TLP2745 [TOSHIBA]
GaAâAs Infrared LED & Photo IC;
| 型号： | TLP2745 |
| 厂家： | 
TOSHIBA |
| 描述： | GaAâAs Infrared LED & Photo IC |
| 文件： | 总20页 (文件大小：1140K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
TLP2745
Photocouplers GaAℓAs Infrared LED & Photo IC
TLP2745
1. Applications
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•
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Intelligent Power Module Signal Isolation
Programmable Logic Controllers (PLCs)
High-Speed Digital Interfacing for Instrumentation and Control Devices
2. General
The Toshiba TLP2745 consists of high-output GaAℓAs light-emitting diode coupled with a high-gain, high-speed
photo detector. It is housed in a thin SO6L package of 2.3 mm (max). The TLP2745 has guaranteed the isolation
voltage 5 kVrms and compliant with international safety standards for reinforced insulation. This product can
operate in power supply voltage 4.5 V to 30 V with the maximum operative temperature of 110 . Since TLP2745
has guaranteed 3 mA low supply current (ICCL/ICCH), and 1.6 mA low threshold input current(IFLH), it contributes
to energy saving of devices. It can drive directly from a microcomputer for a low input current. The detector has
a totem-pole output stage with current sourcing and sinking capabilities. The TLP2745 has an internal Faraday
shield that provides a guaranteed common-mode transient immunity of ±30 kV/µs. The TLP2745 has a buffer
output. An inverter output version, the TLP2748, is also available.
3. Features
(1) Buffer logic type (totem pole output)
(2) Package: SO6L
(3) Operating temperature: -40 to 110
(4) Supply voltage: 4.5 to 30 V
(5) Threshold input current: 1.6 mA (max)
(6) Supply current: 3 mA (max)
(7) Propagation delay time: 120 ns (max)
(8) Pulse width distortion: 40 ns (max)
(9) Common-mode transient immunity: ±30 kV/µs (min)
(10) Isolation voltage: 5000 Vrms (min)
(11) Safety standards
UL-approved: UL1577, File No.E67349
cUL-approved: CSA Component Acceptance Service No.5A File No.E67349
VDE-approved: EN60747-5-5, EN60065, EN60950-1, EN 62368-1 (Note 1)
Note 1: When a VDE approved type is needed, please designate the Option (D4).
Start of commercial production
2015-05
©2015-2018
2018-05-07
Rev.7.0
1
Toshiba Electronic Devices & Storage Corporation
TLP2745
4. Packaging (Note)
TLP2745
TLP2745(LF4)
11-4N1A
11-4N101A
Note: Lead-formed product: (LF4)
5. Pin Assignment
1: Anode
2: N.C.
3: Cathode
4: GND
5: VO (Output)
6: VCC
6. Internal Circuit (Note)
Note: A 0.1-µF bypass capacitor must be connected between pin 6 and pin 4.
©2015-2018
Toshiba Electronic Devices & Storage Corporation
2018-05-07
Rev.7.0
2
TLP2745
7. Principle of Operation
7.1. Truth Table
Input
LED
Output
H
L
ON
H
L
OFF
7.2. Mechanical Parameters
Characteristics
Min
Unit
mm
Creepage distances
8.0
8.0
0.4
Clearance distances
Internal isolation thickness
8. Absolute Maximum Ratings (Note) (Unless otherwise specified, Ta = 25 )
Characteristics
Symbol
Note
Rating
Unit
LED
Input forward current
IF
∆IF/∆Ta
IFPT
15
-0.33
1
mA
mA/
A
Input forward current derating
Peak transient input forward current
Input power dissipation
(Ta ≥ 110 )
(Ta ≥ 110 )
(Note 1)
PD
40
mW
mW/
V
Input power dissipation derating
Input reverse voltage
∆PD/∆Ta
VR
-0.89
5
Detector Output current
Output voltage
IO
50 / -50
mA
VO
-0.5 to 30
-0.5 to 30
100
V
V
Supply voltage
VCC
Output power dissipation
Output power dissipation derating
Common Operating temperature
PO
mW
mW/
(Ta ≥ 75 )
∆PO/∆Ta
Topr
-2
-40 to 110
-55 to 125
260
Storage temperature
Lead soldering temperature
Isolation voltage
Tstg
(10 s)
Tsol
(AC, 60 s, R.H. ≤ 60 %)
BVS
(Note 2)
5000
Vrms
Note: Using continuously under heavy loads (e.g. the application of high temperature/current/voltage and the
significant change in temperature, etc.) may cause this product to decrease in the reliability significantly even
if the operating conditions (i.e. operating temperature/current/voltage, etc.) are within the absolute maximum
ratings.
