TLP183(V4GRL-TR(T

更新时间:2025-07-03 18:23:14
品牌:TOSHIBA
描述:Transistor Output Optocoupler

TLP183(V4GRL-TR(T 概述

Transistor Output Optocoupler 光耦合器

TLP183(V4GRL-TR(T 规格参数

生命周期:ActiveReach Compliance Code:unknown
风险等级:5.58光电设备类型:TRANSISTOR OUTPUT OPTOCOUPLER
Base Number Matches:1

TLP183(V4GRL-TR(T 数据手册

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TLP183  
Photocouplers InGaAs Infrared LED & Photo Transistor  
TLP183  
1. Applications  
Office Equipment  
Programmable Logic Controllers (PLCs)  
AC Adapters  
I/O Interface Boards  
2. General  
TLP183 is a low input type phototransistor coupler that consists of a photo transistor optically coupled to an  
InGaAs infrared emitting diode in a SO6 package.  
TLP183 is guaranteed high isolation voltage (3750 Vrms) and wide operating temperature range (Ta = -55 to  
125 ).  
TLP183 is smaller than DIP package, it's suitable for high density surface mounting applications such as  
programmable controllers.  
3. Features  
(1) Collector-emitter voltage: 80 V (min)  
(2) Current transfer ratio: 50 % (min) (@IF = 0.5 mA, VCE = 5 V)  
GB Rank: 100 % (min) (@IF = 0.5 mA, VCE = 5 V)  
(3) Isolation voltage: 3750 Vrms (min)  
(4) Operating temperature range: -55 to 125   
(5) Safety standards  
UL-approved: UL1577, File No.E67349  
cUL-approved: CSA Component Acceptance Service No.5A File No.E67349  
VDE-approved: EN60747-5-5, EN60065 or EN60950-1 (Note 1)  
: EN62368-1 (Pending) (Note 1)  
CQC-approved: GB4943.1, GB8898 Thailand Factory  
Note 1: When a VDE approved type is needed, please designate the Option (V4).  
Start of commercial production  
2013-09  
2016-07-06  
Rev.3.0  
1
TLP183  
4. Packaging and Pin Assignment  
1: Anode  
3: Cathode  
4: Emitter  
6: Collector  
11-4M1S  
5. Mechanical Parameters  
Characteristics  
Min  
Unit  
mm  
Creepage distances  
Clearance  
5.0  
5.0  
0.4  
Internal isolation thickness  
2016-07-06  
Rev.3.0  
2
TLP183  
6. Absolute Maximum Ratings (Note) (Unless otherwise specified, Ta = 25 )  
Characteristics  
Input forward current  
Symbol  
Note  
Rating  
Unit  
LED  
IF  
IF/Ta  
IFP  
50  
-1.5  
1
mA  
mA/  
A
Input forward current derating  
Input forward current (pulsed)  
Input reverse voltage  
(Ta 90 )  
(Note 1)  
VR  
5
V
Junction temperature  
Tj  
125  
80  
7
Detector Collector-emitter voltage  
Emitter-collector voltage  
Collector current  
VCEO  
VECO  
IC  
V
V
50  
150  
-1.5  
mA  
mW  
mW/  
Collector power dissipation  
PC  
Collector power dissipation  
derating  
(Ta 25 )  
PC/Ta  
Junction temperature  
Common Operating temperature  
Storage temperature  
Tj  
Topr  
125  
-55 to 125  
-55 to 125  
260  
Tstg  
Lead soldering temperature  
Total power dissipation  
(10 s)  
Tsol  
PT  
200  
mW  
mW/  
Total power dissipation  
derating  
(Ta 25 )  
PT/Ta  
-2.0  
Isolation voltage  
AC, 60 s, R.H. 60 %  
BVS  
(Note 2)  
3750  
Vrms  
Note: Using continuously under heavy loads (e.g. the application of high temperature/current/voltage and the  
significant change in temperature, etc.) may cause this product to decrease in the reliability significantly even  
if the operating conditions (i.e. operating temperature/current/voltage, etc.) are within the absolute maximum  
ratings.  
Please design the appropriate reliability upon reviewing the Toshiba Semiconductor Reliability Handbook  
("Handling Precautions"/"Derating Concept and Methods") and individual reliability data (i.e. reliability test  
report and estimated failure rate, etc).  
