TD62318BPG [TOSHIBA]
IC 0.57 A BUF OR INV BASED PRPHL DRVR, PDIP16, 0.300 INCH, 2.54 MM PITCH, LEAD FREE, PLASTIC, DIP-16, Peripheral Driver;![TD62318BPG](http://pdffile.icpdf.com/pdf2/p00293/img/icpdf/TD62318BPG_1775738_icpdf.jpg)
型号: | TD62318BPG |
厂家: | ![]() |
描述: | IC 0.57 A BUF OR INV BASED PRPHL DRVR, PDIP16, 0.300 INCH, 2.54 MM PITCH, LEAD FREE, PLASTIC, DIP-16, Peripheral Driver 驱动 光电二极管 接口集成电路 驱动器 |
文件: | 总9页 (文件大小:229K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
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TD62318BPG/BFG
TOSHIBA Bipolar Digital Integrated Circuit Silicon Monolithic
TD62318BPG,TD62318BFG
4ch Low Input Active High-Current Darlington Sink Driver
The TD62318BPG and TD62318BFG are non-inverting transistor
array which are comprised of four NPN darlington output stages
and PNP input stages.
TD62318BPG
This device is low level input active driver and are suitable for
operation with TTL, 5 V CMOS and 5 V Microprocessor which
have sink current output drivers.
Applications include relay, hammer, lamp and stepping motor
drivers.
Features
•
•
Two V
terminals V
, V
(Separated)
CC
CC1 CC2
TD62318BFG
Package type BPG : DIP-16 pin
BFG : HSOP-16 pin
•
•
•
•
•
•
•
High sustaining voltage output : V
= 80 V (min)
CE (SUS)
Output current (Single output) : I
Output clamp diodes
= 700 mA/ch (max)
OUT
Input compatible with TTL and 5 V CMOS
GND and SUB terminal = Heat sink
Low level active input
Standard supply voltage
Weight
DIP16-P-300-2.54A : 1.11 g (typ.)
HSOP16-P-300-1.00 : 0.50 g (typ.)
Pin Connection (top view)
TD62318BPG
AD62318BFG
Heat sink
& GND
Heat sink
& GND
COM O4 I4
NC
NC I3 O3 COM
COM O4
I4
I3
O3 COM
16
15
14
13 12
11
10
9
16 15 14 13
12 11 10
9
1
2
3
4
5
6
7
8
1
2
3
4
5
6
7
8
Heat sink
& GND
V
O1
I1
Heat sink
& GND
I2
O2
V
V
O1 I1 NC
NC I2 O2 V
CC2
CC1
CC2
CC1
1
2004-02-24
TD62318BPG/BFG
Schematics (each driver)
V
CC
Common
Output
4 kΩ
600 Ω
Input
8.2 kΩ
GND
Note: The input and output parastitic diodes cannot be used as clamp diodes.
Maximum Ratings (Ta = 25°C)
Characteristics
Supply voltage
Symbol
Rating
Unit
V
−0.5 to 17
−0.5 to 80
700
V
V
CC
V
CE (SUS)
Output sustaining voltage
Output current
I
mA/ch
mA
V
OUT
Input current
I
−10
IN
Input voltage
V
−0.5 to 17
80
IN
Clamp diode reverse voltage
Clamp diode forward current
V
V
R
I
700
mA
F
BPG
BFG
1.47/2.7 (Note 1)
0.9/1.4 (Note 2)
−40 to 85
−55 to 150
Power dissipation
P
W
D
Operating temperature
Storage temperature
T
opr
°C
°C
T
stg
Note 1: On glass epoxy PCB (50 × 50 × 1.6 mm Cu 50%)
Note 2: On glass epoxy PCB (60 × 60 × 1.6 mm Cu 30%)
Recommended Operating Conditions (Ta = −40 to 85°C)
Characteristics
Supply voltage
Symbol
Condition
Min
Typ.
