TLP2408(V4-TPL)_技术文档

TLP2408

Photocouplers GaAℓAs Infrared LED & Photo IC

TLP2408

1. Applications

•

High-Speed Digital Interfacing for Instrumentation and Control Devices

Communications Equipment

Intelligent Power Module Signal Isolation

2. General

The Toshiba TLP2408 consists of a GaAℓAs light-emitting diode coupled with a high-gain, high-speed photo

detector. It is housed in the 8-pin SO8 package. The detector has a totem-pole output stage with current sourcing

and sinking capabilities. The TLP2408 has an internal Faraday shield that provides a guaranteed common-mode

transient immunity of 15 kV/µs.

The TLP2408 has a logic inverter output. A buffer output version, the TLP2405, is also available.

3. Features

(1) Inverter logic type (totem pole output)

(2) Package: SO8

(3) Supply voltage: 4.5 to 20 V

(4) Threshold input current: 1.6 mA (max)

(5) Propagation delay time: 250 ns (max)

(6) Common-mode transient immunity: 15 kV/µs (min)

(7) Operating temperature range: -40 to 100 

(8) Isolation voltage: 3750 Vrms (min)

(9) Safety standards

UL-approved: UL1577, File No.E67349

cUL-approved: CSA Component Acceptance Service No.5A File No.E67349

VDE-approved: EN60747-5-5 (Note 1)

Note 1: When an EN60747-5-5 approved type is needed, please designate the Option (V4).

4. Packaging and Pin Assignment

1: N.C.

2: Anode

3: Cathode

4: N.C.

5: GND

6: VO (Output)

7: N.C.

8: VCC

11-5K1S

Start of commercial production

2010-03

2016-01-14

Rev.2.0

1

TLP2408

5. Internal Circuit (Note)

Note: A 0.1-µF bypass capacitor must be connected between pin 8 and pin 5.

6. Principle of Operation

6.1. Truth Table

Input

LED

Output

H

L

ON

L

OFF

H

6.2. Mechanical Parameters

Characteristics

Min

Unit

mm

Creepage distances

4.0



Clearance distances

Internal isolation thickness

2016-01-14

Rev.2.0

2

TLP2408

7. Absolute Maximum Ratings (Note) (Unless otherwise specified, Ta = 25 )

Characteristics

Input forward current

Symbol

Note

Rating

Unit

LED

(Ta ≤ 85 )

(Ta ≥ 85 )

IF

∆IF/∆Ta

VR

25

-0.67

5

mA

mA/

V

Input forward current derating

Input reverse voltage

Input power dissipation

PD

40

mW

Input power dissipation

derating

(Ta ≥ 85 )

∆PD/∆Ta

-1.0

mW/

Detector Output current

Output current

(Ta ≤ 25 )

IO

25 / -15

5 / -5

mA

(Ta = 100 )

Output voltage

VO

-0.5 to 20

75

V

Output power dissipation

PO

mW

Output power dissipation

derating

(Ta ≥ 25 )

∆PO/∆Ta

-0.8

mW/

Supply voltage

Common Operating temperature

Storage temperature

VCC

Topr

Tstg

Tsol

BVS

-0.5 to 20

-40 to 100

-55 to 125

260

V



Lead soldering temperature

Isolation voltage

(10 s)



AC, 60 s, R.H. ≤ 60 %

(Note 1)

3750

Vrms

Note: Using continuously under heavy loads (e.g. the application of high temperature/current/voltage and the

significant change in temperature, etc.) may cause this product to decrease in the reliability significantly even

if the operating conditions (i.e. operating temperature/current/voltage, etc.) are within the absolute maximum

ratings.

Please design the appropriate reliability upon reviewing the Toshiba Semiconductor Reliability Handbook

("Handling Precautions"/"Derating Concept and Methods") and individual reliability data (i.e. reliability test

report and estimated failure rate, etc).

Note 1: This device is considered as a two-terminal device: Pins 1, 2, 3 and 4 are shorted together, and pins 5, 6, 7

and 8 are shorted together.

8. Recommended Operating Conditions (Note)

Characteristics

Symbol

Note

Min

Typ.

