TLP2662(TP1,F) [TOSHIBA]
LOGIC OUTPUT OPTOCOUPLER;
| 型号： | TLP2662(TP1,F) |
| 厂家： | 
TOSHIBA |
| 描述： | LOGIC OUTPUT OPTOCOUPLER 输出元件 光电 |
| 文件： | 总19页 (文件大小：560K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
TLP2662,TLP2662F
Photocouplers GaAℓAs Infrared LED & Photo IC
TLP2662,TLP2662F
1. Applications
•
•
•
Factory Automation (FA)
High-Speed Digital Interfacing for Instrumentation and Control Devices
Measuring Instruments
2. General
TheTLP2662/TLP2662Fconsistsofhigh-intensityGaAℓAsinfraredlight-emittingdiodes(LEDs)opticallycoupled
to a high-gain, high-speed photoreceptor chip. The TLP2662/TLP2662F guarantees operation at up to 125 and
on supplies from 2.7 V to 5.5 V. It is offered in the DIP8 package. With two LED-photoreceptor pairs, the TLP2662/
TLP2662Fhelpssaveboardspace. Aninternalnoiseshieldprovidessuperiorcommon-moderejectionforimproved
noise immunity of ±20 kV/µs.
3. Features
(1) Inverter logic type (open collector output)
(2) Package: DIP8
(3) Operating temperature: -40 to 125
(4) Supply voltage: 2.7 to 5.5 V
(5) Data transfer rate: 10 MBd (typ.) (NRZ)
(6) Threshold input current: 5.0 mA (max)
(7) Supply current: 8 mA (max)
(8) Common-mode transient immunity: ±20 kV/µs (min)
(9) Isolation voltage: 5000 Vrms (min)
(10) Safety standards
UL-approved: UL1577, File No.E67349
cUL-approved: CSA Component Acceptance Service No.5A File No.E67349
VDE-approved: EN60747-5-5 (Note 1)
Note 1: When an EN60747-5-5 approved type is needed, please designate the Option (D4).
©2015 Toshiba Corporation
2015-11-30
Rev.5.0
1
TLP2662,TLP2662F
4. Packaging (Note)
TLP2662
TLP2662(LF1)
TLP2662(LF5)
11-10C405S
11-10C401S
11-10C4S
TLP2662F
TLP2662F(LF4)
11-10C404S
11-10C402S
Note: Lead-formed product: (LF1), (LF4), (LF5)
5. Pin Assignment
1: Anode 1
2: Cathode 1
3: Cathode 2
4: Anode 2
5: GND
6: VO2 (Output 2)
7: VO1 (Output 1)
8: VCC
©2015 Toshiba Corporation
2015-11-30
Rev.5.0
2
TLP2662,TLP2662F
6. Internal Circuit
7. Principle of Operation
7.1. Truth Table
Input
LED
Output
H
L
ON
L
OFF
H
7.2. Mechanical Parameters
7.62-mm pitch
10.16-mm pitch
TLP2662F
Characteristics
Unit
TLP2662
7.0 (min)
7.0 (min)
0.4 (min)
Creepage distances
8.0 (min)
8.0 (min)
0.4 (min)
mm
mm
mm
Clearance distances
Internal isolation thickness
©2015 Toshiba Corporation
2015-11-30
Rev.5.0
3
TLP2662,TLP2662F
8. Absolute Maximum Ratings (Note) (Unless otherwise specified, Ta = 25 )
Characteristics
Test Condition
Symbol
Note
Rating
Unit
LED
Input forward current
IF
∆IF/∆Ta
IFP
(Note 1)
(Note 1)
20
-0.6
40
mA
mA/
mA
Input forward current derating
Input forward current (pulsed)
(Ta ≥ 116 )
(Note 1), (Note
2)
Input forward current derating
(pulsed)
(Ta ≥ 116 )
∆IFP/∆Ta
IFPT
(Note 1)
-1.17
1
mA/
A
Peak transient input forward
current
(Note 1), (Note
3)
Peak transient input forward
current derating
(Ta ≥ 116 )
(Ta ≥ 116 )
∆IFPT/∆Ta
(Note 1)
-29.4
mA/
Input power dissipation
PD
(Note 1)
(Note 1)
40
mW
Input power dissipation
derating
∆PD/∆Ta
-1.17
mW/
Input reverse voltage
VR
IO
(Note 1)
(Note 1)
(Note 1)
5
25
6
V
mA
V
Detector Output current
Output voltage
VO
Supply voltage
VCC
PO
6
V
Output power dissipation
(Note 1)
(Note 1)
85
-2.1
mW
mW/
Output power dissipation
derating
(Ta ≥ 110 )
∆PO/∆Ta
Common Operating temperature
Storage temperature
Topr
Tstg
Tsol
BVS
-40 to 125
-55 to 150
260
Lead soldering temperature
Isolation voltage
(10 s)
AC, 60 s., R.H. ≤ 60 %
(Note 4)
5000
Vrms
Note: Using continuously under heavy loads (e.g. the application of high temperature/current/voltage and the
significant change in temperature, etc.) may cause this product to decrease in the reliability significantly even
if the operating conditions (i.e. operating temperature/current/voltage, etc.) are within the absolute maximum
ratings.
