TLP116A(V4,E) [TOSHIBA]
Logic IC Output Optocoupler;
| 型号： | TLP116A(V4,E) |
| 厂家： | 
TOSHIBA |
| 描述： | Logic IC Output Optocoupler |
| 文件： | 总10页 (文件大小：461K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
TLP116A
TOSHIBA PHOTOCOUPLER GaAℓAs IRED & PHOTO-IC
TLP116A
Plasma Display Panels (PDPs)
High-Speed Interface
Unit: mm
Factory Automation (FA)
6
4
The Toshiba TLP116A mini-flat coupler is a small-outline coupler suitable for
surface-mount assembly. The TLP116A consists of a GaAℓAs light-emitting
diode and an integrated high-gain, high-speed photodetector. This unit is
housed in the 6-pin SO package and guarantees a creepage distance of ≥
5.0mm, a clearance of ≥ 5.0mm and an insulation thickness of ≥ 0.4mm.
Therefore, the TLP116A meets the reinforced insulation class requirements of
international safety standards.
3
1
3.7 ± 0.15
7.0 ± 0.4
Inverter logic (totem-pole output)
SO6 package
0.4
0.5 min
1.27
2.54
Guaranteed performance over: −40 to 100°C
Power supply voltage: 4.5 to 5.5V
TOSHIBA
11−4L1
Input thresholds current: I
= 5 mA (max)
Weight: 0.08 g (typ.)
FHL
Propagation delay time (tpHL / tpLH): 60 ns (max)
Switching speed: 20 MBd (typ.)
Pin Configuration (Top View)
1: ANODE
1
3
6
5
4
VCC
Common-mode transient immunity: 10 kV/μs
Isolation voltage: 3750 Vrms
3: CATHODE
4: GND
UL approval: UL1577, File No.E67349 Under application
cUL approved :CSA Component Acceptance Service
No. 5A, File No.E67349
5: V (Output)
O
GND
6: V
CC
SHIELD
CQC approved:GB4943.1,GB8898 Japan Factory
仅适用干海拔 2000m以下地区安全使用
Option (V4) VDE approved : DIN EN60747-5-5 ,EN60065,EN60950-1 (Note1)
EN62368-1(Pending) (Note1)
Schematic
Note 1 : When a EN60747-5-5 approved type is needed,
ICC
VCC
please designate “Option(V4)”
6
IF
Tr1
Tr2
1＋
Truth Table
IO
5
V
F
Input
H
LED
ON
Tr1
Tr2
Output
VO
3－
OFF ON
ON OFF
L
OFF
H
L
GND
4
SHIELD
Construction Mechanical Rating
Creepage Distance: 5.0mm (min)
Clearance: 5.0mm (min)
Insulation Thickness: 0.4mm (min)
A bypass capacitor of 0.1μF must be
connected between pins 6 and 4.
Start of commercial production
2008-07
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TLP116A
Absolute Maximum Ratings (Ta=25°C)
Characteristic
Symbol
Rating
Unit
Forward current
I
20
mA
mA/°C
A
F
Forward current derating (Ta ≥ 85°C)
Peak transient forward current (Note 1)
Reverse voltage
ΔI / °C
F
−0.5
I
1
FPT
V
5
V
R
Input power dissipation
PD
ΔPD/°C
40
mW
mW/°C
mA
mA/°C
V
Input power dissipation derating (Ta ≥ 85°C)
Output current
-1.0
I
10
-0.25
6
O
Output current derating (Ta ≥ 85°C)
Output voltage
ΔIO/°C
V
O
Supply voltage
V
6
V
CC
Output power dissipation
Operating temperature range
Storage temperature range
Lead solder temperature(10 s)
P
40
mW
°C
O
Topr
Tstg
Tsol
BVs
−40 to 100
−55 to 125
260
°C
°C
Isolation voltage (AC,60 s, R.H. ≤ 60%)
(Note 2)
3750
Vrms
Note:
Using continuously under heavy loads (e.g. the application of high temperature/current/voltage and the
significant change in temperature, etc.) may cause this product to decrease in the reliability significantly even
if the operating conditions (i.e. operating temperature/current/voltage, etc.) are within the absolute maximum
ratings and the operating ranges. Please design the appropriate reliability upon reviewing the Toshiba
Semiconductor Reliability Handbook (“Handling Precautions”/“Derating Concept and Methods”) and
individual reliability data (i.e. reliability test report and estimated failure rate, etc).