Max

Unit

Input on-state current

Input off-state voltage

Supply voltage

IF(ON)

VF(OFF)

VCC

2

0



10

0.8

20

mA

V

(Note 1)

4.5

-40

V

Operating temperature

Topr

100



Note: The recommended operating conditions are given as a design guide necessary to obtain the intended

performance of the device. Each parameter is an independent value. When creating a system design using

this device, the electrical characteristics specified in this datasheet should also be considered.

Note: A ceramic capacitor (0.1 µF) should be connected between pin 8 and pin 5 to stabilize the operation of a high-

gain linear amplifier. Otherwise, this photocoupler may not switch properly. The bypass capacitor should be

placed within 1 cm of each pin.

Note 1: Denotes the operating range, not the recommended operating condition.

2016-01-14

Rev.2.0

3

TLP2408

9. Electrical Characteristics (Note)

(Unless otherwise specified, Ta = -40 to 100 , VCC = 4.5 to 20 V)

Test

Circuit

Characteristics

Symbol

Note

Test Condition

Min

Typ.

Max

Unit

Input forward voltage

VF

IF = 10 mA, Ta = 25 

1.40

1.57

-1.8

1.80

V

Input forward voltage

temperature coefficient

∆VF/∆Ta

IF = 10 mA



mV/

Input reverse current

Input capacitance

IR

Ct

VR = 5 V, Ta = 25 

V = 0 V, f = 1 MHz



60

10



µA

pF

V

Low-level output voltage

VOL

Fig.

IO = 3.5 mA, IF = 5 mA

0.2

0.6

12.1.1

High-level output voltage

VOH

(Note 1)

Fig.

VCC = 4.5 V, IO = -2.6 mA,

2.7

3.5

19



V

12.1.2 VF = 0.8 V

VCC = 20 V, IO = -2.6 mA,

17.4

VF = 0.8 V

Low-level supply current

High-level supply current

ICCL

ICCH

IOSL

Fig.

12.1.3

VCC = 5.5 V, IF = 5 mA

VCC = 20 V, IF = 5 mA

VCC = 5.5 V, VF = 0 V

VCC = 20 V, VF = 0 V

VCC = VO = 5.5 V,



15



80

3.0



mA

Fig.

12.1.4

Low-level short-circuit output

current

(Note 2)

Fig.

12.1.5 IF = 5 mA

VCC = VO = 20 V,

IF = 5 mA

20

-5

90

-15

-20



High-level short-circuit output

current

IOSH

Fig.

VCC = 5.5 V, VF = 0 V,

mA

12.1.6 VO = GND

VCC = 20 V, VF = 0 V,

-10

VO = GND

Threshold input current (H/L)

Threshold input voltage (L/H)

Input current hysteresis

IFHL

VFLH

IHYS

IO = 3.5 mA, VO < 0.6 V

IO = -2.6 mA, VO > 2.4 V

VCC = 5 V



0.8



0.4



1.6



mA

V

0.05



mA

Note: All typical values are at Ta = 25 .

Note 1: VOH = VCC - VO (V)

Note 2: Duration of output short circuit time should not exceed 10 ms.

10. Isolation Characteristics (Unless otherwise specified, Ta = 25 )

Characteristics

Symbol

CS

Note

Test Condition

Min

Typ.

1.0

Max

Unit

pF

Total capacitance (input to

output)

(Note 1) VS = 0 V, f = 1 MHz



Isolation resistance

Isolation voltage

RS

(Note 1) VS = 500 V, R.H. ≤ 60 %

(Note 1) AC, 60 s

AC, 1 s in oil

1×1012

3750



1014



Ω

BVS

Vrms

10000

DC, 60 s in oil



Vdc

Note 1: This device is considered as a two-terminal device: Pins 1, 2, 3 and 4 are shorted together, and pins 5, 6, 7

and 8 are shorted together.

2016-01-14

Rev.2.0

4

TLP2408

11. Switching Characteristics (Note)

(Unless otherwise specified, Ta = -40 to 100 , VCC = 4.5 to 20 V)

Test

Circuit

Characteristics

Symbol

Note

Test Condition

Min

Typ.

