TLP351HF(LF4) [TOSHIBA]
LOGIC OUTPUT OPTOCOUPLER;
| 型号： | TLP351HF(LF4) |
| 厂家： | 
TOSHIBA |
| 描述： | LOGIC OUTPUT OPTOCOUPLER 输出元件 光电 |
| 文件： | 总21页 (文件大小：491K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
TLP351H,TLP351HF
Photocouplers GaAℓAs Infrared LED & Photo IC
TLP351H,TLP351HF
1. Applications
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•
•
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Industrial Inverters
MOSFET Gate Drivers
IGBT Gate Drivers
Induction Cooktop and Home Appliances
2. General
The TLP351H is a photocoupler in a DIP8 package that consists of a GaAℓAs infrared light-emitting diode (LED)
opticallycoupledtoanintegratedhigh-gain,high-speedphotodetectorICchip.Itprovidesguaranteedperformance
and specifications at temperatures up to 125.The TLP351H has an internal Faraday shield that provides a
guaranteed Common-mode transient immunity of ±20 kV/µs.
It has a totem-pole output that can both sink and source current. The TLP351H is ideal for IGBT and power
MOSFET gate drive.
3. Features
(1) Output peak current: ±0.6 A (max)
(2) Operating temperature: -40 to 125
(3) Supply current: 2 mA (max)
(4) Supply voltage: 10 to 30 V
(5) Threshold input current: 5 mA (max)
(6) Propagation delay time: 700 ns (max)
(7) Common-mode transient immunity: ±20 kV/µs (min)
(8) Isolation voltage: 3750 Vrms (min)
(9) Safety standards
UL-approved: UL1577, File No.E67349
cUL-approved: CSA Component Acceptance Service No.5A File No.E67349
VDE-approved: EN60747-5-5, EN60065 or EN60950-1 (Note 1)
CQC-approved: GB4943.1, GB8898 Japan Factory
Note 1: When an EN60747-5-5 approved type is needed, please designate the Option (D4).
Start of commercial production
2011-08
©2016 Toshiba Corporation
2016-04-18
Rev.6.0
1
TLP351H,TLP351HF
4. Packaging (Note)
TLP351H
TLP351H(LF1,TP1)
TLP351H(LF5,TP5)
11-10C405S
11-10C401S
11-10C4S
TLP351HF
TLP351HF(LF4,TP4)
11-10C404S
11-10C402S
Note: Through-hole type: TLP351H, TLP351HF
Lead forming option: (LF1), (LF4), (LF5)
Taping option: (TP1), (TP4), (TP5)
5. Pin Assignment
1: N.C.
2: Anode
3: Cathode
4: N.C.
5: GND
6: VO(Output)
7: N.C.
8: VCC
©2016 Toshiba Corporation
2016-04-18
Rev.6.0
2
TLP351H,TLP351HF
6. Internal Circuit (Note)
Note: A 0.1-µF bypass capacitor must be connected between pin 8 and pin 5.