Please design the appropriate reliability upon reviewing the Toshiba Semiconductor Reliability Handbook
("Handling Precautions"/"Derating Concept and Methods") and individual reliability data (i.e. reliability test
report and estimated failure rate, etc).
Note 1: Pulse width (PW) ≤ 1 µs, 300 pps
Note 2: This device is considered as a two-terminal device: Pins 1, 2 and 3 are shorted together, and pins 4, 5 and 6
are shorted together.
©2015-2018
Toshiba Electronic Devices & Storage Corporation
2018-05-07
Rev.7.0
3
TLP2745
9. Recommended Operating Conditions (Note)
Characteristics
Symbol
Note
Min
Typ.
Max
Unit
Input on-state current
Input off-state voltage
Supply voltage
IF(ON)
VF(OFF)
VCC
(Note 1)
2
0
10
0.8
30
mA
V
(Note 2)
(Note 2)
4.5
-40
Operating temperature
Topr
110
Note: The recommended operating conditions are given as a design guide necessary to obtain the intended
performance of the device. Each parameter is an independent value. When creating a system design using
this device, the electrical characteristics specified in this data sheet should also be considered.
Note: A ceramic capacitor (0.1 µF) should be connected between pin 6 and pin 4 to stabilize the operation of a high-
gain linear amplifier. Otherwise, this photocoupler may not switch properly. The bypass capacitor should be
placed within 1 cm of each pin.
Note 1: The rise and fall times of the input on-current should be less than 0.5 µs.
Note 2: Denotes the operating range, not the recommended operating condition.
10. Electrical Characteristics (Note)
(Unless otherwise specified, Ta = -40 to 110 , VCC = 4.5 to 30 V)
Test
Circuit
Characteristics
Symbol
Note
Test Condition
Min
Typ.
Max
Unit
Input forward voltage
VF
IF = 3 mA, Ta = 25
1.35
1.55
-2.0
1.65
V
Input forward voltage
temperature coefficient
∆VF/∆Ta
IF = 3 mA
mV/
Input reverse current
Input capacitance
IR
Ct
VR = 5 V, Ta = 25
V = 0 V, f = 1 MHz, Ta = 25
VF = 0.8 V, IO = 3.5 mA
VF = 0.8 V, IO = 6.5 mA
IF = 3 mA, IO = -3.5 mA
IF = 3 mA, IO = -6.5 mA
VCC = 5.5 V
10
0.2
0.4
3
µA
pF
V
20
Low-level output voltage
VOL
Fig.
13.1.1
0.026
0.047
High-level output voltage
Low-level supply current
High-level supply current
VOH
ICCL
ICCH
IOSL
IOSH
Fig.
13.1.2
VCC-0.2 VCC-0.03
VCC-0.4 VCC-0.05
Fig.
13.1.3
2.1
2.35
2.1
mA
VCC = 30 V
3
Fig.
13.1.4
IF = 3 mA, VCC = 5.5 V
IF = 3 mA, VCC = 30 V
VCC = VO = 5.5 V
3
2.35
270
300
-350
3
Low-level short-circuit output
current
Fig.
