TD62104PG [TOSHIBA]

TRANSISTOR 500 mA, 25 V, 7 CHANNEL, NPN, Si, SMALL SIGNAL TRANSISTOR, LEAD FREE, DIP-16, BIP General Purpose Small Signal;


型号：	TD62104PG
厂家：	TOSHIBA
描述：	TRANSISTOR 500 mA, 25 V, 7 CHANNEL, NPN, Si, SMALL SIGNAL TRANSISTOR, LEAD FREE, DIP-16, BIP General Purpose Small Signal 开关光电二极管晶体管
文件：	总9页 (文件大小：456K)
中文：	中文翻译
下载：	下载PDF数据表文档文件

TD62101,103~105PG/FG

TOSHIBA BIPOLAR DIGITAL INTEGRATED CIRCUIT SILICON MONOLITHIC

TD62101PG,TD62101FG,TD62103PG,TD62103FG

TD62104PG,TD62104FG,TD62105PG,TD62105FG

7CH DARLINGTON SINK DRIVER

The TD62101PG / FG series are high-voltage, high-current

darlington drivers comprised of seven NPN darlington pairs.

This devices are a product for the Pb free(Sn-Ag).

TD62101PG

TD62103PG

TD62104PG

TD62105PG

FEATURES

ꢀ

Output current (single output) : 500 mA (max)

High sustaining voltage output: 25 V (min)

Inputs compatible with various types of logic.

Package type−PG :

Package type−FG :

DIP−16 pin.

SOP−16 pin.

TD62101FG

TD62103FG

TD62104FG

TD62105FG

TYPE

INPUT BASE RESISTOR

DESIGNATION

General Purpose

TD62101PG / FG

TD62103PG / FG

TD62104PG / FG

TD62105PG / FG

External

2.7kΩ

TTL, 5 V CMOS

10.5kΩ

20kΩ

6~15 V CMOS, PMOS

12~25 V CMOS, PMOS

Weight

DIP16−P−300−2.54A : 1.11 g (typ.)

SOP16−P−225−1.27 : 0.16 g (typ.)

PIN CONNECTION

SCHEMATICS

(TOP VIEW)

(EACH DRIVER)

TD62101PG / FG

Note: The input and output parasitic diodes cannot be

used as clamp diodes.

2005-02-28

TD62101,103~105PG/FG

SCHEMATICS (EACH DRIVER)

TD62103PG / FG

TD62104PG / FG

TD62105PG / FG

Note: The input and output parasitic diodes cannot be used as clamp diodes.

MAXIMUM RATINGS

(Ta = 25°C)

CHARACTERISTICS

Output Sustaining Voltage

SYMBOL

RATING

UNIT

−0.5~25

500

mA / ch

CE (SUS)

Output Current

Input Voltage

Input Current

OUT

(Note 1)

(Note 2)

−0.5~30

1.0

Power Dissipation

0.625 (Note 3)

−30~75

−40~85

−55~150

Operating Temperature

Storage Temperature

opr

°C

stg

Note 1: Except TD62101PG / FG

Note 2: Only TD62101PG / FG

Note 3: On Glass Epoxy PCB (30 × 30 × 1.6 mm Cu 50%)

RECOMMENDED OPERATING CONDITIONS

(Ta = −40~85°C and Ta = −30~75°C for only Type−P)

CHARACTERISTIC

SYMBOL

CONDITION

MIN

TYP.

MAX

UNIT

Output Sustaining Voltage

―

CE (SUS)

DC 1 Circuit

= 25 ms, Duty = 10%

350

mA /

Output Current

OUT

―

300

7 Circuits, Ta = 85°C, T = 120°C

Input Voltage

Input Current

Except TD62101PG / FG

―

Only TD62101PG / FG

―

0.44

0.325

Power Dissipation

(Note)

Note: On Glass Epoxy PCB (30 × 30 × 1.6 mm Cu 50%)

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TD62101,103~105PG/FG

ELECTRICAL CHARACTERISTICS (Ta = 25°C)

TEST

CIR−

CUIT

CHARACTERISTIC

SYMBOL

TEST CONDITION

MIN

TYP.

MAX

UNIT

µA

Ta = 75°C

= 25 V

―

1000

―

100

2.2

2.0

1.8

―

Output Leakage

Current

CEX

= 0

Ta = 85°C

= 350 mA, I = 600 µA

1.3

1.1

1.0

―

OUT

Collector−Emitter Saturation Voltage

= 200 mA, I = 400 µA

CE (sat)

= 100 mA, I = 200 µA

DC Current Transfer Ratio

TD62101PG / FG

= 2 V, I

= 350 mA

OUT

= 1.5 V, I

= 350 mA

0.25

1.00

0.4

1.2

1.0

―

OUT

= 1.75 V, I

= 2.4 V, I

= 350 mA

―

OUT

Output On

µA

TD62103PG / FG

TD62104PG / FG

TD62105PG / FG

= 350 mA

0.7

1.7

1.5

―

IN (ON)

