THNSNB062GBSJ_技术文档

Solid State Drive SG2 Series

Key Features

• High capacity in smallest size

• Fast access and fast transfer rate

• Low power consumption

• High reliability

• Intelligent Interface

• Data integrity

Applications

• For slate PCs and mobile equipments

Specifications and Features

Form Factor

Memory

Half Slim Module

mSATA^TMModule^*1

TOSHIBA® 32nm MLC NAND Flash Memory

ATA-8 ACS2, SATA revision 2.6 3Gb/s

30/62/128 GB

2.5-type Case

Interface

Capacity

30/62/128 GB

30/62 GB

Performance

Supply Voltage

Power

Consumption

Temperature

Shock

Maximum Data Read : 180 MB/s (Ave), Maximum Data Write : 50 MB/s (Ave)

5.0V ±5%

3.3V ±5%

5.0V ±5%

Active : 1.9W Typ.

Idle : 55mW Typ.

Active : 1.8W Typ.

Idle : 55mW Typ.

Active : 1.8W Typ.

Idle : 55mW Typ.

Operating : 0°C (Tc) – 70°C (Tc), Non-operating : -40°C – 85°C

1500G @ 0.5 ms

Vibration

Operating / Non-operating : 20G @ 10-2,000Hz

Reliability

Mean Time to Failure (MTTF) : 1,000,000 hours

Product Life : Approximately 3 years or 20,000 power on hours, whichever comes earlier

Size

39mm x 54mm x 4mm

50.95mm x 30mm x 3.95mm

100.0mm x 69.85mm x

9.5mm

Weight

9.2g typ.

8.5g typ.

36g typ.

More Features

・

Translation mode which enables any drive configuration

28-bit LBA mode commands and 48-bit LBA mode commands support

Multi word DMA

Ultra-DMA

Advanced PIO mode

Data Set Management Command set (Trim) support

Automatic retries and corrections for read errors

FDE (Full Disk Encryption) (Optional) ^*2

UL, CSA, TUV, KCC, FCC, BSMI, CE, C-Tick

Compliance

*2) The products with FDE option are subject to foreign exchange and foreign trade control laws.

Products and specifications discussed herein are for reference purposes

only and are subject to change without notice. All information discussed

herein is provided on an “as is” basis, without warranties of any kind.

Before creating and producing designs and using, customers must refer to

and comply with the latest versions of the product specifications.

Solid State Drive SG2 Series Brochure Rev.1.1

1

Solid State Drive SG2 Series Brochure Rev.1.1

Ordering Information

THN SX X XXXG X X X

1 2 3 4 5 6 7

1. Model Name THN: Toshiba NAND drive

2. Model Type SN: Normal SSD, SF: FDE supported SSD (Optional)

3. Controller Type C: Type B

4. Capacity

030G / 062G / 128G /…

(1 GB = 1,000,000,000 bytes)

5. Form Factor B: 2.5-type case, M: Module type

6. Host I/F Type C: Mini SATA, S: Standard SATA

7. NAND Process J: 32nm MLC

Product Line up

Product Number

THNSxB030GMSJ

THNSxB062GMSJ

THNSxB128GMSJ

THNSxB030GMCJ

THNSxB062GMCJ

THNSxB128GMCJ

THNSxB030GBSJ

THNSxB062GBSJ

Capacity

30 GB

62 GB

128 GB

30 GB

62 GB

128 GB

30 GB

62 GB

Form Factor

Half Slim Module

mSATA^TMModule

2.5-type Case

NOTE: *1) x: Refer to Chapter “Ordering Information”

2

Solid State Drive SG2 Series Brochure Rev.1.1

Contents

Ordering Information................................................................................................................................................. 2

Product Line up.......................................................................................................................................................... 2

Contents..................................................................................................................................................................... 3

1. General Description........................................................................................................................................... 4

2. Product Specifications ....................................................................................................................................... 4

2.1.

2.2.

Capacity..................................................................................................................................................... 4

Performance.............................................................................................................................................. 4

3. Electrical Characteristics.................................................................................................................................... 5

3.1.

3.2.

Supply Voltage........................................................................................................................................... 5

Power Consumption.................................................................................................................................. 5

4. Environmental Conditions................................................................................................................................. 6

4.1.

4.2.