7. Principle of Operation
7.1. Truth Table
Input
LED
M1
M2
Output
H
L
ON
ON
OFF
ON
H
L
OFF
OFF
7.2. Mechanical Parameters
7.62-mm Pitch
10.16-mm Pitch
Characteristics
Unit
mm
TLP351H
7.0 (min)
7.0 (min)
0.4 (min)
TLP351HF
8.0 (min)
8.0 (min)
0.4 (min)
Creepage distances
Clearance distances
Internal isolation thickness
©2016 Toshiba Corporation
2016-04-18
Rev.6.0
3
TLP351H,TLP351HF
8. Absolute Maximum Ratings (Note) (Unless otherwise specified, Ta = 25 )
Characteristics
Input forward current
Symbol
Note
Rating
Unit
LED
IF
20
-0.6
1
mA
mA/
A
Input forward current derating
(Ta ≥ 116 )
(Ta ≥ 110 )
∆IF/∆Ta
IFPT
Peak transient input forward
current
(Note 1)
Peak transient input forward
current derating
∆IFPT/∆Ta
-25
mA/
Input reverse voltage
Input power dissipation
VR
PD
5
V
40
mW
Input power dissipation
derating
(Ta ≥ 110 )
∆PD/∆Ta
-1.0
mW/
Detector Peak high-level output current
Peak low-level output current
Output voltage
(Ta = -40 to 125 )
(Ta = -40 to 125 )
IOPH
IOPL
(Note 2)
(Note 2)
-0.6
+0.6
35
A
V
VO
Supply voltage
VCC
35
Output power dissipation
PO
260
-6.5
mW
Output power dissipation
derating
(Ta ≥ 110 )
∆PO/∆Ta
mW/
Common Operating temperature
Storage temperature
Topr
Tstg
Tsol
BVS
-40 to 125
-55 to 150
260
Lead soldering temperature
Isolation voltage
(10 s)
(Note 3)
(Note 4)
AC, 60 s,
3750
Vrms
R.H. ≤ 60 %, Ta = 25
Note: Using continuously under heavy loads (e.g. the application of high temperature/current/voltage and the
significant change in temperature, etc.) may cause this product to decrease in the reliability significantly even
if the operating conditions (i.e. operating temperature/current/voltage, etc.) are within the absolute maximum
ratings.
Please design the appropriate reliability upon reviewing the Toshiba Semiconductor Reliability Handbook
("Handling Precautions"/"Derating Concept and Methods") and individual reliability data (i.e. reliability test
report and estimated failure rate, etc).
Note 1: Pulse width (PW) ≤ 1 µs, 300 pps
Note 2: Exponential waveform. Pulse width ≤ 10 µs, f ≤ 15 kHz
Note 3: ≥ 2 mm below seating plane.
Note 4: This device is considered as a two-terminal device: Pins 1, 2, 3 and 4 are shorted together, and pins 5, 6, 7
and 8 are shorted together.
9. Recommended Operating Conditions (Note)
Characteristics
Symbol
Note
Min
Typ.
Max
Unit
Input on-state current
Input off-state voltage
Supply voltage
IF(ON)
VF(OFF)
VCC
(Note 1)
6.5
0
15
0.8
30
mA
V
(Note 2)
10
Peak high-level output current
Peak low-level output current
Operating frequency
IOPH
IOPL
f
-0.2
+0.2
25
A
(Note 3)
kHz
Note: The recommended operating conditions are given as a design guide necessary to obtain the intended
performance of the device. Each parameter is an independent value. When creating a system design using
this device, the electrical characteristics specified in this datasheet should also be considered.
Note: A ceramic capacitor (0.1 µF) should be connected between pin 8 and pin 5 to stabilize the operation of a high-
gain linear amplifier. Otherwise, this photocoupler may not switch properly. The bypass capacitor should be
placed within 1 cm of each pin.
Note 1: The rise and fall times of the input on-current should be less than 0.5 µs.
Note 2: Denotes the operating range, not the recommended operating condition.
Note 3: Exponential waveform. IOPH ≥ -0.4 A (≤ 2.0 µs), IOPL ≤ 0.4 A (≤ 2.0 µs), Ta = 125
©2016 Toshiba Corporation
2016-04-18
Rev.6.0
4
TLP351H,TLP351HF
10. Electrical Characteristics (Note)
(Unless otherwise specified, Ta = -40 to 125 )
Test
Circuit
Characteristics
Symbol
Note
Test Condition
Min
Typ.
Max
Unit
Input forward voltage
VF
IF = 10 mA, Ta = 25
1.45
1.55
-2.0
1.7
V
Input forward voltage
temperature coefficient
∆VF/∆Ta
IF = 10 mA
mV/
Input reverse current
Input capacitance
IR
Ct
VR = 5 V, Ta = 25
95
10
µA
pF
A
V = 0 V, f = 1 MHz, Ta = 25
IF = 5 mA, VCC = 15 V,
Peak high-level output current
IOPH
(Note 1)
(Note 1)
Fig.
