TD62318BPG [TOSHIBA]

IC 0.57 A BUF OR INV BASED PRPHL DRVR, PDIP16, 0.300 INCH, 2.54 MM PITCH, LEAD FREE, PLASTIC, DIP-16, Peripheral Driver;
TD62318BPG
型号: TD62318BPG
厂家: TOSHIBA    TOSHIBA
描述:

IC 0.57 A BUF OR INV BASED PRPHL DRVR, PDIP16, 0.300 INCH, 2.54 MM PITCH, LEAD FREE, PLASTIC, DIP-16, Peripheral Driver

驱动 光电二极管 接口集成电路 驱动器
文件: 总9页 (文件大小:229K)
中文:  中文翻译
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TD62318BPG/BFG  
TOSHIBA Bipolar Digital Integrated Circuit Silicon Monolithic  
TD62318BPG,TD62318BFG  
4ch Low Input Active High-Current Darlington Sink Driver  
The TD62318BPG and TD62318BFG are non-inverting transistor  
array which are comprised of four NPN darlington output stages  
and PNP input stages.  
TD62318BPG  
This device is low level input active driver and are suitable for  
operation with TTL, 5 V CMOS and 5 V Microprocessor which  
have sink current output drivers.  
Applications include relay, hammer, lamp and stepping motor  
drivers.  
Features  
Two V  
terminals V  
, V  
(Separated)  
CC  
CC1 CC2  
TD62318BFG  
Package type BPG : DIP-16 pin  
BFG : HSOP-16 pin  
High sustaining voltage output : V  
= 80 V (min)  
CE (SUS)  
Output current (Single output) : I  
Output clamp diodes  
= 700 mA/ch (max)  
OUT  
Input compatible with TTL and 5 V CMOS  
GND and SUB terminal = Heat sink  
Low level active input  
Standard supply voltage  
Weight  
DIP16-P-300-2.54A : 1.11 g (typ.)  
HSOP16-P-300-1.00 : 0.50 g (typ.)  
Pin Connection (top view)  
TD62318BPG  
AD62318BFG  
Heat sink  
& GND  
Heat sink  
& GND  
COM O4 I4  
NC  
NC I3 O3 COM  
COM O4  
I4  
I3  
O3 COM  
16  
15  
14  
13 12  
11  
10  
9
16 15 14 13  
12 11 10  
9
1
2
3
4
5
6
7
8
1
2
3
4
5
6
7
8
Heat sink  
& GND  
V
O1  
I1  
Heat sink  
& GND  
I2  
O2  
V
V
O1 I1 NC  
NC I2 O2 V  
CC2  
CC1  
CC2  
CC1  
1
2004-02-24  
TD62318BPG/BFG  
Schematics (each driver)  
V
CC  
Common  
Output  
4 kΩ  
600 Ω  
Input  
8.2 kΩ  
GND  
Note: The input and output parastitic diodes cannot be used as clamp diodes.  
Maximum Ratings (Ta = 25°C)  
Characteristics  
Supply voltage  
Symbol  
Rating  
Unit  
V
0.5 to 17  
0.5 to 80  
700  
V
V
CC  
V
CE (SUS)  
Output sustaining voltage  
Output current  
I
mA/ch  
mA  
V
OUT  
Input current  
I
10  
IN  
Input voltage  
V
0.5 to 17  
80  
IN  
Clamp diode reverse voltage  
Clamp diode forward current  
V
V
R
I
700  
mA  
F
BPG  
BFG  
1.47/2.7 (Note 1)  
0.9/1.4 (Note 2)  
40 to 85  
55 to 150  
Power dissipation  
P
W
D
Operating temperature  
Storage temperature  
T
opr  
°C  
°C  
T
stg  
Note 1: On glass epoxy PCB (50 × 50 × 1.6 mm Cu 50%)  
Note 2: On glass epoxy PCB (60 × 60 × 1.6 mm Cu 30%)  
Recommended Operating Conditions (Ta = −40 to 85°C)  
Characteristics  
Supply voltage  
Symbol  
Condition  
Min  
Typ.  
Max  
Unit  
V
4.5  
0
5.5  
80  
V
V
CC  
Output Sustaining voltage  
V
CE (SUS)  
DC 1 circuit, Ta = 25°C  
0
570  
570  
330  
570  
100  
15  
Duty = 10%  
Duty = 50%  
Duty = 10%  
Duty = 50%  
0
T
= 25 ms  
pw  
BPG (Note 1)  
BFG (Note 2)  
Output current  
I
mA/ch  
4 circuits  
0
OUT  
Ta = 85°C  
0
T = 120°C  
j
0
V
0
V
V
IN  
V
CC  
Output on  
Output off  
V
0
IN (ON)  
Input voltage  
3.6  
V
CC  
V
15.0  
IN (OFF)  
1.6  
Clamp diode reverse voltage  
Clamp diode forward current  
V
80  
570  
1.4  
0.7  
V
R
I
mA  
F
BPG  
BFG  
Ta = 85°C  
Ta = 85°C  
(Note 1)  
(Note 2)  
Power dissipation  
P
W
D
Note 1: On glass epoxy PCB (50 × 50 × 1.6 mm Cu 50%)  
Note 2: On glass epoxy PCB (60 × 30 × 1.6 mm Cu 30%)  
2
2004-02-24  
TD62318BPG/BFG  
Electrical Characteristics (Ta = 25°C)  
Test  
Circuit  
Characteristics  
Symbol  
Test Condition  
Min  
Typ.  