13.1.5
150
160
-150
VCC = VO = 20 V
High-level short-circuit output
current
Fig.
IF = 3 mA, VCC = 5.5 V,
13.1.6 VO = GND
IF = 3 mA, VCC = 20 V,
VO = GND
-350
-160
1.6
Threshold input current (L/H)
IFLH
IO = -3.5 mA, VO > 4.8 V,
VCC = 5 V
Input current hysteresis
IHYS
IO = -3.5 mA
0.1
Threshold input voltage (H/L)
VFHL
IO = 6.5 mA, VO < 0.4 V
0.8
V
Note: All typical values are at VCC = 5 V, Ta = 25 , unless otherwise noted.
©2015-2018
Toshiba Electronic Devices & Storage Corporation
2018-05-07
Rev.7.0
4
TLP2745
11. Isolation Characteristics (Unless otherwise specified, Ta = 25 )
Characteristics
Symbol
Note
Test Condition
Min
Typ.
0.8
Max
Unit
Total capacitance (input to output)
Isolation resistance
CS
RS
(Note 1) VS = 0 V, f = 1 MHz
(Note 1) VS = 500 V, R.H. ≤ 60 %
(Note 1) AC, 60 s
pF
Ω
1 × 1012 1 × 1014
5000
Isolation voltage
BVS
Vrms
Note 1: This device is considered as a two-terminal device: Pins 1, 2 and 3 are shorted together, and pins 4, 5 and 6
are shorted together.
12. Switching Characteristics (Note)
(Unless otherwise specified, Ta = -40 to 110 , VCC = 4.5 to 30 V)
Test
Circuit
Characteristics
Symbol
Note
Test Condition
Min
Typ.
Max
Unit
ns
Propagation delay time (L/H)
Propagation delay time (H/L)
Pulse width distortion
tpLH
tpHL
(Note 1)
Fig. IF = 0 → 3 mA
13.1.7
35
35
120
120
40
IF = 3 → 0 mA
|tpHL-tpLH|
tpsk
IF = 3 mA
IF = 3 mA
Propagation delay skew
(device to device)
(Note 1),
(Note 2)
-70
70
Rise time
Fall time
tr
tf
(Note 1)
(Note 1)
IF = 0 → 3 mA
IF = 3 → 0 mA
3
3
30
30
High-level common-mode
transient immunity
CMH
Fig. IF = 3 mA, VCC = 30 V,
13.1.8 VCM = 1500 Vp-p, Ta = 25
±30
±50
kV/µs
Low-level common-mode
transient immunity
CML
IF = 0 mA, VCC = 30 V,
VCM = 1500 Vp-p, Ta = 25
±30
±50
Note: All typical values are at VCC = 5 V, Ta = 25 , unless otherwise noted.
Note 1: f = 50 kHz, duty = 50 %, input current tr = tf = 5 ns, CL is approximately 15 pF which includes probe and stray
wiring capacitance.
Note 2: The propagation delay skew, tpsk, is equal to the magnitude of the worst-case difference in tpHL and/or tpLH
that will be seen between units at the same given conditions (supply voltage, input current, temperature, etc).