-0.4
-0.2
13.1.1 V8-6 = 4 V
IF = 5 mA, VCC = 15 V,
V8-6 = 10 V
0.2
0.4
6.0
0.5
-0.4
Peak low-level output current
IOPL
Fig.
IF = 0 mA, VCC = 15 V,
13.1.2 V6-5 = 2 V
IF = 0 mA, VCC = 15 V,
V6-5 = 10 V
High-level output voltage
Low-level output voltage
High-level supply current
Low-level supply current
VOH
VOL
ICCH
ICCL
Fig.
IF = 5 mA, VCC = 10 V,
13.1.3 IO = -100 mA
8.5
0.34
1.2
1.1
V
Fig.
VF = 0.8 V, VCC = 10 V,
13.1.4 IO = 100 mA
1.0
2.0
2.0
Fig.
IF = 10 mA, VCC = 10 to 30 V,
13.1.5 VO = Open
mA
Fig.
IF = 0 mA, VCC = 10 to 30 V,
13.1.6 VO = Open
Threshold input current (L/H)
Threshold input voltage (H/L)
Supply voltage
IFLH
VFHL
VCC
VCC = 15 V, VO > 1 V
0.8
10
1.1
5
VCC = 15 V, VO < 1 V
30
V
Note: All typical values are at Ta = 25 .
Note: This device is designed for low power consumption, making it more sensitive to ESD than its predecessors.
Extra care should be taken in the design of circuitry and pc board implementation to avoid ESD problems.
Note 1: IO application time ≤ 50 µs, single pulse.
11. Isolation Characteristics (Unless otherwise specified, Ta = 25 )
Characteristics
Symbol
Note
Test Conditions
Min
Typ.
Max
Unit
Total capacitance (input to output)
Isolation resistance
CS
RS
(Note 1) VS = 0 V, f = 1 MHz
1.0
pF
(Note 1) VS = 500 V, R.H. ≤ 60 %
1
1014
Ω
× 1012
Isolation voltage
BVS
(Note 1) AC, 60 s
AC, 1 s in oil
3750
Vrms
10000
10000
DC, 60 s in oil
Vdc
Note 1: This device is considered as a two-terminal device: Pins 1, 2, 3 and 4 are shorted together, and pins 5, 6, 7
and 8 are shorted together.
©2016 Toshiba Corporation
2016-04-18
Rev.6.0
5
TLP351H,TLP351HF
12. Switching Characteristics (Note)
(Unless otherwise specified, Ta = -40 to 125 )
Test
Circuit
Characteristics
Symbol
Note
Test Condition
Min
30
Typ.
Max
700
Unit
ns
Propagation delay time
(L/H)
tpLH
(Note 1)
Fig.
IF = 0 → 5 mA, VCC = 30 V,
13.1.7 Rg = 47 Ω, Cg = 3 nF
Propagation delay time
(H/L)
tpHL
tr
(Note 1)
(Note 1)
(Note 1)
IF = 5 → 0 mA, VCC = 30 V,
Rg = 47 Ω, Cg = 3 nF
30
50
700
Rise time
IF = 0 → 5 mA, VCC = 30 V,
Rg = 47 Ω, Cg = 3 nF
Fall time
tf
IF = 5 → 0 mA, VCC = 30 V,
Rg = 47 Ω, Cg = 3 nF
50
Pulse width distortion
|tpHL-tpLH| (Note 1)
IF = 0 ←→ 5 mA, VCC = 30 V,
Rg = 47 Ω, Cg = 3 nF
500
Common-mode transient
immunity at output high
CMH
CML
(Note 2)
(Note 3)
Fig.
VCM = 1000 Vp-p, IF = 5 mA,
13.1.8 VCC = 30 V, Ta = 25 ,
±20
±25
kV/µs
VO(min) = 26 V
Common-mode transient
immunity at output low
VCM = 1000 Vp-p, IF = 0 mA,
VCC = 30 V, Ta = 25 ,
VO(max) = 1 V
±20
±25
Note: All typical values are at Ta = 25 .
Note 1: f = 25 kHz, duty = 50 %, input current tr = tf = 5 ns, CL is approximately 15 pF which includes probe and stray
wiring capacitance.