Max  
15  
Unit  
V
V
CC  
“H” level  
V
IH  
1.6  
Input voltage  
V
CC  
“L” level  
V
0
IL  
3.6  
“H” level  
“L” level  
I
10  
µA  
IH  
Input current  
2
I
0.05 0.36  
mA  
IL  
V
V
= 80 V, Ta = 25°C  
= 80 V, Ta = 85°C  
35  
0.4  
8.0  
50  
100  
0.8  
0.45  
50  
CE  
CE  
µA  
V
Output leakage current  
I
1
3
4
CEX  
I
I
= 0.5 A, V  
= 0.2 A, V  
= 4.5 V  
= 4.5 V  
OUT  
OUT  
CC  
CC  
Output saturation voltage  
V
CE (sat)  
V
V
= 80 V, Ta = 25°C  
= 80 V, Ta = 85°C  
R
R
Clamp diode reverse current  
Clamp diode forward voltage  
I
µA  
R
100  
2.0  
40  
V
5
2
2
I
= 500 mA  
F
V
F
Output on  
Output off  
I
V
V
= 5.5 V, V = 0 V  
IN  
mA/ch  
µA  
CC (ON)  
CC  
CC  
Supply current  
I
= 5.5 V, V = V  
IN  
10  
CC (OFF)  
CC  
Turn-on delay  
Turn-off delay  
t
0.8  
16.0  
ON  
V
V
= 80 V, R = 142 Ω  
L
OUT  
CC  
6
µs  
= 5.0 V, C = 15 pF  
L
t
OFF  
Test Circuit  
1. I  
2. I , I  
3. V  
CE (sat)  
CEX  
IH IL  
V
Open  
V
Open  
CC  
V
CC  
Open  
CC  
CC  
I
I
I
OUT  
I
CEX  
IN  
Open  
Open  
V
V
V
V
CE (sat)  
CE  
IN  
IL  
4. I  
5. V  
F
R
V
CC  
V
CC  
V
F
I
F
I
R
V
R
Open  
Open  
3
2004-02-24  
TD62318BPG/BFG  
6. t , t  
ON OFF  
(Note1)  
t
t
f
r
Input  
V
Open  
V
OUT  
CC  
V
= 5 V  
IH  
90%  
50%  
90%  
50%  
Input  
Pulse  
generator  
Output  
10%  
10%  
50 µs  
V
(Note 1)  
IN  
t
t
ON  
OFF  
50%  
V
V
OH  
OL  
50%  
Output  
Note 1: Pulse width 50 µs, duty cycle 10%, output impedance 50 , t 5 ns, t 10 ns  
r
f
Note 2: C includes probe and jig capacitance.  
L
Precautions for Using  
This IC does not include built-in protection circuits for excess current or overvoltage.  
If this IC is subjected to excess current or overvoltage, it may be destroyed.  
Hence, the utmost care must be taken when systems which incorporate this IC are designed.  
Utmost care is necessary in the design of the output line, V , COMMON and GND line since IC may be  
CC  
destroyed due to short-circuit between outputs, air contamination fault, or fault by improper grounding.  
4
2004-02-24  
TD62318BPG/BFG  
I
– V  
V
– V  
OUT IN  
IN  
IN  
200  
160  
120  
80  
40  
0
50  
40  
30  
20  
10  
0
Ta = 25°C typ.  
V
= 4.5 V 5.0 5.5  
CC  
V
= 5.5 V  
CC  
5.0  
4.5  
TD62318  
Ta = 25°C typ.  
I
= 570 mA  
OUT  
0
1
2
3
4
5
6
0
1
2
3
4
5
6
Input voltage  
V
(V)  
Input voltage  
V
F
(V)  
IN  
IN  
I
– V  
I – V  
F
CC (ON)  
CC  
100  
80  
60  
40  
20  
0
700  
560  
420  
280  
140  
0
Ta = 25°C typ.  
Ta = 25°C typ.  