©2015-2018
Toshiba Electronic Devices & Storage Corporation
2018-05-07
Rev.7.0
5
TLP2745
13. Test Circuits and Characteristics Curves
13.1. Test Circuits
Fig. 13.1.1 VOL Test Circuit
Fig. 13.1.2 VOH Test Circuit
Fig. 13.1.3 ICCL Test Circuit
Fig. 13.1.4 ICCH Test Circuit
Fig. 13.1.5 IOSL Test Circuit
Fig. 13.1.6 IOSH Test Circuit
Fig. 13.1.7 Switching Time Test Circuit and Waveform
Fig. 13.1.8 Common-Mode Transient Immunity Test Circuit and Waveform
©2015-2018
Toshiba Electronic Devices & Storage Corporation
2018-05-07
Rev.7.0
6
TLP2745
13.2. Characteristics Curves (Note)
Fig. 13.2.1 IF - VF
Fig. 13.2.3 VO - IF(IHYS)
Fig. 13.2.5 VOL - Ta
Fig. 13.2.2 IFLH - Ta
Fig. 13.2.4 VO - IF(IHYS)
Fig. 13.2.6 (VCC-VOH) - Ta
©2015-2018
2018-05-07
Rev.7.0
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Toshiba Electronic Devices & Storage Corporation
TLP2745
Fig. 13.2.7 ICCL - Ta
Fig. 13.2.8 ICCH - Ta
Fig. 13.2.9 IOSL - Ta
Fig. 13.2.10 IOSH - Ta
Fig. 13.2.11 tpLH, tpHL, |tpHL-tpLH| - Ta
Fig. 13.2.12 tpLH, tpHL, |tpHL-tpLH| - Ta
Note: The above characteristics curves are presented for reference only and not guaranteed by production test,
unless otherwise noted.
©2015-2018
Toshiba Electronic Devices & Storage Corporation
2018-05-07
Rev.7.0
8
TLP2745
14. Soldering and Storage
14.1. Precautions for Soldering
The soldering temperature should be controlled as closely as possible to the conditions shown below, irrespective
of whether a soldering iron or a reflow soldering method is used.
•
When using soldering reflow.
The soldering temperature profile is based on the package surface temperature.
(See the figure shown below, which is based on the package surface temperature.)
Reflow soldering must be performed once or twice.
The mounting should be completed with the interval from the first to the last mountings being 2 weeks.
An Example of a Temperature Profile When Lead(Pb)-free Solder Is Used
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•
When using soldering flow
Preheat the device at a temperature of 150 (package surface temperature) for 60 to 120 seconds.
Mounting condition of 260 within 10 seconds is recommended.
Flow soldering must be performed once.
When using soldering Iron
Complete soldering within 10 seconds for lead temperature not exceeding 260 or within 3 seconds not
exceeding 350
Heating by soldering iron must be done only once per lead.
14.2. Precautions for General Storage
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•
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Avoid storage locations where devices may be exposed to moisture or direct sunlight.
Follow the precautions printed on the packing label of the device for transportation and storage.
Keep the storage location temperature and humidity within a range of 5 to 35 and 45 % to 75 %,
respectively.
•
•
Do not store the products in locations with poisonous gases (especially corrosive gases) or in dusty
conditions.
Store the products in locations with minimal temperature fluctuations. Rapid temperature changes during
storage can cause condensation, resulting in lead oxidation or corrosion, which will deteriorate the
solderability of the leads.
•
•
•
When restoring devices after removal from their packing, use anti-static containers.
Do not allow loads to be applied directly to devices while they are in storage.
If devices have been stored for more than two years under normal storage conditions, it is recommended
that you check the leads for ease of soldering prior to use.
©2015-2018
2018-05-07
Rev.7.0
9
Toshiba Electronic Devices & Storage Corporation
TLP2745
15. Land Pattern Dimensions (for reference only)
Unit: mm
TLP2745
TLP2745(LF4)
Fig. 15.1 Lead Forming Option (standard)
Fig. 15.2 Lead Forming Option (LF4)
16. Marking
©2015-2018
2018-05-07
Rev.7.0
10
Toshiba Electronic Devices & Storage Corporation
TLP2745
17. EN60747-5-5 Option (D4) Specification
•
Part number: TLP2745 (Note 1)
•
The following part naming conventions are used for the devices that have been qualified according to
option (D4) of EN60747.
Example: TLP2745(D4-TP,E
D4: EN60747 option
TP: Tape type
E: [[G]]/RoHS COMPATIBLE (Note 2)
Note 1: Use TOSHIBA standard type number for safety standard application.
e.g., TLP2745(D4-TP,E → TLP2745
Note 2: Please contact your Toshiba sales representative for details on environmental information such as the product's
RoHS compatibility.
