TLP358(TP5) [TOSHIBA]
Optocoupler - IC Output, 1 CHANNEL LOGIC OUTPUT OPTOCOUPLER, 11-10C405, DIP-8;
| 型号： | TLP358(TP5) |
| 厂家： | 
TOSHIBA |
| 描述： | Optocoupler - IC Output, 1 CHANNEL LOGIC OUTPUT OPTOCOUPLER, 11-10C405, DIP-8 输出元件 光电 |
| 文件： | 总12页 (文件大小：365K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
TLP358/TLP358F
TOSHIBA Photocoupler GaAℓAs IRED LED + Photo IC
TLP358,TLP358F
Industrial Inverter
TLP358
Unit: mm
MOS FET / IGBT Gate Driver
IH(Induction Heating)
The TOSHIBA TLP358 consists of a GaAℓAs light-emitting diode and an
integrated photodetector. This unit is an 8-lead DIP package.
The TLP358 is suitable for gate driving IGBTs or power MOSFETs.
The TLP358F is of a long creepage distance and clearance type.
z
z
z
z
z
z
z
z
z
z
z
Peak output current : I = ± 6.0A (max)
OP
Guaranteed performance over temperature : −40 to 100°C
Supply current : I = 2 mA (max)
CC
Power supply voltage : 15 to 30 V
Input current: I = 5mA (max)
FLH
Switching time ( t
/ t
pLH pHL)
: 500 ns (max)
Common-mode transient immunity : ±15 kV / μs (min)
Isolation voltage : 3750 Vrms (min)
TOSHIBA
11−10C4
Weight: 0.54 g (typ.)
UL under application : UL1577, File No.E67349
c-UL under application: CSA Component Acceptance Service No. 5A, File No.E67349
Option (D4)
VDE / TÜV under application: EN 60747-5-2
TLP358F
Unit: mm
Pin Configuration (top view)
1
2
8
7
1: N.C
2: Anode
3: Cathode
4: N.C
5: GND
6: N.C
7: VO (output)
8: VCC
3
4
6
5
TOSHIBA
11−10C402
Construction Mechanical Rating
Weight: 0.54 g (typ.)
7.62 mm Pitch
TLP358 Type
10.16 mm Pitch
TLP358F Type
8.0 mm (min)
8.0 mm (min)
0.4 mm (min)
Creepage distance
Clearance
Insulation thickness
6.4 mm (min)
6.4 mm (min)
0.4 mm (min)
1
2009-08-10
TLP358/TLP358F
Schematic
Truth Table
I
CC
V
V
CC
Input
LED
M1
M2
Output
(M1)
(M2)
8
7
I
I
F
O
H
L
ON
ON
OFF
ON
H
L
2+
O
OFF
OFF
V
F
3−
GND
1.0 μF bypass capacitor must be
connected between pins 8 and 5. (Note 5)
SHIELD
5
Absolute Maximum Ratings (Ta = 25°C)
Characteristic
Symbol
Rating
20
Unit
mA
Forward current
I
F
Forward current derating (Ta ≥ 85°C)
ΔI /ΔTa
−0.54
mA/°C
A
F
Peak transient forward current
Reverse voltage
(Note 1)
I
1
5
FP
V
V
R
“H” peak output current
“L” peak output current
I
-6.0
A
OPH
Ta = −40 to 100°C
(Note 2)
I
6.0
A
OPL
Supply voltage
V
T
35
V
CC
Operating temperature range
Storage temperature range
Lead soldering temperature (10 s)
−40 to 100
−55 to 125
260
°C
°C
°C
opr
T
T
stg
(Note 3)
sol
Isolation voltage (AC, 1 minute, R.H. ≤ 60%)
(Note 4)
BV
3750
Vrms
S
Note: Using continuously under heavy loads (e.g. the application of high temperature/current/voltage and the
significant change in temperature, etc.) may cause this product to decrease in the reliability significantly even
if the operating conditions (i.e. operating temperature/current/voltage, etc.) are within the absolute maximum
ratings.
Please design the appropriate reliability upon reviewing the Toshiba Semiconductor Reliability Handbook
(“Handling Precautions”/“Derating Concept and Methods”) and individual reliability data (i.e. reliability test
report and estimated failure rate, etc).
