TLP173A(TPR) [TOSHIBA]
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| 型号： | TLP173A(TPR) |
| 厂家： | 
TOSHIBA |
| 描述： | 暂无描述 光电 继电器 固态继电器 输出元件 通信 |
| 文件： | 总10页 (文件大小：249K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
TLP173A
TOSHIBA Photocoupler Photorelay
TLP173A
Telecommunications
Control Equipment
Unit: mm
Data Acquisition System
Security Equipment
Measurement Equipment
The Toshiba TLP173A consists of a gallium arsenide infrared emitting
diode optically coupled to a photo-MOSFET in a MFSOP6 package.
This photorelay requires 2mA of LED current to turn it on. It is suitable
for applications that need electrical power savings.
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4-pin SOP (MFSOP6): Height = 2.5 mm, pitch = 2.54 mm
Normally open (1-Form-A) device
Peak off-state voltage: 60 V (min)
Trigger LED current: 2 mA (max)
On-state current: 70 mA (max)
On-state resistance: 50 Ω (max)
JEDEC
JEITA
―
―
Isolation voltage: 3750 Vrms (min)
UL (pending approval) : UL1577, File No.E67349
c-UL (pending approval)
TOSHIBA
11-4C1
CSA Component Acceptance Service No. 5A File No.E67349
BSI (pending approval):
Weight: 0.09 g (typ.)
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SEMKO (pending approval):
Option (V4) type
VDE (pending approval):
Maximum operating insulation voltage: 565Vpk
Highest permissible over voltage: 6000Vpk
Pin Configuration (top view)
Internal Circuit
1
3
6
4
1
3
6
4
1: Anode
3: Cathode
4: Drain
6: Drain
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TLP173A
Absolute Maximum Rating (Ta = 25°C)
Characteristics
Symbol
Rating
Unit
Forward current
I
50
−0.5
5
mA
mA/°C
V
F
Forward current derating (Ta ≥ 25°C)
Reverse voltage
ΔI /°C
F
V
R
LED
Pulse forward current
I
1
A
FP
(100 μs pulse, 100 pps)
Junction temperature
T
125
60
°C
V
j
Off-state output terminal voltage
V
I
OFF
ON
On-state current
Detector
70
mA
mA/°C
°C
Forward current derating (Ta ≥ 25°C)
ΔI /°C
ON
−0.7
Junction temperature
Storage temperature
T
125
j
T
−55 to 125
−40 to 85
260
°C
stg
opr
Operating temperature
T
°C
Lead soldering temperature (10 s)
Isolation voltage (AC, 1 min, R.H. ≤ 60%) (Note 1)
T
sol
°C
BV
3750
Vrms
S
Note: Using continuously under heavy loads (e.g. the application of high temperature/current/voltage and the
significant change in temperature, etc.) may cause this product to decrease in the reliability significantly even if
the operating conditions (i.e. operating temperature/current/voltage, etc.) are within the absolute maximum ratings.
Please design the appropriate reliability upon reviewing the Toshiba Semiconductor Reliability Handbook
(“Handling Precautions”/“Derating Concept and Methods”) and individual reliability data (i.e. reliability test report
and estimated failure rate, etc).
Note: This product is more sensitive than conventional products to electrostatic discharge (ESD). It is therefore all
the more necessary to observe general precautions regarding ESD when handling this component.
Note 1: LED pins are shorted together. Detector pins are also shorted together.
Recommended Operating Conditions
Characteristics
Supply voltage
Symbol
Min
Typ.
Max
Unit
V
⎯
⎯
⎯
3
48
25
60
65
V
DD
Forward current
I
mA
mA
°C
F
On-state current
I
⎯
⎯
⎯
ON
Operating temperature
T
opr
−20
Note: Recommended operating conditions are given as a design guideline to obtain expected performance of the
device. Additionally, each item is an independent guideline respectively. In developing designs using this
product, please confirm specified characteristics shown in this document.
Electrical Characteristics (Ta = 25°C)
Characteristics
Symbol
Test Condition
= 10 mA
F
Min
Typ.
Max
Unit
Forward voltage
Reverse current
Capacitance
V
I
1.0
⎯
⎯
⎯
⎯
1.15
⎯
1.3
10
V
F
LED
I
V
= 5 V
R
μA
pF
nA
pF
R
C
V = 0, f = 1 MHz
30
1
⎯
T
Off-state current
Capacitance
I
V
V
= 60 V
1000
⎯
OFF
OFF
OFF
Detector
C
= 0, f = 1 MHz
10
OFF
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TLP173A
Coupled Electrical Characteristics (Ta = 25°C)
Characteristics
Trigger LED current
Symbol
Test Condition
= 70 mA
Min
Typ.
