TLOU172P [TOSHIBA]
Panel Circuit Indicator; 面板指示灯电路![TLOU172P](http://pdffile.icpdf.com/pdf1/p00119/img/icpdf/TLOU172P_653556_icpdf.jpg)
型号: | TLOU172P |
厂家: | ![]() |
描述: | Panel Circuit Indicator |
文件: | 总4页 (文件大小:203K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
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TLOU172P(F)
TOSHIBA LED Lamp InGaAℓP Orange Light Emission
TLOU172P(F)
Panel Circuit Indicator
Unit in mm
•
•
•
•
•
•
•
•
Lead(Pb)-free products (lead: Sn-Ag-Cu)
5mm package
InGaAℓP orange LED
Colored transparent lens
Low drive current, high intensity orange light emission
All plastic molded lens, provides an excellent on−off contrast ratio.
Fast response time, capable of pulse operation.
Without stand−offs
Absolute Maximum Ratings (Ta = 25°C)
Characteristic
Forward current (DC)
Symbol
Rating
Unit
I
30
4
mA
V
F
Reverse voltage
V
P
R
D
JEDEC
JEITA
―
―
Power dissipation
72
mW
°C
Operating temperature range
Storage temperature range
T
opr
−30~85
−40~120
TOSHIBA
4-5AH2
T
stg
°C
Weight: 0.31 g(Typ.)
Note: Using continuously under heavy loads (e.g. the application of high
temperature/current/voltage and the significant change in temperature, etc.) may cause this product to
decrease in the reliability significantly even if the operating conditions (i.e. operating
temperature/current/voltage, etc.) are within the absolute maximum ratings.
Please design the appropriate reliability upon reviewing the Toshiba Semiconductor Reliability Handbook
(“Handling Precautions”/“Derating Concept and Methods”) and individual reliability data (i.e. reliability test
report and estimated failure rate, etc).
1
2007-10-01
TLOU172P(F)
Electrical Characteristics (Ta = 25°C)
Characteristic
Forward voltage
Symbol
Test Condition
Min
Typ.
Max
Unit
V
IF = 20mA
= 4V
―
2.0
―
2.4
50
―
―
―
―
V
F
Reverse current
I
V
―
μA
R
R
Luminous intensity
I
IF = 20mA
(Note) 476
1200
(612)
15
mcd
nm
nm
nm
V
Peak emission wavelength
Spectral line half width
Dominant wavelength
λ
I
F
I
F
I
F
= 20mA
= 20mA
= 20mA
―
―
―
p
Δλ
λ
605
d
Note): Lamps are classified into the following ranks according to their luminous intensity. Each packing box includes
single Luminous Intensity class.
R:476-1290mcd, S:850-2300mcd, T:1530 mcd -
Precaution
Please be careful of the followings
•
•
•
Soldering temperature: 260°C max
(Soldering portion of lead: Up to 1.6mm from the body of the device)
Soldering time: 3s max
If the lead is formed, the lead should be formed up to 1.6mm from the body of the device without forming stress
to the resin. Soldering should be performed after lead forming.
This visible LED lamp also emits some IR light. If a photodetector is located near the LED lamp, please ensure
that it will not be affected by this IR light.
2
2007-10-01
TLOU172P(F)
I
– V
I – I
V F
F
F
100
50
2000
1000
500
Ta = 25°C
Ta = 25°C
20
10
5
200
100
50
20
2
1
1
2
5
10
20
50
100
1.6
1.8
2.0
2.2
V
2.4
2.6
Forward voltage
(V)
Forward current
I
F
(mA)
F
Relative Luminous Intensity –
Wavelength
I
V
– Tc
10
5
1.0
0.8
0.6
I
= 20mA
F
Ta = 25°C
2
1
0.4
0.2
0
0.5
0.2
0.1
75
100
640
660
−25
0
25
50
600
620
540
560
580
Case temperature Tc (°C)
Wavelength
λ
(nm)
Radiation Pattern
I – Ta
F
40
Ta = 25°C
30
0°
10°
10°
20°
20°
30°
30°
40°
40°
20
10
0
50°
60°
70°
80°
90°
50°
60°
70°
80°
90°
1.0
0
0.2
0.4 0.6
0.8
0
20
40
60
80
100
Ambient temperature Ta (°C)
3
2007-10-01
TLOU172P(F)
RESTRICTIONS ON PRODUCT USE
20070701-EN
• The information contained herein is subject to change without notice.
• TOSHIBA is continually working to improve the quality and reliability of its products. Nevertheless, semiconductor
devices in general can malfunction or fail due to their inherent electrical sensitivity and vulnerability to physical
stress. It is the responsibility of the buyer, when utilizing TOSHIBA products, to comply with the standards of
safety in making a safe design for the entire system, and to avoid situations in which a malfunction or failure of
such TOSHIBA products could cause loss of human life, bodily injury or damage to property.
In developing your designs, please ensure that TOSHIBA products are used within specified operating ranges as
set forth in the most recent TOSHIBA products specifications. Also, please keep in mind the precautions and
conditions set forth in the “Handling Guide for Semiconductor Devices,” or “TOSHIBA Semiconductor Reliability
Handbook” etc.
• The TOSHIBA products listed in this document are intended for usage in general electronics applications
(computer, personal equipment, office equipment, measuring equipment, industrial robotics, domestic appliances,
etc.).These TOSHIBA products are neither intended nor warranted for usage in equipment that requires
extraordinarily high quality and/or reliability or a malfunction or failure of which may cause loss of human life or
bodily injury (“Unintended Usage”). Unintended Usage include atomic energy control instruments, airplane or
spaceship instruments, transportation instruments, traffic signal instruments, combustion control instruments,
medical instruments, all types of safety devices, etc.. Unintended Usage of TOSHIBA products listed in his
document shall be made at the customer’s own risk.
• The products described in this document shall not be used or embedded to any downstream products of which
manufacture, use and/or sale are prohibited under any applicable laws and regulations.
• The information contained herein is presented only as a guide for the applications of our products. No
responsibility is assumed by TOSHIBA for any infringements of patents or other rights of the third parties which
may result from its use. No license is granted by implication or otherwise under any patents or other rights of
TOSHIBA or the third parties.
• GaAs(Gallium Arsenide) is used in this product. The dust or vapor is harmful to the human body. Do not break,
cut, crush or dissolve chemically.
• Please contact your sales representative for product-by-product details in this document regarding RoHS
compatibility. Please use these products in this document in compliance with all applicable laws and regulations
that regulate the inclusion or use of controlled substances. Toshiba assumes no liability for damage or losses
occurring as a result of noncompliance with applicable laws and regulations.
4
2007-10-01
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