TLP2748 [TOSHIBA]
IC Output Device;
TOSHIBA 
TLP2748
Photocouplers GaAℓAs Infrared LED & Photo IC
TLP2748
1. Applications
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Intelligent Power Module Signal Isolation
Programmable Logic Controllers (PLCs)
High-Speed Digital Interfacing for Instrumentation and Control Devices
2. General
The Toshiba TLP2748 consists of high-output GaAℓAs light-emitting diode coupled with a high-gain, high-speed
photo detector. It is housed in a thin SO6L package of 2.3 mm(max). The TLP2748 has guaranteed the isolation
voltage 5 kVrms and compliant with international safety standards for reinforced insulation.
This product can operate in power supply voltage 4.5 V to 30 V with the maximum operative temperature of 110
. Since TLP2748 has guaranteed 3 mA low supply current (ICCL/ICCH), and 1.6 mA low threshold input current
(IFHL), it contributes to energy saving of devices. It can drive directly from a microcomputer for a low input current.
The detector has a totem-pole output stage with current sourcing and sinking capabilities. The TLP2748 has an
internal Faraday shield that provides a guaranteed common-mode transient immunity of ±30 kV/µs.
The TLP2748 has an inverter output. A buffer output version, the TLP2745, is also available.
3. Features
(1) Inverter logic type (Totem pole output)
(2) Package: SO6L
(3) Operating temperature: -40 to 110
(4) Supply voltage: 4.5 to 30 V
(5) Threshold input current: 1.6 mA (max)
(6) Supply current: 3 mA (max)
(7) Propagation delay time: tpHL/tpLH = 120 ns (max)
(8) Pulse width distortion: |tpHL-tpLH| = 40 ns (max)
(9) Common-mode transient immunity: ±30 kV/µs (min)
(10) Isolation voltage: 5000 Vrms (min)
(11) Safety standards
UL-approved UL1577 File No.E67349
cUL-approved CSA Component Acceptance Service No.5A File No.E67349
VDE-approved: Option (D4) EN60747-5-5 (approval pending) (Note)
Note: When an EN60747-5-5 approved type is needed, please designate the Option (D4).
Start of commercial production
2015-05
2015-01-29
Rev.1.0
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TLP2748
4. Packaging and Pin Configuration
1: Anode
2: N.C.
3: Cathode
4: GND
5: VO (Output)
6: VCC
11-4N1A
5. Internal Circuit (Note)
Note: A 0.1-µF bypass capacitor must be connected between pin 6 and pin 4.
6. Principle of Operation
6.1. Truth Table
Input
LED
Output
H
L
ON
L
OFF
H
6.2. Mechanical Parameters
Characteristics
Min
Unit
mm
Creepage distances
8.0
8.0
0.4
Clearance distances
Internal isolation thickness
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TLP2748
7. Absolute Maximum Ratings (Note) (Unless otherwise specified, Ta = 25 )
Characteristics
Symbol
Note
Rating
Unit
LED
Input forward current
IF
IFPT
PD
15
mA
A
Peak transient input forward current
Input power dissipation
(Note 1)
1
40
mW
V
Input reverse voltage
VR
5
Detector Output current
Output voltage
IO
50 / -50
mA
VO
-0.5 to 30
-0.5 to 30
100
V
V
Supply voltage
VCC
PO
Output power dissipation
Output power dissipation derating
Common Operating temperature
mW
mW/
(Ta ≥ 75 )
∆PO/∆Ta
Topr
Tstg
Tsol
BVS
-2
-40 to 110
-55 to 125
260
Storage temperature
Lead soldering temperature
Isolation voltage
(10 s)
AC, 60 s, R.H. ≤ 60 %
(Note 2)
5000
Vrms
Note: Using continuously under heavy loads (e.g. the application of high temperature/current/voltage and the
significant change in temperature, etc.) may cause this product to decrease in the reliability significantly even
if the operating conditions (i.e. operating temperature/current/voltage, etc.) are within the absolute maximum
ratings.