Note 1 : Pulse width PW ≤ 1μs, 300 pps.
Note 2 :This device is regarded as a two terminal device : pins 1 and 3 are shorted together, as are pins 4,5 and 6.
Recommended Operating Conditions
Characteristic
Input current ON
Symbol
Min
8
Typ.
—
Max
18
Unit
mA
V
I
F(ON)
—
Input voltage , OFF
Supply voltage
V
0
0.8
5.5
100
F(OFF)
V
CC
Topr
4.5
-40
5.0
—
V
Operating temperature
°C
Note: Recommended operating conditions are given as a design guideline to obtain expected performance of the
device. Additionally, each item is an independent guideline respectively. In developing designs using this
product, please confirm specified characteristics shown in this document.
Note:
The detector of this product requires a power supply voltage (V ) of 4.5 V or higher for stable operation.
CC
If the V
is lower than this value, an I
may increase, or an output may be unstable.
CC
CC
Be sure to use the product after checking the supply current, and the operation of a power-on/-off.
Correlation between Input current, switching speed and drive circuit
(reference information).
Input current
Test Circuit
Typical switching speed
(IF)
1
12mA
21 to 23 MBd
18 to 20 MBd
23 to 27 MBd
(Page 4)
1
8mA
8mA
(Page 4)
2
(Page 4, With Speed up capacitor)
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2017-05-26
TLP116A
Electrical Characteristics
(Unless otherwise specified, Ta=-40 to 100°C, VCC=4.5 to 5.5 V )
Test
Circuit
Characteristic
Symbol
Conditions
Min
1.45
—
Typ.
1.58
Max
1.85
Unit
V
—
Input forward voltage
V
I
I
= 10 mA ,Ta = 25°C
F
F
F
Temperature coefficient
of forward voltage
—
—
ΔV /ΔTa
= 10 mA
-2.0
—
mV/°C
μA
F
—
—
—
Input reverse current
I
V =5 V, Ta = 25°C
10
R
R
Capacitance between Input
terminals
—
1
60
—
—
C
T
V
= 0 V, f= 1 MHz, Ta = 25°C
—
0.4
—
pF
V
F
I
I
I
= 1.6 mA,
OL
—
Logic low output voltage
Logic high output voltage
V
OL
= 12 mA, V
= 5 V
= 5 V
F
CC
= −0.02 mA,
OH
V
2
4.0
—
—
—
0.8
V
OH
V
= 1.05 V, V
CC
F
—
—
—
—
Logic low supply current
Logic high supply current
I
3
4
I
= 12 mA
F
5.0
5.0
5
mA
mA
mA
CCL
I
V = 0 V
F
CCH
Input current logic low
output
—
I
I
I
= 1.6 mA, V < 0.4 V
O O
FHL
Input voltage logic high
output
—
—
V
= -0.02 mA, V > 4.0 V
V
FLH
O
O
*All typical values are at Ta=25°C, V =5 V, I (ON)=12 mA unless otherwise specified
CC
F
Isolation Characteristics (Ta = 25°C)
Characteristic
Symbol
Test Conditions
Vs = 0 V,f = 1 MHz
Min
Typ.