Note 2: CMH is the maximum rate of rise of the common mode voltage that can be sustained with the output voltage
in the logic high state (VO > 26 V).
Note 3: CML is the maximum rate of fall of the common mode voltage that can be sustained with the output voltage in
the logic low state (VO < 1 V).
©2016 Toshiba Corporation
2016-04-18
Rev.6.0
6
TLP351H,TLP351HF
13. Test Circuits and Characteristics Curves
13.1. Test Circuits
Fig. 13.1.1 IOPH Test Circuit
Fig. 13.1.2 IOPL Test Circuit
Fig. 13.1.3 VOH Test Circuit
Fig. 13.1.4 VOL Test Circuit
Fig. 13.1.5 ICCH Test Circuit
Fig. 13.1.6 ICCL Test Circuit
Fig. 13.1.7 Switching Time Test Circuit and Waveform
Fig. 13.1.8 Common-Mode Transient Immunity and Waveform
©2016 Toshiba Corporation
2016-04-18
Rev.6.0
7
TLP351H,TLP351HF
13.2. Characteristics Curves (Note)
Fig. 13.2.1 IF - VF
Fig. 13.2.2 IF - Ta
Fig. 13.2.3 PO - Ta
Fig. 13.2.4 IFLH - Ta
Fig. 13.2.5 ICCL - Ta
Fig. 13.2.6 ICCH - Ta
©2016 Toshiba Corporation
2016-04-18
Rev.6.0
8
TLP351H,TLP351HF
Fig. 13.2.7 VOL - Ta
Fig. 13.2.8 VOH - Ta
Fig. 13.2.9 VOL - IOPL
Fig. 13.2.10 (VOH-VCC) - IOPH
Fig. 13.2.11 tpLH,tpHL,|tpHL-tpLH| - Ta
Fig. 13.2.12 tpLH,tpHL,|tpHL-tpLH| - IF
©2016 Toshiba Corporation
2016-04-18
Rev.6.0
9
TLP351H,TLP351HF
Fig. 13.2.13 tpLH,tpHL,|tpHL-tpLH| - VCC
NOTE: The above characteristics curves are presented for reference only and not guaranteed by production test,
unless otherwise noted.
©2016 Toshiba Corporation
2016-04-18
Rev.6.0
10
TLP351H,TLP351HF
14. Soldering and Storage
14.1. Precautions for Soldering
The soldering temperature should be controlled as closely as possible to the conditions shown below, irrespective
of whether a soldering iron or a reflow soldering method is used.
•
When using soldering reflow.
The soldering temperature profile is based on the package surface temperature.
(See the figure shown below, which is based on the package surface temperature.)
Reflow soldering must be performed once or twice.
The mounting should be completed with the interval from the first to the last mountings being 2 weeks.
Fig. 14.1.1 An Example of a Temperature Profile Fig. 14.1.2 An Example of a Temperature Profile
When Sn-Pb Eutectic Solder Is Used When Lead(Pb)-free Solder Is Used
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When using soldering flow (Applicable to both eutectic solder and Lead(Pb)-Free solder)
Preheat the device at a temperature of 150 (package surface temperature) for 60 to 120 seconds.
Mounting condition of 260 within 10 seconds is recommended.
Flow soldering must be performed once.
•
When using soldering Iron
Complete soldering within 10 seconds for lead temperature not exceeding 260 or within 3 seconds not
exceeding 350
Heating by soldering iron must be done only once per lead.
14.2. Precautions for General Storage
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Avoid storage locations where devices may be exposed to moisture or direct sunlight.
Follow the precautions printed on the packing label of the device for transportation and storage.
Keep the storage location temperature and humidity within a range of 5 to 35 and 45 % to 75 %,
respectively.
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•
Do not store the products in locations with poisonous gases (especially corrosive gases) or in dusty
conditions.
Store the products in locations with minimal temperature fluctuations. Rapid temperature changes during
storage can cause condensation, resulting in lead oxidation or corrosion, which will deteriorate the
solderability of the leads.