Note 1: Pulse width P ≤ 1 μs, 300 pps
W
Note 2: Exponential waveform pulse width P ≤ 0.3μs, f ≤ 15kHz
W
Note 3: At 2 mm or more from the lead root.
Note 4: This device is regarded as a two terminal device: pins 1, 2, 3 and 4 are shorted together, as are pins 5, 6, 7
and 8.
Note 5: A ceramic capacitor(1.0 μF) should be connected from pin 8 to pin 5 to stabilize the operation of the high
gain linear amplifier. Failure to provide the bypass may impair the switching property.
The total lead length between capacitor and coupler should not exceed 1 cm.
2
2009-08-10
TLP358/TLP358F
Recommended Operating Conditions
Characteristic
Input current, ON
Symbol
Min
Typ.
Max
Unit
(Note 6)
I
7.5
0
⎯
⎯
⎯
⎯
⎯
⎯
10
0.8
30
mA
V
F (ON)
Input voltage, OFF
Supply voltage*
V
F (OFF)
V
15
⎯
V
CC
Peak output current
Operating frequency
Operating temperature
I
/I
± 5.5
50
A
OPH OPL
(Note 7)
f
⎯
kHz
°C
T
opr
−40
100
*This item denotes operating ranges, not meaning of recommended operating conditions.
Note: Recommended operating conditions are given as a design guideline to obtain expected performance of the
device. Additionally, each item is an independent guideline respectively. In developing designs using this
product, please confirm specified characteristics shown in this document.
Note 6: Input signal rise time (fall time) < 0.5 μs.
Note 7: Exponential waveform I
≥ -4.0 A (≤ 0.3 μs), I
≤ 4.0 A (≤ 0.3 μs)
OPL
OPH
Electrical Characteristics (Ta = −40 to 100°C, unless otherwise specified)
Test
Circuit
Characteristic
Forward voltage
Symbol
Test Conditions
= 10 mA, Ta = 25 °C
= 10 mA
Min
1.45
⎯
Typ.*
1.57
−2.0
Max
1.75
⎯
Unit
V
V
⎯
I
I
F
F
F
Temperature coefficient of forward
voltage
∆V /∆Ta
⎯
mV/°C
F
Input reverse current
Input capacitance
I
⎯
⎯
V
= 5 V, Ta = 25 °C
R
⎯
⎯
⎯
⎯
10
⎯
μA
R
C
V = 0 , f = 1 MHz, Ta = 25 °C
100
-4.0
pF
T
V
V
V
V
= 30 V, I = 5 mA , V
= -3.5 V
= -5.5 V
= 2.5 V
= 5.5 V
-2.0
-5.0
⎯
CC
CC
CC
CC
F
8-7
8-7
7-5
7-5
“H” Level
I
1
2
OPH
= 15 V, I = 5 mA , V
Output current
⎯
2.0
5.0
⎯
4.0
⎯
F
A
(Note 8)
= 30 V, I = 0 mA, V
F
“L” Level
I
OPL
= 15 V, I = 0 mA, V
⎯
F
V
V
= +15 V
= -15 V
CC 1
“H” Level
“L” Level
V
3
4
I
= 5 mA
F
11
13.7
⎯
OH
Output voltage
Supply current
V
EE 1
V
V
= 0.8 V
F
⎯
-14.9 -12.5
OL
R = 100 Ω
L
“H” Level
“L” Level
L → H
I
5
I
I
= 5 mA
= 0 mA
⎯
⎯
1.3
1.3
1.8
⎯
2.0
2.0
5
CCH
F
F
V
V
= 30 V
CC
mA
open
O
I
6
CCL
Threshold input current
Threshold input voltage
Supply voltage
I
⎯
⎯
⎯
⎯
⎯
―
⎯
mA
V
V
V
= 15 V , V > 1 V , I = 0 mA
O O
FLH
CC
CC
H → L
V
= 15 V , V < 1 V , I = 0 mA
0.8
15
⎯
FHL
O
O
V
⎯
⎯
30
V
CC
V
11.0
9.5
―
13.5
12.0
―
12.5
11.0
1.5
V
UVLO+
UVLO threshold
UVLO hysteresis
V
> 2.5 V , I = 5 mA
F
O
V
V
UVLO-
UVLO
―
V
HYS
*: All typical values are at Ta = 25°C
Note 8: Duration of I : ≤ 50 μs (1 PULSE)
O
Note 9: This product is more sensitive to static electricity (ESD) than the conventional product because of its
minimal power consumption design.