0.8
Max
Unit
Capacitance input to output
Isolation resistance
C
R
(Note 1)
―
―
pF
S
12
14
R.H. ≤ 60%, V = 500 V
S
(Note 1) 1×10
10
―
―
―
―
Ω
S
AC, 60 s
3750
―
―
V
rms
Isolation voltage
BV
AC, 1 s, in oil
DC, 60 s, in oil
10000
10000
S
―
Vdc
Note 1:A ceramic capacitor(0.1 μF) should be connected from pin 6 to pin 4 to stabilize the operation of the high
gain linear amplifier. Failure to provide the bypass may impair the switching property.
The total lead length between capacitor and coupler should not exceed 1 cm.
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TLP116A
Switching Characteristics
(Unless otherwise specified, Ta=-40 to 100°C, V =4.5 to 5.5 V)
CC
Test
Circuit
Characteristic
Symbol
tpHL
Conditions
Min
Typ.
Max
60
Unit
ns
Propagation delay time
to logic high output
I
I
= 0→12 mA
—
—
R
C
= 100 Ω
F
F
IN
= 15 pF
5
L
Propagation delay time
to logic low output
(Note 1)
= 12→0 mA
= 0→5 V
—
—
—
—
—
—
—
—
tpLH
tpHL
tpLH
60
60
60
30
ns
ns
ns
ns
Propagation delay time
to logic high output
V
IN
R
C
C
= 470 Ω
IN
(I = 0→8 mA)
F
27 pF
IN =
6
5
= 15 pF
L
Propagation delay time
to logic low output
V
= 5→0 V
IN
(Note 1)
(I = 8→0 mA)
F
Switching time dispersion
between ON and OFF
|tpHL-
tpLH|
I
= 12 mA , R = 100 Ω,
IN
F
CL =v15 pF (Note 1)
R
C
= 100 Ω
I
= 0→12 mA
= 12→0 mA
IN
—
—
—
—
Output fall time(90-10%)
Output rise time(10-90%)
tf
15
15
ns
ns
F
F
= 15 pF
L
I
tr
(Note 1)
Common mode transient
immunity at high Level
output
V
= 1000 Vp-p, I = 0 mA,
F
CM
Vo(Min) = 4 V, Ta = 25°C
—
—
—
—
CM
10000
V/μs
V/μs
H
7
Common mode transient
immunity at low level
output
V
= 1000 Vp-p, I = 12 mA,
F
CM
Vo(Max) = 0.4 V, Ta = 25°C
CM
-10000
L
*All typical values are at Ta=25°C
Note 1: C is approximately 15 pF which includes probe and Jig/stray wiring capacitance.
L
TEST CIRCUIT 1: V
TEST CIRCUIT 2: V
OH
OL
I
→
F
6
1
6
5
4
1
V
V
CC
CC
VO
IOH
0.1 μF
↑
V
5
4
VCC
↑
VCC
0.1 μF
IOL
VOL
3
3
GND
GND
↑
V
SHIELD
SHIELD
V
= V
- V
CC O
OH
TEST CIRCUIT 3: I
CCL
TEST CIRCUIT 4: I
CCH
I
F
→
ICCH
ICCL
1
1
6
6
V
A
A
V
CC
CC
0.1 μF
0.1 μF
5
4
5
4
VCC
VCC
↑
3
3
GND
GND
SHIELD
SHIELD
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2017-05-26
TLP116A
TEST CIRCUIT 5: tpHL, tpLH
I = 12 mA(P.G)
F
(f = 5 MHz , duty = 50%
less than tr = tf = 5 ns)
50%
VCC
GND
I
F
0.1 μF
Vo
tf
INPUT
MONITORING
NODE
tr
MONITORING
NODE
VO
VCC
V
90%
CL = 15 pF
SHIELD
=100 Ω
CL=15 pF
R
1.5 V
IN
10%
L
tpLH
tpHL
CL is capacitance of the probe and JIG.
(P.G): Pulse Generator
TEST CIRCUIT 6: tpHL, tpLH
INPUT MONITORING NODE
V
= 5 V(P.G)
IN
(f = 5 MHz , duty = 50%
less than tr = tf = 5 ns)
VCC
50%
0.1 μF
CL=15 pF
Vo
I
MONITORING
NODE
F
VCC
tf
tr
VO
GND
CL=15 pF
V
90%
SHIELD
=470 Ω
CIN=27 pF
R
IN
1.5 V
10%
L
tpLH
CL is capacitance of the probe and JIG.