Please design the appropriate reliability upon reviewing the Toshiba Semiconductor Reliability Handbook
("Handling Precautions"/"Derating Concept and Methods") and individual reliability data (i.e. reliability test
report and estimated failure rate, etc).
Note 1: Pulse width (PW) ≤ 1 µs, 300 pps
Note 2: This device is considered as a two-terminal device: Pins 1, 2 and 3 are shorted together, and pins 4, 5 and 6
are shorted together.
8. Recommended Operating Conditions (Note)
Characteristics
Symbol
Note
Min
Typ.
Max
Unit
Input on-state current
Input off-state voltage
Supply voltage
IF(ON)
VF(OFF)
VCC
(Note 1)
2
0
10
0.8
30
mA
V
(Note 2)
(Note 2)
4.5
-40
Operating temperature
Topr
110
Note: The recommended operating conditions are given as a design guide necessary to obtain the intended
performance of the device. Each parameter is an independent value. When creating a system design using
this device, the electrical characteristics specified in this datasheet should also be considered.
Note: A ceramic capacitor (0.1 µF) should be connected between pin 6 and pin 4 to stabilize the operation of a high-
gain linear amplifier. Otherwise, this photocoupler may not switch properly. The bypass capacitor should be
placed within 1 cm of each pin.
Note 1: The rise and fall times of the input on-current should be less than 0.5 µs.
Note 2: Denotes the operating range, not the recommended operating condition.
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TLP2748
9. Electrical Characteristics (Note)
(Unless otherwise specified, Ta = -40 to 110 , VCC = 4.5 to 30 V)
Test
Circuit
Characteristics
Symbol
Note
Test Condition
Min
Typ.
Max
Unit
Input forward voltage
VF
IF = 3 mA, Ta = 25
1.35
1.55
-2.0
1.65
V
Input forward voltage
temperature coefficient
∆VF/∆Ta
IF = 3 mA
mV/
Input reverse current
Input capacitance
IR
Ct
VR = 5 V, Ta = 25
V = 0 V, f = 1 MHz, Ta = 25
IF = 3 mA, IO = 3.5 mA
IF = 3 mA, IO = 6.5 mA
VF = 0.8 V, IO = -3.5 mA
VF = 0.8 V, IO = -6.5 mA
IF = 3 mA, VCC = 5.5 V
IF = 3 mA, VCC = 30 V
VCC = 5.5 V
10
0.2
0.4
3
µA
pF
V
20
Low-level output voltage
VOL
Fig.
12.1.1
0.026
0.047
High-level output voltage
Low-level supply current
High-level supply current
VOH
ICCL
ICCH
IOSL
Fig.
12.1.2
VCC-0.2 VCC-0.03
VCC-0.4 VCC-0.05
Fig.
12.1.3
2.1
2.35
2.1
mA
3
Fig.
12.1.4
3
VCC = 30 V
2.35
270
3
Low-level short-circuit output
current
Fig.
IF = 3 mA, VCC = VO = 5.5 V,
150
12.1.5 VO = GND
IF = 3 mA, VCC = VO = 20 V,
160
300
VO = GND
VCC = 5.5 V
VCC = 20 V
High-level short-circuit output
current
IOSH
IFHL
Fig.
12.1.6
-310
-330
-150
-160
1.6
Threshold input current (H/L)
IO = 3.5 mA, VO < 0.2 V,
VCC = 5 V
Input current hysteresis
IHYS
IO = 3.5 mA
0.1
Threshold input voltage (L/H)
VFLH
IO = -6.5 mA, VO > (VCC - 0.4)
0.8
V
Note: All typical values are at VCC = 5 V, Ta = 25 , unless otherwise noted.
10. Isolation Characteristics (Unless otherwise specified, Ta = 25 )
Characteristics
Symbol
Note
Test Condition
Min
Typ.