General static electricity precautions are necessary for handling this component.
3
2009-08-10
TLP358/TLP358F
Isolation Characteristics (Ta = 25°C)
Characteristic
Symbol
Test Conditions
Min.
Typ.
1.0
Max.
Unit
Capacitance input to output
Isolation resistance
C
R
V = 0, f = 1MHz
= 500 V, R.H. ≤ 60%
(Note4)
⎯
⎯
―
―
―
―
pF
S
S
12
14
V
(Note4) 1×10
10
Ω
S
AC,1 minute
3750
―
―
V
rms
Isolation voltage
BV
S
AC,1 second, in oil
DC,1 minute, in oil
10000
10000
―
Vdc
Switching Characteristics (Ta = −40 to 100°C, unless otherwise specified)
Test
Circuit
Characteristic
Symbol
Test Conditions
Min
Typ.*
Max
Unit
V
= 30 V,
L → H
H → L
t
I
I
= 0 → 5 mA
= 5 → 0 mA
50
50
230
230
500
500
CC
g
g
pLH
F
F
Propagation delay time
R = 10 Ω,
C = 10 nF
t
pHL
V
R
C
= 30 V,
= 10 Ω,
= 10 nF
CC
g
g
Switching Time Dispersion
between ON and OFF
7
ns
⎯
⎯
250
|t
-t
|
pHL pLH
V
= 30 V,
Output rise time (10-90%)
Output fall time (90-10%)
t
r
I
I
I
= 0 → 5 mA
= 5 → 0 mA
= 5 mA,
⎯
⎯
17
17
⎯
⎯
CC
g
g
F
F
F
R = 10 Ω,
C = 10 nF
t
f
Common mode transient immunity
at high level output
CM
- 15000
15000
⎯
⎯
⎯
⎯
H
V
= 1000 Vp-p
V
=26V
CM
O (min)
8
Ta = 25 °C,
V/μs
Common mode transient immunity
at low level output
I
F
= 0 mA,
V
= 30 V
CC
CM
L
V
=1V
O (max)
*: All typical values are at Ta = 25°C
Test Circuit 1: I
Test Circuit 2: I
OPH
OPL
8
5
8
1
1
I
OPL
V8-7
A
I
A
OPH
I
F
1.0μF
V
CC
V
CC
1.0μF
V7-5
4
4
5
Test Circuit 3: V
Test Circuit 4: V
OH
OL
8
8
5
1
1
V
V
V
CC1
EE1
CC1
V
F
R
L
I
R
L
F
1.0μF
V
OL
1.0μF
V
V
4
4
V
V
EE1
OH
5
4
2009-08-10
TLP358/TLP358F
Test Circuit 5: I
Test Circuit 6: I
CCH
CCL
I
CCH
A
8
5
I
CCL
A
8
5
1
1
4
I
F
1.0μF
V
1.0μF
CC
V
CC
4
Test Circuit 7: t
, t
, t , t
pLH pHL r f
8
5
1
Vo
Cg =10 nF
Rg = 10 Ω
1.0μF
I
I
F
F
VOH
t
t
f
r
VCC
90%
50%
10%
V
O
4
t
pHL
t
pLH
VOL
Test Circuit 8: CM , CM
H
L
1000 V
90%
8
5
1
I
V
F
CM
SW
10%
V
O
V
A
B
CC
t
t
f
r
1.0μF
4
SW A: I = 5 mA
F
CM
CM
H
L
26V
V
V
O
CM
1V
+
−
SW B: I = 0 mA
F
800(V)
800(V)
CM
=
CM
=
H
L
(μs)
t
f
(μs)
t
r
CM (CM ) is the maximum rate of rise (fall) of the common mode voltage that can be
L
H
sustained with the output voltage in the low (high) state.