Please design the appropriate reliability upon reviewing the Toshiba Semiconductor Reliability Handbook
("Handling Precautions"/"Derating Concept and Methods") and individual reliability data (i.e. reliability test
report and estimated failure rate, etc).
Note 1: Each channel
Note 2: Pulse width (PW) ≤ 1 ms, duty = 50 %
Note 3: Pulse width (PW) ≤ 1 µs, duty = 300 pps
Note 4: This device is considered as a two-terminal device: Pins 1, 2, 3 and 4 are shorted together, and pins 5, 6, 7
and 8 are shorted together.
9. Recommended Operating Conditions (Note)
Characteristics
Symbol
Note
Min
6
Typ.
Max
15
Unit
mA
Input on-state current
IF(ON)
(Note 1), (Note
2)
Input off-state voltage
Supply voltage
VF(OFF)
VCC
(Note 1)
(Note 3)
0
3.3/5.0
0.8
5.5
125
V
V
2.7
-40
Operating temperature
Topr
Note: The recommended operating conditions are given as a design guide necessary to obtain the intended
performance of the device. Each parameter is an independent value. When creating a system design using
this device, the electrical characteristics specified in this datasheet should also be considered.
Note: A ceramic capacitor (0.1 µF) should be connected between pin 8 and pin 5 to stabilize the operation of a high-
gain linear amplifier. Otherwise, this photocoupler may not switch properly. The bypass capacitor should be
placed within 1 cm of each pin.
Note 1: Each channel
Note 2: The rise and fall times of the input on-current should be less than 0.5 µs.
Note 3: Denotes the operating range, not the recommended operating condition.
©2015 Toshiba Corporation
2015-11-30
Rev.5.0
4
TLP2662,TLP2662F
10. Electrical Characteristics (Note)
(Unless otherwise specified, Ta = -40 to 125 , VCC = 2.7 to 5.5 V)
Test
Circuit
Characteristics
Symbol
VF
Note
Test Condition
Min
Typ.
Max
Unit
Input forward voltage
(Note 1)
IF = 10 mA, Ta = 25
1.45
1.55
-2.0
1.7
V
Input forward voltage
temperature coefficient
∆VF/∆Ta (Note 1)
IF = 10 mA
mV/
Input reverse current
Input capacitance
IR
Ct
(Note 1)
(Note 1)
(Note 1)
VR = 5 V, Ta = 25
60
10
50
µA
pF
µA
V = 0 V, f = 1 MHz, Ta = 25
VF = 0.8 V, VO = 5.5 V,
High-level output current
IOH
Fig.
13.1.1 VCC = 5.5 V
Fig.
VF = 0.8 V, VO = 5.5 V,
0.2
3.8
3.4
1.3
10
0.6
8
µA
V
13.1.1 VCC = 5.5 V, Ta = 25
Low-level output voltage
Low-level supply current
High-level supply current
Threshold input current (H/L)
VOL
ICCL
ICCH
IFHL
(Note 1)
Fig.
IF = 10 mA,
13.1.2 IO = 13 mA (Sinking)
Fig.
13.1.4
IF1 =IF2 = 10 mA
IF1 =IF2 = 0 mA
mA
mA
mA
mA
Fig.
