TK80A08K3 [TOSHIBA]

TRANSISTOR 80 A, 75 V, 0.0045 ohm, N-CHANNEL, Si, POWER, MOSFET, LEAD FREE, 2-10U1B, SC-67, 3 PIN, FET General Purpose Power;
TK80A08K3
型号: TK80A08K3
厂家: TOSHIBA    TOSHIBA
描述:

TRANSISTOR 80 A, 75 V, 0.0045 ohm, N-CHANNEL, Si, POWER, MOSFET, LEAD FREE, 2-10U1B, SC-67, 3 PIN, FET General Purpose Power

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TK80A08K3  
TOSHIBA Field Effect Transistor Silicon N Channel MOS Type (U-MOS)  
TK80A08K3  
Switching Regulator Applications  
Unit: mm  
Low drain-source ON-resistance: R  
= 3.6 mΩ (typ.)  
DS (ON)  
High forward transfer admittance: |Y | = 200 S  
fs  
Low leakage current: I  
= 10 μA (max) (V  
= 75 V)  
DSS  
DS  
Enhancement mode: V = 2.0 to 4.0 V (V  
= 10 V, I = 1 mA)  
D
th  
DS  
Absolute Maximum Ratings (Ta = 25°C)  
Characteristics  
Drain-source voltage  
Symbol  
Rating  
Unit  
V
75  
75  
V
V
V
DSS  
Drain-gate voltage (R  
Gate-source voltage  
= 20 kΩ)  
V
GS  
DGR  
V
± 20  
80  
GSS  
DC  
(Note 1)  
I
D
Drain current  
A
Pulse (Note 1)  
I
320  
40  
DP  
Drain power dissipation (Tc = 25°C)  
P
W
D
AS  
AR  
1: Gate  
2: Drain  
3: Source  
Single pulse avalanche energy  
E
443  
mJ  
(Note 2)  
Avalanche current  
I
80  
4
A
JEDEC  
JEITA  
-
Repetitive avalanche energy (Note 3)  
Channel temperature  
E
mJ  
°C  
°C  
AR  
SC-67  
2-10U1B  
T
150  
ch  
TOSHIBA  
Weight: 1.7 g (typ.)  
Storage temperature range  
T
55 to 150  
stg  
Note: Using continuously under heavy loads (e.g. the application of high temperature/current/voltage and the  
significant change in temperature, etc.) may cause this product to decrease in the reliability significantly even  
if the operating conditions (i.e. operating temperature/current/voltage, etc.) are within the absolute maximum  
ratings. Please design the appropriate reliability upon reviewing the Toshiba Semiconductor Reliability  
Handbook (“Handling Precautions”/’’Derating Concept and Methods’’) and individual reliability data (i.e.  
reliability test report and estimated failure rate, etc).  
Internal Connection  
Thermal Characteristics  
2
Characteristics  
Symbol  
Max  
Unit  
Thermal resistance, channel to case  
Thermal resistance, channel to ambient  
R
3.125  
62.5  
°C/W  
°C/W  
th (ch-c)  
R
th (ch-a)  
1
Note 1: Ensure that the channel and lead temperatures do not exceed 150°C.  
Note 2: = 25 V, T = 25°C, L = 100 μH, I = 80 A, R = 1 Ω  
V
DD  
ch  
AR  
G
Note 3: Repetitive rating: pulse width limited by maximum channel temperature  
This transistor is an electrostatic-sensitive device. Handle with care.  
3
1
2008-03-28  
TK80A08K3  
Electrical Characteristics (Ta = 25°C)  
Characteristics  
Gate leakage current  
Symbol  
Test Condition  
= ±20 V, V = 0 V  
Min  
Typ.  