5
2009-08-10
TLP358/TLP358F
Soldering and Storage
(1) Precautions for Soldering
1) When Using Soldering Reflow
z
An example of a temperature profile when Sn-Pb eutectic solder is used:
z
An example of a temperature profile when lead(Pb)-free solder is used:
z Reflow soldering must be performed once or twice.
z The mounting should be completed with the interval from the first to the last mountings being 2 weeks.
2) When using soldering Flow (Applicable to both eutectic solder and Lead(Pb)-Free solder)
z
z
z
Apply preheating of 150 deg.C for 60 to 120 seconds.
Mounting condition of 260 deg.C or less within 10 seconds is recommended.
Flow soldering must be performed once
3) When using soldering Iron (Applicable to both eutectic solder and Lead(Pb)-Free solder)
z
Complete soldering within 10 seconds for lead temperature not exceeding 260 deg.C or within 3 seconds
not exceeding 350 deg.C.
z
Heating by soldering iron must be only once per 1 lead
6
2009-08-10
TLP358/TLP358F
(2) Precautions for General Storage
1) Do not store devices at any place where they will be exposed to moisture or direct sunlight.
2) When transportation or storage of devices, follow the cautions indicated on the carton box.
3) The storage area temperature should be kept within a temperature range of 5 degree C
to 35 degree C, and relative humidity should be maintained at between 45% and 75%.
4) Do not store devices in the presence of harmful (especially corrosive) gases, or in dusty conditions.
5) Use storage areas where there is minimal temperature fluctuation. Because rapid temperature
changes can cause condensation to occur on stored devices, resulting in lead oxidation or corrosion,
as a result, the solderability of the leads will be degraded.
6) When repacking devices, use anti-static containers.
7) Do not apply any external force or load directly to devices while they are in storage.
8) If devices have been stored for more than two years, even though the above conditions have been
followed, it is recommended that solderability of them should be tested before they are used.
7
2009-08-10
TLP358/TLP358F
DIP8 Package Dimensions
DIP8（LF1）/（TP1）
DIP8（LF4）/（TP4）
Unit: mm
Unit: mm
TOSHIBA
11−10C401
TOSHIBA
11−10C404
Weight: 0.54 g (typ.)
Weight: 0.54 g (typ.)
DIP8（LF5）/（TP5）
Unit: mm
TOSHIBA
11−10C405
Weight: 0.54 g (typ.)
8
2009-08-10
TLP358/TLP358F
Specifications for Embossed-Tape Packing
for DIP8 Type Photocoupler：(TP1), (TP4), (TP5)
1. Applicable Package
Package Name
Product Type
DIP8LF1 / DIP8LF5
DIP8LF4
TLP358
TLP358F
2. Product Naming System
Type of package used for shipment is denoted by a symbol suffix after a product number. The method of
classification is as below.
(Example１)
ＴＬＰ３５８（ＴＰ１，Ｆ）
[[G]]/RoHS COMPATIBLE (Note 10)
Tape type
Device name
(Example２)
ＴＬＰ３５８Ｆ（ＴＰ４，Ｆ）
[[G]]/RoHS COMPATIBLE (Note 10)
Tape type
Device name
3. Tape Dimensions
3.1 Orientation of Devices in Relation to Direction of Tape Movement
Device orientation in the recesses is as shown in Figure 1.
Tape feed
Figure 1 Device Orientation
3.2 Tape Packing Quantity
DIP8LF1 / DIP8LF5
DIP8LF4
：1,500 devices per reel
：1,000 devices per reel
9
2009-08-10
TLP358/TLP358F
3.3 Empty Device Recesses Are as Shown in Table 1.
Table 1 Empty Device Recesses
Standard
Remarks
Occurrences of 2 or more
successive empty device
recesses
Within any given 40-mm section of
tape, not including leader and trailer
0
Single
recesses
empty
device
6 devices (max) per reel
Not including leader and trailer
3.4 Start and End of Tape:
The start of the tape has 30 or more empty holes. The end of the tape has 30 or more empty holes
and two empty turns only for a cover tape.
3.5 Tape Specification
(1) Tape material: Plastic (protection against electrostatics)
(2) Dimensions: The tape dimensions are as shown in Figure 2 and Table 2.
