TLP291(GB-TP,E(O_技术文档

TLP291

TOSHIBA PHOTOCOUPLER GaAs IRED & PHOTO-TRANSISTOR

TLP291

Power Supplies

Unit: mm

Programmable Controllers

Hybrid ICs

TLP291 consists of photo transistor, optically coupled to a gallium arsenide

infrared emitting diode. TLP291 is housed in the SO4 package, very small

and thin coupler.

Since TLP291 is guaranteed wide operating temperature (Ta=-55 to 110 ˚C)

and high isolation voltage (3750Vrms), it’s suitable for high-density surface

mounting applications such as small switching power supplies and

programmable controllers.

z Collector-Emitter Voltage : 80 V (min)

z Current Transfer Ratio

: 50% (min)

TOSHIBA

11-3C1

Rank GB

: 100% (min)

Weight: 0.05 g (typ.)

z Isolation Voltage

: 3750 Vrms (min)

z Operation temperature: -55 to 110 ˚C

Pin Configuration

z UL recognized

z cUL approved

: UL1577, File No. E67349

: CSA Component Acceptance Service No.5A,

File No. 67349

z SEMKO aprroved:

EN 60065: 2002, Approved no. 1200315

EN 60950-1: 2001, EN 60335-1: 2002,

Approved no. 1200315

TLP291

1

2

4

3

z BSI approved

z Option (V4)

: BS EN 60065: 2002, Approved no. 9036

: BS EN 60950-1: 2006, Approved no. 9037

VDE approved: EN 60747-5-5 Certificate, No. 40009347

Maximum operating insulation voltage: 707 Vpk

Highest permissible over-voltage: 6000 Vpk

(Note) When a EN 60747-5-5 approved type is needed,

please designate the “Option(V4)”

1:ANODE

2:CATHODE

3:EMITTER

4:COLLECTOR

Construction Mechanical Rating

Creepage distance:5.0mm(min)

Clearance:5.0mm(min)

Insultion thickness:0.4mm(min)

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TLP291

Current Transfer Ratio (CTR) Rank ( Unless otherwise specified, Ta = 25°C)

Current Transfer Ratio (%)

(I / I )

C

F

Classification

(Note1)

TYPE

Marking of Classification

I

= 5 mA, V = 5 V, Ta = 25°C

CE

F

Min

Max

Blank

50

400

Blank, YE, Y+, GR, GB, G, G+,B

Rank Y

50

150

300

400

150

200

300

400

YE

GR

GB

Y+

G

Rank GR

Rank GB

Rank YH

Rank GRL

Rank GRH

Rank BLL

100

75

TLP291

100

150

200

G+

B

Note1: Specify both the part number and a rank in this format when ordering

(e.g.) rank GB: TLP291 (GB,E

For safety standard certification, however, specify the part number alone.

(e.g.)TLP291 (GB,E: TLP291

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TLP291

Absolute Maximum Ratings (Note)( Unless otherwise specified, Ta = 25°C)

NOTE

RATING

CHARACTERISTIC

Input forward current

SYMBOL

UNIT

I

50

-1.5

mA

mA /°C

A

F

Input forward current derating (Ta≥90°C)

Input forward current (pulsed )

Input reverse voltage

∆I /ΔTa

F

I

(Note 2)

1

FP

V

P

5

V

R

D

Input power dissipation

100

mW

mW/°C

°C

Input power dissipation derating (Ta ≥ 90°C)

Junction temperature

ΔP /ΔTa

-3.0

D

T

j

125

Collector-emitter voltage

V

80

V

CEO

ECO

Emitter-collector voltage

7

V

Collector current

I

50

mA

C

Collector power dissipation

Collector power dissipation derating(Ta≥25°C)

P

150

mW

mW /°C

°C

C

∆P /ΔTa

-1.5

C

Junction temperature

T

125

j

Operating temperature range

T

-55 to 110

-55 to 125

260 (10s)

200

°C

opr

Storage temperature range

T

°C

stg

Lead soldering temperature

T

°C

sol

Total package power dissipation

Total package power dissipation derating(Ta≥25°C)

P

mW

mW /°C

Vrms

T

∆P /ΔTa

-2.0

T

Isolation voltage

BV

(Note3)

3750

S

Note: Using continuously under heavy loads (e.g. the application of high temperature/current/voltage and the

significant change in temperature, etc.) may cause this product to decrease in the reliability significantly even

if the operating conditions (i.e. operating temperature/current/voltage, etc.) are within the absolute maximum

ratings.