Note 1: Pulse width (PW) 0.1 ms, f = 100 Hz  
Note 2: This device is considered as a two-terminal device: Pins 1 and 3 are shorted together, and pins 4 and 6 are  
shorted together.  
7. Electrical Characteristics (Unless otherwise specified, Ta = 25 )  
Characteristics  
Input forward voltage  
Symbol  
Note  
Test Condition  
IF = 10 mA  
Min  
Typ.  
Max  
Unit  
LED  
VF  
IR  
1.1  
1.25  
1.4  
5
V
µA  
pF  
V
Input reverse current  
Input capacitance  
VR = 5 V  
Ct  
V = 0 V, f = 1 MHz  
IC = 0.5 mA  
30  
Detector Collector-emitter breakdown  
voltage  
V(BR)CEO  
80  
Emitter-collector breakdown  
voltage  
V(BR)ECO  
IDARK  
IE = 0.1 mA  
7
V
Dark Current  
VCE = 48 V  
0.01  
2
0.08  
50  
µA  
VCE = 48 V, Ta = 85   
V = 0 V, f = 1 MHz  
Collector-emitter capacitance  
CCE  
10  
pF  
2016-07-06  
Rev.3.0  
3
TLP183  
8. Coupled Electrical Characteristics (Unless otherwise specified, Ta = 25 )  
Characteristics  
Current transfer ratio  
Symbol  
IC/IF  
Note  
Test Condition  
Min  
Typ.  
Max  
Unit  
%
(Note 1) IF = 5 mA, VCE = 5 V  
IF = 5 mA, VCE = 5 V, Rank GB  
50  
100  
50  
100  
60  
0.2  
600  
600  
600  
600  
IF = 0.5 mA, VCE = 5 V  
IF = 0.5 mA, VCE = 5 V, Rank GB  
IF = 1 mA, VCE = 0.4 V  
Saturated current transfer ratio  
IC/IF(sat)  
IF = 1 mA, VCE = 0.4 V, Rank GB  
IC = 2.4 mA, IF = 8 mA  
30  
Collector-emitter saturation voltage VCE(sat)  
0.3  
V
IC = 0.2 mA, IF = 1 mA  
IC = 0.2 mA, IF = 1 mA, Rank GB  
VF = 0.7 V, VCE = 48 V  
0.3  
10  
OFF-state collector current  
IC(off)  
µA  
Note 1: See Table 8.1 for current transfer ratio.  
Table 8.1 Current Transfer Ratio (CTR) Rank (Note) (Unless otherwise specified, Ta = 25 )  
Rank  
short  
code  
Current transfer ratio Current transfer ratio  
Marking of  
classification  
Rank  
Blank  
Note  
Test Condition  
IC/IF  
IC/IF  
Unit  
%
(min)  
(max)  
IF = 5 mA, VCE = 5 V  
IF = 0.5 mA, VCE = 5 V  
IF = 5 mA, VCE = 5 V  
IF = 0.5 mA, VCE = 5 V  
IF = 5 mA, VCE = 5 V  
IF = 0.5 mA, VCE = 5 V  
IF = 5 mA, VCE = 5 V  
IF = 0.5 mA, VCE = 5 V  
IF = 5 mA, VCE = 5 V  
IF = 0.5 mA, VCE = 5 V  
IF = 0.5 mA, VCE = 5 V  
50  
50  
600  
150  
300  
600  
600  
Blank, YE, GR, GB,  
BL, Y+, G, G+, B  
Y
YE  
GR  
GB  
BL  
GR  
GB  
BL  
100  
100  
200  
YH  
GRL  
GRH  
BLL  
GL  
GH  
B
75  
150  
200  
300  
400  
Y+  
G
(Note1) IF = 0.5 mA, VCE = 5 V  
(Note1) IF = 0.5 mA, VCE = 5 V  
(Note1) IF = 0.5 mA, VCE = 5 V  
100  
150  
200  
G+  
B
Note: Specify both the part number and a rank in this format when ordering.  
Example: TLP183(GB,E  
For safety standard certification, however, specify the part number alone.  
Example: TLP183(GB,E TLP183  
Note1: A rank in the order name is sometimes omitted like above "Rank short code".  
9. Isolation Characteristics (Unless otherwise specified, Ta = 25 )  
Characteristics  
Symbol  
Note  
Test Condition  
Min  
Typ.  