13.1.3
8
(Note 1)
IO = 13 mA (Sinking),
VO < 0.6 V, Ta = 25
2.8
5.0
IO = 13 mA (Sinking),
VO < 0.6 V
Note: All typical values are at Ta = 25 .
Note 1: Each channel
11. Isolation Characteristics (Unless otherwise specified, Ta = 25 )
Characteristics
Symbol
Note
Test Condition
Min
Typ.
Max
Unit
Total capacitance (input to output)
Isolation resistance
CS
RS
(Note 1) VS = 0 V, f = 1 MHz
(Note 1) VS = 500 V, R.H. ≤ 60 %
(Note 1) AC, 60 s
1 × 1012
5000
1.0
1014
pF
Ω
Isolation voltage
BVS
Vrms
Vrms
Vdc
AC, 1 s in oil
10000
10000
DC, 60 s in oil
Note 1: This device is considered as a two-terminal device: Pins 1, 2, 3 and 4 are shorted together, and pins 5, 6, 7
and 8 are shorted together.
©2015 Toshiba Corporation
2015-11-30
Rev.5.0
5
TLP2662,TLP2662F
12. Switching Characteristics (Note)
(Unless otherwise specified, Ta = -40 to 125 , VCC = 2.7 to 5.5 V (Each channel))
Test
Circuit
Characteristics
Symbol
Note
Test Condition
Min
Typ.
27
Max
75
Unit
ns
Propagation delay time
(H/L)
tpHL
(Note 1)
Fig.
IF = 0 → 7.5 mA, RL = 350 Ω,
13.1.5 CL = 15 pF
Propagation delay time
(L/H)
tpLH
(Note 1)
(Note 1)
Fig.
IF = 7.5 → 0 mA, RL = 350 Ω,
25
75
35
40
ns
ns
13.1.5 CL = 15 pF
Pulse width distortion
|tpHL-
tpLH|
Fig.
IF = 0 ←→ 7.5 mA,
13.1.5 RL = 350 Ω, CL = 15 pF
Propagation delay
skew (device to device)
tpsk
(Note 1), (Note
2)
Fig.
IF = 0 ←→ 7.5 mA,
-40
ns
13.1.5 RL = 350 Ω, CL = 15 pF
Fall time
tf
(Note 1)
Fig. IF = 0 → 7.5 mA, RL = 350 Ω,
13.1.5 CL = 15 pF
3
ns
Rise time
tr
(Note 1)
Fig.
IF = 7.5 → 0 mA, RL = 350 Ω,
12
±25
ns
13.1.5 CL = 15 pF
Common-mode
transient immunity at
output high
CMH
Fig.
VCM = 1000 Vp-p, IF = 0 mA,
±20
kV/µs
13.1.6 VCC = 3.3 V/5 V, Ta = 25
Common-mode
transient immunity at
output low
CML
Fig.
VCM = 1000 Vp-p, IF = 10 mA,
±20
±25
kV/µs
13.1.6 VCC = 3.3 V/5 V, Ta = 25
Note: All typical values are at Ta = 25 .
Note 1: f = 5 MHz, duty = 50 %, input current tr = tf = 5 ns, CL is approximately 15 pF which includes probe and stray
wiring capacitance.
Note 2: The propagation delay skew, tpsk, is equal to the magnitude of the worst-case difference in tpHL and/or tpLH
that will be seen between units at the same given conditions (supply voltage, input current, temperature, etc).
