TLP185(V4-GB) [TOSHIBA]
NPN-OUTPUT DC-INPUT OPTOCOUPLER,1-CHANNEL,3.75KV ISOLATION,SO;
| 型号： | TLP185(V4-GB) |
| 厂家： | 
TOSHIBA |
| 描述： | NPN-OUTPUT DC-INPUT OPTOCOUPLER,1-CHANNEL,3.75KV ISOLATION,SO 分离技术 隔离技术 输入元件 输出元件 光电 |
| 文件： | 总11页 (文件大小：385K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
TLP185
TOSHIBA Photocoupler GaAs Ired & Photo-Transistor
TLP185
Office Machine
Programmable Controllers
AC Adapter
Unit: mm
I/O Interface Board
The TOSHIBA mini flat coupler TLP185 is a small outline coupler, suitable for
surface mount assembly.
TLP185 consists of a photo transistor optically coupled to a gallium arsenide
infrared emitting diode. Since TLP185 is smaller than DIP package, it’s
suitable for high-density surface mounting applications such as
programmable controllers.
•
•
Collector-emitter voltage: 80 V (min)
Current transfer ratio: 50 % (min)
Rank GB: 100% (min)
•
•
•
Isolation voltage: 3750 Vrms (min)
Operation Temperature:-55 to 110 ˚C
Safety Standards
UL approved: UL1577, File No. E67349
cUL approved: CSA Component Acceptance Service No. 5A
File No.E67349
TOSHIBA
11-4M1S
Weight: 0.08 g (typ.)
•
•
CQC approved:GB4943.1,GB8898 Japan and Thailand Factory
仅适用干海拔 2000m 以下地区安全使用
Option (V4) type
VDE approved: EN60747-5-5 ,EN60065,EN60950-1 (Note 1)
Under application EN62368-1
Pin Configuration (top view)
Note 1: When a EN60747-5-5 approved type is needed,
Please designate “Option(V4)”
Construction mechanical rating
•
Creepage distance
Clearance
Insulation thickness
: 5.0 mm (min)
: 5.0 mm (min)
: 0.4 mm (min)
Start of commercial production
2011-12
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TLP185
Current Transfer Ratio
Current Transfer Ratio (%) (I / I )
C
F
Classification
Type
I
= 5 mA, V = 5 V, Ta = 25°C
Marking Of Classification
F
CE
(Note1)
Min
Max
Blank
Rank Y
Rank GR
50
50
400
150
300
400
150
200
300
400
Blank, YE, GR, GB, Y+, G, G+, B
YE , Y+
100
100
75
GR , G ,G+
Rank GB
TLP185
GB, GR, G, G+, BL, B,
Rank YH
Y+
G
Rank GRL
Rank GRH
Rank BLL
100
150
200
G+
B
Note1: Ex Rank GB: TLP185 (GB,E
Note: Application, type name for certification test, please use standard product type name, i, e.
TLP185(GB,E: TLP185
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TLP185
Absolute Maximum Ratings (Ta = 25°C)
Characteristic
Symbol
Rating
Unit
Forward current
I
50
-1.5
1
mA
mA/°C
A
F
Forward current derating (Ta ≥ 90°C)
ΔI /°C
F
Pulse forward current
Reverse voltage
(Note 1)
I
FP
V
P
5
V
R
D
100
mW
mW/°C
°C
Diode power dissipation
ΔP /°C
-2.9
125
Diode power dissipation derating (Ta >90°C)
Junction temperature
D
T
j
Collector-emitter voltage
V
V
80
V
CEO
ECO
Emitter-collector voltage
7
V
Collector current
I
50
mA
C
Collector power dissipation
P
150
mW
mW/°C
°C
C
Collector power dissipation derating (Ta ≥ 25°C)
Junction temperature
ΔP /°C
-1.5
125
C
T
j
Operating temperature range
Storage temperature range
T
-55 to 110
-55 to 125
260
°C
opr
T
°C
stg
sol
Lead soldering temperature (10 s)
Total package power dissipation
Total package power dissipation derating (Ta ≥ 25°C)
T
°C
P
200
mW
mW/°C
Vrms
T
ΔP /°C
-2.0
3750
T
Isolation voltage (AC, 60 s, R.H. ≤ 60%)
(Note 2)
BV
S
Note: Using continuously under heavy loads (e.g. the application of high temperature/current/voltage and the
significant change in temperature, etc.) may cause this product to decrease in the reliability significantly even if
the operating conditions (i.e. operating temperature/current/voltage, etc.) are within the absolute maximum
ratings.