Max
Unit
I
I
I
I
⎯
0.1
⎯
0.6
⎯
2
mA
mA
Ω
FT
ON
Return LED current
On-state resistance
I
= 100 μA
⎯
50
FC
OFF
R
= 70 mA, I = 3 mA
25
ON
ON
F
Isolation Characteristics (Ta = 25°C)
Characteristics
Symbol
Test Condition
Min
Typ.
0.4
Max
Unit
Capacitance input to output
Isolation resistance
C
R
V
V
= 0 V, f = 1 MHz
⎯
⎯
⎯
⎯
⎯
⎯
pF
S
S
S
S
= 500 V, R.H. .≤ 60%
5 × 1010 1014
Ω
AC, 1 min
3750
⎯
⎯
Vrms
Vdc
Isolation voltage
BV
S
AC, 1 s, in oil
DC, 1 min, in oil
10000
10000
⎯
Switching Characteristics (Ta = 25°C)
Characteristics
Symbol
Test Condition
= 200 Ω
Min
Typ.
1.0
Max
5.0
Unit
ms
R
(Note.2)
(Note.2)
L
Turn-on time
Turn-off time
t
⎯
ON
V
= 10 V, I = 3 mA
DD
F
R
= 200 Ω
L
t
⎯
0.5
5.0
OFF
V
= 10 V, I = 3 mA
F
DD
Note 2: Switching time test circuit
I
F
V
DD
1
3
6
4
R
L
I
F
V
OUT
V
OUT
90%
10%
t
ON
t
OFF
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2009-12-22
TLP173A
I
─ Ta
I
─ Ta
ON
F
60
50
40
30
20
10
80
70
60
50
40
30
20
10
0
0
-40
-20
0
20
40
60
80
100
-40
-20
0
20
40
60
80
100
Ambient temperature Ta (°C)
Ambient temperature Ta (°C)
I
─ V
I
─ V
ON
F
F
ON
100
10
1
80
Ta = 25℃
Ta = 25
℃
60
40
IF = 3mA
20
0
-20
-40
-60
-80
0.1
0.8
0.9
1.0
1.1
1.2
F
1.3
1.4
-2
-1
0
1
2
Forward voltage
V
(V)
On-sate voltage
V
(V)
ON
R
ON
─ Ta
I
─ Ta
FT
30
20
10
0
2.8
2.4
2.0
1.6
1.2
0.8
0.4
IF = 3mA
ION = 70mA
ION = 70mA
0
-40
-20
0
20
40
60
80
100
-40
-20
0
20
40
60
80
100
Ambient temperature Ta (°C)
Ambient temperature Ta (°C)
*: The above graphs show typical characteristics.
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2009-12-22
TLP173A
t
,t
─ I
t
,t
─ Ta
ON OFF
F
ON OFF
10
1
10
IF = 3mA
VDD = 10V
RL = 200Ω
tOFF
tON
1
tON
tOFF
0.1
0.01
VDD = 10V
RL = 200Ω
Ta = 25℃
0.1
-40
-20
0
20
40
60
80
100
0.1
1
10
(mA)
100
Forward current
I
Ambient temperature Ta (°C)
F
I
─ Ta
OFF
10
VOFF = 60V
1
0.1
0.01
0.001
-40 -20
0
20
40
60
80
100
Ambient temperature Ta (°C)
*: The above graphs show typical characteristics.
5
2009-12-22
TLP173A
Precautions about the Soldering of
the SMD Type Photocoupler
＜Types＞
TLP173A(F)
＜Mounting Method＞
1) Using Solder Reflow
・Temperature profile example of lead (Pb) solder
(°C)
240
210
160
140
less than 30s
60～120s
Time
(s)
・Temperature profile example of using lead (Pb-free) solder
(°C)
260
230
190
180
60～120s
30～50s
Time
(s)
・The use of the reflow is to twice.
・In case of second reflow soldering should be performed within 2 weeks of the first reflow under
the above conditions.
2) Using Solder Flow (for lead (Pb) solder, or lead (Pd)-free solder)
・Please preheat is at 150°C between 60 and 120 seconds.
・Complete soldering within 10 seconds below 260°C. Each pin may be heated at most once.
・The use of the reflow is to once.