Max
Unit
V
⎯
⎯
4.5
0
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
5.5
80
V
V
CC
Output Sustaining voltage
V
CE (SUS)
DC 1 circuit, Ta = 25°C
0
570
570
330
570
100
15
Duty = 10%
Duty = 50%
Duty = 10%
Duty = 50%
0
T
= 25 ms
pw
BPG (Note 1)
BFG (Note 2)
Output current
I
mA/ch
4 circuits
0
OUT
Ta = 85°C
0
T = 120°C
j
0
V
⎯
⎯
0
V
V
IN
V
CC
Output on
Output off
V
0
⎯
⎯
IN (ON)
Input voltage
− 3.6
V
CC
V
⎯
15.0
IN (OFF)
− 1.6
Clamp diode reverse voltage
Clamp diode forward current
V
⎯
⎯
⎯
⎯
⎯
⎯
⎯
80
570
1.4
0.7
V
R
I
⎯
mA
F
BPG
BFG
Ta = 85°C
Ta = 85°C
(Note 1)
(Note 2)
⎯
Power dissipation
P
W
D
⎯
Note 1: On glass epoxy PCB (50 × 50 × 1.6 mm Cu 50%)
Note 2: On glass epoxy PCB (60 × 30 × 1.6 mm Cu 30%)
2
2004-02-24
TD62318BPG/BFG
Electrical Characteristics (Ta = 25°C)
Test
Circuit
Characteristics
Symbol
Test Condition
Min
Typ.
Max
15
Unit
V
V
CC
“H” level
V
⎯
⎯
⎯
IH
− 1.6
Input voltage
⎯
V
CC
“L” level
V
0
⎯
⎯
IL
− 3.6
“H” level
“L” level
I
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
10
µA
IH
Input current
2
I
−0.05 −0.36
mA
IL
V
V
= 80 V, Ta = 25°C
= 80 V, Ta = 85°C
⎯
⎯
⎯
⎯
⎯
⎯
⎯
35
⎯
0.4
8.0
50
100
0.8
0.45
50
CE
CE
µA
V
Output leakage current
I
1
3
4
CEX
I
I
= 0.5 A, V
= 0.2 A, V
= 4.5 V
= 4.5 V
OUT
OUT
CC
CC
Output saturation voltage
V
CE (sat)
V
V
= 80 V, Ta = 25°C
= 80 V, Ta = 85°C
R
R
Clamp diode reverse current
Clamp diode forward voltage
I
µA
R
100
2.0
40
V
5
2
2
I
= 500 mA
F
V
F
Output on
Output off
I
V
V
= 5.5 V, V = 0 V
IN
mA/ch
µA
CC (ON)
CC
CC
Supply current
I
= 5.5 V, V = V
IN
10
CC (OFF)
CC
Turn-on delay
Turn-off delay
t
0.8
16.0
ON
V
V
= 80 V, R = 142 Ω
L
OUT
CC
6
µs
= 5.0 V, C = 15 pF
L
t
OFF
Test Circuit
1. I
2. I , I
3. V
CE (sat)
CEX
IH IL
V
Open
V
Open
CC
V
CC
Open
CC
CC
I
I
I
OUT
I
CEX
IN
Open
Open
V
V
V
V
CE (sat)
CE
IN
IL
4. I
5. V
F
R
V
CC
V
CC
V
F
I
F
I
R
V
R
Open
Open
3
2004-02-24
TD62318BPG/BFG
6. t , t
ON OFF
(Note1)
t
t
f
r
Input
V
Open
V
OUT
CC
V
= 5 V
IH
90%
50%
90%
50%
Input
Pulse
generator
Output
10%
10%
50 µs
V
(Note 1)
IN
t
t
ON
OFF
50%
V
V
OH
OL
50%
Output
Note 1: Pulse width 50 µs, duty cycle 10%, output impedance 50 Ω, t ≤ 5 ns, t ≤ 10 ns
r
f
Note 2: C includes probe and jig capacitance.
L
Precautions for Using
This IC does not include built-in protection circuits for excess current or overvoltage.
If this IC is subjected to excess current or overvoltage, it may be destroyed.
Hence, the utmost care must be taken when systems which incorporate this IC are designed.
Utmost care is necessary in the design of the output line, V , COMMON and GND line since IC may be
CC
destroyed due to short-circuit between outputs, air contamination fault, or fault by improper grounding.
4
2004-02-24
TD62318BPG/BFG
I
– V
V
– V
OUT IN
IN
IN
−200
−160
−120
−80
−40
0
50
40
30
20
10
0
Ta = 25°C typ.
V
= 4.5 V 5.0 5.5
CC
V
= 5.5 V
CC
5.0
4.5
TD62318
Ta = 25°C typ.
I
= 570 mA
OUT
0
1
2
3
4
5
6
0
1
2
3
4
5
6
Input voltage
V
(V)
Input voltage
V
F
(V)
IN
IN
I
– V
I – V
F
CC (ON)
CC
100
80
60
40
20
0
700
560
420
280
140
0
Ta = 25°C typ.
Ta = 25°C typ.