Please design the appropriate reliability upon reviewing the Toshiba Semiconductor Reliability Handbook
(“Handling Precautions”/“Derating Concept and Methods”) and individual reliability data (i.e. reliability test
report and estimated failure rate, etc).
Note 1: Pulse width ≤ 100 μs, f = 100 Hz
Note 2: Device considered a two terminal device: Pins 1 and 3 shorted together and 4 and 6 shorted together.
Recommended Operating Conditions
Characteristic
Symbol
Min
Typ.
Max
Unit
Supply voltage
Forward current
Collector current
V
―
―
―
5
16
1
48
20
10
V
CC
I
mA
mA
F
I
C
Note: Recommended operating conditions are given as a design guideline to obtain expected performance of the
device. Additionally, each item is an independent guideline respectively. In developing designs using this
product, please confirm specified characteristics shown in this document.
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TLP185
Electrical Characteristics (Ta = 25°C)
Characteristic
Forward voltage
Symbol
Test Condition
I = 10 mA
Min
Typ.
Max
Unit
V
1.1
—
—
80
7
1.25
—
1.4
5
V
μA
pF
V
F
F
Reverse current
I
V = 5 V
R
R
Capacitance
C
T
V = 0 V, f = 1 MHz
30
—
—
Collector-emitter breakdown voltage
Emitter-collector breakdown voltage
V
V
I
I
= 0.5 mA
= 0.1 mA
—
(BR)CEO
(BR)ECO
C
E
—
—
V
V
V
= 48 V
—
—
—
0.01
2
0.08
50
—
μA
μA
pF
CE
CE
Collector dark current
I
CEO
= 48 V, Ta = 85°C
Capacitance (collector to emitter)
C
CE
V = 0 V, f = 1 MHz
10
Coupled Electrical Characteristics (Ta = 25°C)
Characteristic
Symbol
Test Condition
= 5 mA, V = 5 V
Min
Typ.
Max
Unit
%
50
100
—
—
—
60
—
—
0.2
—
1
400
400
—
I
I
F
F
CE
Current transfer ratio
I /I
C F
Rank GB
Rank GB
= 1 mA, V = 0.4 V
CE
Saturated CTR
I /I
C F(sat)
%
30
—
—
I
I
= 2.4 mA, I = 8 mA
0.3
—
C
C
F
Collector-emitter saturation voltage
Off-state collector current
V
—
V
CE(sat)
= 0.2 mA, I = 1 mA
F
Rank GB
—
0.3
10
I
V
= 0.7 V, V = 48 V
CE
—
μA
C(off)
F
Isolation Characteristics (Ta = 25°C)
Characteristic
Symbol
Test Condition
Min
—
Typ.
0.8
Max
Unit
Capacitance (input to output)
Isolation resistance
C
R
V
V
= 0 V, f = 1 MHz
—
—
—
—
—
pF
S
S
S
12
14
= 500 V, R.H. ≤ 60%
1×10
3750
—
10
Ω
S
AC, 60 s
—
Vrms
Vdc
Isolation voltage
BV
AC, 1 s, in oil
DC, 60 s, in oil
10000
10000
S
—
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TLP185
Switching Characteristics (Ta = 25°C)
Characteristic
Symbol
Test Condition
Min
Typ.