RoHS is the Directive 2011/65/EU of the European Parliament and of the Council of 8 June 2011 on the
restriction of the use of certain hazardous substances in electrical and electronic equipment.
Fig. 17.1 EN60747 Isolation Characteristics
©2015-2018
Toshiba Electronic Devices & Storage Corporation
2018-05-07
Rev.7.0
11
TLP2745
Fig. 17.2 Insulation Related Specifications (Note)
Note: This photocoupler is suitable for safe electrical isolation only within the safety limit data.
Maintenance of the safety data shall be ensured by means of protective circuits.
Fig. 17.3 Marking on Packing for EN60747
Fig. 17.4 Marking Example (Note)
Note: The above marking is applied to the photocouplers that have been qualified according to option (D4) of
EN60747.
©2015-2018
Toshiba Electronic Devices & Storage Corporation
2018-05-07
Rev.7.0
12
TLP2745
Fig. 17.5 Measurement Procedure
©2015-2018
Toshiba Electronic Devices & Storage Corporation
2018-05-07
Rev.7.0
13
TLP2745
18. Specifications for Embossed-Tape Packing
18.1. Applicable Package
Package Name
Product Type
SO6L / SO6L(LF4)
Long creepage mini flat coupler
18.2. Product Naming Conventions
Type of package used for shipment is denoted by a symbol suffix after a part number. The method of classification
is as below.
Example) TLP2745(TP,E
Part number: TLP2745
Tape type: TP
[[G]]/RoHS COMPATIBLE: E (Note 1)
Note 1: Please contact your Toshiba sales representative for details on environmental information such as the product's
RoHS compatibility.
RoHS is the Directive 2011/65/EU of the European Parliament and of the Council of 8 June 2011 on the
restriction of the use of certain hazardous substances in electrical and electronic equipment.
18.3. Tape Dimensions Specification
Packing Amount
(A unit per reel)
Tape Type
TP / TP4
Division
1500
18.3.1. Orientation of Device in Relation to Direction of Feed
Device orientation in the carrier cavities as shown in the following figure.
Orientation of Device in Relation to Direction of Tape Movement
18.3.2. Empty Cavities
Characteristics
Criterion
0 device
Remarks
Occurrences of 2 or more
successive empty cavities
Within any given 40-mm section of tape, not including leader
and trailer
Single empty cavity
6 devices (max) per reel
Not including leader and trailer
18.3.3. Tape Leader and Trailer
The start of the tape has 14 or more empty holes. The end of the tape has 34 or more empty holes and a cover
tape of 30 mm or longer.
©2015-2018
Toshiba Electronic Devices & Storage Corporation
2018-05-07
Rev.7.0
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TLP2745
18.3.4. Tape Dimensions
Tape material: Plastic (for protection against static electricity)
Table Tape Dimensions (unit: mm, tolerance: ±0.1)
Dimension Dimension
Symbol
Remark
(standard)
10.4
4.24
7.5
(LF4)
11.55
4.24
7.5
A
B
D
E
Center line of embossed cavity and sprocket hole
Distance between tape edge and sprocket hole center
Cumulative error +0.1/-0.3 per 10 empty cavities holes
Cumulative error +0.1/-0.3 per 10 sprocket holes
1.75
12.0
4.0
1.75
16.0
4.0
F
G
K
2.7
2.8
K0
2.4
2.4
Internal space
©2015-2018
Toshiba Electronic Devices & Storage Corporation
2018-05-07
Rev.7.0
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TLP2745
18.3.5. Reel Specification
Material: Plastic (for protection against static electricity)
Table Reel Dimensions (unit: mm)
Symbol
Dimension
A
B
φ330 ± 2.0
φ100 ± 1.0
φ13 ± 0.5
2.0 ± 0.5
C
E
U
4.0 ± 0.5
W1
W2
17.4 ± 1.0
21.4 ± 1.0
©2015-2018
Toshiba Electronic Devices & Storage Corporation
2018-05-07
Rev.7.0
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TLP2745
18.4. Packing (Note)
1 reel/carton (unit: mm)
Note: Taping reel diameter: φ330 mm
18.5. Label Format
(1) Carton: The label provides the part number, quantity, lot number, the Toshiba logo, etc.