2.0 ± 0.1
+0.1
−0
φ1.5
0.4 ± 0.05
F
G
A
φ1.6 ± 0.1
K
0
4.55 ± 0.2
Figure 2 Tape Forms
Table 2 Tape Dimension
Unit: mm
Unless otherwise specified: ±0.1
Dimensions
(TP1), (TP5)
Symbol
Remark
(TP4)
A
B
D
E
F
10.4
10.1
7.5
12.3
10.1
7.5
⎯
⎯
Center line of indented square hole and sprocket hole
1.75
16.0
4.0
1.75
16.0
4.0
Distance between tape edge and hole center
+0.1
Cumulative error
Cumulative error
Internal space
(max) per 10 feed holes
(max) per 10 feed holes
−0.3
+0.1
−0.3
G
K
4.1
4.1
0
10
2009-08-10
TLP358/TLP358F
3.6 Reel
(1) Material: Plastic
(2) Dimensions: The reel dimensions are as shown in Figure 3 and Table 3.
Table 3 Reel Dimension
Unit: mm
Symbol
Dimensions
A
B
φ380 ± 2
φ80 ± 1
U
C
φ13 ± 0.5
2.0 ± 0.5
4.0 ± 0.5
17.5 ± 0.5
21.5 ± 1.0
E
E
U
W1
W2
W1
W2
Figure 3 Reel Forms
4. Packing
Either one reel or five reels of photocouplers are packed in a shipping carton.
5. Label Indication
The carton bears a label indicating the product number, the symbol representing classification of
standard, the quantity, the lot number and the Toshiba company name.
6. Ordering Method
When placing an order, please specify the product number, the tape type and the quantity as shown in
the following example.
(Example 1)
ＴＬＰ３５８（ＴＰ１，Ｆ）１５００pcs
Quantity (must be a multiple of 1500)
[[G]]/RoHS COMPATIBLE (Note 10)
Tape type
Device name
(Example 2)
ＴＬＰ３５８Ｆ（ＴＰ４，Ｆ）２０００pcs
Quantity (must be a multiple of 1000)
[[G]]/RoHS COMPATIBLE(Note 10)
Tape type
Device name
Note 10 : Please contact your TOSHIBA sales representative for details as to environmental matters such as the
RoHS compatibility of Product.
RoHS is the Directive 2002/95/EC of the European Parliament and of the Council of 27 January 2003 on
the restriction of the use of certain hazardous substances in electrical and electronics equipment.
11
2009-08-10
TLP358/TLP358F
RESTRICTIONS ON PRODUCT USE
•
•
•
Toshiba Corporation, and its subsidiaries and affiliates (collectively “TOSHIBA”), reserve the right to make changes to the information
in this document, and related hardware, software and systems (collectively “Product”) without notice.
This document and any information herein may not be reproduced without prior written permission from TOSHIBA. Even with
TOSHIBA’s written permission, reproduction is permissible only if reproduction is without alteration/omission.
Though TOSHIBA works continually to improve Product’s quality and reliability, Product can malfunction or fail. Customers are
responsible for complying with safety standards and for providing adequate designs and safeguards for their hardware, software and
systems which minimize risk and avoid situations in which a malfunction or failure of Product could cause loss of human life, bodily
injury or damage to property, including data loss or corruption. Before creating and producing designs and using, customers must
also refer to and comply with (a) the latest versions of all relevant TOSHIBA information, including without limitation, this document,
the specifications, the data sheets and application notes for Product and the precautions and conditions set forth in the “TOSHIBA
Semiconductor Reliability Handbook” and (b) the instructions for the application that Product will be used with or for. Customers are
solely responsible for all aspects of their own product design or applications, including but not limited to (a) determining the
appropriateness of the use of this Product in such design or applications; (b) evaluating and determining the applicability of any
information contained in this document, or in charts, diagrams, programs, algorithms, sample application circuits, or any other
referenced documents; and (c) validating all operating parameters for such designs and applications. TOSHIBA ASSUMES NO
LIABILITY FOR CUSTOMERS’ PRODUCT DESIGN OR APPLICATIONS.
•
Product is intended for use in general electronics applications (e.g., computers, personal equipment, office equipment, measuring
equipment, industrial robots and home electronics appliances) or for specific applications as expressly stated in this document.