Max
Unit
Rise time
t
—
—
—
—
—
—
—
5
9
—
—
—
—
—
—
—
r
Fall time
t
f
V
= 10 V, I = 2 mA
C
CC
L
μs
R = 100 Ω
Turn-on time
Turn-off time
Turn-on time
Storage time
Turn-off time
t
t
t
9
on
off
on
9
2
R = 1.9 kΩ
V
(Fig.1)
L
CC
t
30
70
μs
s
= 5 V, I = 16 mA
F
t
off
Fig. 1 Switching time test circuit
I
F
t
I
S
F
V
V
CC
V
CC
R
L
4.5V
V
CE
CE
0.5V
t
t
on
off
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TLP185
I
- Ta
P
- Ta
C
F
100
80
60
40
20
0
160
140
120
100
80
60
40
This curve shows the maximum
limit to the forward current.
This curve shows the
maximum limit to the
20
collector power dissipation.
-20
0
20
40
60
80 100 120
0
-20
0
20
40
60
80
100
120
Ambient temperature Ta (˚C)
Ambient temperature Ta (˚C)
I
- D
I
- V
F F
F P
R
100
3000
Pulse width≤100μs
Ta=25˚C
1000
500
300
10
1
110˚C
85˚C
50˚C
25˚C
0˚C
-25˚C
-55˚C
100
50
30
This curve shows the maximum
limit to the pulse forward current.
0.1
10
100
10-1
10-2
10-3
0.6 0.8
1
1.2 1.4 1.6 1.8
2
Duty cycle ratio
D
R
Forward voltage
V
(V)
F
∆ V / ∆ Ta - I
I
– V
F
F
F P
F P
1000
100
10
-3.2
-2.8
-2.4
-2
-1.6
-1.2
-0.8
-0.4
Pulse width≤10μs
Repetitive frequency=100Hz
Ta=25°C
1
0.1
1
10
(mA)
100
0.6
1
1.4
1.8
2.2
2.6
3
3.4
Forward current
I
Pulse forward voltage VFP (V)
F
*The above graphs show typical characteristic.
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TLP185
I
- V
I
- V
C E
C
C E
C
30
20
10
0
50
40
30
20
10
0
Ta=25˚C
Ta=25˚C
P
( m a x )
C
5 0
3 0
2 0
5 0
1 5
3 0
2 0
1 5
1 0
5
1 0
I
= 2 m A
F
I
= 5 m A
F
0
2
4
6
8
10
0
0.2
0.4
0.6
0.8
1
Collector-emitter voltage VCE (V)
Collector-emitter voltage VCE (V)
I
- I
F
ICEO-Ta
C
10
1
100
10
1
Ta=25˚C
0.1
0.01
V
=48V
CE
24V
10V
5V
0.001
V
CE
=10V
V
CE
=5V
V
CE
=0.4V
0.0001
0.1
0
20
40
60
80
100
120
0.1
1
10
100
Forward current
I
(mA)
Ambient temperature Ta (°C)
F
I
I
- I
F
C /
F
1000
100
10
V
=10V
CE
V
=5V
CE
V
=0.4V
CE
0.1
1
10
100
Forward current
I
(mA)
F
*The above graphs show typical characteristic.
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TLP185
V
- Ta
I
- Ta
C
C E ( s a t )
100
10
1
0.28
0.24
0.20
0.16
0.12
0.08
0.04
0.00
25
10
5
1
I =0.5mA
F
I
I
=8mA, I =2.4mA
C
F
F
=1mA, I =0.2mA
C
V =5V
CE
0.1
-60 -40 -20
0
20 40 60 80 100 120
-60 -40 -20
0
20 40 60 80 100 120
Ambient temperature Ta (°C)
Ambient temperature Ta (°C)
Switching time - R
L
Switching time - Ta
10000
1000
100
10
1000
Ta=25˚C
I
=16mA
F
V =5V
CC
t
off
100
10
1
t
off
t
s
t
s
t
off
I
=16mA
F
t
V =5V
CC
on
R =1.9kΩ
L
0.1
1
-60 -40 -20
0
20 40 60 80 100 120
1
10
Load resistance
100
Ambient temperature Ta (°C)
R
L
(kΩ)
*The above graphs show typical characteristic.
