all effective pixels.
DRK
DSNU is defined as different voltage between V
and V
when V
is maximum dark signal
DRK
MDK
MDK
voltage.
V
DRK
V
MDK
DSNU
Note 9: DC signal output voltage is defined as follows.
Reset Noise Voltage is defined as follows.
V
RSN
OS
V
MS
V
OS
SS
5
2005-8-29
TCD2913BFG
Note 10: Random noise is defined as the standard deviation (sigma) of the output level difference between two
adjacent effective pixels under no illumination (i.e. dark conditions) calculated by the following procedure.
video output
200 ns
video output
Output waveform
(effective pixels under
dark condition)
200 ns
∆V
pixel (n)
pixel (n + 1)
(1) Two adjacent pixels (pixel n and n + 1) after reference level clamp in one reading are fixed as
measurement points.
(2) Each of the output level at video output periods averaged over 200 ns period to get V (n) and V (n + 1).
(3) V (n + 1) is subtracted from V (n) to get ∆V.
∆V = V (n) − V (n + 1)
(4) The standard deviation of ∆V is calculated after procedure (2) and (3) are repeated 30 times (30
readings).
30
30
1
(∆V －∆V)2
1
∆V =
∆Vi
σ =
∑
∑
i
30 i=1
30 i =1
(5) Procedure (2), (3) and (4) are repeated 10 times to get sigma value.
(6) 10 sigma values are averaged.
10
1
σ =
σ
j
∑
10 j=1
(7) σ value calculated using the above procedure is observed
2 times larger than that measured
relative to the ground level. So we specify random noise as follows.
1
2
N
=
σ
Dσ
6
2005-8-29
TCD2913BFG
Operating Condition
Characteristics
Symbol
Min
Typ.
Max
Unit
V
“H” Level
“L” Level
“H” Level
“L” Level
“H” Level
“L” Level
“H” Level
“L” Level
“H” Level
“L” Level
V
4.5
0
5.0
0
5.5
0.3
5.5
0.5
5.5
0.5
5.5
0.5
5.5
0.5
12.6
φA
Clock pulse voltage
, V
φB
4.5
0
5.0
0
Shift pulse voltage
Reset pulse voltage
Clamp pulse voltage
V
V
V
V
V
V
SH
4.5
0
5.0
0
RS
CP
SW
4.5
0
5.0
0
4.5
0
5.0
0
Switch pulse voltage
Power supply voltage
V
V
V
V
11.4
12.0
OD
Clock Characteristics (Ta = 25°C)
Characteristics
Symbol
Min
Typ.
Max
Unit
Clock pulse frequency
f
f
0.15
0.3
0.3
1.0
2.0
2.0
265
300
15
12.0
10.0
10.0
MHz
MHz
MHz
pF
φA, φB
Reset pulse frequency
Clamp pulse frequency
Clock(A) capacitance
Clock(B) capacitance
Shift gate capacitance
Reset gate capacitance
Clamp gate capacitance
Switch gate capacitance
f
f
C
RS
CP
(Note 11)
(Note 11)
φA
φB
SH
C
pF
C
pF
15
pF
C
C
RS
CP
SW
10
pF
10
pF
C
Note 11: V
= 12 V
OD
Clocking Mode
φ1A,
φ2A
φ1B,
φ2B
Mode
SW 1
SW 2
SH0
SH1
RS
CP
Color 1200DPI
“H”
“L”
“L”
“L”
“L”
“H”
“H”
“H”
Pulse
Pulse
“H”
“L”
“L”
Pulse
Pulse
“L”
Pulse
Pulse