4ch ON  
V
= 0 V  
IN  
0
1
2
3
4
5
6
0
0.4  
0.8  
1.2  
1.6  
2.0  
2.4  
Supply voltage  
V
CC  
(V)  
Clamp diode forward voltage  
V
F
(V)  
P
Ta  
D
3.0  
2.4  
1.8  
(1) DIP-16 pin on glass epoxy PCB  
(50 × 50 × 1.6 mm Cu 50%)  
(2) DIP-16 pin free air  
(3) PFP-16 pin on glass epoxy PCB  
(60 × 30 × 1.6 mm Cu 30%)  
(1)  
(2)  
(4) PFP-16 pin free air  
1.2 (3)  
(4)  
0.6  
0
0
40  
80  
120  
160  
200  
240  
Ambient temperature Ta (°C)  
5
2004-02-24  
TD62318BPG/BFG  
I
– Duty cycle  
I
– Duty cycle  
OUT  
OUT  
700  
560  
420  
280  
140  
0
700  
560  
420  
280  
140  
0
n = 1 to 4  
n = 1 to 2  
3
4
TD62318BPG  
Ta = 25°C  
TD62318BPG  
Ta = 85°C  
V
V
= 5.5 V  
V
V
= 5.5 V  
CC  
= 2.5 V  
IN  
CC  
= 2.5 V  
IN  
n-ch ON  
n-ch ON  
0
20  
40  
60  
80  
100  
120  
0
20  
40  
60  
80  
100  
120  
Duty cycle (%)  
Duty cycle (%)  
I
– Duty cycle  
I
– Duty cycle  
OUT  
OUT  
700  
560  
420  
280  
140  
0
700  
560  
420  
280  
140  
0
n = 1 to 3  
n = 1  
4
2
3
4
TD62318BFG  
Ta = 25°C  
TD62318BFG  
Ta = 85°C  
V
V
= 5.5 V  
V
V
= 5.5 V  
CC  
= 2.5 V  
IN  
CC  
= 2.5 V  
IN  
n-ch ON  
n-ch ON  
0
20  
40  
60  
80  
100  
120  
0
20  
40  
60  
80  
100  
120  
Duty cycle (%)  
Duty cycle (%)  
6
2004-02-24  
TD62318BPG/BFG  
Package Dimensions  
Weight: 1.11 g (typ.)  
7
2004-02-24  
TD62318BPG/BFG  
Package Dimensions  
Weight: 0.50 g (typ.)  
8
2004-02-24  
TD62318BPG/BFG  
About solderability, following conditions were confirmed  
Solderability  
(1) Use of Sn-63Pb solder Bath  
·
·
·
·
solder bath temperature = 230°C  
dipping time = 5 seconds  
the number of times = once  
use of R-type flux  
(2) Use of Sn-3.0Ag-0.5Cu solder Bath  
·
·
·
·
solder bath temperature = 245°C  
dipping time = 5 seconds  
the number of times = once  
use of R-type flux  
RESTRICTIONS ON PRODUCT USE  
030619EBA  
The information contained herein is subject to change without notice.  
The information contained herein is presented only as a guide for the applications of our products. No  
responsibility is assumed by TOSHIBA for any infringements of patents or other rights of the third parties which  
may result from its use. No license is granted by implication or otherwise under any patent or patent rights of  
TOSHIBA or others.  
TOSHIBA is continually working to improve the quality and reliability of its products. Nevertheless, semiconductor  
devices in general can malfunction or fail due to their inherent electrical sensitivity and vulnerability to physical  
stress. It is the responsibility of the buyer, when utilizing TOSHIBA products, to comply with the standards of  
safety in making a safe design for the entire system, and to avoid situations in which a malfunction or failure of  
such TOSHIBA products could cause loss of human life, bodily injury or damage to property.  
In developing your designs, please ensure that TOSHIBA products are used within specified operating ranges as  
set forth in the most recent TOSHIBA products specifications. Also, please keep in mind the precautions and  
conditions set forth in the “Handling Guide for Semiconductor Devices,” or “TOSHIBA Semiconductor Reliability  
Handbook” etc..  
The TOSHIBA products listed in this document are intended for usage in general electronics applications  
(computer, personal equipment, office equipment, measuring equipment, industrial robotics, domestic appliances,  
etc.). These TOSHIBA products are neither intended nor warranted for usage in equipment that requires  
extraordinarily high quality and/or reliability or a malfunction or failure of which may cause loss of human life or  
bodily injury (“Unintended Usage”). Unintended Usage include atomic energy control instruments, airplane or  
spaceship instruments, transportation instruments, traffic signal instruments, combustion control instruments,  
medical instruments, all types of safety devices, etc.. Unintended Usage of TOSHIBA products listed in this  
document shall be made at the customer’s own risk.  
The products described in this document are subject to the foreign exchange and foreign trade laws.  
TOSHIBA products should not be embedded to the downstream products which are prohibited to be produced  
and sold, under any law and regulations.  
9
2004-02-24  

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