(2) Reel: The label provides the part number, the taping name, quantity, lot number, etc.
19. Ordering Information (Example of Item Name)
Item Name
TLP2745(E
Packaging
VDE Option
Packing (MOQ)
Magazine (125 pcs)
TLP2745(TP,E
TLP2745(D4,E
TLP2745(D4-TP,E
TLP2745(LF4,E
Tape and reel (1500 pcs)
Magazine (125 pcs)
EN60747-5-5
EN60747-5-5
Tape and reel (1500 pcs)
Magazine (125 pcs)
LF4, Wide forming
LF4, Wide forming
TLP2745(TP4,E
Tape and reel (1500 pcs)
TLP2745(D4-LF4,E
TLP2745(D4-TP4,E
LF4, Wide forming
LF4, Wide forming
EN60747-5-5
EN60747-5-5
Magazine (125 pcs)
Tape and reel (1500 pcs)
©2015-2018
Toshiba Electronic Devices & Storage Corporation
2018-05-07
Rev.7.0
17
TLP2745
Package Dimensions
Unit: mm
TLP2745
Weight: 0.126 g (typ.)
Package Name(s)
TOSHIBA: 11-4N1A
©2015-2018
Toshiba Electronic Devices & Storage Corporation
2018-05-07
Rev.7.0
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TLP2745
Package Dimensions
Unit: mm
TLP2745(LF4)
Weight: 0.126 g (typ.)
Package Name(s)
TOSHIBA: 11-4N101A
©2015-2018
Toshiba Electronic Devices & Storage Corporation
2018-05-07
Rev.7.0
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TLP2745
RESTRICTIONS ON PRODUCT USE
Toshiba Corporation and its subsidiaries and affiliates are collectively referred to as "TOSHIBA".
Hardware, software and systems described in this document are collectively referred to as "Product".
•
•
TOSHIBA reserves the right to make changes to the information in this document and related Product without notice.
This document and any information herein may not be reproduced without prior written permission from TOSHIBA. Even with TOSHIBA's
written permission, reproduction is permissible only if reproduction is without alteration/omission.
•
ThoughTOSHIBAworkscontinuallytoimproveProduct'squalityandreliability,Productcanmalfunctionorfail.Customersareresponsible
for complying with safety standards and for providing adequate designs and safeguards for their hardware, software and systems which
minimize risk and avoid situations in which a malfunction or failure of Product could cause loss of human life, bodily injury or damage
to property, including data loss or corruption. Before customers use the Product, create designs including the Product, or incorporate
the Product into their own applications, customers must also refer to and comply with (a) the latest versions of all relevant TOSHIBA
information, including without limitation, this document, the specifications, the data sheets and application notes for Product and the
precautions and conditions set forth in the "TOSHIBA Semiconductor Reliability Handbook" and (b) the instructions for the application
with which the Product will be used with or for. Customers are solely responsible for all aspects of their own product design or applications,
including but not limited to (a) determining the appropriateness of the use of this Product in such design or applications; (b) evaluating
and determining the applicability of any information contained in this document, or in charts, diagrams, programs, algorithms, sample
application circuits, or any other referenced documents; and (c) validating all operating parameters for such designs and applications.
TOSHIBA ASSUMES NO LIABILITY FOR CUSTOMERS' PRODUCT DESIGN OR APPLICATIONS.