(P.G): Pulse Generator
tpHL
TEST CIRCUIT 7: Common-Mode Transient Immunity Test Circuit
90%
1000 V
I
6
F
→
1
3
SW
10%
V
CC
tr
tf
A
0.1 μF
VO
B
5
4
・SW B : I =0 mA
F
VCC
CMH
CML
GND
4V
SHIELD
VCM
0.4 V
・SW A : I =12 mA
F
800(V )
800(V )
CM
=
CM
=
H
L
(µs)
t
(µs)
t
r
f
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2017-05-26
TLP116A
Soldering and Storage
1. Precautions for Soldering
The soldering temperature should be controlled as closely as possible to the conditions shown
below, irrespectiveof whether a soldering iron or a reflow soldering method is used.
1) When Using Soldering Reflow
An example of a temperature profile when lead(Pb)-free solder is used.
The soldering temperature profile is based on the package surface temperature
(See the figure shown above.)
Reflow soldering must be performed once or twice.
The mounting should be completed with the interval from the first to the last mountings being 2 weeks.
2) When using soldering Flow
Preheat the device at a temperature of 150 °C (package surface temperature) for 60 to 120 seconds.
Mounting condition of 260 °C within 10 seconds is recommended
Flow soldering must be performed once.
3) When using soldering Iron
Complete soldering within 10 seconds for lead temperature not exceeding 260 °C or within 3 seconds not
exceeding 350 °C.
Heating by soldering iron must be done only once per lead.
2. Precautions for General Storage
1) Avoid storage locations where devices may be exposed to moisture or direct sunlight.
2) Follow the precautions printed on the packing label of the device for transportation and storage.
3) Keep the storage location temperature and humidity within a range of 5°C to 35°C and 45% to 75%,
respectively.
4) Do not store the products in locations with poisonous gases (especially corrosive gases) or in dusty
conditions.
5) Store the products in locations with minimal temperature fluctuations. Rapid temperature changes during
storage can cause condensation, resulting in lead oxidation or corrosion, which will deteriorate the
solderability of the leads.
6) When restoring devices after removal from their packing, use anti-static containers.
7) Do not allow loads to be applied directly to devices while they are in storage.
8) If devices have been stored for more than two years under normal storage conditions, it is recommended
that you check the leads for ease of soldering prior to use.
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TLP116A
Specification for Embossed–Tape Packing (TPL)(TPR) for SO6 Coupler
1. Applicable Package
Package
SO6
Product Type
Mini-flat coupler
2. Product Naming System
Type of package used for shipment is denoted by a symbol suffix after a product number. The method of
classification is as below.
(Example)
TLP116A(TPL,E)
[[G]]/RoHS COMPATIBLE(Note)
Tape type
Device name
3. Tape Dimensions
3.1 Specification Classification Are as Shown in Table 1
Table 1 Tape Type Classification
Quantity
Tape type
Classification
(pcs/reel)
TPL
TPR
L direction
R direction
3000
3000
3.2 Orientation of Device in Relation to Direction of Tape Movement
Device orientation in the recesses is as shown in Figure 1.
Direction of Tape
L direction
R direction
Figure 1 Device Orientation
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2017-05-26
TLP116A
3.3 Empty Device Recesses Are as Shown in Table 2.
Table 2 Empty Device Recesses
Standard
0 device
Remarks
Occurrences of 2 or more
successive empty device
recesses
Within any given 40-mm section of
tape, not including leader and trailer
Single empty device
recesses
6 devices (max.) per reel
Not including leader and trailer
3.4 Start and End of Tape
The start of the tape has 50 or more empty holes. The end of tape has 50 or more empty holes and two empty
turns only for a cover tape.