Product is neither intended nor warranted for use in equipment or systems that require extraordinarily high levels of quality and/or
reliability and/or a malfunction or failure of which may cause loss of human life, bodily injury, serious property damage or serious
public impact (“Unintended Use”). Unintended Use includes, without limitation, equipment used in nuclear facilities, equipment used
in the aerospace industry, medical equipment, equipment used for automobiles, trains, ships and other transportation, traffic signaling
equipment, equipment used to control combustions or explosions, safety devices, elevators and escalators, devices related to electric
power, and equipment used in finance-related fields. Do not use Product for Unintended Use unless specifically permitted in this
document.
•
•
Do not disassemble, analyze, reverse-engineer, alter, modify, translate or copy Product, whether in whole or in part.
Product shall not be used for or incorporated into any products or systems whose manufacture, use, or sale is prohibited under any
applicable laws or regulations.
•
•
The information contained herein is presented only as guidance for Product use. No responsibility is assumed by TOSHIBA for any
infringement of patents or any other intellectual property rights of third parties that may result from the use of Product. No license to
any intellectual property right is granted by this document, whether express or implied, by estoppel or otherwise.
ABSENT A WRITTEN SIGNED AGREEMENT, EXCEPT AS PROVIDED IN THE RELEVANT TERMS AND CONDITIONS OF SALE
FOR PRODUCT, AND TO THE MAXIMUM EXTENT ALLOWABLE BY LAW, TOSHIBA (1) ASSUMES NO LIABILITY
WHATSOEVER, INCLUDING WITHOUT LIMITATION, INDIRECT, CONSEQUENTIAL, SPECIAL, OR INCIDENTAL DAMAGES OR
LOSS, INCLUDING WITHOUT LIMITATION, LOSS OF PROFITS, LOSS OF OPPORTUNITIES, BUSINESS INTERRUPTION AND
LOSS OF DATA, AND (2) DISCLAIMS ANY AND ALL EXPRESS OR IMPLIED WARRANTIES AND CONDITIONS RELATED TO
SALE, USE OF PRODUCT, OR INFORMATION, INCLUDING WARRANTIES OR CONDITIONS OF MERCHANTABILITY, FITNESS
FOR A PARTICULAR PURPOSE, ACCURACY OF INFORMATION, OR NONINFRINGEMENT.
•
•
GaAs (Gallium Arsenide) is used in Product. GaAs is harmful to humans if consumed or absorbed, whether in the form of dust or
vapor. Handle with care and do not break, cut, crush, grind, dissolve chemically or otherwise expose GaAs in Product.
Do not use or otherwise make available Product or related software or technology for any military purposes, including without
limitation, for the design, development, use, stockpiling or manufacturing of nuclear, chemical, or biological weapons or missile
technology products (mass destruction weapons). Product and related software and technology may be controlled under the
Japanese Foreign Exchange and Foreign Trade Law and the U.S. Export Administration Regulations. Export and re-export of Product
or related software or technology are strictly prohibited except in compliance with all applicable export laws and regulations.
•
Please contact your TOSHIBA sales representative for details as to environmental matters such as the RoHS compatibility of Product.
Please use Product in compliance with all applicable laws and regulations that regulate the inclusion or use of controlled substances,
including without limitation, the EU RoHS Directive. TOSHIBA assumes no liability for damages or losses occurring as a result of
noncompliance with applicable laws and regulations.
12
2009-08-10
相关型号：
TLP358(TP5,F)
Optocoupler - IC Output, 1 CHANNEL LOGIC OUTPUT OPTOCOUPLER, ROHS COMPLIANT, 11-10C405, DIP-8
TOSHIBA
TLP358F(D4-TP4,F)
Optocoupler - IC Output, 1 CHANNEL LOGIC OUTPUT OPTOCOUPLER, ROHS COMPLIANT, 11-10C404, DIP-8
TOSHIBA
TLP358F(TP4,F)
Optocoupler - IC Output, 1 CHANNEL LOGIC OUTPUT OPTOCOUPLER, ROHS COMPLIANT, 11-10C404, DIP-8
TOSHIBA
©2020 ICPDF网 联系我们和版权申明