Max

Unit

ns

Propagation delay time (L/H)

Propagation delay time (H/L)

Pulse width distortion

Rise time

tpLH

Fig. IF = 3 → 0 mA

12.1.7,

Fig.

12.1.8

30



15

110

100



250

220

75

tpHL

IF = 0 → 3 mA

|tpHL-tpLH|



tr

tf

IF = 3 → 0 mA, VCC = 5 V

IF = 0 → 3 mA, VCC = 5 V

30

Fall time

30

75

Common-mode transient

immunity at output high

CMH

Fig. VCM = 1000 Vp-p, IF = 0 mA,

12.1.9 VCC = 20 V, Ta = 25 



kV/µs

Common-mode transient

immunity at output low

CML

VCM = 1000 Vp-p, IF = 5 mA,

VCC = 20 V, Ta = 25 

-15



Note: All typical values are at Ta = 25 .

2016-01-14

Rev.2.0

5

TLP2408

12. Test Circuits and Characteristics Curves

12.1. Test Circuits

Fig. 12.1.1 VOL Test Circuit

Fig. 12.1.2 VOH Test Circuit

Fig. 12.1.3 ICCL Test Circuit

Fig. 12.1.4 ICCH Test Circuit

Fig. 12.1.5 IOSL Test Circuit

Fig. 12.1.6 IOSH Test Circuit

Fig. 12.1.7 Switching Time Test Circuit and Waveform

2016-01-14

Rev.2.0

6

TLP2408

Fig. 12.1.8 Switching Time Test Circuit and Waveform

Fig. 12.1.9 Common-Mode Transient Immunity Test Circuit and Waveform

2016-01-14

Rev.2.0

7

TLP2408

13. Soldering and Storage

13.1. Precautions for Soldering

The soldering temperature should be controlled as closely as possible to the conditions shown below, irrespective

of whether a soldering iron or a reflow soldering method is used.

•

When using soldering reflow.

The soldering temperature profile is based on the package surface temperature.

(See the figure shown below, which is based on the package surface temperature.)

Reflow soldering must be performed once or twice.

The mounting should be completed with the interval from the first to the last mountings being 2 weeks.

Fig. 13.1.1 An Example of a Temperature Profile Fig. 13.1.2 An Example of a Temperature Profile

When Sn-Pb Eutectic Solder Is Used When Lead(Pb)-Free Solder Is Used

•

When using soldering flow (Applicable to both eutectic solder and Lead(Pb)-Free solder)

Preheat the device at a temperature of 150  (package surface temperature) for 60 to 120 seconds.

Mounting condition of 260  within 10 seconds is recommended.

Flow soldering must be performed once.

•

When using soldering Iron

Complete soldering within 10 seconds for lead temperature not exceeding 260  or within 3 seconds not

exceeding 350 

Heating by soldering iron must be done only once per lead.

13.2. Precautions for General Storage

•

Avoid storage locations where devices may be exposed to moisture or direct sunlight.

Follow the precautions printed on the packing label of the device for transportation and storage.

Keep the storage location temperature and humidity within a range of 5  to 35  and 45 % to 75 %,

respectively.

•

Do not store the products in locations with poisonous gases (especially corrosive gases) or in dusty

conditions.

Store the products in locations with minimal temperature fluctuations. Rapid temperature changes during

storage can cause condensation, resulting in lead oxidation or corrosion, which will deteriorate the

solderability of the leads.

•

When restoring devices after removal from their packing, use anti-static containers.

Do not allow loads to be applied directly to devices while they are in storage.

If devices have been stored for more than two years under normal storage conditions, it is recommended

that you check the leads for ease of soldering prior to use.

2016-01-14

Rev.2.0

8

TLP2408

14. Land Pattern Dimensions (for reference only)

Unit: mm

15. Marking

2016-01-14

Rev.2.0

9

TLP2408

16. EN60747-5-5 Option (V4) Specification

•

Part number: TLP2408(F) (Note 1)

•

The following part naming conventions are used for the devices that have been qualified according to

option (V4) of EN60747.

