TD62082AFG [TOSHIBA]
8ch Darlington Sink Driver; 8CH达林顿驱动程序库
| 型号： | TD62082AFG |
| 厂家： | 
TOSHIBA |
| 描述： | 8ch Darlington Sink Driver |
| 文件： | 总13页 (文件大小：272K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
TD62081~084APG/AFG
Toshiba Bipolar Digital Integrated Circuit Silicon Monolithic
TD62081APG,TD62081AFG,TD62082APG,TD62082AFG,
TD62083APG,TD62083AFG,TD62084APG,TD62084AFG
8ch Darlington Sink Driver
The TD62081APG/AFG Series are high-voltage, high-current
darlington drivers comprised of eight NP darlington pairs.
All units feature integral clamp diodes for switching inductive loads.
Applications include relay, hammer, lamp and display (LED)
drivers.
The suffix (G) appended to the part number represents a Lead
(Pb)-Free product.
Features
ꢀ
Output current (single output)
500 mA (max) (TD62081APG/AFG series)
ꢀ
High sustaining voltage output
50 V (min)
(TD62081APG/AFG series)
ꢀ
ꢀ
ꢀ
ꢀ
Output clamp diodes
Inputs compatible with various types of logic.
Package type-APG: DIP-18 pin
Package type-AFG: SOP-18 pin
Input Base
Resistor
Type
Designation
Weight
DIP18-P-300-2.54D: 1.47 g (typ.)
SOP18-P-375-1.27 : 0.41 g (typ.)
TD62081APG/AFG
TD62082APG/AFG
TD62083APG/AFG
TD62084APG/AFG
External
General purpose
10.5-kΩ + 7 V
Zenner diode
14 V to 25 V
PMOS
2.7 kΩ
TTL, 5 V CMOS
6 V to 15 V
PMOS, CMOS
10.5 kΩ
Pin Connection
(top view)
O1
18
O2
O3
16
O4
15
O5
14
O6
13
O7
12
O8 COMMON
11 10
17
1
2
3
4
5
6
7
8
9
I1
I2
I3
I4
I5
I6
I7
I8 GND
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TD62081~084APG/AFG
Schematics (each driver)
TD62081APG/AFG Common
TD62082APG/AFG Common
Output
TD62083APG/AFG Common
Input
Input
Input
7 V
10.5 kΩ
Output
Output
2.7 kΩ
7.2 kΩ
7.2 kΩ
7.2 kΩ
GND
GND
GND
TD62084APG/AFG Common
Input
Output
10.5 kΩ
7.2 kΩ
GND
Note: The input and output parasitic diodes cannot be used as clamp diodes.
Absolute Maximum Ratings (Ta = 25°C)
Characteristics
Symbol
Rating
Unit
Output sustaining voltage
Output current
V
−0.5 to 50
500
V
mA/ch
V
CE (SUS)
I
OUT
Input voltage
V
IN
I
IN
(Note 1)
−0.5 to 30
25
Input current
(Note 2)
mA
V
Clamp diode reverse voltage
Clamp diode forward current
V
50
R
I
500
mA
F
APG
AFG
1.47
Power dissipation
P
W
D
0.96
Operating temperature
Storage temperature
T
−40 to 85
−55 to 150
°C
°C
opr
T
stg
Note 1: Except TD62081APG/AFG
Note 2: Only TD62081APG/AFG
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TD62081~084APG/AFG
Recommended Operating Conditions (Ta = −40 to 85°C)
Characteristics
Symbol
Test Condition
Min
0
Typ.
⎯
Max
50
Unit
V
Output sustaining voltage
V
CE (SUS)
T
= 25 ms, Duty = 10%
pw
0
⎯
347
8 circuits
APG
Output current
AFG
T
= 25 ms, Duty = 50%
pw
0
0
0
0
⎯
⎯
⎯
⎯
123
268
90
8 circuits
I
mA/ch
OUT
T
pw
= 25 ms, Duty = 10%
8 circuits
T
pw
= 25 ms, Duty = 50%
8 circuits
Except
TD62081APG/AFG
Input voltage
V
30
V
V
IN
TD62082APG/AFG
TD62083APG/AFG
TD62084APG/AFG
TD62082APG/AFG
TD62083APG/AFG
TD62084APG/AFG
14
2.5
8
⎯
⎯
⎯
⎯
⎯
⎯
30
30
Input voltage
(Output on)
V
IN (ON)
30
0
7.4
0.5
1.0
Input voltage
(Output off)
V
V
0
IN (OFF)
0
Only
Input current
I
0
⎯
5
mA
IN
TD62081APG/AFG
Clamp diode reverse voltage
Clamp diode forward current
V
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
50
400
0.52
0.4
V
R
I
mA
F
APG
Power
P
W
D
dissipation
AFG
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TD62081~084APG/AFG
Electrical Characteristics (Ta = 25°C)
Test
Circuit
Characteristics
Symbol
Test Condition
Min
Typ.