3.5 Tape Specification
(1) Tape material: Plastic (protection against electrostatics)
(2) Dimensions: The tape dimensions are as shown in Figure 2 and Table 3.
0.3 ± 0.05
+0.1
−0
φ1.5
G
A
K
0
F
φ1.6 ± 0.1
3.15 ± 0.2
Figure 2 Tape Forms
Table 3 Tape Dimensions
Unit: mm
Unless otherwise specified: ±0.1
Symbol
Dimension
Remark
A
B
D
E
F
4.2
7.6
5.5
1.75
8.0
4.0
2.8
―
―
Center line of indented square hole and sprocket hole
Distance between tape edge and hole center
+0.1
Cumulative error
Cumulative error
Internal space
(max) per 10 feed holes
(max) per 10 feed holes
-0.3
+0.1
-0.3
G
K
0
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2017-05-26
TLP116A
3.6 Reel
(1) Material: Plastic
(2) Dimensions: The reel dimensions are as shown in Figure 3 and Table 4.
U
E
W1
W2
Figure 3 Reel Form
Table 4 Reel Dimensions
Unit: mm
Symbol
Dimension
A
B
Φ330 ±2
Φ80 ±1
C
Φ13 ±0.5
2.0 ±0.5
4.0 ±0.5
13.5 ±0.5
17.5 ±1.0
E
U
W1
W2
4. Packing
Either one reel or five reels of photocoupler are packed in a shipping carton.
5. Label Indication
The carton bears a label indicating the product number, the symbol representing classification of standard,
the quantity, the lot number and the Toshiba company name.
6. Ordering Method
When placing an order, please specify the product number, the tape type and the quantity as shown in the
following example.
(Example)
TLP116A (TPL,E) 3000 pcs
Quantity (must be a multiple of 3000)
[[G]]/RoHS COMPATIBLE(Note)
Tape type
Device name
Note : Please contact your TOSHIBA sales representative for details as to environmental matters such as the RoHS
compatibility of Product.
The RoHS is the Directive 2011/65/EU of the European Parliament and of the Council of 8 June 2011 on
the restriction of the use of certain hazardous substances in electrical and electronic equipment.
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TLP116A
RESTRICTIONS ON PRODUCT USE
•
•
•
Toshiba Corporation, and its subsidiaries and affiliates (collectively "TOSHIBA"), reserve the right to make changes to the information
in this document, and related hardware, software and systems (collectively "Product") without notice.
This document and any information herein may not be reproduced without prior written permission from TOSHIBA. Even with
TOSHIBA's written permission, reproduction is permissible only if reproduction is without alteration/omission.
Though TOSHIBA works continually to improve Product's quality and reliability, Product can malfunction or fail. Customers are
responsible for complying with safety standards and for providing adequate designs and safeguards for their hardware, software and
systems which minimize risk and avoid situations in which a malfunction or failure of Product could cause loss of human life, bodily
injury or damage to property, including data loss or corruption. Before customers use the Product, create designs including the Product,
or incorporate the Product into their own applications, customers must also refer to and comply with (a) the latest versions of all
relevant TOSHIBA information, including without limitation, this document, the specifications, the data sheets and application notes for
Product and the precautions and conditions set forth in the "TOSHIBA Semiconductor Reliability Handbook" and (b) the instructions for
the application with which the Product will be used with or for. Customers are solely responsible for all aspects of their own product
design or applications, including but not limited to (a) determining the appropriateness of the use of this Product in such design or
applications; (b) evaluating and determining the applicability of any information contained in this document, or in charts, diagrams,
programs, algorithms, sample application circuits, or any other referenced documents; and (c) validating all operating parameters for
such designs and applications. TOSHIBA ASSUMES NO LIABILITY FOR CUSTOMERS' PRODUCT DESIGN OR APPLICATIONS.