Pulse
Pulse
Pulse
Pulse
Bit Clamp
Color 600DPI
B/W
Pulse
Pulse
SH1 or
“H”
Color 1200DPI
Color 600DPI
B/W
“H”
“L”
“L”
“L”
“L”
“H”
“H”
“H”
Pulse
Pulse
“H”
“L”
“L”
Pulse
Pulse
“L”
Pulse
Pulse
Pulse
SH1 or
“H”
Line Clamp
SH0 or
“H”
Pulse
Pulse
7
2005-8-29
TCD2913BFG
Timing Chart (Color 1200DPI Bit Clamp mode)
SH0(“H”)
tINT (integration time)
SH1
φ
1B
φ
2B
RS
CP
SW 1(“H”)
SW 2(“L”)
OS
LIGHT SHIELD
TEST OUTPUTS (2 elements)
DUMMY OUTPUTS
(13 elements)
OUTPUTS
(47 elements)
(4 elements)
(4 elements)
DUMMY
DUMMY OUTPUT (1 element)
OUTPUTS
(7 elements)
SIGNAL OUTPUTS
(10800 elements)
DUMMY OUTPUTS
(14 elements)
DUMMY OUTPUTS (64 elements)
1 LINE READOUT PERIOD (10878 elements)
8
2005-8-29
TCD2913BFG
Timing Chart (Color 1200DPI Line Clamp mode)
SH0(“H”)
tINT (integration time)
SH1
φ
1B
φ
2B
RS
= SH 1
CP
SW 1(“H”)
SW 2(“L”)
OS
LIGHT SHIELD
OUTPUTS
(47 elements)
TEST OUTPUTS (2 elements)
DUMMY OUTPUTS
(13 elements)
(4 elements)
(4 elements)
DUMMY
DUMMY OUTPUT (1 element)
OUTPUTS
(7 elements)
SIGNAL OUTPUTS
(10800 elements)
DUMMY OUTPUTS
(14 elements)
DUMMY OUTPUTS (64 elements)
1 LINE READOUT PERIOD (10878 elements)
9
2005-8-29
TCD2913BFG
Timing Chart (Color 600DPI Bit Clamp mode)
SH0(“H”)
tINT (integration time)
SH1
φ
1B
φ
2B
RS
CP
SW 1(“L”)
SW 2(“L”)
OS
DUMMY
OUTPUTS
(3 elements)
TEST OUTPUT
(1 element)
DUMMY OUTPUTS
(6 elements)
LIGHT SHIELD OUTPUTS
(24 elements)
(2 elements)
(2 elements)
DUMMY OUTPUT
(1 element)
SIGNAL OUTPUTS
(5400 elements)
DUMMY OUTPUTS
(7 elements)
DUMMY OUTPUTS (32 elements)
1 LINE READOUT PERIOD (5439 elements)
10
2005-8-29
TCD2913BFG
Timing Chart (Color 600DPI Line Clamp mode)
SH0(“H”)
tINT (integration time)
SH1
φ
1B
φ
2B
RS
= SH 1
CP
SW 1(“L”)
SW 2(“L”)
OS
DUMMY
OUTPUTS
(3 elements)
TEST OUTPUT
(1 element)
DUMMY OUTPUTS
(6 elements)
LIGHT SHIELD OUTPUTS
(24 elements)
(2 elements)
(2 elements)
DUMMY OUTPUT
(1 element)
SIGNAL OUTPUTS
(5400 elements)
DUMMY OUTPUTS
(7 elements)
DUMMY OUTPUTS (32 elements)
1 LINE READOUT PERIOD (5439 elements)
11
2005-8-29
TCD2913BFG
Timing Chart (B/W Bit Clamp mode)
tINT (integration time)
SH0
SH1(”H”)
φ1A
φ2A
RS
CP
SW1(”L”)
SW2(”H”)
OS1
TEST
(B/W_ODD)
OUTPUTS
(1 ELEMENTS)
DUMMY
OUTPUTS
(1 ELEMENTS)
DUMMY OUTPUTS
(6 ELEMENTS)
LIGHT SHIELD OUTPUTS
(24 ELEMENTS)
DUMMY OUTPUTS
(4 ELEMENTS)
(2 ELEMENTS)
(2 ELEMENTS)
DUMMY OUTPUTS (32 ELEMENTS)
SIGNAL OUTPUTS (5400 ELEMENTS)
DUMMY OUTPUTS(8 ELEMENTS)
1 LINE READOUT PERIOD (5440 ELEMENTS)
OS2
(B/W_EVEN)
OS3
(B/W_EVEN)
DUMMY OUTPUT
(2 ELEMENT)
TEST OUTPUT
(1 ELEMENT)