©2015 Toshiba Corporation
2015-11-30
Rev.5.0
6
TLP2662,TLP2662F
13. Test Circuits and Characteristics Curves
13.1. Test Circuits
Fig. 13.1.1 IOH Test Circuit
Fig. 13.1.2 VOL Test Circuit
Fig. 13.1.3 ICCH Test Circuit
Fig. 13.1.4 ICCL Test Circuit
Fig. 13.1.5 Switching Time Test Circuit and Waveform
Fig. 13.1.6 Common-Mode Transient Immunity and Waveform
©2015 Toshiba Corporation
2015-11-30
Rev.5.0
7
TLP2662,TLP2662F
13.2. Characteristics Curves (Note)
Fig. 13.2.1 IF - VF
Fig. 13.2.2 IF - Ta
Fig. 13.2.3 VOL - Ta
Fig. 13.2.4 VOL - Ta
Fig. 13.2.5 VO - IF
Fig. 13.2.6 VO - IF
©2015 Toshiba Corporation
2015-11-30
Rev.5.0
8
TLP2662,TLP2662F
Fig. 13.2.7 IFHL - Ta
Fig. 13.2.9 ICCH / ICCL - Ta
Fig. 13.2.11 tpLH / tpHL - Ta
Fig. 13.2.8 IFHL - Ta
Fig. 13.2.10 ICCH / ICCL - Ta
Fig. 13.2.12 |tpHL-tpLH| - Ta
©2015 Toshiba Corporation
2015-11-30
Rev.5.0
9
TLP2662,TLP2662F
Fig. 13.2.13 tpLH / tpHL - Ta
Fig. 13.2.15 tpLH / tpHL - IF
Fig. 13.2.17 tpLH / tpHL - IF
Fig. 13.2.14 |tpHL-tpLH| - Ta
Fig. 13.2.16 |tpHL-tpLH| - IF
Fig. 13.2.18 |tpHL-tpLH| - IF
NOTE: The above characteristics curves are presented for reference only and not guaranteed by production test,
unless otherwise noted.
©2015 Toshiba Corporation
2015-11-30
Rev.5.0
10
TLP2662,TLP2662F
14. Soldering and Storage
14.1. Precautions for Soldering
The soldering temperature should be controlled as closely as possible to the conditions shown below, irrespective
of whether a soldering iron or a reflow soldering method is used.
•
When using soldering reflow.
The soldering temperature profile is based on the package surface temperature.
(See the figure shown below, which is based on the package surface temperature.)
Reflow soldering must be performed once or twice.
The mounting should be completed with the interval from the first to the last mountings being 2 weeks.
Fig. 14.1.1 An Example of a Temperature Profile Fig. 14.1.2 An Example of a Temperature Profile
When Sn-Pb Eutectic Solder Is Used When Lead(Pb)-Free Solder Is Used
•
When using soldering flow (Applicable to both eutectic solder and Lead(Pb)-Free solder)
Preheat the device at a temperature of 150 (package surface temperature) for 60 to 120 seconds.
Mounting condition of 260 within 10 seconds is recommended.
Flow soldering must be performed once.
•
When using soldering Iron
Complete soldering within 10 seconds for lead temperature not exceeding 260 or within 3 seconds not
exceeding 350
Heating by soldering iron must be done only once per lead.
14.2. Precautions for General Storage
•
•
•
Avoid storage locations where devices may be exposed to moisture or direct sunlight.
Follow the precautions printed on the packing label of the device for transportation and storage.
Keep the storage location temperature and humidity within a range of 5 to 35 and 45 % to 75 %,
respectively.
•
•
Do not store the products in locations with poisonous gases (especially corrosive gases) or in dusty
conditions.
Store the products in locations with minimal temperature fluctuations. Rapid temperature changes during
storage can cause condensation, resulting in lead oxidation or corrosion, which will deteriorate the
solderability of the leads.
•
•
•
When restoring devices after removal from their packing, use anti-static containers.
Do not allow loads to be applied directly to devices while they are in storage.
If devices have been stored for more than two years under normal storage conditions, it is recommended
that you check the leads for ease of soldering prior to use.
©2015 Toshiba Corporation
2015-11-30
Rev.5.0
11
TLP2662,TLP2662F
15. Land Pattern Dimensions (for reference only)
Fig. 15.1 (LF1), (LF5) Type (Unit: mm)
Fig. 15.2 (LF4) Type (Unit: mm)
16. Marking
Fig. 16.1 TLP2662
Fig. 16.2 TLP2662F
©2015 Toshiba Corporation
2015-11-30
Rev.5.0
12
TLP2662,TLP2662F
17. EN60747-5-5 Option (D4) Specification
•
Part number: TLP2662 (Note 1)
•
The following part naming conventions are used for the devices that have been qualified according to
option (D4) of EN60747.