Temperature and Humidity....................................................................................................................... 6

Shock and Vibration .................................................................................................................................. 6

5. Compliance........................................................................................................................................................ 7

6. Reliability........................................................................................................................................................... 7

7. Mechanical Specifications ................................................................................................................................. 8

7.1.

7.2.

7.3.

Half Slim Module....................................................................................................................................... 8

mSATA^TMModule .................................................................................................................................... 10

2.5-type Case .......................................................................................................................................... 11

8. Interface Connector......................................................................................................................................... 12

8.1.

8.2.

Half Slim Module and 2.5-type Case....................................................................................................... 12

mSATA^TMModule .................................................................................................................................... 13

9. Command Descriptions ................................................................................................................................... 14

10. Revision History........................................................................................................................................... 17

RESTRICTIONS ON PRODUCT USE............................................................................................................................ 18

3

Solid State Drive SG2 Series Brochure Rev.1.1

1. General Description

The TOSHIBA SSD SG series is a memory storage device using NAND Flash Memories, which has no

mechanical moving parts and provides high performance and reliability.

The drive features an ATA-8 and Serial ATA revision 2.6 interface embedded controller that requires a

simplified adapter board for interfacing to a Serial ATA or Serial ATA compatible bus. The drive is

distinctive for its small and light body.

2. Product Specifications

2.1. Capacity

Table 2-1. User Addressable Sectors in LBA Mode

Formatted Capacity

30 GB

Total Number of User Addressable Sectors in LBA Mode

58,626,288

121,138,416

250,069,680

62 GB

128 GB

NOTE: 1 GB (Gigabyte) = 1,000,000,000 bytes

Bytes per sector: 512 bytes

2.2. Performance

Table 2-2. Host Transfer Rate and Data Transfer Rate in Read/Write

Parameter

Transfer Rate

300 MB/s

Host Transfer Rate

Maximum Data Read ^*1

Maximum Data Write ^*1

180 MB/s (Ave.)

50 MB/s (Ave.)

NOTE: *1) Under the condition of measurement with 128KB unit sequential access

4

Solid State Drive SG2 Series Brochure Rev.1.1

3. Electrical Characteristics

3.1. Supply Voltage

Table 3-1. Supply Voltage

Half Slim Module

5.0V ±5%

mSATA^TMModule

2.5-type Case

5.0V ±5%

Allowable voltage

3.3V ±5%

100 mV p-p or less

2 –100 ms

Allowable noise/ripple

Allowable supply rise time

100 mV p-p or less

2 –100 ms

100 mV p-p or less

2 –100 ms

NOTE: The drive has over current protection circuit. (Rated current: 3.15A)

3.2. Power Consumption

Table 3-2. Power Consumption in Half Slim Module Type

Half Slim Module

Operation

(@25°C)

Read ^*1

THNSxB030GMSJ

1.4W Typ.

THNSxB062GMSJ

1.5W Typ.

THNSxB128GMSJ

1.6W Typ.

Write ^*1

1.7W Typ.

1.8W Typ.

1.9W Typ.

Idle ^*2

Standby / Sleep ^*3

55mW Typ.

Table 3-3. Power Consumption in mSATA^TMModule Type

mSATA^TMModule

Operation

(@25°C)

Read ^*1

THNSxB030GMCJ

1.3W Typ.

THNSxB062GMCJ

1.4W Typ.

THNSxB128GMCJ

1.5W Typ.

Write ^*1

1.5W Typ.

1.6W Typ.

1.8W Typ.

Idle ^*2

Standby / Sleep ^*3

55mW Typ.

Table 3-4. Power Consumption in 2.5-type Case Type

2.5-type Case

Operation

(@25°C)

Read ^*1

THNSxB030GBSJ

1.4W Typ.

THNSxB062GBSJ

1.5W Typ.

Write ^*1

Idle ^*2

Standby / Sleep ^*3

1.7W Typ.

1.8W Typ.

55mW Typ.

NOTE: *1) The read/write current is specified 180 MB/s in read, 50 MB/s in write.

*2) The values are based on using S-ATA power management features. The Slumber mode is

used for the idle mode power consumption measurements. In Idle mode, if a background

write operation occurs, the drive power consumption may temporally rise to that in write

5

Solid State Drive SG2 Series Brochure Rev.1.1

operation.