•
•
•
When restoring devices after removal from their packing, use anti-static containers.
Do not allow loads to be applied directly to devices while they are in storage.
If devices have been stored for more than two years under normal storage conditions, it is recommended
that you check the leads for ease of soldering prior to use.
©2016 Toshiba Corporation
2016-04-18
Rev.6.0
11
TLP351H,TLP351HF
15. Land Pattern Dimensions for Reference Only
Unit: mm
TLP351H
TLP351HF
Fig. 15.1 Lead forming and taping option
(LF1), (TP1), (LF5), (TP5)
Fig. 15.2 Lead forming and taping option
(LF4), (TP4)
16. Marking
©2016 Toshiba Corporation
2016-04-18
Rev.6.0
12
TLP351H,TLP351HF
17. EN60747-5-5 Option (D4) Specification
•
Part number: TLP351H, TLP351HF (Note 1)
•
The following part naming conventions are used for the devices that have been qualified according to
option (D4) of EN60747.
Example: TLP351H(D4-TP1, F)
D4: EN60747 option
TP: Tape type
F: [[G]]/RoHS COMPATIBLE (Note 2)
Note 1: Use TOSHIBA standard type number for safety standard application.
e.g., TLP351H(D4-TP1,F) → TLP351H
Note 2: Please contact your Toshiba sales representative for details on environmental information such as the product's
RoHS compatibility.
RoHS is the Directive 2011/65/EU of the European Parliament and of the Council of 8 June 2011 on the
restriction of the use of certain hazardous substances in electrical and electronics equipment.
Fig. 17.1 EN60747 Isolation Characteristics
©2016 Toshiba Corporation
2016-04-18
Rev.6.0
13
TLP351H,TLP351HF
Fig. 17.2 Insulation Related Specifications (Note)
Note: If a printed circuit is incorporated, the creepage distance and clearance may be reduced below this value. (e.
g., at a standard distance between soldering eye centers of 7.5 mm). If this is not permissible, the user shall
take suitable measures.
Note: This photocoupler is suitable for safe electrical isolation only within the safety limit data.
Maintenance of the safety data shall be ensured by means of protective circuits.
Fig. 17.3 Marking Example (Note)
Fig. 17.4 Marking Example (Note)
Note: Theabovemarkingisappliedtothephotocouplersthathavebeenqualifiedaccordingtooption(D4)ofEN60747.
©2016 Toshiba Corporation
2016-04-18
Rev.6.0
14
TLP351H,TLP351HF
Fig. 17.5 Measurement Procedure
©2016 Toshiba Corporation
2016-04-18
Rev.6.0
15
TLP351H,TLP351HF
Package Dimensions
Unit: mm
TLP351H
Weight: 0.54 g (typ.)
Package Name(s)
TOSHIBA: 11-10C4S
©2016 Toshiba Corporation
2016-04-18
Rev.6.0
16
TLP351H,TLP351HF
Package Dimensions
Unit: mm
TLP351H(LF1,TP1)
Weight: 0.53 g (typ.)
Package Name(s)
TOSHIBA: 11-10C401S
©2016 Toshiba Corporation
2016-04-18
Rev.6.0
17
TLP351H,TLP351HF
Package Dimensions
Unit: mm
TLP351H(LF5,TP5)
Weight: 0.53 g (typ.)
Package Name(s)
TOSHIBA: 11-10C405S
©2016 Toshiba Corporation
2016-04-18
Rev.6.0
18
TLP351H,TLP351HF
Package Dimensions
Unit: mm
TLP351HF
Weight: 0.54 g (typ.)
Package Name(s)
TOSHIBA: 11-10C402S
Nickname: DIP8
©2016 Toshiba Corporation
2016-04-18
Rev.6.0
19
TLP351H,TLP351HF
Package Dimensions
Unit: mm
TLP351HF(LF4,TP4)
Weight: 0.53 g (typ.)