OUT

Input

Current

= 13.5 V, I

= 20.0 V, I

= 350 mA

OUT

Ta = 75°C

Ta = 85°C

OUT

Output Off

IN (OFF)

500 µA

―

TD62103PG / FG

TD62104PG / FG

TD62105PG / FG

TD62103PG / FG

TD62104PG / FG

TD62105PG / FG

TD62103PG / FG

TD62104PG / FG

TD62105PG / FG

―

2.1

OUT

―

125 mA

―

6.4

2.7

―

Input

Voltage

OUT

Output On

= 2 V

―

IN (ON)

250 mA

―

3.3

8.8

―

OUT

―

350 mA

―

Input Capacitance

Turn−On Delay

Turn−Off Delay

= 0, f = 1 MHz

µs

0.1

0.2

―

= 25 V, R = 70 Ω

OUT

= 15 pF

―

OFF

TEST CIRCUIT

1. I

2. h , V

3. I

IN (ON)

CEX

FE CE (sat)

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TD62101,103~105PG/FG

TEST CIRCUIT

4. I

5. V

6. C

IN (OFF)

IN (ON)

7. t , t

ON OFF

INPUT CONDITION

Note 1: Pulse Width 50 µs, Duty Cycle 10%

Output Impedance 50 Ω, t ≤ 5 ns, t ≤ 10 ns

Note 2: See right.

TYPE NUMBER

Note 3: C includes probe and jig capacitance.

TD62101PG / FG

TD62103PG / FG

TD62104PG / FG

TD62105PG / FG

2.7 kΩ

0 Ω

3 V

0 Ω

8 V

0 Ω

15 V

PRECAUTIONS for USING

This IC does not include built-in protection circuits for excess current or overvoltage.

If this IC is subjected to excess current or overvoltage, it may be destroyed.

Hence, the utmost care must be taken when systems which incorporate this IC are designed.

Utmost care is necessary in the design of the output line, GND line since IC may be destroyed due to

short−circuit between outputs, air contamination fault, or fault by improper grounding.

2005-02-28

TD62101,103~105PG/FG

TD62103PG/FG

TD62105PG/FG

2005-02-28

TD62101,103~105PG/FG

①

②

Type-PG Free Air

Type-FG On Glass Epoxy PCB

30×30×1.6mm Cu 50%

Type-FG Free Air

③

2005-02-28

TD62101,103~105PG/FG

PACKAGE DIMENSIONS

DIP16−P−300−2.54A

Unit: mm

Weight: 1.11 g (typ.)

2005-02-28

TD62101,103~105PG/FG

PACKAGE DIMENSIONS

SOP16−P−225−1.27

Unit: mm

Weight: 0.16 g (typ.)

2005-02-28

TD62101,103~105PG/FG

About solderability, following conditions were confirmed

• Solderability

(1) Use of Sn-63Pb solder Bath

· solder bath temperature = 230°C

· dipping time = 5 seconds

· the number of times = once

· use of R-type flux

(2) Use of Sn-3.0Ag-0.5Cu solder Bath

· solder bath temperature = 245°C

· dipping time = 5 seconds

· the number of times = once

· use of R-type flux

RESTRICTIONS ON PRODUCT USE

030619EBA

• The information contained herein is subject to change without notice.

• The information contained herein is presented only as a guide for the applications of our products. No

responsibility is assumed by TOSHIBA for any infringements of patents or other rights of the third parties which

may result from its use. No license is granted by implication or otherwise under any patent or patent rights of

TOSHIBA or others.

• TOSHIBA is continually working to improve the quality and reliability of its products. Nevertheless, semiconductor

devices in general can malfunction or fail due to their inherent electrical sensitivity and vulnerability to physical

stress. It is the responsibility of the buyer, when utilizing TOSHIBA products, to comply with the standards of

safety in making a safe design for the entire system, and to avoid situations in which a malfunction or failure of

such TOSHIBA products could cause loss of human life, bodily injury or damage to property.

In developing your designs, please ensure that TOSHIBA products are used within specified operating ranges as

set forth in the most recent TOSHIBA products specifications. Also, please keep in mind the precautions and

conditions set forth in the “Handling Guide for Semiconductor Devices,” or “TOSHIBA Semiconductor Reliability

Handbook” etc..

• The TOSHIBA products listed in this document are intended for usage in general electronics applications

(computer, personal equipment, office equipment, measuring equipment, industrial robotics, domestic appliances,

etc.). These TOSHIBA products are neither intended nor warranted for usage in equipment that requires

extraordinarily high quality and/or reliability or a malfunction or failure of which may cause loss of human life or

bodily injury (“Unintended Usage”). Unintended Usage include atomic energy control instruments, airplane or

spaceship instruments, transportation instruments, traffic signal instruments, combustion control instruments,

medical instruments, all types of safety devices, etc.. Unintended Usage of TOSHIBA products listed in this

document shall be made at the customer’s own risk.

• The products described in this document are subject to the foreign exchange and foreign trade laws.

• TOSHIBA products should not be embedded to the downstream products which are prohibited to be produced

and sold, under any law and regulations.

2005-02-28

TD62104PG [TOSHIBA]

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