Please design the appropriate reliability upon reviewing the Toshiba Semiconductor Reliability Handbook

(“Handling Precautions”/“Derating Concept and Methods”) and individual reliability data (i.e. reliability test

report and estimated failure rate, etc).

Note2: Pulse width ≤ 100μs, frequency 100Hz

Note3: AC, 1 minute, R.H.≤60%, Device considered a two terminal device: LED side pins shorted together and

DETECTOR side pins shorted together.

Electrical Characteristics (Unless otherwise specified, Ta = 25°C)

CHARACTERISTIC

Input forward voltage

SYMBOL

TEST CONDITION

= 10 mA

F

MIN

TYP.

MAX

UNIT

V

I

1.1

-

1.25

-

1.4

5

V

F

Input reverse current

Input capacitance

V

= 5 V

R

μA

R

C

V = 0 V, f = 1 MHz

30

-

pF

-

T

Collector-emitter breakdown voltage

Emitter-collector breakdown voltage

V

I

= 0.5 mA

= 0.1 mA

= 48 V

80

7

-

V

-

(BR) CEO

(BR) ECO

C

E

V

0.01

2

0.08

50

-

μA

pF

CE

Dark current

I

CEO

= 48 V, Ta = 85°C

-

CE

Collector-emitter capacitance

C

V = 0 V, f = 1 MHz

10

-

CE

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2012-04-26

TLP291

Coupled Electrical Characteristics (Unless otherwise specified, Ta = 25°C)

CHARACTERISTIC

SYMBOL

TEST CONDITION

MIN

TYP.

MAX

UNIT

%

I

= 5 mA, V = 5 V

CE

50

400

-

F

Current transfer ratio

I / I

C F

Rank GB

100

= 1 mA, V

= 0.4 V

-

30

-

60

-

CE

Saturated current transfer ratio

I

/ I

F (sat)

%

C

V

-

I

= 2.4 mA, I = 8 mA

F

0.3

-

C

Collector-emitter saturation voltage

OFF-state collector current

V

= 0.2 mA, I = 1 mA

F

0.2

-

CE (sat)

Rank GB

0.3

10

-

I

V

= 0.7 V, V = 48 V

CE

μA

-

C (off)

F

Isolation Characteristics (Unless otherwise specified, Ta = 25°C)

CHARACTERISTIC

SYMBOL

TEST CONDITION

= 0 V, f = 1 MHz

MIN

-

TYP.

0.8

MAX

UNIT

Total capacitance (input to output)

Isolation resistance

C

S

V

pF

-

S

12

14

R

S

= 500 V, R.H.≤60%

1×10

10

Ω

AC , 1 minute

3750

-

Vrms

Vdc

Isolation voltage

BV

S

AC , 1 second, in OIL

DC , 1 minute, in OIL

10000

-

Switching Characteristics (Unless otherwise specified, Ta = 25°C)

CHARACTERISTIC

SYMBOL

TEST CONDITION

MIN

TYP.

MAX

UNIT

-

Rise time

Fall time

t

r

4

7

-

t

f

V

= 10 V, I = 2 mA

C

CC

R = 100Ω

μs

L

Turn-on time

Turn-off time

Turn-on time

Storage time

Turn-off time

t

7

on

t

7

off

t

2

on

R = 1.9 kΩ

V

(Fig.1)

L

CC

μs

t

30

60

s

= 5 V, I = 16 mA

F

t

off

(Fig.1) Switching Time Test Circuit

t

on

t

off

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2012-04-26

TLP291

I

- Ta

P

- Ta

F

C

160

140

120

100

80

100

80

60

40

20

0

60

(Note) This curve shows

the maximum limit to the

input forward current.