DUMMY OUTPUT
(1 ELEMENT)
DUMMY OUTPUTS
(11 ELEMENTS)
LIGHT SHIELD OUTPUTS
(20 ELEMENTS)
(1 ELEMENTS)
(1 ELEMENTS)
DUMMY OUTPUTS
(5 ELEMENTS)
SIGNAL OUTPUTS
(2700 ELEMENTS)
DUMMY OUTPUTS (32 ELEMENTS)
1 LINE READOUT PERIOD (2737 ELEMENTS)
12
2005-8-29
TCD2913BFG
Timing Chart (B/W Line Clamp mode)
tINT (integration time)
SH0
SH1 (”H”)
φ1A
φ2A
RS
CP = SH0
SW1 (”L”)
SW2 (”H”)
OS1
TEST
(B/W_ODD)
OUTPUTS
(1 ELEMENTS)
DUMMY
OUTPUTS
(1 ELEMENTS)
DUMMY OUTPUTS
(6 ELEMENTS)
LIGHT SHIELD OUTPUTS
(24 ELEMENTS)
DUMMY OUTPUTS
(4 ELEMENTS)
(2 ELEMENTS)
(2 ELEMENTS)
DUMMY OUTPUTS (32 ELEMENTS)
SIGNAL OUTPUTS (5400 ELEMENTS)
DUMMY OUTPUTS(8 ELEMENTS)
1 LINE READOUT PERIOD (5440 ELEMENTS)
OS2
(B/W_EVEN)
OS3
(B/W_EVEN)
DUMMY OUTPUT
(2 ELEMENT)
TEST OUTPUT
(1 ELEMENT)
DUMMY OUTPUT
(1 ELEMENT)
DUMMY OUTPUTS
(11 ELEMENTS)
LIGHT SHIELD OUTPUTS
(20 ELEMENTS)
(1 ELEMENTS)
(1 ELEMENTS)
DUMMY OUTPUTS
(5 ELEMENTS)
SIGNAL OUTPUTS
(2700 ELEMENTS)
DUMMY OUTPUTS (32 ELEMENTS)
1 LINE READOUT PERIOD (2737 ELEMENTS)
13
2005-8-29
TCD2913BFG
Timing Requirements
t2
t3
t4
SH
φ
φ
1
t1
t5
2
φ
1
GND
3.5 V (max) 3.5 V (max)
1.5 V (min) 1.5 V (min)
RS
CP
t20
t21
SW 1, SW 2 (“L” → “H”)
SW 1, SW 2 (“H” → “L”)
Color 1200DPI mode (SW 1= “H”, SW 2= “L”)
φ
1
10%
t7
t6
φ
2
10%
RS
t15
t14
t8
t10
t9
CP
t16
t17
t11
t13
t12
10% to the peak
10%
10% to the peak
OS
Video signal
Video signal
10%
(bit clamp mode)
Peak
Peak
t18
t18
10% to the peak
10% to the peak
OS
t19
t19
(line clamp mode)
14
2005-8-29
TCD2913BFG
B/W mode (SW 1= “L”, SW 2= “H”) / Color 600DPI mode (SW 1= “L”, SW 2= “L”)
φ
1
10%
t6
t7
φ
2
10%
RS
CP
t15
t14
t9
t17
t12
10% to the peak
OS
(bit clamp mode)
10%
Peak
t18
10% to the peak
OS
t19
(line clamp mode)
15
2005-8-29
TCD2913BFG
Typ.
Characteristics
Pulse timing of SH and φ
Symbol
Min
Max
Unit
ns
(Note 12)
t1
t5
110
800
0
1000
1000
50
1
SH pulse rise time, fall time
SH pulse width
t2, t4
t3
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
3000
0
5000
50
φ , φ pulse rise time, fall time
t6, t7
t8, t10
t9
1
2
RS pulse rise time, fall time
RS pulse width
0
20
15
0
100
20
CP pulse rise time, fall time
CP pulse width
t11, t13
t12
25
10
0
100
40
Pulse timing of φ , φ and CP
t14
1
2
Pulse timing of RS and CP
t15
100
20
Video data delay time
(Note 13)
t16, t17
t18
0
20
Reference level settle time
t19
35
Pulse timing of SH and CP
t20
500
0
Pulse timing of SH and SW 1, SW 2
t21
0
Pulse timing of φ , φ and RS
t22
0
10
1
2
Note 12: Typ. is the case of fφ = 1.0 MHz.
Note 13: Load resistance is 100 kΩ.