0.8
Max
Unit
Total capacitance (input to output)
Isolation resistance
CS
RS
(Note 1) VS = 0 V, f = 1 MHz
(Note 1) VS = 500 V, R.H. ≤ 60 %
(Note 1) AC, 60 s
pF
Ω
1×1012 1×1014
Isolation voltage
BVS
5000
Vrms
AC, 1 s, in oil
10000
10000
DC, 60 s, in oil
Vdc
Note 1: This device is considered as a two-terminal device: Pins 1, 2 and 3 are shorted together, and pins 4, 5 and 6
are shorted together.
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TLP2748
11. Switching Characteristics (Note)
(Unless otherwise specified, Ta = -40 to 110 , VCC = 4.5 to 30 V)
Test
Circuit
Characteristics
Symbol
Note
Test Condition
Min
Typ.
Max
Unit
ns
Propagation delay time (H/L)
Propagation delay time (L/H)
Pulse width distortion
tpHL
tpLH
(Note 1)
Fig. IF = 0 → 3 mA
12.1.7,
Fig.
12.1.8
35
35
120
120
40
IF = 3 → 0 mA
|tpHL-tpLH|
tpsk
IF = 3 mA
IF = 3 mA
Propagation delay skew
(device to device)
(Note 1),
(Note 2)
-70
70
Fall time
tf
tr
(Note 1)
IF = 0 → 3 mA
IF = 3 → 0 mA
3
3
30
30
Rise time
Common-mode transient
immunity at output high
CMH
Fig. IF = 0 mA, VCC = 30 V,
12.1.9 VCM = 1500 Vp-p, Ta = 25
±30
±50
kV/µs
Common-mode transient
immunity at output low
CML
IF = 3 mA, VCC = 30 V,
VCM = 1500 Vp-p, Ta = 25
±30
±50
Note: All typical values are at VCC = 5 V, Ta = 25 , unless otherwise noted.
Note 1: f = 50 kHz, duty = 50 %, input current tr = tf = 5 ns, CL is approximately 15 pF which includes probe and stray
wiring capacitance.
Note 2: The propagation delay skew, tpsk, is equal to the magnitude of the worst-case difference in tpHL and/or tpLH
that will be seen between units at the same given conditions (supply voltage, input current, temperature, etc).
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Rev.1.0
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TLP2748
12. Test Circuits and Characteristics Curves
12.1. Test Circuits
Fig. 12.1.1 VOL Test Circuit
Fig. 12.1.2 VOH Test Circuit
Fig. 12.1.3 ICCL Test Circuit
Fig. 12.1.4 ICCH Test Circuit
Fig. 12.1.5 IOSL Test Circuit
Fig. 12.1.6 IOSH Test Circuit
Fig. 12.1.7 Switching Time Test Circuit and Waveform
Fig. 12.1.8 Switching Time Test Circuit and Waveform
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TLP2748
Fig. 12.1.9 Common-Mode Transient Immunity and Waveform
13. Soldering and Storage
13.1. Precautions for Soldering
The soldering temperature should be controlled as closely as possible to the conditions shown below, irrespective
of whether a soldering iron or a reflow soldering method is used.
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When using soldering reflow.
The soldering temperature profile is based on the package surface temperature.
(See the figure shown below, which is based on the package surface temperature.)
Reflow soldering must be performed once or twice.
The mounting should be completed with the interval from the first to the last mountings being 2 weeks.
Fig. 13.1.1 An example of a temperature profile when lead(Pb)-free solder is used
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When using soldering flow
Preheat the device at a temperature of 150 (package surface temperature) for 60 to 120 seconds.
Mounting condition of 260 within 10 seconds is recommended.
Flow soldering must be performed once.
When using soldering Iron
Complete soldering within 10 seconds for lead temperature not exceeding 260 or within 3 seconds not
exceeding 350
Heating by soldering iron must be done only once per lead.
2015-01-29
Rev.1.0
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TLP2748
13.2. Precautions for General Storage
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Avoid storage locations where devices may be exposed to moisture or direct sunlight.
Follow the precautions printed on the packing label of the device for transportation and storage.