40

(Note) This curve shows the

maximum limit to the collector

power dissipation.

20

0

-20

0

20

40

60

80 100 120

-20

0

20

40

60

80

100

120

Ambient temperature Ta (˚C)

Ambient temperature

Ta (˚C)

I

- D

I

- V

F F

F P

R

3000

100

Pules width ≤100μs

Ta=25˚C

1000

500

300

10

1

110˚C

85˚C

50˚C

25˚C

0˚C

100

-25˚C

-55˚C

50

30

(Note) This curve shows the

maximum limit to the input

forward current (pulsed).

0.1

10

10⁰

10^-1

10^-2

10^-3

0.6 0.8

1

1.2 1.4 1.6 1.8

(V)

2

Duty cycle ratio

D

Input forward voltage

V

F

R

∆ V / ∆ Ta - I

I

- V

F

F P

1000

100

10

-3.2

-2.8

-2.4

-2

-1.6

-1.2

-0.8

-0.4

Pulse width ≤10μs

Repeative frequency=100Hz

Ta=25°C

1

0.1

1

10

100

0.6

1

1.4

1.8

2.2

2.6

3

3.4

Input forward current

I

(mA)

Input forward voltage (pulsed) V_FP(V)

F

Note: The above characteristics curves are presented for reference only and not guaranteed by production test,

unless otherwise noted.

5

2012-04-26

TLP291

I

- V

I

- V

C

C E

C

C E

50

40

30

20

10

0

30

25

20

15

10

5

Ta=25˚C

P

( m a x )

C

5 0

3 0

2 0

5 0

3 0

1 5

2 0

1 5

1 0

5

I

= 2 m A

F

I

= 5 m A

F

0

2

4

6

8

10

0

0.2

0.4

0.6

0.8

1

Collector-emitter voltage V_CE(V)

I

- I

I

-Ta

C E O

C

F

10

100

10

1

Ta=25˚C

1

0.1

V

=48V

CE

24V

10V

5V

0.01

0.001

0.0001

V

=10V

=5V

CE

V

CE

V

=0.4V

CE

0.1

0

20

40

60

80

100

120

0.1

1

10

100

Input forward voltage

I

(mA)

Ambient temperature Ta (°C)

F

I

- I

C /

F

1000

100

10

V

=10V

CE

V

=5V

CE

V

=0.4V

CE

0.1

1

10

F

100

Input forward current

I

(mA)

Note: The above characteristics curves are presented for reference only and not guaranteed by production test,

unless otherwise noted.

6

2012-04-26

TLP291

V

- Ta

I

- Ta

C E ( s a t )

C

0.28

0.24

0.20

0.16

0.12

0.08

0.04

0.00

100

10

1

25

10

5

1

I =0.5mA

F

I

=8mA, I =2.4mA

C

F

=1mA, I =0.2mA

F

C

V

=5V

CE

0.1

-60 -40 -20

0

20 40 60 80 100 120

-60 -40 -20

0

20 40 60 80 100 120

Ambient temperature Ta (°C)

Switching time - R

L

Switching time - Ta

1000

10000

1000

100

10

Ta=25˚C

I

=16mA

F

V

=5V

CC

t

off

100

10

1

t

off

t

s

t

s

T

on

I

=16mA

F

V

=5V

CC

t

on

R

L

=1.9kΩ

0.1

1

-60 -40 -20

0

20 40 60 80 100 120

1

10

Load resistance

100

Ambient temperature Ta (°C)

R

L

(kΩ)

Note: The above characteristics curves are presented for reference only and not guaranteed by production test,

unless otherwise noted.

7

2012-04-26

TLP291

Soldering and Storage

1. Soldering

1.1 Soldering

When using a soldering iron or medium infrared ray/hot air reflow, avoid a rise in device temperature as

much as possible by observing the following conditions.