Max
Unit
Ta = 25°C
Ta = 85°C
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
50
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
1000
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
50
100
500
500
1.6
1.3
1.1
1.25
1.35
0.5
1.45
⎯
Output leakage
current
I
1
2
V
= 50 V
µA
CEX
CE
TD62082
TD62084
V
IN
V
IN
= 6 V
= 1 V
⎯
⎯
I
I
I
= 350 mA, I = 500 µA
1.3
1.1
0.9
0.82
0.93
0.35
1.0
65
⎯
OUT
OUT
OUT
IN
Collector-emitter saturation voltage
V
V
= 200 mA, I = 350 µA
CE (sat)
IN
= 100 mA, I = 250 µA
IN
TD62082APG/AFG
TD62083APG/AFG
V
V
V
V
= 17 V
= 3.85 V
= 5 V
IN
IN
I
2
4
mA
IN (ON)
Input current
IN
TD62084APG/AFG
= 12 V
IN
I
I
= 500 µA, Ta = 85°C
µA
IN (OFF)
OUT
TD62082APG/AFG
TD62083APG/AFG
V
CE
V
CE
V
CE
V
CE
V
CE
V
CE
V
CE
V
CE
V
CE
= 2 V, I
= 2 V, I
= 2 V, I
= 2 V, I
= 2 V, I
= 2 V, I
= 2 V, I
= 2 V, I
= 2 V, I
= 300 mA
= 200 mA
= 250 mA
= 300 mA
= 125 mA
= 200 mA
= 275 mA
= 350 mA
= 350 mA
13
OUT
OUT
OUT
OUT
OUT
OUT
OUT
OUT
OUT
⎯
2.4
2.7
3.0
5.0
6.0
7.0
8.0
⎯
⎯
⎯
Input voltage
(Output on)
V
5
V
IN (ON)
⎯
⎯
TD62084APG/AFG
⎯
⎯
DC current transfer ratio
h
2
6
⎯
FE
Ta = 25°C
Ta = 85°C
(Note)
(Note)
⎯
50
Clamp diode reverse current
I
µA
R
⎯
100
2.0
⎯
Clamp diode forward voltage
Input capacitance
Turn-on delay
V
7
I
= 350 mA
F
⎯
V
F
C
⎯
15
0.1
0.2
pF
IN
t
R
R
= 125 Ω, V
= 125 Ω, V
= 50 V
⎯
ON
L
OUT
8
µs
Turn-off delay
t
= 50 V
⎯
OFF
L
OUT
Note: VR = VR max
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TD62081~084APG/AFG
Test Circuit
1. I
2. V
, h
3. I
IN (ON)
CEX
CE (sat) FE
Open
Open
Open
I
I
IN (ON)
CEX
V
I
I
OUT
IN
Open
Open
V
IN
CE
V
IN
V
, V
CE CE (sat)
I
OUT
h
FE
=
I
IN
4. I
5. V
IN (ON)
IN (OFF)
6. I
R
Open
Open
I
R
I
I
I
OUT
IN (OFF)
OUT
V
R
Open
V
V
CE
IN (ON)
Open
7. V
F
I
F
V
F
Open
Open
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TD62081~084APG/AFG
8. t
t
ON, OFF
Input
Open V
OUT
R
L
Pulse
generator
Output
= 15 pF
(Note 2)
C
L
(Note 1)
(Note 3)
Input
condition
t
t
f
r
V
IH
90%
50%
10%
90%
50%
Input
10%
0
50 µs
t
t
OFF
ON
V
OH
OL
Output
V
Note 1: Pulse width 50 µs, duty cycle 10%
Output impedance 50 Ω, t ≤ 5 ns, t ≤ 10 ns
r
f
Note 2: See below.