16
2005-8-29
TCD2913BFG
Typical Spectral Response
Spectral Response
1.0
Ta = 25°C
Red
0.8
Green
Blue
0.6
0.4
0.2
0
400
450
500
550
600
650
700
Wavelength
λ (nm)
B/W
17
2005-8-29
TCD2913BFG
Typical Drive Circuit
+5 V
0.1 µF/25 V
12 V
φ
φ
φ
φ
1A1
2A1
1B1
2B1
0.1 µF/25 V
10 µF/25 V
φ
1B2
2B2
φ
IC1
22
21
20
19
18
17
16
15
14
13
12
OS2 NC OS1 OD SW 1 SW 2 NC
φ
φ
NC SH0
2A1 1A1
TCD2913BFG
OS3 SS
NC φ
φ
SH1 SS
RS
3
CP
4
φ
φ
2B2 1B2
1B1 2B1
1
2
5
6
7
8
9
10
11
+12 V
+5 V
0.1 µF/25 V
0.1 µF/25 V
10 µF/25 V
R1 R1 R1
SW 1
SW 2
R1
R1 R1
TR1
SH0
SH1
CP
OS1
OS2
OS3
TR2
TR3
R2
R2 R2
RS
IC2
IC1: TC74AC04P
IC2: TC74HC04AP
TR1, 2, 3: 2SC1815-Y
R1: 150 Ω
R2: 1500 Ω
18
2005-8-29
TCD2913BFG
Caution
1. Electrostatic Breakdown
Store in shorting clip or in conductive foam to avoid electrostatic breakdown.
CCD Image Sensor is protected against static electricity, but inferior puncture mode device due to static
electricity is sometimes detected. In handing the device, it is necessary to execute the following static
electricity preventive measures, in order to prevent the trouble rate increase of the manufacturing system
due to static electricity.
a. Prevent the generation of static electricity due to friction by making the work with bare hands or by
putting on cotton gloves and non-charging working clothes.
b. Discharge the static electricity by providing earth plate or earth wire on the floor, door or stand of the
work room.
c. Ground the tools such as soldering iron, radio cutting pliers of or pincer.
It is not necessarily required to execute all precaution items for static electricity.
It is all right to mitigate the precautions by confirming that the trouble rate within the prescribed
range.
d. Ionized air is recommended for discharge when handling CCD image sensors.
2. Incident Light
CCD sensor is sensitive to infrared light. Note that infrared light component degrades resolution and
PRNU of CCD sensor.
3. Cloudiness of Glass Inside
CCD surface mount products may have a haze on the inside of glass, so be careful about following.
Even if the haze arises inside of glass, when it is not on the pixel area, there is no problem in quality.
･Before the aluminum bag is opened, please keep the products in the environment below 30℃90%RH. And
after the aluminum bag is opened, please keep the products in the environment below 30℃60%RH .
・ Please mount the products within 12month from sealed date and within 6 month from opening the
aluminum bag. (Sealed date is printed on aluminum bag.)
4. Ultrasonic Cleaning
Ultrasonic cleaning should not be used with such hermetically-sealed ceramic package as CCD because
the bonding wires can become disconnected due to resonance during the cleaning process.
5. Mounting
In the case of solder mounting, the devices should be mounted with the window glass protective tape in
order to avoid dust or dirt included in reflow machine.
6. Window Glass Protective Tape
The window glass protective tape is manufactured from materials in which static charges tend to build
up. When removing the tape from CCD sensor after solder mounting, install an ionizer to prevent the tape
from being charged with static electricity.
When the tape is removed, adhesives will remain in the glass surface. Since these adhesives appear as
black or white flaws on the image, please wipe the window glass surface with the cloth into which the
organic solvent was infiltrated. Then please attach CCD to a product.
Do not reuse the tape.
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7. Soldering Temperature Profile for Pb free
Good temperature profile for each soldering method is as follows. In addition, in case of the repair work
accompanied by IC removal, since the degree of parallel may be spoiled with the left solder, please do not
carry out and in case of the repair work not accompanied by IC removal, carry out with a soldering iron or ,
in reflow, only one time.
a. Using a soldering iron
Complete soldering within ten seconds for lead temperatures of up to 260°C, or within three seconds
for lead temperatures of up to 350℃.
b. Using long infrared rays reflow / hot air reflow
Please do reflow at the condition that the package surface (electrode) temperature is on the solder
maker's recommendation profile. And that reflow profile is within below condition 1 to 3.
1. Peak temperature: 250℃ or less.
2. Time to keep high temperature : 220～250℃, 30～40sec.
3. Pre. heat : 150～190℃, 60～120sec
8. Window Glass
The dust and stain on the glass window of the package degrade optical performance of CCD sensor.