3) Using a Soldering Iron
・Complete soldering within 10 seconds below 260°C, or within 3 seconds at 350°C. Each pin may
be heated at most once.
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TLP173A
Specification for Embossed-Tape Packing
(TP) for Mini-Flat Coupler
1. Applicable Package
Package
Product Type
MF-SOP6
Mini-Flat Coupler
2. Product Naming System
Type of package used for shipment is denoted by a symbol suffix after a product number. The method of
classification is as below.
（Example）
ＴＬＰ１７３A（ＴＰＬ，Ｆ）
[[G]]/RoHS COMPATIBLE(Note 3)
Tape type
Device name
3. Tape Dimensions
3.1 Specification Classification Are as Shown in Table 1
3.2 Orientation of Device in Relation to Direction of Tape Movement
Device orientation in the recesses is as shown in Figure 1.
Figure１ Device Orientation
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2009-12-22
TLP173A
3.3 Empty Device Recesses Are as Shown in Table 2.
Table 2 Empty Device Recesses
Standard
Remarks
Occurrences of 2 or more
successive empty device
recesses
Within any given 40-mm section of
tape, not including leader and trailer
0
Single empty device
recesses
6 device (max.) per reel
Not including leader and trailer
3.4 Start and End of Tape
The start of the tape has 50 or more empty holes. The end of tape has 50 or more empty holes and two
empty turns only a cover tape.
3.5 Tape Specification
(1) Tape material: Plastic (protection against electrostatics)
(2) Dimensions: The tape dimensions are as shown in Figure 2 and Table 3.
0.3 ± 0.05
+0.1
−0
φ1.5
G
A
K
0
F
φ1.6 ± 0.1
3.15 ± 0.2
Figure 2 Tape Forms
Table 3 Tape Dimensions
Unit: mm
Unless otherwise specified: ±0.1
Symbol
Dimension
Remark
A
B
D
E
F
4.2
7.6
5.5
1.75
8.0
4.0
2.8
―
―
Center line of indented square hole and sprocket hole
Distance between tape edge and hole center
+0.1
Cumulative error
Cumulative error
Internal space
(max.) per 10 feed holes
(max.) per 10 feed holes
-0.3
+0.1
-0.3
G
K
0
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2009-12-22
TLP173A
3.6 Reel
(1) Material: Plastic
(2) Dimensions: The reel dimensions are as shown in Figure 3 and Table 4.
Table 4 Reel Dimensions
Unit: mm
Symbol
Dimension
A
B
Φ380 ±2
Φ80 ±1
U
C
Φ13 ±0.5
2.0 ±0.5
4.0 ±0.5
13.5 ±0.5
17.5 ±1.0
E
E
U
W1
W2
W1
W2
Figure 3 Reel Form
4. Packing
Either one reel or five reels of photocoupler are packed in a shipping carton.
5. Label Indication
The carton bears a label indicating the product number, the symbol representing classification of
standard, the quantity, the lot number and the Toshiba company name.
6. Ordering Method
When placing an order, please specify the product number, the tape type and the quantity as shown in the
following example.
（Example）
TLP173A (TPL,F) 3000 pcs
Quantity (must be a multiple of 3000)
[[G]]/RoHS COMPATIBLE(Note 3)
Tape type
Device name
Note 3 : Please contact your TOSHIBA sales representative for details as to environmental matters such as the RoHS
compatibility of Product. RoHS is the Directive 2002/95/EC of the European Parliament and of the Council of 27 January
2003 on the restriction of the use of certain hazardous substances in electrical and electronics equipment.
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2009-12-22
TLP173A
RESTRICTIONS ON PRODUCT USE
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Toshiba Corporation, and its subsidiaries and affiliates (collectively “TOSHIBA”), reserve the right to make changes to the information
in this document, and related hardware, software and systems (collectively “Product”) without notice.
This document and any information herein may not be reproduced without prior written permission from TOSHIBA. Even with
TOSHIBA’s written permission, reproduction is permissible only if reproduction is without alteration/omission.