Keep the storage location temperature and humidity within a range of 5 to 35 and 45 % to 75 %,
respectively.
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Do not store the products in locations with poisonous gases (especially corrosive gases) or in dusty
conditions.
Store the products in locations with minimal temperature fluctuations. Rapid temperature changes during
storage can cause condensation, resulting in lead oxidation or corrosion, which will deteriorate the
solderability of the leads.
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•
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When restoring devices after removal from their packing, use anti-static containers.
Do not allow loads to be applied directly to devices while they are in storage.
If devices have been stored for more than two years under normal storage conditions, it is recommended
that you check the leads for ease of soldering prior to use.
14. Land Pattern Dimensions (for reference only)
(unit: mm)
15. Marking
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TLP2748
16. EN60747-5-5 Option (D4) Specification
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Part number: TLP2748 (Note)
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The following part naming conventions are used for the devices that have been qualified according to
option (D4) of EN60747.
Example: TLP2748(D4-TP,E(T
D4: EN60747 option
TP: Tape type
E: [[G]]/RoHS COMPATIBLE (Note 1)
Domestic ID (Country / Region of origin: Thailand): (T
Note: Use TOSHIBA standard type number for safety standard application.
e.g., TLP2748(D4-TP,E(T → TLP2748
Note 1: Please contact your Toshiba sales representative for details on environmental information such as the product's
RoHS compatibility.
RoHS is the Directive 2011/65/EU of the European Parliament and of the Council of 8 June 2011 on the
restriction of the use of certain hazardous substances in electrical and electronics equipment.
Fig. 16.1 EN60747 Insulation Characteristics
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Rev.1.0
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TLP2748
Fig. 16.2 Insulation Related Specifications (Note)
Note: If a printed circuit is incorporated, the creepage distance and clearance may be reduced below this value.
(e.g., at a standard distance between soldering eye centers of 9.5 mm). If this is not permissible, the user shall
take suitable measures.
Note: This photocoupler is suitable for safe electrical isolation only within the safety limit data.
Maintenance of the safety data shall be ensured by means of protective circuits.
Fig. 16.3 Marking on Packing for EN60747
Fig. 16.4 Marking Example (Note)
Note: The above marking is applied to the photocouplers that have been qualified according to option (D4) of
EN60747.
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TLP2748
Fig. 16.5 Measurement Procedure
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TLP2748
17. Embossed-Tape Packing (TP) Specification for Mini-Flat Photocouplers
17.1. Applicable Package
Package Name
SO6L
Product Type
Long creepage mini flat coupler
17.2. Product Naming Conventions
Type of package used for shipment is denoted by a symbol suffix after a part number. The method of classification
is as below.
Example) TLP2748(TP,E(T
Part number: TLP2748
Tape type: TP
[[G]]/RoHS COMPATIBLE: E (Note)
Domestic ID (Country / Region of origin: Thailand): (T
Note: Please contact your Toshiba sales representative for details on environmental information such as the product's
RoHS compatibility.
RoHS is the Directive 2011/65/EU of the European Parliament and of the Council of 8 June 2011 on the
restriction of the use of certain hazardous substances in electrical and electronics equipment.
17.3. Tape Dimensions Specification
Packing Amount
(A unit per reel)
Specification
TP
Division
1500
17.3.1. Orientation of Device in Relation to Direction of Feed
Device orientation in the carrier cavities as shown in the following figure.
Fig. 17.3.1.1 Orientation of Device in Relation to Direction of Tape Movement
17.3.2. Empty Device Recesses
Characteristics
Standard
0
Remarks
Occurrences of 2 or more
successive empty cavities
Within any given 40-mm section of tape, not including leader
and trailer
Single empty cavity
6 devices (max) per reel
Not including leader and trailer
17.3.3. Tape Leader and Trailer
The start of the tape has 14 or more empty holes. The end of the tape has 34 or more empty holes and more than
30mm only for a cover tape.