Keep the glass window clean by saturating a cotton swab in alcohol and lightly wiping the surface, and
allow the glass to dry, by blowing with filtered dry N2. Care should be taken to avoid mechanical or
thermal shock because the glass window is easily to damage.
9. Cleaning Method of the Window Glass Surface
Wiping Cloth
a.
b.
c.
Use soft cloth with a fine mesh.
The wiping cloth must not cause dust from itself.
Use a clean wiping cloth necessarily.
Recommended wiping cloth is as follow;
- MK cloth (Toray Industries)
Cleaner
Recommended cleaning liquid of window glass are as follow;
- EE-3310 (Olympus)
When using solvents, such as alcohol, unavoidably, it is cautious of the next.
A clean thing with quick-drying.
a.
b.
c.
After liquid dries, there needs to be no residual substance.
A thing safe for a human body.
And, please observe the use term of a solvent and use the storage container of a solvent to be clean.
Be cautious of fire enough.
Way of Cleaning
First, the surface of window glass is wiped with the wiping cloth into which the cleaner was infiltrated.
Please wipe down the surface of window glass at least 2 times or more.
Next, the surface of window glass wipes with the dry wiping cloth. Please wipe down the surface of
window glass at least 3 times or more.
Finally, blow cleaning is performed by dry N2 filtered.
If operator wipes the surface of the window glass with the above-mentioned process and dirt still remains,
Toshiba recommends repeating the clean operation from the beginning.
Be cautious of the next thing.
a.
b.
c.
Don't infiltrate the cleaner too much.
A wiping portion is performed into the optical range and don't touch the edge of window glass.
Be sure to wipe in a long direction and the same direction.
d. A wiping cloth always uses an unused portion.
Wiper
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10. Foot Pattern on the PCB
We recommend fig1 's foot pattern for your PCB(Printed circuit Board).
41.4
37.6
P1.27 X 10 = 12.70
1.27
0.67
fig1
11. Mask for Solder Paste Application
We recommend metal mask that have the following thickness.
･TCD****BFG(Pad material : Au) : a thickness of 0.2mm.
And we recommend that the size of the pattern of the metal mask is 95% to 100% of recommended foot
pattern at fig1.
12. Temperature cycle
After mounting, if temperature cycle stress is too much, CCD surface mount products have a possibility
that a crack may arise in solder. As a method of preventing a solder crack, underfil is effective
13. Reuse of a Tray
We reuse tray in order to reduce plastic waste as we can. Please cooperate with us in reusing for ecology.
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TCD2913BFG
14. Caution for Package Handling
Over force on CCD products may cause crack and chip removing on the product. The three point bending
strength of this product is the following. (Reference data)
If the stress is loaded far from a fulcrum, the stress on the package will be increase.
When you will treat CCD on every process, please be careful particularly. For example, soldering on PCB,
cutting PCB, wiping on the glass surface, optical assemble and so on.
Bending Test
force(N)
force(N)
１３ｍｍ
force(N)
３６ｍｍ
force(N)
３６ｍｍ
１３ｍｍ
･22CLCC
Bearing length 13mm :
The force from upside : 300[Ｎ]
The force from downside : 200[Ｎ]
The force from upside : 150[Ｎ]
The force from downside : 80[Ｎ]
Bearing length 36mm :
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TCD2913BFG
Application Note
The TCD2913BFG can be operated in two modes: Color 1200DPI mode and Color 600DPI mode.
Each mode is selected by SW 1 terminal.
SW 1
Mode
Application Example
“H”
“L”
Color 1200 DPI
Color 600 DPI
1200 DPI/A4 Reading
600 DPI/A4 Reading
Color 1200DPI mode
In Color 1200DPI Mode, the dummy and signal outputs in odd and even lines are read out. This mode provides
1200 DPI/A4 resolution. The timing for this mode is shown in page 8/28, 9/28 and 14/28.
Color 600DPI mode
In Color 600DPI Mode, the dummy and signal outputs in even lines are read out. The dummy and signal outputs
in odd lines cannot be read out in this mode. This mode provides 600 DPI/A4 resolution. Timing examples for 600
DPI/A4 reading using this mode are shown in page 10/28, 11/28 and 15/28 for reference.