Max  
Unit  
Total capacitance (input to output)  
Isolation resistance  
CS  
RS  
(Note 1) VS = 0 V, f = 1 MHz  
(Note 1) VS = 500 V, R.H. 60 %  
(Note 1) AC, 60 s  
1 × 1012  
3750  
0.8  
1014  
pF  
Isolation voltage  
BVS  
Vrms  
AC, 1 s in oil  
10000  
10000  
DC, 60 s in oil  
Vdc  
Note 1: This device is considered as a two-terminal device: Pins 1 and 3 are shorted together, and pins 4 and 6 are  
shorted together.  
2016-07-06  
Rev.3.0  
4
TLP183  
10. Switching Characteristics (Unless otherwise specified, Ta = 25 )  
Characteristics  
Symbol  
Note  
Test Condition  
Min  
Typ.  
Max  
Unit  
Rise time  
Fall time  
tr  
VCC = 10 V, IC = 2 mA,  
RL = 100 Ω  
2
3
µs  
tf  
Turn-on time  
Turn-off time  
Turn-on time  
Storage time  
Turn-off time  
Turn-on time  
Storage time  
Turn-off time  
ton  
toff  
ton  
ts  
3
3
See Fig. 10.1  
RL = 1.9 k, VCC = 5 V,  
IF = 16 mA  
1.3  
20  
35  
4
toff  
ton  
ts  
See Fig. 10.1  
RL = 4.7 k, VCC = 5 V,  
IF = 1.6 mA  
7
toff  
30  
Fig. 10.1 Switching Time Test Circuit and Waveform  
2016-07-06  
Rev.3.0  
5
TLP183  
11. Characteristics Curves (Note)  
Fig. 11.1 IF - Ta  
Fig. 11.3 IFP - DR  
Fig. 11.5 VF/Ta - IF  
Fig. 11.2 PC - Ta  
Fig. 11.4 IF - VF  
Fig. 11.6 IFP - VFP  
2016-07-06  
Rev.3.0  
6
TLP183  
Fig. 11.7 IC - VCE  
Fig. 11.9 IDARK - Ta  
Fig. 11.11 IC - IF  
Fig. 11.8 IC - VCE  
Fig. 11.10 VCE(sat) - Ta  
Fig. 11.12 IC/IF - IF  
2016-07-06  
Rev.3.0  
7
TLP183  
Fig. 11.13 IC - Ta  
Fig. 11.14 Switching Time - RL  
Fig. 11.15 Switching Time - Ta  
Note: The above characteristics curves are presented for reference only and not guaranteed by production test,  
unless otherwise noted.  
2016-07-06  
Rev.3.0  
8
TLP183  
12. Soldering and Storage  
12.1. Precautions for Soldering  
The soldering temperature should be controlled as closely as possible to the conditions shown below, irrespective  
of whether a soldering iron or a reflow soldering method is used.  
When using soldering reflow.  
The soldering temperature profile is based on the package surface temperature.  
(See the figure shown below, which is based on the package surface temperature.)  
Reflow soldering must be performed once or twice.  
The mounting should be completed with the interval from the first to the last mountings being 2 weeks.  
Fig. 12.1.1 An Example of a Temperature Profile When Lead(Pb)-Free Solder Is Used  
When using soldering flow  
Preheat the device at a temperature of 150 (package surface temperature) for 60 to 120 seconds.  
Mounting condition of 260 within 10 seconds is recommended.  
Flow soldering must be performed once.  
When using soldering Iron  
Complete soldering within 10 seconds for lead temperature not exceeding 260 or within 3 seconds not  
exceeding 350   
Heating by soldering iron must be done only once per lead.  
12.2. Precautions for General Storage  
Avoid storage locations where devices may be exposed to moisture or direct sunlight.  
Follow the precautions printed on the packing label of the device for transportation and storage.  
Keep the storage location temperature and humidity within a range of 5 to 35 and 45 % to 75 %,  
respectively.  
Do not store the products in locations with poisonous gases (especially corrosive gases) or in dusty  
conditions.  
Store the products in locations with minimal temperature fluctuations. Rapid temperature changes during  
storage can cause condensation, resulting in lead oxidation or corrosion, which will deteriorate the  
solderability of the leads.  
When restoring devices after removal from their packing, use anti-static containers.  