1) Using solder reflow

·Temperature profile example of lead (Pb) solder

(°C)

240

This profile is based on the device’s

maximum heat resistance guaranteed

value.

210

Set the preheat temperature/heating

temperature to the optimum temperature

corresponding to the solder paste

type used by the customer within the

described profile.

160

140

less than 30s

60 to 120s

Time

(s)

·Temperature profile example of using lead (Pb)-free solder

(°C)

This profile is based on the device’s

maximum heat resistance guaranteed

value.

Set the preheat temperature/heating

temperature to the optimum temperature

corresponding to the solder paste

type used by the customer within the

described profile.

260

230

190

180

60 to 120s

30 to 50s

Time

(s)

Reflow soldering must be performed once or twice.

The mounting should be completed with the interval from the first to the last mountings being 2 weeks.

2) Using solder flow (for lead (Pb) solder, or lead (Pb)-free solder)

· Please preheat it at 150°C between 60 and 120 seconds.

· Complete soldering within 10 seconds below 260°C. Each pin may be heated at most once.

3) Using a soldering iron

Complete soldering within 10 seconds below 260°C, or within 3 seconds at 350°C. Each pin may

be heated at most once.

8

2012-04-26

TLP291

2. Storage

1) Avoid storage locations where devices may be exposed to moisture or direct sunlight.

2) Follow the precautions printed on the packing label of the device for transportation and storage.

3) Keep the storage location temperature and humidity within a range of 5°C to 35°C and 45% to 75%,

respectively.

4) Do not store the products in locations with poisonous gases (especially corrosive gases) or in dusty

conditions.

5) Store the products in locations with minimal temperature fluctuations. Rapid temperature changes during

storage can cause condensation, resulting in lead oxidation or corrosion, which will deteriorate the

solderability of the leads.

6) When restoring devices after removal from their packing, use anti-static containers.

7) Do not allow loads to be applied directly to devices while they are in storage.

8) If devices have been stored for more than two years under normal storage conditions, it is recommended

that you check the leads for ease of soldering prior to use.

9

2012-04-26

TLP291

EN 60747-5-5 Option:(V4)

Types

: TLP291

Type designations for “option: (V4)”, which are tested under EN 60747 requirements.

(e.g.): TLP291 (V4GB-TP,E

V4 : EN 60747 option

GB: CTR rank type

TP : Standard tape & reel type

E

: [[G]]/RoHS COMPATIBLE (Note4 )

Note: Use TOSHIBA standard type number for safety standard application.

(e.g.): TLP291(V4GB-TP,E TLP291

Æ

Note4: Please contact your Toshiba sales representative for details on environmental information such

as the product’s RoHS compatibility.

RoHS is the Directive 2002/95/EC of the European Parliament and of the Council of 27

January 2003 on the restriction of the use of certain hazardous substances in electrical and

electronics equipment.

EN 60747 Isolation Characteristics

Description

Symbol

Rating

Unit

-

Application classification

for rated mains voltage ≤ 150Vrms

for rated mains voltage ≤ 300Vrms

I-IV

I-III

Climatic classification

Pollution degree

55 / 110 / 21

2

-

Maximum operating insulation voltage

V

707

Vpk

IORM

Input to output test voltage, Method A

Vpr=1.5 × V

, type and sample test

V

pr

V

pr

1060

IORM

tp=10s, partial discharge<5pC

Input to output test voltage, Method B

Vpr=1.875 × V

, 100% production test

1325

6000

Vpk

IORM

tp=1s, partial discharge<5pC

Highest permissible overvoltage

(transient overvoltage, tpr=60s)

V

TR

Safety limiting values (max. permissible ratings in case of fault,

also refer to thermal derating curve)

current (input current: I , Psi=0mW)

F

power (output or total power dissipation)

temperature

I

P

T

250

400

150

mA

mW

°C

si

Insulation resistance

9

>

R

si

10

Ω

=

V =500V, Ta=T

IO si

10

2012-04-26

TLP291

Insulation Related Specifications

Minimum creepage distance

Minimum clearance

Cr

Cl

5.0mm

0.4mm

175

Minimum insulation thickness

Comparative tracking index

ti

CTl

1. If a printed circuit is incorporated, the creepage distance and clearance may be reduced below this value.

(e.g. at a standard distance between soldering eye centers of 3.5mm).