Example: TLP2408(V4-TPL,F)

V4: EN60747 option

TPL: Tape type

F: [[G]]/RoHS COMPATIBLE (Note 2)

Note 1: Use TOSHIBA standard type number for safety standard application.

e.g., TLP2408(V4-TPL,F) → TLP2408

Note 2: Please contact your Toshiba sales representative for details on environmental information such as the product's

RoHS compatibility.

RoHS is the Directive 2011/65/EU of the European Parliament and of the Council of 8 June 2011 on the

restriction of the use of certain hazardous substances in electrical and electronics equipment.

Fig. 16.1 EN60747 Insulation Characteristics

2016-01-14

Rev.2.0

10

TLP2408

Table Insulation Related Specifications (Note)

Insulation Related Parameters

Symbol

TLP2408

Minimum creepage distance

Minimum clearance

Cr

Cl

4.0 mm



Minimum insulation thickness

Comparative tracking index

ti

CTI

175

Note: If a printed circuit is incorporated, the creepage distance and clearance may be reduced below this value.

(e.g., at a standard distance between soldering eye centers of 3.5 mm). If this is not permissible, the user shall

take suitable measures.

Note: This photocoupler is suitable for safe electrical isolation only within the safety limit data.

Maintenance of the safety data shall be ensured by means of protective circuits.

Fig. 16.2 Marking on Packing for EN60747

Fig. 16.3 Marking Example (Note)

Note: The above marking is applied to the photocouplers that have been qualified according to option (V4) of

EN60747.

2016-01-14

Rev.2.0

11

TLP2408

Fig. 16.4 Measurement Procedure

2016-01-14

Rev.2.0

12

TLP2408

Package Dimensions

Unit: mm

Weight: 0.11 g (typ.)

Package Name(s)

TOSHIBA: 11-5K1S

2016-01-14

Rev.2.0

13

TLP2408

RESTRICTIONS ON PRODUCT USE

•

Toshiba Corporation, and its subsidiaries and affiliates (collectively "TOSHIBA"), reserve the right to make changes to the information

in this document, and related hardware, software and systems (collectively "Product") without notice.

This document and any information herein may not be reproduced without prior written permission from TOSHIBA. Even with TOSHIBA's

written permission, reproduction is permissible only if reproduction is without alteration/omission.

ThoughTOSHIBAworkscontinuallytoimproveProduct'squalityandreliability,Productcanmalfunctionorfail.Customersareresponsible

for complying with safety standards and for providing adequate designs and safeguards for their hardware, software and systems which

minimize risk and avoid situations in which a malfunction or failure of Product could cause loss of human life, bodily injury or damage

to property, including data loss or corruption. Before customers use the Product, create designs including the Product, or incorporate

the Product into their own applications, customers must also refer to and comply with (a) the latest versions of all relevant TOSHIBA

information, including without limitation, this document, the specifications, the data sheets and application notes for Product and the

precautions and conditions set forth in the "TOSHIBA Semiconductor Reliability Handbook" and (b) the instructions for the application

with which the Product will be used with or for. Customers are solely responsible for all aspects of their own product design or applications,

including but not limited to (a) determining the appropriateness of the use of this Product in such design or applications; (b) evaluating

and determining the applicability of any information contained in this document, or in charts, diagrams, programs, algorithms, sample

application circuits, or any other referenced documents; and (c) validating all operating parameters for such designs and applications.

TOSHIBA ASSUMES NO LIABILITY FOR CUSTOMERS' PRODUCT DESIGN OR APPLICATIONS.

•

PRODUCT IS NEITHER INTENDED NOR WARRANTED FOR USE IN EQUIPMENTS OR SYSTEMS THAT REQUIRE

EXTRAORDINARILY HIGH LEVELS OF QUALITY AND/OR RELIABILITY, AND/OR A MALFUNCTION OR FAILURE OF WHICH MAY

CAUSE LOSS OF HUMAN LIFE, BODILY INJURY, SERIOUS PROPERTY DAMAGE AND/OR SERIOUS PUBLIC IMPACT

("UNINTENDEDUSE").Exceptforspecificapplicationsasexpresslystatedinthisdocument, UnintendedUseincludes, withoutlimitation,

equipment used in nuclear facilities, equipment used in the aerospace industry, medical equipment, equipment used for automobiles,

trains, ships and other transportation, traffic signaling equipment, equipment used to control combustions or explosions, safety devices,

elevators and escalators, devices related to electric power, and equipment used in finance-related fields. IF YOU USE PRODUCT FOR

UNINTENDED USE, TOSHIBA ASSUMES NO LIABILITY FOR PRODUCT. For details, please contact your TOSHIBA sales

representative.