Example: TLP2662(D4-TP1,F)
D4: EN60747 option
TP1: Tape type
F: [[G]]/RoHS COMPATIBLE (Note 2)
Note 1: Use TOSHIBA standard type number for safety standard application.
e.g., TLP2662(D4-TP1,F) → TLP2662
Note 2: Please contact your Toshiba sales representative for details on environmental information such as the product's
RoHS compatibility.
RoHS is the Directive 2011/65/EU of the European Parliament and of the Council of 8 June 2011 on the
restriction of the use of certain hazardous substances in electrical and electronics equipment.
Fig. 17.1 EN60747 Isolation Characteristics
©2015 Toshiba Corporation
2015-11-30
Rev.5.0
13
TLP2662,TLP2662F
Fig. 17.2 Insulation Related Specifications (Note)
Note: If a printed circuit is incorporated, the creepage distance and clearance may be reduced below this value. (e.
g., at a standard distance between soldering eye centers of 7.5 mm). If this is not permissible, the user shall
take suitable measures.
Note: This photocoupler is suitable for safe electrical isolation only within the safety limit data.
Maintenance of the safety data shall be ensured by means of protective circuits.
Fig. 17.3 TLP2662 Marking Example
Fig. 17.4 TLP2662F Marking Example
Note: The above marking is applied to the photocouplers that have been qualified according to option (D4) of
EN60747.
©2015 Toshiba Corporation
2015-11-30
Rev.5.0
14
TLP2662,TLP2662F
Fig. 17.5 Measurement Procedure
©2015 Toshiba Corporation
2015-11-30
Rev.5.0
15
TLP2662,TLP2662F
Package Dimensions
Unit: mm
TLP2662
Weight: 0.54 g (typ.)
Package Name(s)
TOSHIBA: 11-10C4S
Package Dimensions
Unit: mm
TLP2662(LF1)
Weight: 0.53 g (typ.)
Package Name(s)
TOSHIBA: 11-10C401S
©2015 Toshiba Corporation
2015-11-30
Rev.5.0
16
TLP2662,TLP2662F
Package Dimensions
Unit: mm
TLP2662(LF5)
Weight: 0.53 g (typ.)
Package Name(s)
TOSHIBA: 11-10C405S
Package Dimensions
Unit: mm
TLP2662F
Weight: 0.54 g (typ.)
Package Name(s)
TOSHIBA: 11-10C402S
©2015 Toshiba Corporation
2015-11-30
Rev.5.0
17
TLP2662,TLP2662F
Package Dimensions
Unit: mm
TLP2662F(LF4)
Weight: 0.53 g (typ.)
Package Name(s)
TOSHIBA: 11-10C404S
©2015 Toshiba Corporation
2015-11-30
Rev.5.0
18
TLP2662,TLP2662F
RESTRICTIONS ON PRODUCT USE
•
•
•
Toshiba Corporation, and its subsidiaries and affiliates (collectively "TOSHIBA"), reserve the right to make changes to the information
in this document, and related hardware, software and systems (collectively "Product") without notice.
This document and any information herein may not be reproduced without prior written permission from TOSHIBA. Even with TOSHIBA's
written permission, reproduction is permissible only if reproduction is without alteration/omission.
ThoughTOSHIBAworkscontinuallytoimproveProduct'squalityandreliability,Productcanmalfunctionorfail.Customersareresponsible
for complying with safety standards and for providing adequate designs and safeguards for their hardware, software and systems which
minimize risk and avoid situations in which a malfunction or failure of Product could cause loss of human life, bodily injury or damage
to property, including data loss or corruption. Before customers use the Product, create designs including the Product, or incorporate
the Product into their own applications, customers must also refer to and comply with (a) the latest versions of all relevant TOSHIBA
information, including without limitation, this document, the specifications, the data sheets and application notes for Product and the
precautions and conditions set forth in the "TOSHIBA Semiconductor Reliability Handbook" and (b) the instructions for the application
with which the Product will be used with or for. Customers are solely responsible for all aspects of their own product design or applications,
including but not limited to (a) determining the appropriateness of the use of this Product in such design or applications; (b) evaluating
and determining the applicability of any information contained in this document, or in charts, diagrams, programs, algorithms, sample
application circuits, or any other referenced documents; and (c) validating all operating parameters for such designs and applications.
TOSHIBA ASSUMES NO LIABILITY FOR CUSTOMERS' PRODUCT DESIGN OR APPLICATIONS.