If this is not permissible, the user shall take suitable measures.

2. This photocoupler is suitable for ‘safe electrical isolation’ only within the safety limit data.

Maintenance of the safety data shall be ensured by means of protective circuit.

VDE test sign: Marking on product

for EN 60747

V

: Marking on packing

for EN 60747

DE

V

Marking Example: TLP291

1pin mark

Lot No.

Option(V4) mark

V

Process Lot No.

Country of origin

e.g.) J; Japan

Type

CTR rank mark

11

2012-04-26

TLP291

1

Partial discharge measurement procedure according to EN 60747

Destructive test for qualification and sampling tests.

Figure

Method A

V

(6kV)

INITIAL

V

(for type and sampling tests,

destructive tests)

V

(1060V)

pr

t_{1, 2}

t

= 1 to 10 s

= 1 s

V

(707V)

t

IORM

t_{3, 4}

t

t_p(Measuring time for

partial discharge)

= 10 s

= 12 s

= 60 s

0

t

3

P

4

t_b

t_ini

t

b

t

1

ini

2

Figure

2

Partial discharge measurement procedure according to EN 60747

Non-destructive test for100% inspection.

Method B

V

(1325V )

pr

V

(for sample test, non-

destructive test)

V

(707V )

IORM

= 0.1 s

t₃, t₄

t_p(Measuring time for

partial discharge)

t_b

= 1 s

= 1.2 s

t

P

t

3

b

t

4

Figure

3 Dependency of maximum safety ratings on ambient temperature

500

400

300

Psi

(mW)

Isi

(mA)

400

300

200

100

0

200

100

Æ

Psi

Isi Å

0

25

50

75

100

Ta (°C)

125

150

175

12

2012-04-26

TLP291

RESTRICTIONS ON PRODUCT USE

•

Toshiba Corporation, and its subsidiaries and affiliates (collectively "TOSHIBA"), reserve the right to make changes to the information

in this document, and related hardware, software and systems (collectively "Product") without notice.

This document and any information herein may not be reproduced without prior written permission from TOSHIBA. Even with

TOSHIBA's written permission, reproduction is permissible only if reproduction is without alteration/omission.

Though TOSHIBA works continually to improve Product's quality and reliability, Product can malfunction or fail. Customers are

responsible for complying with safety standards and for providing adequate designs and safeguards for their hardware, software and

systems which minimize risk and avoid situations in which a malfunction or failure of Product could cause loss of human life, bodily

injury or damage to property, including data loss or corruption. Before customers use the Product, create designs including the

Product, or incorporate the Product into their own applications, customers must also refer to and comply with (a) the latest versions of

all relevant TOSHIBA information, including without limitation, this document, the specifications, the data sheets and application notes

for Product and the precautions and conditions set forth in the "TOSHIBA Semiconductor Reliability Handbook" and (b) the

instructions for the application with which the Product will be used with or for. Customers are solely responsible for all aspects of their

own product design or applications, including but not limited to (a) determining the appropriateness of the use of this Product in such

design or applications; (b) evaluating and determining the applicability of any information contained in this document, or in charts,

diagrams, programs, algorithms, sample application circuits, or any other referenced documents; and (c) validating all operating

parameters for such designs and applications. TOSHIBA ASSUMES NO LIABILITY FOR CUSTOMERS' PRODUCT DESIGN OR

APPLICATIONS.