Input condition
Type Number
R1
V
IH
TD62081APG/AFG
TD62082APG/AFG
TD62083APG/AFG
TD62084APG/AFG
2.7 kΩ
0 Ω
3 V
13 V
3 V
0 Ω
0 Ω
8 V
Note 3: C includes probe and jig capacitance
L
Precautions for Using
This IC does not include built-in protection circuits for excess current or overvoltage.
If this IC is subjected to excess current or overvoltage, it may be destroyed.
Hence, the utmost care must be taken when systems which incorporate this IC are designed.
Utmost care is necessary in the design of the output line, COMMON and GND line since IC may be destroyed
due to short-circuit between outputs, air contamination fault, or fault by improper grounding.
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TD62081~084APG/AFG
I
– V
I
– V
IN IN
IN
IN
3
2
1
0
3
2
1
0
TD62082APG
TD62083APG
max
max
typ.
min
typ.
min
12
16
Input voltage
20
V
24
2
3
4
5
(V)
Input voltage
V
(V)
IN
IN
I
– V
I – V (sat)
OUT CE
IN
IN
3
2
1
0
600
400
200
0
TD62084APG
typ.
max
typ.
25°C max
min
5
7
9
11
0
0.5
1.0
1.5
2.0
Input voltage
V
(V)
Collector-emitter saturation voltage
IN
V
(V)
CE (sat)
I
– V
I
– Duty cycle
OUT
OUT
CE (sat)
600
400
200
0
500
400
300
200
100
0
8 circuits active
I
IN
= 500 µA
Ta = 85°C
Ta = 25°C
25
−30
85
0
0.4
0.8
1.2
1.6
0
20
40
60
80
100
Collector-emitter saturation voltage
(V)
Duty cycle (%)
V
CE (sat)
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TD62081~084APG/AFG
h
FE
– I
h – I
FE OUT
OUT
10000
10000
TD62083
TD62084
5000
3000
5000
3000
V
CE
= 2.0 V
V
CE
= 2.0 V
1000
1000
85°C
85°C
500
300
500
300
−40
−40
25
100
100
25
50
30
50
30
10
10
5
3
1
5
3
1
10
100
1000
10000
10
100
1000
10000
Output current
I
(mA)
OUT
Output current
I
(mA)
OUT
P
D
– Ta
2.0
1.5
1.0
0.5
0
(1) Type-APG Free air
(2) Type-AFG Free air
(1)
(2)
0
50
100
150
200
Ambient temperature Ta (°C)
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TD62081~084APG/AFG
Package Dimensions
Weight: 1.47 g (typ.)
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TD62081~084APG/AFG
Package Dimensions
Weight: 0.41 g (typ.)
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TD62081~084APG/AFG
Notes on Contents
1. Equivalent Circuits
The equivalent circuit diagrams may be simplified or some parts of them may be omitted for explanatory
purposes.
2. Test Circuits
Components in the test circuits are used only to obtain and confirm the device characteristics. These
components and circuits are not guaranteed to prevent malfunction or failure from occurring in the
application equipment.
IC Usage Considerations
Notes on Handling of ICs
(1) The absolute maximum ratings of a semiconductor device are a set of ratings that must not be
exceeded, even for a moment. Do not exceed any of these ratings.
Exceeding the rating(s) may cause the device breakdown, damage or deterioration, and may result
injury by explosion or combustion.
(2) Use an appropriate power supply fuse to ensure that a large current does not continuously flow in
case of over current and/or IC failure. The IC will fully break down when used under conditions that
exceed its absolute maximum ratings, when the wiring is routed improperly or when an abnormal
pulse noise occurs from the wiring or load, causing a large current to continuously flow and the
breakdown can lead smoke or ignition. To minimize the effects of the flow of a large current in case of
breakdown, appropriate settings, such as fuse capacity, fusing time and insertion circuit location, are
required.
(3) If your design includes an inductive load such as a motor coil, incorporate a protection circuit into the
design to prevent device malfunction or breakdown caused by the current resulting from the inrush
current at power ON or the negative current resulting from the back electromotive force at power OFF.
IC breakdown may cause injury, smoke or ignition.
Use a stable power supply with ICs with built-in protection functions. If the power supply is unstable,
the protection function may not operate, causing IC breakdown. IC breakdown may cause injury,
smoke or ignition.