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TLP185
Soldering and Storage
1. Soldering
1.1 Soldering
When using a soldering iron or medium infrared ray/hot air reflow, avoid a rise in device temperature as
much as possible by observing the following conditions.
1) Using solder reflow
∙Temperature profile example of lead (Pb) solder
(°C)
240
This profile is based on the device’s
maximum heat resistance guaranteed
value.
0
Set the preheat temperature/heating
temperature to the optimum
temperature corresponding to the
solder paste type used by the
customer within the described profile.
0
140
less than 30s
60 to 120s
Time
(s)
∙Temperature profile example of using lead (Pb)-free solder
(°C)
This profile is based on the device’s
maximum heat resistance guaranteed
value.
260
230
Set the preheat temperature/heating
temperature to the optimum
temperature corresponding to the
solder paste type used by the
customer within the described profile.
190
180
60 to 120s
30 to 50s
Time
(s)
Reflow soldering must be performed once or twice.
The mounting should be completed with the interval from the first to the last mountings being 2
weeks.
2) Using solder flow (for lead (Pb) solder, or lead (Pb)-free solder)
Please preheat it at 150°C between 60 and 120 seconds.
Complete soldering within 10 seconds below 260°C. Each pin may be heated at most once.
3) Using a soldering iron
Complete soldering within 10 seconds below 260°C, or within 3 seconds at 350°C. Each pin
may be heated at most once.
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TLP185
2. Storage
1) Avoid storage locations where devices may be exposed to moisture or direct sunlight.
2) Follow the precautions printed on the packing label of the device for transportation and storage.
3) Keep the storage location temperature and humidity within a range of 5°C to 35°C and 45% to 75%,
respectively.
4) Do not store the products in locations with poisonous gases (especially corrosive gases) or in dusty
conditions.
5) Store the products in locations with minimal temperature fluctuations. Rapid temperature changes during
storage can cause condensation, resulting in lead oxidation or corrosion, which will deteriorate the
solderability of the leads.
6) When restoring devices after removal from their packing, use anti-static containers.
7) Do not allow loads to be applied directly to devices while they are in storage.
8) If devices have been stored for more than two years under normal storage conditions, it is recommended
that you check the leads for ease of soldering prior to use.
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TLP185
RESTRICTIONS ON PRODUCT USE
• Toshiba Corporation, and its subsidiaries and affiliates (collectively "TOSHIBA"), reserve the right to make changes to the information
in this document, and related hardware, software and systems (collectively "Product") without notice.
• This document and any information herein may not be reproduced without prior written permission from TOSHIBA. Even with
TOSHIBA's written permission, reproduction is permissible only if reproduction is without alteration/omission.
• Though TOSHIBA works continually to improve Product's quality and reliability, Product can malfunction or fail. Customers are
responsible for complying with safety standards and for providing adequate designs and safeguards for their hardware, software and
systems which minimize risk and avoid situations in which a malfunction or failure of Product could cause loss of human life, bodily
injury or damage to property, including data loss or corruption. Before customers use the Product, create designs including the Product,
or incorporate the Product into their own applications, customers must also refer to and comply with (a) the latest versions of all
relevant TOSHIBA information, including without limitation, this document, the specifications, the data sheets and application notes for
Product and the precautions and conditions set forth in the "TOSHIBA Semiconductor Reliability Handbook" and (b) the instructions for
the application with which the Product will be used with or for. Customers are solely responsible for all aspects of their own product
design or applications, including but not limited to (a) determining the appropriateness of the use of this Product in such design or
applications; (b) evaluating and determining the applicability of any information contained in this document, or in charts, diagrams,
programs, algorithms, sample application circuits, or any other referenced documents; and (c) validating all operating parameters for
such designs and applications. TOSHIBA ASSUMES NO LIABILITY FOR CUSTOMERS' PRODUCT DESIGN OR APPLICATIONS.