*3) The values are based on using S-ATA power management features. The Slumber mode is

used for Standby and Sleep modes power consumption measurements.

4. Environmental Conditions

4.1. Temperature and Humidity

Table 4-1. Temperature

Range

Condition

Operating ^*1

Gradient

0°C (Tc) – 70°C (Tc)

-40°C – 85°C

30°C (Ta) / h maximum

30°C / h maximum

Non-operating

Under Shipment ^*2

-40°C – 85°C

NOTE: *1) Ta: Ambient Temperature, Tc: Case Temperature

*2) Packed in Toshiba’s original shipping package

Table 4-2. Humidity

Condition

Operating

Range

8% – 90% R.H. (No condensation)

Non-operating

Under Shipment ^*1

8% – 95% R.H. (No condensation)

5% – 95% R.H.

NOTE: *1) Packed in Toshiba’s original shipping package

4.2. Shock and Vibration

Table 4-3. Shock

Condition

Operating

Range

1500G, 0.5 ms, half sine wave

100 cm free drop

Non-operating

Under Shipment ^*1

NOTE:

*1) Apply shocks in each direction of the drive’s three mutually perpendicular axes, one axis at a time.

Packed in Toshiba’s original shipping package.

Table 4-4. Vibration

Condition

Operating

Range

20G Peak, 10-2,000Hz, (20min /Axis)x3 Axis

20G Peak, 10-2,000Hz, (12Cycle /Axis)x3 Axis, x20min.

Non-operating

6

Solid State Drive SG2 Series Brochure Rev.1.1

5. Compliance

TOSHIBA SSDs SG series comply with the following.

Table 5-1. Compliance

Description

Title

Region

UL

UL 60950-1

USA

(Underwriters Laboratories)

CSA

(Canadian Standard Association)

CSA-C22.2 No.60950-1

Canada

*Included UL logo mark

TÜV

EN 60950-1

Germany

Korea

(Technischer Überwachungs Verein)

KCC

KN22 (CISPR Pub. 22),

KN24 (CISPR Pub. 24)

(Korea Communication Commission)

FCC

FCC part 15 Subpart B Class B

USA

BSMI

(Bureau of Standards, Metrology and

CNS13438(CISPR Pub. 22)

Taiwan

Europe

Inspection)

CE Mark

EN 55022, EN 55024

Declaration of Conformity

C-Tick

Australia,

AS/NZS CISPR Pub. 22 Class B

New Zealand

6. Reliability

Table 6-1. Reliability

Value

Parameter

Mean Time to Failure

Product Life

1,000,000 hours

Approximately 3 years or 20,000 power on hours, whichever comes earlier

7

Solid State Drive SG2 Series Brochure Rev.1.1

7. Mechanical Specifications

7.1. Half Slim Module

Table 7-1. Weight and Dimensions

Model

Weight

Width

Height

Length

Half Slim Module

9.2 g Typ.

54mm

4 mm

39 mm

8

Solid State Drive SG2 Series Brochure Rev.1.1

Figure 7-1. Half Slim Module Drive Dimension

9

Solid State Drive SG2 Series Brochure Rev.1.1

7.2. mSATA^TMModule

Table 7-2. Weight and Dimensions

Weight

Width

Height

Length

1.8-type Case

8.5 g Typ.

30 mm

3.95 mm

50.95 mm

Figure 7-2. mSATA^TMModule Drive Dimension

10

Solid State Drive SG2 Series Brochure Rev.1.1

7.3. 2.5-type Case

Table 7-3. Weight and Dimensions

Weight

Width

Height

Length

2.5-type Case

36 g Typ.