Max  
Unit  
I
V
V
±1  
10  
μA  
μA  
GSS  
GS  
DS  
DS  
Drain cut-OFF current  
I
= 75 V, V  
= 0 V  
= 0 V  
DSS  
GS  
GS  
GS  
V
V
I
I
= 10 mA, V  
= 10 mA, V  
75  
55  
2.0  
(BR) DSS  
(BR) DSX  
D
D
Drain-source breakdown voltage  
V
= -20 V  
Gate threshold voltage  
V
V
V
V
= 10 V, I = 1 mA  
4.0  
4.5  
V
mΩ  
S
th  
DS  
GS  
DS  
D
Drain-source ON-resistance (Note 4)  
Forward transfer admittance  
Input capacitance  
R
= 10 V, I = 40A  
3.6  
200  
8200  
770  
1140  
DS (ON)  
Y ⎪  
D
= 10 V, I = 40 A  
100  
fs  
D
C
C
iss  
V
= 10V, V  
= 0 V, f = 1 MHz  
GS  
pF  
Reverse transfer capacitance  
Output capacitance  
DS  
rss  
C
oss  
Rise time  
t
r
30  
55  
10 V  
I = 40 A  
D
V
GS  
0 V  
V
OUT  
Turn-ON time  
Switching time  
t
on  
R
L
= 0.75 Ω  
ns  
Fall time  
t
f
33  
V
30 V  
DD  
Duty 1%, t = 10 μs  
w
Turn-OFF time  
t
150  
175  
off  
Total gate charge  
Qg  
(gate-source plus gate-drain)  
V
60 V, V  
= 10 V, I = 80A  
nC  
Gate-source charge 1  
Q
40  
65  
80  
DD  
GS  
D
gs1  
Gate-drain (“miller”) charge  
Gate switch charge  
Q
gd  
QSW  
Note 4: Measured at lead standoff.  
Source-Drain Ratings and Characteristics (Ta = 25°C)  
Characteristics  
Symbol  
Test Condition  
Min  
Typ.  
Max  
Unit  
Continuous drain reverse current (Note 1)  
I
80  
320  
1.2  
A
A
DR  
Pulse drain reverse current  
Forward voltage (diode)  
Reverse recovery time  
Reverse recovery charge  
(Note 1)  
I
DRP  
V
I
I
= 80 A, V  
= 80 A, V  
= 0 V  
0.9  
60  
V
DSF  
DR  
DR  
GS  
GS  
t
= 0 V,  
ns  
nC  
rr  
dI /dt = 50 A/μs  
Q
60  
DR  
rr  
Marking  
K80A08K  
3
Part No. (or abbreviation code)  
Lot No.  
A line indicates  
Lead (Pb)-Free Finish  
2
2008-03-28  
TK80A08K3  
I
– V  
I
– V  
DS  
D
DS  
D
300  
250  
200  
150  
100  
50  
50  
40  
Common source  
Tc = 25°C  
Pulse Test  
5
Common source  
Tc = 25°C  
Pulse Test  
10  
6
5.5  
4.8  
5.2  
10  
8
5.2  
5
8
5.5  
4.6  
6
30  
20  
4.8  
4.4  
4.2  
4.6  
4.4  
10  
0
4.2  
V
= 4 V  
GS  
V
= 4 V  
GS  
0
0
2
4
6
8
10  
0
0.2  
0.4  
0.6  
0.8  
1.0  
Drain-source voltage  
V
DS  
(V)  
Drain-source voltage  
V
DS  
(V)  
I
D
– V  
V
– V  
DS GS  
GS  
200  
160  
1
Common source  
Tc = 25°C  
Pulse Test  
Common source  
= 10 V  
V
DS  
Pulse Test  
0.8  
120  
80  
0.6  
0.4  
I
= 80 A  
D
25  
100  
40  
0
0.2  
0
40  
20  
Tc = −55°C  
0
2
4
6
8
10  
0
4
8
12  
16  
20  
Gate-source voltage  
V
GS  
(V)  
Gate-source voltage  
V
GS  
(V)  
|Y | – I  
fs  
R
– I  
DS (ON) D  
D
1000  
100  
10  
100  
10  
1
Common source  
= 10 V  
Common source  
Tc = 25°C  
25  
V
DS  
Pulse Test  
Pulse Test  
Tc = −55°C  
100  
V
= 10 V  
GS  
1
0.1  
1
10  
100  
1000  
1
10  
100  
1000  
Drain current  
I
(A)  
Drain current  
I
(A)  
D
D
3
2008-03-28  
TK80A08K3  
R
Tc  
I
V  
DS  
DS (ON)  
DR  
10  
8
1000  
Common source  
Tc = 25°C  
Pulse Test  
Common source  
= 10 V  
Pulse Test  
V
GS  
300  
100  
10  
40  
5
I
= 80 A  
D
20  
6
4
3
30  
10  
1
V
= 0  
GS  
2
0
3
1
80  
40  
0
40  
80  
120  
160  
100  
160  
0
0.4  
0.8  
1.2  
1.6  
2.0  
Case temperature Tc (°C)  
Drain-source voltage  
V
(V)  
DS  
Capacitance – V  
V
Tc  
th  
DS  
100000  
10000  
5
4
3
2
1
Common source  
= 10 V  
V
DS  
= 1mA  
I
D
Pulse Test  
C
iss  
1000  
100  
C
oss  
Common source  
V
= 0 V  
GS  
C
rss  
f =1MHz  
Tc = 25°C  
0
80  
0.1  
1
10  
40  
0
40  
80  
120  
160  
Drain-source voltage  
V
DS  
(V)  
Case temperature Tc (°C)  
Dynamic input / output  
characteristics  
P
Tc  
D
50  
40  
30  
100  
20  
Common source  
= 80 A  
Ta = 25°C  
I
D
Pulse Test  
80  
16  
12  
8
V
15  
DS  
60  
40  
30  
V
= 60V  
DD  
20  
10  
V
GS  
20  
0
4
0
0
0
40  
80  
120  
0
60  
120  
180  
240  
Case temperature Tc (°C)  
Total gate charge  