Do not allow loads to be applied directly to devices while they are in storage.  
If devices have been stored for more than two years under normal storage conditions, it is recommended  
that you check the leads for ease of soldering prior to use.  
2016-07-06  
Rev.3.0  
9
TLP183  
13. Land Pattern Dimensions (for reference only)  
14. Marking  
2016-07-06  
Rev.3.0  
10  
TLP183  
15. EN60747-5-5 Option (V4) Specification  
Part number: TLP183 (Note 1)  
The following part naming conventions are used for the devices that have been qualified according to  
option (V4) of EN60747.  
Example: TLP183(V4GR-TL,E(T  
V4: EN60747 option  
GR: CTR rank  
TL: Tape type (L direction: TPL)  
E: [[G]]/RoHS COMPATIBLE (Note 2)  
T: Domestic ID (Country/Region of origin: Thailand)  
Note 1: Use TOSHIBA standard type number for safety standard application.  
e.g., TLP183(V4GR-TL,E(T TLP183  
Note 2: Please contact your Toshiba sales representative for details on environmental information such as the product's  
RoHS compatibility.  
RoHS is the Directive 2011/65/EU of the European Parliament and of the Council of 8 June 2011 on the  
restriction of the use of certain hazardous substances in electrical and electronics equipment.  
Fig. 15.1 EN60747 Insulation Characteristics  
2016-07-06  
Rev.3.0  
11  
TLP183  
Table 15.1 Insulation Related Specifications (Note)  
Insulation Related Parameters  
Symbol  
TLP293  
Minimum creepage distance  
Minimum clearance  
Cr  
Cl  
5.0 mm  
5.0 mm  
0.4 mm  
175  
Minimum insulation thickness  
Comparative tracking index  
ti  
CTI  
Note: This photocoupler is suitable for safe electrical isolation only within the safety limit data.  
Maintenance of the safety data shall be ensured by means of protective circuits.  
Fig. 15.2 Marking on packing for EN60747  
Fig. 15.3 Marking Example (Note)  
Note: The above marking is applied to the photocouplers that have been qualified according to option (V4) of  
EN60747.  
2016-07-06  
Rev.3.0  
12  
TLP183  
Fig. 15.4 Measurement Procedure  
2016-07-06  
Rev.3.0  
13  
TLP183  
16. Embossed-Tape Packing (TPL), (TPR) Specification for Mini-Flat Photocouplers  
16.1. Applicable Package  
Package Name  
SO6  
Product Type  
Mini flat coupler  
16.2. Product Naming Conventions  
Type of package used for shipment is denoted by a symbol suffix after a part number. The method of classification  
is as below.  
Example) TLP183(GR-TPL,E(T  
Part number: TLP183  
CTR rank: GR  
Tape type: TPL(L direction)  
[[G]]/RoHS COMPATIBLE: E (Note 1)  
Domestic ID (Country/Region of origin: Thailand): T  
Note 1: Please contact your Toshiba sales representative for details on environmental information such as the product's  
RoHS compatibility.  
RoHS is the Directive 2011/65/EU of the European Parliament and of the Council of 8 June 2011 on the  
restriction of the use of certain hazardous substances in electrical and electronics equipment.  
2016-07-06  
Rev.3.0  
14  
TLP183  
16.3. Tape Dimensions Specification  
Packing Amount  
(A unit per reel)  
Tape Type  
Division  
TPL  
TPR  
L direction  
R direction  
3000  
3000  
16.3.1. Orientation of Device in Relation to Direction of Feed  
Device orientation in the carrier cavities as shown in the following figure.  
Fig. 16.3.1.1 Device Orientation  
16.3.2. Packing Quantity  
3000 pcs per reel  
16.3.3. Empty Cavities  
Characteristics  
Criterion  
0 device  
Remarks  
Occurrences of 2 or more  
successive empty cavities  
Within any given 40-mm section of tape, not including leader  
and trailer  
Single empty cavity  
6 devices (max) per reel  
Not including leader and trailer  
16.3.4. Tape Leader and Trailer  
The start end of the tape has 50 or more empty cavities. The hub end of the tape has 50 or more empty cavities  
and 2 empty turns for a cover tape.  