•
PRODUCT IS NEITHER INTENDED NOR WARRANTED FOR USE IN EQUIPMENTS OR SYSTEMS THAT REQUIRE
EXTRAORDINARILY HIGH LEVELS OF QUALITY AND/OR RELIABILITY, AND/OR A MALFUNCTION OR FAILURE OF WHICH
MAY CAUSE LOSS OF HUMAN LIFE, BODILY INJURY, SERIOUS PROPERTY DAMAGE AND/OR SERIOUS PUBLIC IMPACT
("UNINTENDED USE"). Except for specific applications as expressly stated in this document, Unintended Use includes, without
limitation, equipment used in nuclear facilities, equipment used in the aerospace industry, medical equipment, equipment used for
automobiles, trains, ships and other transportation, traffic signaling equipment, equipment used to control combustions or explosions,
safety devices, elevators and escalators, devices related to electric power, and equipment used in finance-related fields. IF YOU USE
PRODUCT FOR UNINTENDED USE, TOSHIBA ASSUMES NO LIABILITY FOR PRODUCT. For details, please contact your
TOSHIBA sales representative.
• Do not disassemble, analyze, reverse-engineer, alter, modify, translate or copy Product, whether in whole or in part.
• Product shall not be used for or incorporated into any products or systems whose manufacture, use, or sale is prohibited under any
applicable laws or regulations.
• The information contained herein is presented only as guidance for Product use. No responsibility is assumed by TOSHIBA for any
infringement of patents or any other intellectual property rights of third parties that may result from the use of Product. No license to
any intellectual property right is granted by this document, whether express or implied, by estoppel or otherwise.
•
ABSENT A WRITTEN SIGNED AGREEMENT, EXCEPT AS PROVIDED IN THE RELEVANT TERMS AND CONDITIONS OF SALE
FOR PRODUCT, AND TO THE MAXIMUM EXTENT ALLOWABLE BY LAW, TOSHIBA (1) ASSUMES NO LIABILITY
WHATSOEVER, INCLUDING WITHOUT LIMITATION, INDIRECT, CONSEQUENTIAL, SPECIAL, OR INCIDENTAL DAMAGES OR
LOSS, INCLUDING WITHOUT LIMITATION, LOSS OF PROFITS, LOSS OF OPPORTUNITIES, BUSINESS INTERRUPTION AND
LOSS OF DATA, AND (2) DISCLAIMS ANY AND ALL EXPRESS OR IMPLIED WARRANTIES AND CONDITIONS RELATED TO
SALE, USE OF PRODUCT, OR INFORMATION, INCLUDING WARRANTIES OR CONDITIONS OF MERCHANTABILITY, FITNESS
FOR A PARTICULAR PURPOSE, ACCURACY OF INFORMATION, OR NONINFRINGEMENT.
• GaAs (Gallium Arsenide) is used in Product. GaAs is harmful to humans if consumed or absorbed, whether in the form of dust or vapor.
Handle with care and do not break, cut, crush, grind, dissolve chemically or otherwise expose GaAs in Product.
• Do not use or otherwise make available Product or related software or technology for any military purposes, including without limitation,
for the design, development, use, stockpiling or manufacturing of nuclear, chemical, or biological weapons or missile technology
products (mass destruction weapons). Product and related software and technology may be controlled under the applicable export
laws and regulations including, without limitation, the Japanese Foreign Exchange and Foreign Trade Law and the U.S. Export
Administration Regulations. Export and re-export of Product or related software or technology are strictly prohibited except in
compliance with all applicable export laws and regulations.
• Please contact your TOSHIBA sales representative for details as to environmental matters such as the RoHS compatibility of Product.
Please use Product in compliance with all applicable laws and regulations that regulate the inclusion or use of controlled substances,
including without limitation, the EU RoHS Directive. TOSHIBA ASSUMES NO LIABILITY FOR DAMAGES OR LOSSES
OCCURRING AS A RESULT OF NONCOMPLIANCE WITH APPLICABLE LAWS AND REGULATIONS.
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