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TLP2748
17.3.4. Tape Dimensions
Tape material: Plastic (for protection against static electricity)
Table Tape Dimensions (unit: mm, tolerance: ±0.1)
Symbol
Dimension
Remark
A
B
10.4
4.24
7.5
D
E
Center line of embossed cavity and sprocket hole
Distance between tape edge and sprocket hole center
Cumulative error +0.1/-0.3 (max) per 10 empty cavities holes
Cumulative error +0.1/-0.3 (max) per 10 empty cavities holes
Internal space
1.75
12.0
4.0
F
G
K0
2.4
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TLP2748
17.3.5. Reel Specification
Material: Plastic (for protection against static electricity)
Table Reel Dimensions (unit: mm)
Symbol
Dimension
A
B
φ330 ± 2
φ100 ± 1
φ13 ± 0.5
2.0 ± 0.5
4.0 ± 0.5
17.4 ± 1.0
21.4 ± 1.0
C
E
U
W1
W2
17.4. Packing (Note)
Either one reel or ten reels of photocouplers are packed in a shipping carton.
1 reel/carton (unit: mm)
10 reel/carton (unit: mm)
Note: Taping reel diameter: φ330 mm
17.5. Label Format
(1) Carton: The label provides the part number, quantity, lot number, the Toshiba logo, etc.
(2) Reel: The label provides the part number, the taping name, quantity, lot number, etc.
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TLP2748
17.6. Ordering Information
When placing an order, please specify the part number, the tape type and quantity (Multiples of 1500) as shown
in the following example.
Example) TLP2748(TP,E 1500pcs
Part number: TLP2748
Tape type: TP(12mm pitch)
[[G]]/RoHS COMPATIBLE: E (Note)
Quantity (must be a multiple of 1500 pcs)
Note: Please contact your Toshiba sales representative for details on environmental information such as the product's
RoHS compatibility.
RoHS is the Directive 2011/65/EU of the European Parliament and of the Council of 8 June 2011 on the
restriction of the use of certain hazardous substances in electrical and electronics equipment.
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TLP2748
Package Dimensions
Unit: mm
Weight: 0.126 g (typ.)
Package Name(s)
TOSHIBA: 11-4N1A
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TLP2748
RESTRICTIONS ON PRODUCT USE
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Toshiba Corporation, and its subsidiaries and affiliates (collectively "TOSHIBA"), reserve the right to make changes to the information
in this document, and related hardware, software and systems (collectively "Product") without notice.
This document and any information herein may not be reproduced without prior written permission from TOSHIBA. Even with TOSHIBA's
written permission, reproduction is permissible only if reproduction is without alteration/omission.
ThoughTOSHIBAworkscontinuallytoimproveProduct'squalityandreliability,Productcanmalfunctionorfail.Customersareresponsible
for complying with safety standards and for providing adequate designs and safeguards for their hardware, software and systems which
minimize risk and avoid situations in which a malfunction or failure of Product could cause loss of human life, bodily injury or damage
to property, including data loss or corruption. Before customers use the Product, create designs including the Product, or incorporate
the Product into their own applications, customers must also refer to and comply with (a) the latest versions of all relevant TOSHIBA
information, including without limitation, this document, the specifications, the data sheets and application notes for Product and the
precautions and conditions set forth in the "TOSHIBA Semiconductor Reliability Handbook" and (b) the instructions for the application
with which the Product will be used with or for. Customers are solely responsible for all aspects of their own product design or applications,
including but not limited to (a) determining the appropriateness of the use of this Product in such design or applications; (b) evaluating
and determining the applicability of any information contained in this document, or in charts, diagrams, programs, algorithms, sample
application circuits, or any other referenced documents; and (c) validating all operating parameters for such designs and applications.
TOSHIBA ASSUMES NO LIABILITY FOR CUSTOMERS' PRODUCT DESIGN OR APPLICATIONS.