•

PRODUCT IS NEITHER INTENDED NOR WARRANTED FOR USE IN EQUIPMENTS OR SYSTEMS THAT REQUIRE

EXTRAORDINARILY HIGH LEVELS OF QUALITY AND/OR RELIABILITY, AND/OR A MALFUNCTION OR FAILURE OF WHICH

MAY CAUSE LOSS OF HUMAN LIFE, BODILY INJURY, SERIOUS PROPERTY DAMAGE AND/OR SERIOUS PUBLIC IMPACT

("UNINTENDED USE"). Except for specific applications as expressly stated in this document, Unintended Use includes, without

limitation, equipment used in nuclear facilities, equipment used in the aerospace industry, medical equipment, equipment used for

automobiles, trains, ships and other transportation, traffic signaling equipment, equipment used to control combustions or explosions,

safety devices, elevators and escalators, devices related to electric power, and equipment used in finance-related fields. IF YOU USE

PRODUCT FOR UNINTENDED USE, TOSHIBA ASSUMES NO LIABILITY FOR PRODUCT. For details, please contact your

TOSHIBA sales representative.

•

Do not disassemble, analyze, reverse-engineer, alter, modify, translate or copy Product, whether in whole or in part.

Product shall not be used for or incorporated into any products or systems whose manufacture, use, or sale is prohibited under any

applicable laws or regulations.

•

The information contained herein is presented only as guidance for Product use. No responsibility is assumed by TOSHIBA for any

infringement of patents or any other intellectual property rights of third parties that may result from the use of Product. No license to

any intellectual property right is granted by this document, whether express or implied, by estoppel or otherwise.

ABSENT A WRITTEN SIGNED AGREEMENT, EXCEPT AS PROVIDED IN THE RELEVANT TERMS AND CONDITIONS OF SALE

FOR PRODUCT, AND TO THE MAXIMUM EXTENT ALLOWABLE BY LAW, TOSHIBA (1) ASSUMES NO LIABILITY

WHATSOEVER, INCLUDING WITHOUT LIMITATION, INDIRECT, CONSEQUENTIAL, SPECIAL, OR INCIDENTAL DAMAGES OR

LOSS, INCLUDING WITHOUT LIMITATION, LOSS OF PROFITS, LOSS OF OPPORTUNITIES, BUSINESS INTERRUPTION AND

LOSS OF DATA, AND (2) DISCLAIMS ANY AND ALL EXPRESS OR IMPLIED WARRANTIES AND CONDITIONS RELATED TO

SALE, USE OF PRODUCT, OR INFORMATION, INCLUDING WARRANTIES OR CONDITIONS OF MERCHANTABILITY, FITNESS

FOR A PARTICULAR PURPOSE, ACCURACY OF INFORMATION, OR NONINFRINGEMENT.

•

GaAs (Gallium Arsenide) is used in Product. GaAs is harmful to humans if consumed or absorbed, whether in the form of dust or

vapor. Handle with care and do not break, cut, crush, grind, dissolve chemically or otherwise expose GaAs in Product.

Do not use or otherwise make available Product or related software or technology for any military purposes, including without

limitation, for the design, development, use, stockpiling or manufacturing of nuclear, chemical, or biological weapons or missile

technology products (mass destruction weapons). Product and related software and technology may be controlled under the

applicable export laws and regulations including, without limitation, the Japanese Foreign Exchange and Foreign Trade Law and the

U.S. Export Administration Regulations. Export and re-export of Product or related software or technology are strictly prohibited

except in compliance with all applicable export laws and regulations.

•

Please contact your TOSHIBA sales representative for details as to environmental matters such as the RoHS compatibility of Product.

Please use Product in compliance with all applicable laws and regulations that regulate the inclusion or use of controlled substances,

including without limitation, the EU RoHS Directive. TOSHIBA ASSUMES NO LIABILITY FOR DAMAGES OR LOSSES

OCCURRING AS A RESULT OF NONCOMPLIANCE WITH APPLICABLE LAWS AND REGULATIONS.

13

2012-04-26


型号：	TLP291(GB-TP,E(O
厂家：	TOSHIBA
描述：	Optocoupler - Transistor Output, 1 CHANNEL TRANSISTOR OUTPUT OPTOCOUPLER, ROHS COMPLIANT, 11-3C1, SOP-4 输出元件光电
文件：	总13页 (文件大小：278K)
中文：	中文翻译
下载：	下载PDF数据表文档文件

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