69.85 mm

9.5 mm

100.0 mm

Figure 7-3. 2.5-type Case Drive Dimension

11

Solid State Drive SG2 Series Brochure Rev.1.1

8. Interface Connector

8.1. Half Slim Module and 2.5-type Case

Figure 8-1. Serial ATA Interface Connector

Table 8-1. Pin Assignment on Serial ATA Connector

Signal segment key

S1

S2

S3

S4

GND

A+

A-

Return Current Path, 2^ndmate

Differential Signal Pair A (Device Rx)

Signal Segment

GND

Return Current Path

S5

S6

S7

B-

Differential Signal Pair B (Device Tx)

B+

GND

Return Current Path, 2^ndmate

Signal segment “L”

Central connector polarizer

Power segment “L”

P1

P2

P3

P4

P5

P6

P7

P8

V33

3.3V power (Unused)

3.3V power pre-charge, 2^ndmate (Unused)

Return Current Path

5V power pre-charge, 2^ndmate

5V power

V33

GND

V5

Power Segment

P9

V5

5V power

P10

P11

P12

P13

P14

P15

GND

Return Current Path

DAS/DSS^*1Drive Access Signal / Disable Staggered Spinup

GND

V12

Return Current Path, 1^stmate

12V power pre-charge, 2^ndmate (Unused)

12V power (Unused)

Power segment key

Note: *1) DAS/DSS signal is not used for this drive

12

Solid State Drive SG2 Series Brochure Rev.1.1

8.2. mSATA^TMModule

Figure 8-2. mSATA^TMInterface Connector

Table 8-2. Pin Assignment on mSATA^TMConnector

Pin # Name

Description

Pin # Name

Description

1

3

5

7

9

Reserved

GND

NC

2

4

6

8

V33

GND

V15

3.3V power

NC

Return Current Path

1.5V power (Unused)

NC

Reserved NC

Return Current Path

10 Reserved NC

12 Reserved NC

14 Reserved NC

16 Reserved NC

11 Reserved

13 Reserved

15 GND

NC

Return Current Path

Key

17 Reserved

19 Reserved

21 GND

23 B+

NC

18 GND

Return Current Path

NC

20 Reserved NC

22 Reserved NC

Return Current Path

Differential Signal Pair B

24 V33

3.3V power

25 B-

26 GND

28 V15

Return Current Path

1.5V power (Unused)

NC

(Device Tx)

Return Current Path

27 GND

29 GND

31 A-

Return Current Path

30 Vendor

32 Vendor

34 GND

Differential Signal Pair A

NC

33 A+

Return Current Path

(Device Rx)

35 GND

37 GND

39 V33

Return Current Path

36 Reserved NC

38 Reserved NC

Return Current Path

3.3V power

40 GND

Return Current Path

41 V33

3.3V power

42 Reserved NC

44 Reserved NC

46 Reserved NC

43 GND

45 Vendor

47 Vendor

49 DAS/DSS^*1Drive Activity Signal

51 Presence^*2Presence Detection

Return Current Path

No connect at Host side

48 V15

50 GND

52 V33

1.5V power (Unused)

Return Current Path

3.3V power

Note: *1) DAS/DSS signal is not used for this drive. (DAS Signal output is optional)

*2) Presence pin is connected to GND by device side. (220Ω Pull Down)

13

Solid State Drive SG2 Series Brochure Rev.1.1

9. Command Descriptions

Table 9-1. Supported ATA Command Set

Command Description

Op-Code

00h

06h

10h

20h

21h

24h

25h

27h

29h

2Fh

30h

31h

34h

35h

37h

39h

3Dh

3Fh

40h

41h

42h

45h

70h

90h

91h

92h

B0h

NOP

DATA SET MANAGEMENT

RECALIBRATE

READ SECTOR(S)

READ SECTOR(S) without retry

READ SECTOR(S) EXT

READ DMA EXT

READ NATIVE MAX ADDRESS EXT

READ MULTIPLE EXT

READ LOG EXT

WRITE SECTOR(S)

WRITE SECTOR(S) without retry

WRITE SECTOR(S) EXT

WRITE DMA EXT

SET MAX ADDRESS EXT

WRITE MULTIPLE EXT

WRITE DMA FUA EXT

WRITE LOG EXT

READ VERIFY SECTOR(S)