•
PRODUCT IS NEITHER INTENDED NOR WARRANTED FOR USE IN EQUIPMENTS OR SYSTEMS THAT REQUIRE
EXTRAORDINARILY HIGH LEVELS OF QUALITY AND/OR RELIABILITY, AND/OR A MALFUNCTION OR FAILURE OF WHICH MAY
CAUSE LOSS OF HUMAN LIFE, BODILY INJURY, SERIOUS PROPERTY DAMAGE AND/OR SERIOUS PUBLIC IMPACT
("UNINTENDEDUSE").Exceptforspecificapplicationsasexpresslystatedinthisdocument, UnintendedUseincludes, withoutlimitation,
equipment used in nuclear facilities, equipment used in the aerospace industry, medical equipment, equipment used for automobiles,
trains, ships and other transportation, traffic signaling equipment, equipment used to control combustions or explosions, safety devices,
elevators and escalators, devices related to electric power, and equipment used in finance-related fields. IF YOU USE PRODUCT FOR
UNINTENDED USE, TOSHIBA ASSUMES NO LIABILITY FOR PRODUCT. For details, please contact your TOSHIBA sales
representative.
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•
Do not disassemble, analyze, reverse-engineer, alter, modify, translate or copy Product, whether in whole or in part.
Product shall not be used for or incorporated into any products or systems whose manufacture, use, or sale is prohibited under any
applicable laws or regulations.
•
•
The information contained herein is presented only as guidance for Product use. No responsibility is assumed by TOSHIBA for any
infringement of patents or any other intellectual property rights of third parties that may result from the use of Product. No license to any
intellectual property right is granted by this document, whether express or implied, by estoppel or otherwise.
ABSENT A WRITTEN SIGNED AGREEMENT, EXCEPT AS PROVIDED IN THE RELEVANT TERMS AND CONDITIONS OF SALE
FOR PRODUCT, AND TO THE MAXIMUM EXTENT ALLOWABLE BY LAW, TOSHIBA (1) ASSUMES NO LIABILITY WHATSOEVER,
INCLUDING WITHOUT LIMITATION, INDIRECT, CONSEQUENTIAL, SPECIAL, OR INCIDENTAL DAMAGES OR LOSS, INCLUDING
WITHOUT LIMITATION, LOSS OF PROFITS, LOSS OF OPPORTUNITIES, BUSINESS INTERRUPTION AND LOSS OF DATA, AND
(2) DISCLAIMS ANY AND ALL EXPRESS OR IMPLIED WARRANTIES AND CONDITIONS RELATED TO SALE, USE OF PRODUCT,
OR INFORMATION, INCLUDING WARRANTIES OR CONDITIONS OF MERCHANTABILITY, FITNESS FOR A PARTICULAR
PURPOSE, ACCURACY OF INFORMATION, OR NONINFRINGEMENT.
•
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GaAs (Gallium Arsenide) is used in Product. GaAs is harmful to humans if consumed or absorbed, whether in the form of dust or vapor.
Handle with care and do not break, cut, crush, grind, dissolve chemically or otherwise expose GaAs in Product.
Do not use or otherwise make available Product or related software or technology for any military purposes, including without limitation,
for the design, development, use, stockpiling or manufacturing of nuclear, chemical, or biological weapons or missile technology products
(mass destruction weapons). Product and related software and technology may be controlled under the applicable export laws and
regulations including, without limitation, the Japanese Foreign Exchange and Foreign Trade Law and the U.S. Export Administration
Regulations. Export and re-export of Product or related software or technology are strictly prohibited except in compliance with all
applicable export laws and regulations.
•
Please contact your TOSHIBA sales representative for details as to environmental matters such as the RoHS compatibility of Product.
Please use Product in compliance with all applicable laws and regulations that regulate the inclusion or use of controlled substances,
including without limitation, the EU RoHS Directive. TOSHIBA ASSUMES NO LIABILITY FOR DAMAGES OR LOSSES OCCURRING
AS A RESULT OF NONCOMPLIANCE WITH APPLICABLE LAWS AND REGULATIONS.
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