•
PRODUCT IS NEITHER INTENDED NOR WARRANTED FOR USE IN EQUIPMENTS OR SYSTEMS THAT REQUIRE
EXTRAORDINARILY HIGH LEVELS OF QUALITY AND/OR RELIABILITY, AND/OR A MALFUNCTION OR FAILURE OF WHICH MAY
CAUSE LOSS OF HUMAN LIFE, BODILY INJURY, SERIOUS PROPERTY DAMAGE AND/OR SERIOUS PUBLIC IMPACT
("UNINTENDEDUSE").Exceptforspecificapplicationsasexpresslystatedinthisdocument, UnintendedUseincludes, withoutlimitation,
equipment used in nuclear facilities, equipment used in the aerospace industry, medical equipment, equipment used for automobiles,
trains, ships and other transportation, traffic signaling equipment, equipment used to control combustions or explosions, safety devices,
elevators and escalators, devices related to electric power, and equipment used in finance-related fields. IF YOU USE PRODUCT FOR
UNINTENDED USE, TOSHIBA ASSUMES NO LIABILITY FOR PRODUCT. For details, please contact your TOSHIBA sales
representative.
•
•
Do not disassemble, analyze, reverse-engineer, alter, modify, translate or copy Product, whether in whole or in part.
Product shall not be used for or incorporated into any products or systems whose manufacture, use, or sale is prohibited under any
applicable laws or regulations.
•
•
The information contained herein is presented only as guidance for Product use. No responsibility is assumed by TOSHIBA for any
infringement of patents or any other intellectual property rights of third parties that may result from the use of Product. No license to any
intellectual property right is granted by this document, whether express or implied, by estoppel or otherwise.
ABSENT A WRITTEN SIGNED AGREEMENT, EXCEPT AS PROVIDED IN THE RELEVANT TERMS AND CONDITIONS OF SALE
FOR PRODUCT, AND TO THE MAXIMUM EXTENT ALLOWABLE BY LAW, TOSHIBA (1) ASSUMES NO LIABILITY WHATSOEVER,
INCLUDING WITHOUT LIMITATION, INDIRECT, CONSEQUENTIAL, SPECIAL, OR INCIDENTAL DAMAGES OR LOSS, INCLUDING
WITHOUT LIMITATION, LOSS OF PROFITS, LOSS OF OPPORTUNITIES, BUSINESS INTERRUPTION AND LOSS OF DATA, AND
(2) DISCLAIMS ANY AND ALL EXPRESS OR IMPLIED WARRANTIES AND CONDITIONS RELATED TO SALE, USE OF PRODUCT,
OR INFORMATION, INCLUDING WARRANTIES OR CONDITIONS OF MERCHANTABILITY, FITNESS FOR A PARTICULAR
PURPOSE, ACCURACY OF INFORMATION, OR NONINFRINGEMENT.
•
•
GaAs (Gallium Arsenide) is used in Product. GaAs is harmful to humans if consumed or absorbed, whether in the form of dust or vapor.
Handle with care and do not break, cut, crush, grind, dissolve chemically or otherwise expose GaAs in Product.
Do not use or otherwise make available Product or related software or technology for any military purposes, including without limitation,
for the design, development, use, stockpiling or manufacturing of nuclear, chemical, or biological weapons or missile technology products
(mass destruction weapons). Product and related software and technology may be controlled under the applicable export laws and
regulations including, without limitation, the Japanese Foreign Exchange and Foreign Trade Law and the U.S. Export Administration
Regulations. Export and re-export of Product or related software or technology are strictly prohibited except in compliance with all
applicable export laws and regulations.
•
Please contact your TOSHIBA sales representative for details as to environmental matters such as the RoHS compatibility of Product.
Please use Product in compliance with all applicable laws and regulations that regulate the inclusion or use of controlled substances,
including without limitation, the EU RoHS Directive. TOSHIBA ASSUMES NO LIABILITY FOR DAMAGES OR LOSSES OCCURRING
AS A RESULT OF NONCOMPLIANCE WITH APPLICABLE LAWS AND REGULATIONS.
©2015 Toshiba Corporation
2015-11-30
Rev.5.0
19
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