•
PRODUCT IS NEITHER INTENDED NOR WARRANTED FOR USE IN EQUIPMENTS OR SYSTEMS THAT REQUIRE
EXTRAORDINARILY HIGH LEVELS OF QUALITY AND/OR RELIABILITY, AND/OR A MALFUNCTION OR FAILURE OF WHICH MAY
CAUSE LOSS OF HUMAN LIFE, BODILY INJURY, SERIOUS PROPERTY DAMAGE AND/OR SERIOUS PUBLIC IMPACT
("UNINTENDEDUSE").Exceptforspecificapplicationsasexpresslystatedinthisdocument, UnintendedUseincludes, withoutlimitation,
equipment used in nuclear facilities, equipment used in the aerospace industry, medical equipment, equipment used for automobiles,
trains, ships and other transportation, traffic signaling equipment, equipment used to control combustions or explosions, safety devices,
elevators and escalators, devices related to electric power, and equipment used in finance-related fields. IF YOU USE PRODUCT FOR
UNINTENDED USE, TOSHIBA ASSUMES NO LIABILITY FOR PRODUCT. For details, please contact your TOSHIBA sales
representative.
•
•
Do not disassemble, analyze, reverse-engineer, alter, modify, translate or copy Product, whether in whole or in part.
Product shall not be used for or incorporated into any products or systems whose manufacture, use, or sale is prohibited under any
applicable laws or regulations.
•
•
The information contained herein is presented only as guidance for Product use. No responsibility is assumed by TOSHIBA for any
infringement of patents or any other intellectual property rights of third parties that may result from the use of Product. No license to any
intellectual property right is granted by this document, whether express or implied, by estoppel or otherwise.
ABSENT A WRITTEN SIGNED AGREEMENT, EXCEPT AS PROVIDED IN THE RELEVANT TERMS AND CONDITIONS OF SALE
FOR PRODUCT, AND TO THE MAXIMUM EXTENT ALLOWABLE BY LAW, TOSHIBA (1) ASSUMES NO LIABILITY WHATSOEVER,
INCLUDING WITHOUT LIMITATION, INDIRECT, CONSEQUENTIAL, SPECIAL, OR INCIDENTAL DAMAGES OR LOSS, INCLUDING
WITHOUT LIMITATION, LOSS OF PROFITS, LOSS OF OPPORTUNITIES, BUSINESS INTERRUPTION AND LOSS OF DATA, AND
(2) DISCLAIMS ANY AND ALL EXPRESS OR IMPLIED WARRANTIES AND CONDITIONS RELATED TO SALE, USE OF PRODUCT,
OR INFORMATION, INCLUDING WARRANTIES OR CONDITIONS OF MERCHANTABILITY, FITNESS FOR A PARTICULAR
PURPOSE, ACCURACY OF INFORMATION, OR NONINFRINGEMENT.
•
•
GaAs (Gallium Arsenide) is used in Product. GaAs is harmful to humans if consumed or absorbed, whether in the form of dust or vapor.
Handle with care and do not break, cut, crush, grind, dissolve chemically or otherwise expose GaAs in Product.
Do not use or otherwise make available Product or related software or technology for any military purposes, including without limitation,
for the design, development, use, stockpiling or manufacturing of nuclear, chemical, or biological weapons or missile technology products
(mass destruction weapons). Product and related software and technology may be controlled under the applicable export laws and
regulations including, without limitation, the Japanese Foreign Exchange and Foreign Trade Law and the U.S. Export Administration
Regulations. Export and re-export of Product or related software or technology are strictly prohibited except in compliance with all
applicable export laws and regulations.
•
Please contact your TOSHIBA sales representative for details as to environmental matters such as the RoHS compatibility of Product.
Please use Product in compliance with all applicable laws and regulations that regulate the inclusion or use of controlled substances,
including without limitation, the EU RoHS Directive. TOSHIBA ASSUMES NO LIABILITY FOR DAMAGES OR LOSSES OCCURRING
AS A RESULT OF NONCOMPLIANCE WITH APPLICABLE LAWS AND REGULATIONS.
©2015-2018
2018-05-07
Rev.7.0
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Toshiba Electronic Devices & Storage Corporation
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