Though TOSHIBA works continually to improve Product’s quality and reliability, Product can malfunction or fail. Customers are
responsible for complying with safety standards and for providing adequate designs and safeguards for their hardware, software and
systems which minimize risk and avoid situations in which a malfunction or failure of Product could cause loss of human life, bodily
injury or damage to property, including data loss or corruption. Before customers use the Product, create designs including the
Product, or incorporate the Product into their own applications, customers must also refer to and comply with (a) the latest versions of
all relevant TOSHIBA information, including without limitation, this document, the specifications, the data sheets and application notes
for Product and the precautions and conditions set forth in the “TOSHIBA Semiconductor Reliability Handbook” and (b) the
instructions for the application with which the Product will be used with or for. Customers are solely responsible for all aspects of their
own product design or applications, including but not limited to (a) determining the appropriateness of the use of this Product in such
design or applications; (b) evaluating and determining the applicability of any information contained in this document, or in charts,
diagrams, programs, algorithms, sample application circuits, or any other referenced documents; and (c) validating all operating
parameters for such designs and applications. TOSHIBA ASSUMES NO LIABILITY FOR CUSTOMERS’ PRODUCT DESIGN OR
APPLICATIONS.
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Product is intended for use in general electronics applications (e.g., computers, personal equipment, office equipment, measuring
equipment, industrial robots and home electronics appliances) or for specific applications as expressly stated in this document.
Product is neither intended nor warranted for use in equipment or systems that require extraordinarily high levels of quality and/or
reliability and/or a malfunction or failure of which may cause loss of human life, bodily injury, serious property damage or serious
public impact (“Unintended Use”). Unintended Use includes, without limitation, equipment used in nuclear facilities, equipment used
in the aerospace industry, medical equipment, equipment used for automobiles, trains, ships and other transportation, traffic signaling
equipment, equipment used to control combustions or explosions, safety devices, elevators and escalators, devices related to electric
power, and equipment used in finance-related fields. Do not use Product for Unintended Use unless specifically permitted in this
document.
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Do not disassemble, analyze, reverse-engineer, alter, modify, translate or copy Product, whether in whole or in part.
Product shall not be used for or incorporated into any products or systems whose manufacture, use, or sale is prohibited under any
applicable laws or regulations.
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The information contained herein is presented only as guidance for Product use. No responsibility is assumed by TOSHIBA for any
infringement of patents or any other intellectual property rights of third parties that may result from the use of Product. No license to
any intellectual property right is granted by this document, whether express or implied, by estoppel or otherwise.
ABSENT A WRITTEN SIGNED AGREEMENT, EXCEPT AS PROVIDED IN THE RELEVANT TERMS AND CONDITIONS OF SALE
FOR PRODUCT, AND TO THE MAXIMUM EXTENT ALLOWABLE BY LAW, TOSHIBA (1) ASSUMES NO LIABILITY
WHATSOEVER, INCLUDING WITHOUT LIMITATION, INDIRECT, CONSEQUENTIAL, SPECIAL, OR INCIDENTAL DAMAGES OR
LOSS, INCLUDING WITHOUT LIMITATION, LOSS OF PROFITS, LOSS OF OPPORTUNITIES, BUSINESS INTERRUPTION AND
LOSS OF DATA, AND (2) DISCLAIMS ANY AND ALL EXPRESS OR IMPLIED WARRANTIES AND CONDITIONS RELATED TO
SALE, USE OF PRODUCT, OR INFORMATION, INCLUDING WARRANTIES OR CONDITIONS OF MERCHANTABILITY, FITNESS
FOR A PARTICULAR PURPOSE, ACCURACY OF INFORMATION, OR NONINFRINGEMENT.
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GaAs (Gallium Arsenide) is used in Product. GaAs is harmful to humans if consumed or absorbed, whether in the form of dust or
vapor. Handle with care and do not break, cut, crush, grind, dissolve chemically or otherwise expose GaAs in Product.
Do not use or otherwise make available Product or related software or technology for any military purposes, including without
limitation, for the design, development, use, stockpiling or manufacturing of nuclear, chemical, or biological weapons or missile
technology products (mass destruction weapons). Product and related software and technology may be controlled under the
Japanese Foreign Exchange and Foreign Trade Law and the U.S. Export Administration Regulations. Export and re-export of Product
or related software or technology are strictly prohibited except in compliance with all applicable export laws and regulations.
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Please contact your TOSHIBA sales representative for details as to environmental matters such as the RoHS compatibility of Product.
Please use Product in compliance with all applicable laws and regulations that regulate the inclusion or use of controlled substances,
including without limitation, the EU RoHS Directive. TOSHIBA assumes no liability for damages or losses occurring as a result of
noncompliance with applicable laws and regulations.
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2009-12-22
相关型号：
TLP173A(TPR,F)
Solid State Relay, TRANSISTOR OUTPUT SOLID STATE RELAY, 3750 V ISOLATION-MAX, ROHS COMPLIANT, 11-4C1, MINIFLAT, MFSOP-6
TOSHIBA
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