READ VERIFY SECTOR(S) without retry

READ VERIFY SECTOR(S) EXT

WRITE UNCORRECTABLE EXT

SEEK

EXECUTE DEVICE DIAGNOSTIC

INITIALIZE DEVICE PARAMETERS

DOWNLOAD MICROCODE

SMART

B0h

D0h

D1h

D2h

D3h

D4h

D5h

SMART READ DATA

B0h

SMART READ ATTRIBUTE THRESHOLDS

SMART ENABLE/DISABLE ATTRIBUTE AUTOSAVE

SMART SAVE ATTRIBUTE VALUES

SMART EXECUTE OFF-LINE IMMEDIATE

SMART READ LOG

14

Solid State Drive SG2 Series Brochure Rev.1.1

Op-Code

Command Description

B0h

D6h

D8h

D9h

DAh

DBh

SMART WRITE LOG

B0h

SMART ENABLE OPERATIONS

SMART DISABLE OPERATIONS

SMART RETURN STATUS

SMART ENABLE/DISABLE AUTOMATIC OFF-LINE

DEVICE CONFIGURATION OVERLAY

DEVICE CONFIGURATION RESTORE

DEVICE CONFIGURATION FREEZE LOCK

DEVICE CONFIGURATION IDENTIFY

DEVICE CONFIGURATION SET

READ MULTILE

B1h

C0h

C1h

C2h

C3h

C4h

C5h

C6h

C8h

C9h

CAh

CBh

CEh

E0h

E1h

E2h

E3h

E4h

E5h

E6h

E7h

E8h

EAh

ECh

EFh

WRITE MULTIPLE

SET MULTIPLE MODE

READ DMA

READ DMA without retry

WRITE DMA

WRITE DMA without retry

WRITE MULTIPLE FUA EXT

STANDBY IMMEDIATE

IDLE IMMEDIATE

STANDBY

IDLE

READ BUFFER

CHECK POWER MODE

SLEEP

FLUSH CACHE

WRITE BUFFER

FLUSH CACHE EXT

IDENTIFY DEVICE

SET FEATURES

EFh

02h

03h

05h

10h

Enable volatile write cache

Set transfer mode

Enable APM feature set

Enable Serial ATA feature set

10h 03h

10h 06h

Enable DIPM transitions

Enable SSP

55h

Disable read look-ahead

15

Solid State Drive SG2 Series Brochure Rev.1.1

Op-Code

Command Description

EFh

5Fh

66h

82h

85h

90h

Enable DDT feature set

EFh

Disable reverting to P-On default

Disable volatile write cache

Disable APM feature set

Disable Serial ATA feature set

90h 03h

90h 06h

Disable DIPM

Disable SSP

AAh

CCh

DFh

Enable read look-ahead

Enable reverting to P-On default

Disable DDT feature set

SECURITY SET PASSWORD

SECURITY UNLOACK

F1h

F2h

F3h

F4h

F5h

F6h

F8h

F9h

SECURITY ERASE PREPARE

SECURITY ERASE UNIT

SECURITY FREEZE LOCK

SECURITY DISABLE PASSWORD

READ NATIVE MAX ADDRESS

SET MAX ADDRESS

F9h

01h

02h

03h

04h

SET MAX SET PASSWORD

SET MAX LOCK

SET MAX UNLOCK

SET MAX FREEZE LOCK

16

Solid State Drive SG2 Series Brochure Rev.1.1

10. Revision History

Rev.

Description

Revised and enlarged edition of “Solid State Drives SG2 Series Product Brief

Rev.01”

Date

1.0

1.1

Sep. 02, 2011

Changed the title of this document

Oct. 14, 2011

Changed into “-type” from “inch” in name of form factor

17

Solid State Drive SG2 Series Brochure Rev.1.1

RESTRICTIONS ON PRODUCT USE

•

Toshiba Corporation, and its subsidiaries and affiliates (collectively “TOSHIBA”), reserve the right to make changes to the information

in this document, and related hardware, software and systems (collectively “Product”) without notice.

This document and any information herein may not be reproduced without prior written permission from TOSHIBA. Even with

TOSHIBA’s written permission, reproduction is permissible only if reproduction is without alteration/omission.

Though TOSHIBA works continually to improve Product’s quality and reliability, Product can malfunction or fail. Customers are

responsible for complying with safety standards and for providing adequate designs and safeguards for their hardware, software and

systems which minimize risk and avoid situations in which a malfunction or failure of Product could cause loss of human life, bodily

injury or damage to property, including data loss or corruption. Before creating and producing designs and using, customers must also

refer to and comply with (a) the latest versions of all relevant TOSHIBA information, including without limitation, this document, the

specifications, the data sheets and application notes for Product and the precautions and conditions set forth in the “TOSHIBA

Semiconductor Reliability Handbook” and (b) the instructions for the application that Product will be used with or for. Customers are

solely responsible for all aspects of their own product design or applications, including but not limited to (a) determining the

appropriateness of the use of this Product in such design or applications; (b) evaluating and determining the applicability of any

information contained in this document, or in charts, diagrams, programs, algorithms, sample application circuits, or any other

referenced documents; and (c) validating all operating parameters for such designs and applications. TOSHIBA ASSUMES NO

LIABILITY FOR CUSTOMERS’ PRODUCT DESIGN OR APPLICATIONS.