Color 300DPI mode
In Color 600DPI Mode, signal charges of adjacent pixels in even line can be merged at an output stage capacitor
using intermittent reset drive. Timing examples for 300 DPI/A4 reading using this mode are shown in page 24/28,
25/28 and 26/28 for reference.
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TCD2913BFG
Timing Chart (Color 300DPI mode)
SH0(“H”)
tINT (integration time)
SH
φ
φ
1A, 1B
φ
φ
2A, 2B
RS
CP
SW 1(“L”)
SW 2(“L”)
OS
LIGHT SHIELD
OUTPUTS
(12 elements)
DUMMY
OUTPUT
(1 element)
TEST OUTPUT
(1 element)
DUMMY OUTPUTS
(3 elements)
(1 element)
(1 element)
DUMMY OUTPUT
(1 element)
SIGNAL OUTPUTS
(2700 elements)
DUMMY OUTPUTS
(4 elements)
DUMMY OUTPUTS (16 elements)
1 LINE READOUT PERIOD (2720 elements)
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TCD2913BFG
Timing Chart (Color 300DPI Line Clamp mode)
SH0(“H”)
SH1
φ
1B
φ
2B
RS
= SH
CP
SW 1(“L”)
SW 2(“L”)
OS
LIGHT SHIELD
OUTPUTS
(12 elements)
DUMMY
OUTPUT
(1 element)
TEST OUTPUT
(1 element)
DUMMY OUTPUTS
(3 elements)
(1 element)
(1 element)
DUMMY OUTPUT
(1 element)
SIGNAL OUTPUTS
(2700 elements)
DUMMY OUTPUTS
(4 elements)
DUMMY OUTPUTS (16 elements)
1 LINE READOUT PERIOD (2720 elements)
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TCD2913BFG
Timing Example (Color 300DPI mode:
1= “L” ,
2= “L”)
SW
SW
φ
1
φ
2
RS
CP
OS
(bit clamp mode)
Video Signal
Video Signal
OS
(line clamp mode)
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TCD2913BFG
Package Dimensions
Weight: 2.0g (typ.)
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TCD2913BFG
RESTRICTIONS ON PRODUCT USE
030619EBA
• The information contained herein is subject to change without notice.
• The information contained herein is presented only as a guide for the applications of our products. No
responsibility is assumed by TOSHIBA for any infringements of patents or other rights of the third parties which
may result from its use. No license is granted by implication or otherwise under any patent or patent rights of
TOSHIBA or others.
• TOSHIBA is continually working to improve the quality and reliability of its products. Nevertheless, semiconductor
devices in general can malfunction or fail due to their inherent electrical sensitivity and vulnerability to physical
stress. It is the responsibility of the buyer, when utilizing TOSHIBA products, to comply with the standards of
safety in making a safe design for the entire system, and to avoid situations in which a malfunction or failure of
such TOSHIBA products could cause loss of human life, bodily injury or damage to property.
In developing your designs, please ensure that TOSHIBA products are used within specified operating ranges as
set forth in the most recent TOSHIBA products specifications. Also, please keep in mind the precautions and
conditions set forth in the “Handling Guide for Semiconductor Devices,” or “TOSHIBA Semiconductor Reliability
Handbook” etc..
• The TOSHIBA products listed in this document are intended for usage in general electronics applications
(computer, personal equipment, office equipment, measuring equipment, industrial robotics, domestic appliances,
etc.). These TOSHIBA products are neither intended nor warranted for usage in equipment that requires
extraordinarily high quality and/or reliability or a malfunction or failure of which may cause loss of human life or
bodily injury (“Unintended Usage”). Unintended Usage include atomic energy control instruments, airplane or
spaceship instruments, transportation instruments, traffic signal instruments, combustion control instruments,
medical instruments, all types of safety devices, etc.. Unintended Usage of TOSHIBA products listed in this
document shall be made at the customer’s own risk.
• The products described in this document are subject to the foreign exchange and foreign trade laws.
• TOSHIBA products should not be embedded to the downstream products which are prohibited to be produced
and sold, under any law and regulations.
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2005-8-29
相关型号：
TCD2957BFG
CCD Imaging ICs; Target Application: MFP/Scanner; Number of Pixels x Lines: 10680x6; Pixel Size (Micron): 2.625um; Resolution (dpi): 2400; Data Rate (Color/BW) (MHz): 10; Sensitivity (G; BW) (V/lx.s): 2.1; Note: Elec.Shutter
TOSHIBA
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