•

Do not disassemble, analyze, reverse-engineer, alter, modify, translate or copy Product, whether in whole or in part.

Product shall not be used for or incorporated into any products or systems whose manufacture, use, or sale is prohibited under any

applicable laws or regulations.

•

The information contained herein is presented only as guidance for Product use. No responsibility is assumed by TOSHIBA for any

infringement of patents or any other intellectual property rights of third parties that may result from the use of Product. No license to any

intellectual property right is granted by this document, whether express or implied, by estoppel or otherwise.

ABSENT A WRITTEN SIGNED AGREEMENT, EXCEPT AS PROVIDED IN THE RELEVANT TERMS AND CONDITIONS OF SALE

FOR PRODUCT, AND TO THE MAXIMUM EXTENT ALLOWABLE BY LAW, TOSHIBA (1) ASSUMES NO LIABILITY WHATSOEVER,

INCLUDING WITHOUT LIMITATION, INDIRECT, CONSEQUENTIAL, SPECIAL, OR INCIDENTAL DAMAGES OR LOSS, INCLUDING

WITHOUT LIMITATION, LOSS OF PROFITS, LOSS OF OPPORTUNITIES, BUSINESS INTERRUPTION AND LOSS OF DATA, AND

(2) DISCLAIMS ANY AND ALL EXPRESS OR IMPLIED WARRANTIES AND CONDITIONS RELATED TO SALE, USE OF PRODUCT,

OR INFORMATION, INCLUDING WARRANTIES OR CONDITIONS OF MERCHANTABILITY, FITNESS FOR A PARTICULAR

PURPOSE, ACCURACY OF INFORMATION, OR NONINFRINGEMENT.

•

GaAs (Gallium Arsenide) is used in Product. GaAs is harmful to humans if consumed or absorbed, whether in the form of dust or vapor.

Handle with care and do not break, cut, crush, grind, dissolve chemically or otherwise expose GaAs in Product.

Do not use or otherwise make available Product or related software or technology for any military purposes, including without limitation,

for the design, development, use, stockpiling or manufacturing of nuclear, chemical, or biological weapons or missile technology products

(mass destruction weapons). Product and related software and technology may be controlled under the applicable export laws and

regulations including, without limitation, the Japanese Foreign Exchange and Foreign Trade Law and the U.S. Export Administration

Regulations. Export and re-export of Product or related software or technology are strictly prohibited except in compliance with all

applicable export laws and regulations.

•

Please contact your TOSHIBA sales representative for details as to environmental matters such as the RoHS compatibility of Product.

Please use Product in compliance with all applicable laws and regulations that regulate the inclusion or use of controlled substances,

including without limitation, the EU RoHS Directive. TOSHIBA ASSUMES NO LIABILITY FOR DAMAGES OR LOSSES OCCURRING

AS A RESULT OF NONCOMPLIANCE WITH APPLICABLE LAWS AND REGULATIONS.

2016-01-14

Rev.2.0

14


型号：	TLP2408(V4-TPL)
厂家：	TOSHIBA
描述：	LOGIC OUTPUT OPTOCOUPLER 输出元件
文件：	总14页 (文件大小：342K)
中文：	中文翻译
下载：	下载PDF数据表文档文件

TLP2408(V4-TPL) [TOSHIBA]

相关型号：

TLP2408(V4-TPL,F)

TLP2409

TLP2409(F)

TLP2409(TP,F)

TLP2409(V4)

TLP2409(V4-TP)

TLP2409(V4-TP,F)

TLP240A(D4,F(O

TLP240A(D4,LF1,F(O

TLP240A(D4,TP5,F(O

TLP240A(F

TLP240A(LF1,F