•

Product is intended for use in general electronics applications (e.g., computers, personal equipment, office equipment, measuring

equipment, industrial robots and home electronics appliances) or for specific applications as expressly stated in this document.

Product is neither intended nor warranted for use in equipment or systems that require extraordinarily high levels of quality and/or

reliability and/or a malfunction or failure of which may cause loss of human life, bodily injury, serious property damage or serious public

impact (“Unintended Use”). Unintended Use includes, without limitation, equipment used in nuclear facilities, equipment used in the

aerospace industry, medical equipment, equipment used for automobiles, trains, ships and other transportation, traffic signaling

equipment, equipment used to control combustions or explosions, safety devices, elevators and escalators, devices related to electric

power, and equipment used in finance-related fields. Do not use Product for Unintended Use unless specifically permitted in this

document.

•

Do not disassemble, analyze, reverse-engineer, alter, modify, translate or copy Product, whether in whole or in part.

Product shall not be used for or incorporated into any products or systems whose manufacture, use, or sale is prohibited under any

applicable laws or regulations.

•

The information contained herein is presented only as guidance for Product use. No responsibility is assumed by TOSHIBA for any

infringement of patents or any other intellectual property rights of third parties that may result from the use of Product. No license to

any intellectual property right is granted by this document, whether express or implied, by estoppel or otherwise.

ABSENT A WRITTEN SIGNED AGREEMENT, EXCEPT AS PROVIDED IN THE RELEVANT TERMS AND CONDITIONS OF SALE

FOR PRODUCT, AND TO THE MAXIMUM EXTENT ALLOWABLE BY LAW, TOSHIBA (1) ASSUMES NO LIABILITY

WHATSOEVER, INCLUDING WITHOUT LIMITATION, INDIRECT, CONSEQUENTIAL, SPECIAL, OR INCIDENTAL DAMAGES OR

LOSS, INCLUDING WITHOUT LIMITATION, LOSS OF PROFITS, LOSS OF OPPORTUNITIES, BUSINESS INTERRUPTION AND

LOSS OF DATA, AND (2) DISCLAIMS ANY AND ALL EXPRESS OR IMPLIED WARRANTIES AND CONDITIONS RELATED TO

SALE, USE OF PRODUCT, OR INFORMATION, INCLUDING WARRANTIES OR CONDITIONS OF MERCHANTABILITY, FITNESS

FOR A PARTICULAR PURPOSE, ACCURACY OF INFORMATION, OR NONINFRINGEMENT.

• Do not use or otherwise make available Product or related software or technology for any military purposes, including without limitation,

for the design, development, use, stockpiling or manufacturing of nuclear, chemical, or biological weapons or missile technology

products (mass destruction weapons). Product and related software and technology may be controlled under the Japanese Foreign

Exchange and Foreign Trade Law and the U.S. Export Administration Regulations. Export and re-export of Product or related software

or technology are strictly prohibited except in compliance with all applicable export laws and regulations.

•

Product may include products subject to foreign exchange and foreign trade control laws.

Please contact your TOSHIBA sales representative for details as to environmental matters such as the RoHS compatibility of Product.

Please use Product in compliance with all applicable laws and regulations that regulate the inclusion or use of controlled substances,

including without limitation, the EU RoHS Directive. TOSHIBA assumes no liability for damages or losses occurring as a result of

noncompliance with applicable laws and regulations.

18


型号：	THNSNB062GBSJ
厂家：	TOSHIBA
描述：	IC FLASH MEMORY DRIVE CONTROLLER, XMA, Secondary Storage Controller
文件：	总18页 (文件大小：506K)
中文：	中文翻译
下载：	下载PDF数据表文档文件

THNSNB062GBSJ [TOSHIBA]

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