2016-07-06  
Rev.3.0  
15  
TLP183  
16.3.5. Tape Dimensions  
Tape material: Plastic (for protection against static electricity)  
Fig. 16.3.5.1 Tape dimensions  
Table 16.3.5.1 Tape Dimensions (unit: mm, tolerance: ±0.1)  
Symbol  
Dimension  
Remark  
A
B
4.0  
7.6  
5.5  
1.75  
8.0  
4.0  
2.6  
D
E
Center line of embossed cavity and sprocket hole  
Distance between tape edge and sprocket hole center  
Cumulative error +0.1/-0.3 (max) per 10 empty cavities holes  
Cumulative error +0.1/-0.3 (max) per 10 sprocket holes  
Internal space  
F
G
K0  
2016-07-06  
Rev.3.0  
16  
TLP183  
16.3.6. Reel Specification  
Material: Plastic  
Fig. 16.3.6.1 Reel Dimensions  
Table 16.3.6.1 Reel Dimensions (unit:  
mm)  
Symbol  
Dimension  
A
B
φ330 ± 2  
φ80 ± 1 / φ100 ± 1  
φ13 ± 0.5  
C
E
2.0 ± 0.5  
U
4.0 ± 0.5  
W1  
W2  
13.5 ± 0.5  
17.5 ± 1.0  
16.4. Packing (Note)  
Either one reel or ten reels of photocouplers are packed in a shipping carton.  
Fig. 16.4.1 1 reel/carton (unit: mm)  
Fig. 16.4.2 10 reel/carton (unit: mm)  
Note: Taping reel diameter: φ330 ± 2 mm  
2016-07-06  
Rev.3.0  
17  
TLP183  
16.5. Label Format  
(1) Carton: The label provides the part number, quantity, lot number, the Toshiba logo, etc.  
(2) Reel: The label provides the part number, the taping name, quantity, lot number, etc.  
16.6. Ordering Information  
When placing an order, please specify the part number, CTR rank, tape type and quantity as shown in the  
following example.  
Example) TLP183(GR-TPL,E(T 6000 pcs  
Part number: TLP183  
CTR rank: GR  
Tape type: TPL (L direction)  
[[G]]/RoHS COMPATIBLE: E (Note 1)  
Domestic ID (Country/Region of origin: Thailand): T  
Quantity (must be a multiple of 3000): 6000 pcs  
Note 1: Please contact your Toshiba sales representative for details on environmental information such as the product's  
RoHS compatibility.  
RoHS is the Directive 2011/65/EU of the European Parliament and of the Council of 8 June 2011 on the  
restriction of the use of certain hazardous substances in electrical and electronics equipment.  
2016-07-06  
Rev.3.0  
18  
TLP183  
Package Dimensions  
Unit: mm  
Weight: 0.08 g (typ.)  
Package Name(s)  
TOSHIBA: 11-4M1S  
2016-07-06  
Rev.3.0  
19  
TLP183  
RESTRICTIONS ON PRODUCT USE  
Toshiba Corporation, and its subsidiaries and affiliates (collectively "TOSHIBA"), reserve the right to make changes to the information  
in this document, and related hardware, software and systems (collectively "Product") without notice.  
This document and any information herein may not be reproduced without prior written permission from TOSHIBA. Even with TOSHIBA's  
written permission, reproduction is permissible only if reproduction is without alteration/omission.  
ThoughTOSHIBAworkscontinuallytoimproveProduct'squalityandreliability,Productcanmalfunctionorfail.Customersareresponsible  
for complying with safety standards and for providing adequate designs and safeguards for their hardware, software and systems which  
minimize risk and avoid situations in which a malfunction or failure of Product could cause loss of human life, bodily injury or damage  
to property, including data loss or corruption. Before customers use the Product, create designs including the Product, or incorporate  
the Product into their own applications, customers must also refer to and comply with (a) the latest versions of all relevant TOSHIBA  
information, including without limitation, this document, the specifications, the data sheets and application notes for Product and the  
precautions and conditions set forth in the "TOSHIBA Semiconductor Reliability Handbook" and (b) the instructions for the application  
with which the Product will be used with or for. Customers are solely responsible for all aspects of their own product design or applications,  
including but not limited to (a) determining the appropriateness of the use of this Product in such design or applications; (b) evaluating  
and determining the applicability of any information contained in this document, or in charts, diagrams, programs, algorithms, sample  
application circuits, or any other referenced documents; and (c) validating all operating parameters for such designs and applications.  