Q
(nC)  
g
4
2008-03-28  
TK80A08K3  
r
th  
– t  
w
10  
1
Duty=0.5  
0.2  
0.1  
0.1  
0.05  
P
DM  
SINGLE PULSE  
0.02  
t
0.01  
0.001  
T
0.01  
Duty = t/T  
R
= 3.125°C/W  
th (ch-c)  
10μ  
100μ  
1m  
10m  
100m  
1
10  
Pulse width  
t
(s)  
w
SAFE OPERATING AREA  
E
– T  
AS  
ch  
1000  
100  
10  
500  
400  
300  
200  
I
max (pulse) *  
D
100 μs *  
I
max (continuous)  
D
1 ms *  
DC OPEATION  
Tc = 25°C  
1
100  
0
Single pulse Ta = 25℃  
0.1  
0.01  
Curves must be derated  
linearly with increase in  
temperature.  
25  
50  
75  
100  
125  
150  
V
max  
DSS  
Channel temperature (initial)  
T
(°C)  
0.1  
10  
100  
1000  
1
ch  
Drain-source voltage  
V
DS  
(V)  
B
VDSS  
20 V  
I
AR  
0 V  
V
V
DD  
DS  
B
Test circuit  
Waveform  
1
2
2
R
V
= 1 Ω  
VDSS  
G
=
LI ⋅  
E
AS  
V
DD  
= 25 V, L = 100 μH  
B
VDSS  
DD  
5
2008-03-28  
TK80A08K3  
RESTRICTIONS ON PRODUCT USE  
20070701-EN GENERAL  
The information contained herein is subject to change without notice.  
TOSHIBA is continually working to improve the quality and reliability of its products. Nevertheless, semiconductor  
devices in general can malfunction or fail due to their inherent electrical sensitivity and vulnerability to physical  
stress. It is the responsibility of the buyer, when utilizing TOSHIBA products, to comply with the standards of  
safety in making a safe design for the entire system, and to avoid situations in which a malfunction or failure of  
such TOSHIBA products could cause loss of human life, bodily injury or damage to property.  
In developing your designs, please ensure that TOSHIBA products are used within specified operating ranges as  
set forth in the most recent TOSHIBA products specifications. Also, please keep in mind the precautions and  
conditions set forth in the “Handling Guide for Semiconductor Devices,” or “TOSHIBA Semiconductor Reliability  
Handbook” etc.  
The TOSHIBA products listed in this document are intended for usage in general electronics applications  
(computer, personal equipment, office equipment, measuring equipment, industrial robotics, domestic appliances,  
etc.).These TOSHIBA products are neither intended nor warranted for usage in equipment that requires  
extraordinarily high quality and/or reliability or a malfunction or failure of which may cause loss of human life or  
bodily injury (“Unintended Usage”). Unintended Usage include atomic energy control instruments, airplane or  
spaceship instruments, transportation instruments, traffic signal instruments, combustion control instruments,  
medical instruments, all types of safety devices, etc.. Unintended Usage of TOSHIBA products listed in his  
document shall be made at the customer’s own risk.  
The products described in this document shall not be used or embedded to any downstream products of which  
manufacture, use and/or sale are prohibited under any applicable laws and regulations.  
The information contained herein is presented only as a guide for the applications of our products. No  
responsibility is assumed by TOSHIBA for any infringements of patents or other rights of the third parties which  
may result from its use. No license is granted by implication or otherwise under any patents or other rights of  
TOSHIBA or the third parties.  
Please contact your sales representative for product-by-product details in this document regarding RoHS  
compatibility. Please use these products in this document in compliance with all applicable laws and regulations  
that regulate the inclusion or use of controlled substances. Toshiba assumes no liability for damage or losses  
occurring as a result of noncompliance with applicable laws and regulations.  
6
2008-03-28  

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