4ch ON
V
= 0 V
IN
0
1
2
3
4
5
6
0
0.4
0.8
1.2
1.6
2.0
2.4
Supply voltage
V
CC
(V)
Clamp diode forward voltage
V
F
(V)
P
– Ta
D
3.0
2.4
1.8
(1) DIP-16 pin on glass epoxy PCB
(50 × 50 × 1.6 mm Cu 50%)
(2) DIP-16 pin free air
(3) PFP-16 pin on glass epoxy PCB
(60 × 30 × 1.6 mm Cu 30%)
(1)
(2)
(4) PFP-16 pin free air
1.2 (3)
(4)
0.6
0
0
40
80
120
160
200
240
Ambient temperature Ta (°C)
5
2004-02-24
TD62318BPG/BFG
I
– Duty cycle
I
– Duty cycle
OUT
OUT
700
560
420
280
140
0
700
560
420
280
140
0
n = 1 to 4
n = 1 to 2
3
4
TD62318BPG
Ta = 25°C
TD62318BPG
Ta = 85°C
V
V
= 5.5 V
V
V
= 5.5 V
CC
= 2.5 V
IN
CC
= 2.5 V
IN
n-ch ON
n-ch ON
0
20
40
60
80
100
120
0
20
40
60
80
100
120
Duty cycle (%)
Duty cycle (%)
I
– Duty cycle
I
– Duty cycle
OUT
OUT
700
560
420
280
140
0
700
560
420
280
140
0
n = 1 to 3
n = 1
4
2
3
4
TD62318BFG
Ta = 25°C
TD62318BFG
Ta = 85°C
V
V
= 5.5 V
V
V
= 5.5 V
CC
= 2.5 V
IN
CC
= 2.5 V
IN
n-ch ON
n-ch ON
0
20
40
60
80
100
120
0
20
40
60
80
100
120
Duty cycle (%)
Duty cycle (%)
6
2004-02-24
TD62318BPG/BFG
Package Dimensions
Weight: 1.11 g (typ.)
7
2004-02-24
TD62318BPG/BFG
Package Dimensions
Weight: 0.50 g (typ.)
8
2004-02-24
TD62318BPG/BFG
About solderability, following conditions were confirmed
• Solderability
(1) Use of Sn-63Pb solder Bath
·
·
·
·
solder bath temperature = 230°C
dipping time = 5 seconds
the number of times = once
use of R-type flux
(2) Use of Sn-3.0Ag-0.5Cu solder Bath
·
·
·
·
solder bath temperature = 245°C
dipping time = 5 seconds
the number of times = once
use of R-type flux
RESTRICTIONS ON PRODUCT USE
030619EBA
• The information contained herein is subject to change without notice.
• The information contained herein is presented only as a guide for the applications of our products. No
responsibility is assumed by TOSHIBA for any infringements of patents or other rights of the third parties which
may result from its use. No license is granted by implication or otherwise under any patent or patent rights of
TOSHIBA or others.
• TOSHIBA is continually working to improve the quality and reliability of its products. Nevertheless, semiconductor
devices in general can malfunction or fail due to their inherent electrical sensitivity and vulnerability to physical
stress. It is the responsibility of the buyer, when utilizing TOSHIBA products, to comply with the standards of
safety in making a safe design for the entire system, and to avoid situations in which a malfunction or failure of
such TOSHIBA products could cause loss of human life, bodily injury or damage to property.
In developing your designs, please ensure that TOSHIBA products are used within specified operating ranges as
set forth in the most recent TOSHIBA products specifications. Also, please keep in mind the precautions and
conditions set forth in the “Handling Guide for Semiconductor Devices,” or “TOSHIBA Semiconductor Reliability
Handbook” etc..
• The TOSHIBA products listed in this document are intended for usage in general electronics applications
(computer, personal equipment, office equipment, measuring equipment, industrial robotics, domestic appliances,
etc.). These TOSHIBA products are neither intended nor warranted for usage in equipment that requires
extraordinarily high quality and/or reliability or a malfunction or failure of which may cause loss of human life or
bodily injury (“Unintended Usage”). Unintended Usage include atomic energy control instruments, airplane or
spaceship instruments, transportation instruments, traffic signal instruments, combustion control instruments,
medical instruments, all types of safety devices, etc.. Unintended Usage of TOSHIBA products listed in this
document shall be made at the customer’s own risk.
• The products described in this document are subject to the foreign exchange and foreign trade laws.
• TOSHIBA products should not be embedded to the downstream products which are prohibited to be produced
and sold, under any law and regulations.
9
2004-02-24
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