(4) Do not insert devices in the wrong orientation or incorrectly.
Make sure that the positive and negative terminals of power supplies are connected properly.
Otherwise, the current or power consumption may exceed the absolute maximum rating, and
exceeding the rating(s) may cause the device breakdown, damage or deterioration, and may result
injury by explosion or combustion.
In addition, do not use any device that is applied the current with inserting in the wrong orientation
or incorrectly even just one time.
(5) Carefully select external components (such as inputs and negative feedback capacitors) and load
components (such as speakers), for example, power amp and regulator.
If there is a large amount of leakage current such as input or negative feedback condenser, the IC
output DC voltage will increase. If this output voltage is connected to a speaker with low input
withstand voltage, overcurrent or IC failure can cause smoke or ignition. (The over current can cause
smoke or ignition from the IC itself.) In particular, please pay attention when using a Bridge Tied
Load (BTL) connection type IC that inputs output DC voltage to a speaker directly.
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TD62081~084APG/AFG
Points to Remember on Handling of ICs
(1) Heat Radiation Design
In using an IC with large current flow such as power amp, regulator or driver, please design the
device so that heat is appropriately radiated, not to exceed the specified junction temperature (Tj) at
any time and condition. These ICs generate heat even during normal use. An inadequate IC heat
radiation design can lead to decrease in IC life, deterioration of IC characteristics or IC breakdown. In
addition, please design the device taking into considerate the effect of IC heat radiation with
peripheral components.
(2) Back-EMF
When a motor rotates in the reverse direction, stops or slows down abruptly, a current flow back to
the motor’s power supply due to the effect of back-EMF. If the current sink capability of the power
supply is small, the device’s motor power supply and output pins might be exposed to conditions
beyond absolute maximum ratings. To avoid this problem, take the effect of back-EMF into
consideration in system design.
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TD62081~084APG/AFG
About solderability, following conditions were confirmed
• Solderability
(1) Use of Sn-37Pb solder Bath
· solder bath temperature = 230°C
· dipping time = 5 seconds
· the number of times = once
· use of R-type flux
(2) Use of Sn-3.0Ag-0.5Cu solder Bath
· solder bath temperature = 245°C
· dipping time = 5 seconds
· the number of times = once
· use of R-type flux
RESTRICTIONS ON PRODUCT USE
060116EBA
• The information contained herein is subject to change without notice. 021023_D
• TOSHIBA is continually working to improve the quality and reliability of its products. Nevertheless, semiconductor
devices in general can malfunction or fail due to their inherent electrical sensitivity and vulnerability to physical
stress. It is the responsibility of the buyer, when utilizing TOSHIBA products, to comply with the standards of
safety in making a safe design for the entire system, and to avoid situations in which a malfunction or failure of
such TOSHIBA products could cause loss of human life, bodily injury or damage to property.
In developing your designs, please ensure that TOSHIBA products are used within specified operating ranges as
set forth in the most recent TOSHIBA products specifications. Also, please keep in mind the precautions and
conditions set forth in the “Handling Guide for Semiconductor Devices,” or “TOSHIBA Semiconductor Reliability
Handbook” etc. 021023_A
• The TOSHIBA products listed in this document are intended for usage in general electronics applications
(computer, personal equipment, office equipment, measuring equipment, industrial robotics, domestic appliances,
etc.). These TOSHIBA products are neither intended nor warranted for usage in equipment that requires
extraordinarily high quality and/or reliability or a malfunction or failure of which may cause loss of human life or
bodily injury (“Unintended Usage”). Unintended Usage include atomic energy control instruments, airplane or
spaceship instruments, transportation instruments, traffic signal instruments, combustion control instruments,
medical instruments, all types of safety devices, etc. Unintended Usage of TOSHIBA products listed in this
document shall be made at the customer’s own risk. 021023_B
• The products described in this document shall not be used or embedded to any downstream products of which
manufacture, use and/or sale are prohibited under any applicable laws and regulations. 060106_Q
• The information contained herein is presented only as a guide for the applications of our products. No
responsibility is assumed by TOSHIBA for any infringements of patents or other rights of the third parties which
may result from its use. No license is granted by implication or otherwise under any patent or patent rights of
TOSHIBA or others. 021023_C
• The products described in this document are subject to the foreign exchange and foreign trade laws. 021023_E
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