TOSHIBA ASSUMES NO LIABILITY FOR CUSTOMERS' PRODUCT DESIGN OR APPLICATIONS.  
PRODUCT IS NEITHER INTENDED NOR WARRANTED FOR USE IN EQUIPMENTS OR SYSTEMS THAT REQUIRE  
EXTRAORDINARILY HIGH LEVELS OF QUALITY AND/OR RELIABILITY, AND/OR A MALFUNCTION OR FAILURE OF WHICH MAY  
CAUSE LOSS OF HUMAN LIFE, BODILY INJURY, SERIOUS PROPERTY DAMAGE AND/OR SERIOUS PUBLIC IMPACT  
("UNINTENDEDUSE").Exceptforspecificapplicationsasexpresslystatedinthisdocument, UnintendedUseincludes, withoutlimitation,  
equipment used in nuclear facilities, equipment used in the aerospace industry, medical equipment, equipment used for automobiles,  
trains, ships and other transportation, traffic signaling equipment, equipment used to control combustions or explosions, safety devices,  
elevators and escalators, devices related to electric power, and equipment used in finance-related fields. IF YOU USE PRODUCT FOR  
UNINTENDED USE, TOSHIBA ASSUMES NO LIABILITY FOR PRODUCT. For details, please contact your TOSHIBA sales  
representative.  
Do not disassemble, analyze, reverse-engineer, alter, modify, translate or copy Product, whether in whole or in part.  
Product shall not be used for or incorporated into any products or systems whose manufacture, use, or sale is prohibited under any  
applicable laws or regulations.  
The information contained herein is presented only as guidance for Product use. No responsibility is assumed by TOSHIBA for any  
infringement of patents or any other intellectual property rights of third parties that may result from the use of Product. No license to any  
intellectual property right is granted by this document, whether express or implied, by estoppel or otherwise.  
ABSENT A WRITTEN SIGNED AGREEMENT, EXCEPT AS PROVIDED IN THE RELEVANT TERMS AND CONDITIONS OF SALE  
FOR PRODUCT, AND TO THE MAXIMUM EXTENT ALLOWABLE BY LAW, TOSHIBA (1) ASSUMES NO LIABILITY WHATSOEVER,  
INCLUDING WITHOUT LIMITATION, INDIRECT, CONSEQUENTIAL, SPECIAL, OR INCIDENTAL DAMAGES OR LOSS, INCLUDING  
WITHOUT LIMITATION, LOSS OF PROFITS, LOSS OF OPPORTUNITIES, BUSINESS INTERRUPTION AND LOSS OF DATA, AND  
(2) DISCLAIMS ANY AND ALL EXPRESS OR IMPLIED WARRANTIES AND CONDITIONS RELATED TO SALE, USE OF PRODUCT,  
OR INFORMATION, INCLUDING WARRANTIES OR CONDITIONS OF MERCHANTABILITY, FITNESS FOR A PARTICULAR  
PURPOSE, ACCURACY OF INFORMATION, OR NONINFRINGEMENT.  
GaAs (Gallium Arsenide) is used in Product. GaAs is harmful to humans if consumed or absorbed, whether in the form of dust or vapor.  
Handle with care and do not break, cut, crush, grind, dissolve chemically or otherwise expose GaAs in Product.  
Do not use or otherwise make available Product or related software or technology for any military purposes, including without limitation,  
for the design, development, use, stockpiling or manufacturing of nuclear, chemical, or biological weapons or missile technology products  
(mass destruction weapons). Product and related software and technology may be controlled under the applicable export laws and  
regulations including, without limitation, the Japanese Foreign Exchange and Foreign Trade Law and the U.S. Export Administration  
Regulations. Export and re-export of Product or related software or technology are strictly prohibited except in compliance with all  
applicable export laws and regulations.  
Please contact your TOSHIBA sales representative for details as to environmental matters such as the RoHS compatibility of Product.  
Please use Product in compliance with all applicable laws and regulations that regulate the inclusion or use of controlled substances,  
including without limitation, the EU RoHS Directive. TOSHIBA ASSUMES NO LIABILITY FOR DAMAGES OR LOSSES OCCURRING  
AS A RESULT OF NONCOMPLIANCE WITH APPLICABLE LAWS AND REGULATIONS.  
2016-07-06  
Rev.3.0  
20  

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