Package Name(s)
TOSHIBA: 11-10C404S
©2016 Toshiba Corporation
2016-04-18
Rev.6.0
20
TLP351H,TLP351HF
RESTRICTIONS ON PRODUCT USE
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Toshiba Corporation, and its subsidiaries and affiliates (collectively "TOSHIBA"), reserve the right to make changes to the information
in this document, and related hardware, software and systems (collectively "Product") without notice.
This document and any information herein may not be reproduced without prior written permission from TOSHIBA. Even with TOSHIBA's
written permission, reproduction is permissible only if reproduction is without alteration/omission.
ThoughTOSHIBAworkscontinuallytoimproveProduct'squalityandreliability,Productcanmalfunctionorfail.Customersareresponsible
for complying with safety standards and for providing adequate designs and safeguards for their hardware, software and systems which
minimize risk and avoid situations in which a malfunction or failure of Product could cause loss of human life, bodily injury or damage
to property, including data loss or corruption. Before customers use the Product, create designs including the Product, or incorporate
the Product into their own applications, customers must also refer to and comply with (a) the latest versions of all relevant TOSHIBA
information, including without limitation, this document, the specifications, the data sheets and application notes for Product and the
precautions and conditions set forth in the "TOSHIBA Semiconductor Reliability Handbook" and (b) the instructions for the application
with which the Product will be used with or for. Customers are solely responsible for all aspects of their own product design or applications,
including but not limited to (a) determining the appropriateness of the use of this Product in such design or applications; (b) evaluating
and determining the applicability of any information contained in this document, or in charts, diagrams, programs, algorithms, sample
application circuits, or any other referenced documents; and (c) validating all operating parameters for such designs and applications.
TOSHIBA ASSUMES NO LIABILITY FOR CUSTOMERS' PRODUCT DESIGN OR APPLICATIONS.
•
PRODUCT IS NEITHER INTENDED NOR WARRANTED FOR USE IN EQUIPMENTS OR SYSTEMS THAT REQUIRE
EXTRAORDINARILY HIGH LEVELS OF QUALITY AND/OR RELIABILITY, AND/OR A MALFUNCTION OR FAILURE OF WHICH MAY
CAUSE LOSS OF HUMAN LIFE, BODILY INJURY, SERIOUS PROPERTY DAMAGE AND/OR SERIOUS PUBLIC IMPACT
("UNINTENDEDUSE").Exceptforspecificapplicationsasexpresslystatedinthisdocument, UnintendedUseincludes, withoutlimitation,
equipment used in nuclear facilities, equipment used in the aerospace industry, medical equipment, equipment used for automobiles,
trains, ships and other transportation, traffic signaling equipment, equipment used to control combustions or explosions, safety devices,
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representative.
•
•
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applicable laws or regulations.
•
•
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PURPOSE, ACCURACY OF INFORMATION, OR NONINFRINGEMENT.
•
•
GaAs (Gallium Arsenide) is used in Product. GaAs is harmful to humans if consumed or absorbed, whether in the form of dust or vapor.
Handle with care and do not break, cut, crush, grind, dissolve chemically or otherwise expose GaAs in Product.
Do not use or otherwise make available Product or related software or technology for any military purposes, including without limitation,
for the design, development, use, stockpiling or manufacturing of nuclear, chemical, or biological weapons or missile technology products
(mass destruction weapons). Product and related software and technology may be controlled under the applicable export laws and
regulations including, without limitation, the Japanese Foreign Exchange and Foreign Trade Law and the U.S. Export Administration
Regulations. Export and re-export of Product or related software or technology are strictly prohibited except in compliance with all
applicable export laws and regulations.
•
Please contact your TOSHIBA sales representative for details as to environmental matters such as the RoHS compatibility of Product.
Please use Product in compliance with all applicable laws and regulations that regulate the inclusion or use of controlled substances,
including without limitation, the EU RoHS Directive. TOSHIBA ASSUMES NO LIABILITY FOR DAMAGES OR LOSSES OCCURRING
AS A RESULT OF NONCOMPLIANCE WITH APPLICABLE LAWS AND REGULATIONS.
©2016 Toshiba Corporation
2016-04-18
Rev.6.0
21
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