•
PRODUCT IS NEITHER INTENDED NOR WARRANTED FOR USE IN EQUIPMENTS OR SYSTEMS THAT REQUIRE
EXTRAORDINARILY HIGH LEVELS OF QUALITY AND/OR RELIABILITY, AND/OR A MALFUNCTION OR FAILURE OF WHICH
MAY CAUSE LOSS OF HUMAN LIFE, BODILY INJURY, SERIOUS PROPERTY DAMAGE AND/OR SERIOUS PUBLIC IMPACT
("UNINTENDED USE"). Except for specific applications as expressly stated in this document, Unintended Use includes, without
limitation, equipment used in nuclear facilities, equipment used in the aerospace industry, medical equipment, equipment used for
automobiles, trains, ships and other transportation, traffic signaling equipment, equipment used to control combustions or explosions,
safety devices, elevators and escalators, devices related to electric power, and equipment used in finance-related fields. IF YOU USE
PRODUCT FOR UNINTENDED USE, TOSHIBA ASSUMES NO LIABILITY FOR PRODUCT. For details, please contact your
TOSHIBA sales representative.
•
•
Do not disassemble, analyze, reverse-engineer, alter, modify, translate or copy Product, whether in whole or in part.
Product shall not be used for or incorporated into any products or systems whose manufacture, use, or sale is prohibited under any
applicable laws or regulations.
•
•
The information contained herein is presented only as guidance for Product use. No responsibility is assumed by TOSHIBA for any
infringement of patents or any other intellectual property rights of third parties that may result from the use of Product. No license to
any intellectual property right is granted by this document, whether express or implied, by estoppel or otherwise.
ABSENT A WRITTEN SIGNED AGREEMENT, EXCEPT AS PROVIDED IN THE RELEVANT TERMS AND CONDITIONS OF SALE
FOR PRODUCT, AND TO THE MAXIMUM EXTENT ALLOWABLE BY LAW, TOSHIBA (1) ASSUMES NO LIABILITY
WHATSOEVER, INCLUDING WITHOUT LIMITATION, INDIRECT, CONSEQUENTIAL, SPECIAL, OR INCIDENTAL DAMAGES OR
LOSS, INCLUDING WITHOUT LIMITATION, LOSS OF PROFITS, LOSS OF OPPORTUNITIES, BUSINESS INTERRUPTION AND
LOSS OF DATA, AND (2) DISCLAIMS ANY AND ALL EXPRESS OR IMPLIED WARRANTIES AND CONDITIONS RELATED TO
SALE, USE OF PRODUCT, OR INFORMATION, INCLUDING WARRANTIES OR CONDITIONS OF MERCHANTABILITY, FITNESS
FOR A PARTICULAR PURPOSE, ACCURACY OF INFORMATION, OR NONINFRINGEMENT.
• GaAs (Gallium Arsenide) is used in Product. GaAs is harmful to humans if consumed or absorbed, whether in the form of dust or vapor.
Handle with care and do not break, cut, crush, grind, dissolve chemically or otherwise expose GaAs in Product.
• Do not use or otherwise make available Product or related software or technology for any military purposes, including without limitation,
for the design, development, use, stockpiling or manufacturing of nuclear, chemical, or biological weapons or missile technology
products (mass destruction weapons). Product and related software and technology may be controlled under the applicable export
laws and regulations including, without limitation, the Japanese Foreign Exchange and Foreign Trade Law and the U.S. Export
Administration Regulations. Export and re-export of Product or related software or technology are strictly prohibited except in
compliance with all applicable export laws and regulations.
•
Please contact your TOSHIBA sales representative for details as to environmental matters such as the RoHS compatibility of Product.
Please use Product in compliance with all applicable laws and regulations that regulate the inclusion or use of controlled substances,
including without limitation, the EU RoHS Directive. TOSHIBA ASSUMES NO LIABILITY FOR DAMAGES OR LOSSES
OCCURRING AS A RESULT OF NONCOMPLIANCE WITH APPLICABLE LAWS AND REGULATIONS.
10
2017-05-26
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