TLP4176A [TOSHIBA]
Transistor Output SSR;
| 型号： | TLP4176A |
| 厂家： | 
TOSHIBA |
| 描述： | Transistor Output SSR 输出元件 光电 |
| 文件： | 总8页 (文件大小：283K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
TLP4176A
Photocouplers Photorelay
TLP4176A
1. Applications
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High-Speed Memory Testers
High-Speed Logic IC Testers
Factory Automation (FA)
Power supplies
Mechanical relay replacements
2. General
The TLP4176A photorelay consists of a photo MOSFET optically coupled to an infrared light emitting diode. It
is housed in a 4 pin package with 2.54 mm lead pitch and 2.1 mm height.
The TLP4176A is suitable for replacement of mechanical relays in many applications which require space savings.
3. Features
(1) Package: SOP (2.54SOP4) (Height 2.1 mm, Pitch 2.54 mm)
(2) Normally closed (1-Form-B)
(3) OFF-state output terminal voltage: 60 V (min)
(4) Trigger LED current: 3 mA (max)
(5) ON-state current: 500 mA (max) (Ta = 25 )
(6) ON-state resistance: 2.5 Ω (max)
(7) Isolation voltage: 1500 Vrms (min)
4. Packaging and Pin Assignment
1: Anode
2: Cathode
3: Drain
4: Drain
11-5H1S
Start of commercial production
2015-12
©2019
2019-05-24
Rev.1.0
1
Toshiba Electronic Devices & Storage Corporation
TLP4176A
5. Internal Circuit
6. Absolute Maximum Ratings (Note) (Unless otherwise specified, Ta = 25 )
Characteristics
Symbol
Note
Rating
Unit
LED
Input forward current
IF
∆IF/∆Ta
IFP
50
-0.5
mA
mA/
A
Input forward current derating
Input forward current (pulsed)
Input reverse voltage
(Ta ≥ 25 )
(100 µs pulse, 100 pps)
1
VR
5
V
Junction temperature
Tj
125
Detector OFF-state output terminal voltage
ON-state current
VOFF
ION
60
V
500
mA
mA/
ON-state current derating
Junction temperature
(Ta ≥ 25 )
∆ION/∆Ta
Tj
-5.0
125
Common Storage temperature
Operating temperature
Tstg
-55 to 125
-40 to 105
260
Topr
Tsol
Lead soldering temperature
Isolation voltage
(10 s)
(AC, 60 s, R.H. ≤ 60 %)
BVS
(Note 1)
1500
Vrms
Note: Using continuously under heavy loads (e.g. the application of high temperature/current/voltage and the
significant change in temperature, etc.) may cause this product to decrease in the reliability significantly even
if the operating conditions (i.e. operating temperature/current/voltage, etc.) are within the absolute maximum
ratings.
Please design the appropriate reliability upon reviewing the Toshiba Semiconductor Reliability Handbook
("Handling Precautions"/"Derating Concept and Methods") and individual reliability data (i.e. reliability test
report and estimated failure rate, etc).
Note 1: This device is considered as a two-terminal device: Pins 1 and 2 are shorted together, and pins 3 and 4 are
shorted together.
7. Recommended Operating Conditions (Note)
Characteristics
Symbol
Note
Min
Typ.
Max
Unit
Supply voltage
VDD
IF
5
48
25
V
Input forward current
ON-state current
mA
mA
ION
Topr
-20
500
85
Operating temperature
Note: The recommended operating conditions are given as a design guide necessary to obtain the intended
performance of the device. Each parameter is an independent value. When creating a system design using
this device, the electrical characteristics specified in this data sheet should also be considered.
©2019
Toshiba Electronic Devices & Storage Corporation
2019-05-24
Rev.1.0
2
TLP4176A
8. Electrical Characteristics (Unless otherwise specified, Ta = 25 )
Characteristics
Symbol Note
Test Condition
IF = 10 mA
Min
Typ.
Max
Unit
LED
Input forward voltage
Input reverse current
Input capacitance
VF
IR
1.0
1.15
1.3
10
1
V
VR = 5 V
µA
pF
µA
pF
Ct
V = 0 V, f = 1 MHz
VOFF = 60 V, IF = 5 mA
V = 0 V, f = 1 MHz, IF = 5 mA
30
Detector OFF-state current
Output capacitance
IOFF
COFF
100
9. Coupled Electrical Characteristics (Unless otherwise specified, Ta = 25 )
Characteristics
Trigger LED current
Symbol
Note
Test Condition
IOFF = 10 µA
Min
Typ.
Max
Unit
IFC
IFT
0.1
1
1
3
mA
mA
Ω
Return LED current
ON-state resistance
ION = 500 mA
ION = 500 mA
RON
2.5
10. Isolation Characteristics (Unless otherwise specified, Ta = 25 )
Characteristics
Symbol
Note
Test Condition
Min
Typ.
Max
Unit
Total capacitance (input to output)
Isolation resistance
CS
RS
(Note 1) VS = 0 V, f = 1 MHz
(Note 1) VS = 500 V, R.H. ≤ 60 %
(Note 1) AC, 60 s
0.8
1014
pF
Ω
5 × 1010
1500
Isolation voltage
BVS
Vrms
Note 1: This device is considered as a two-terminal device: Pins 1 and 2 are shorted together, and pins 3 and 4 are
shorted together.
11. Switching Characteristics (Unless otherwise specified, Ta = 25 )
Characteristics
Turn-on time
Symbol
tON
Note
Test Condition
See Fig. 11.1.
Min
Typ.
0.3
Max
1
Unit
ms
RL = 200 Ω, VDD = 20 V, IF = 5 mA
Turn-off time
tOFF
See Fig. 11.1.
0.7
3
ms
RL = 200 Ω, VDD = 20 V, IF = 5 mA
Fig. 11.1 Switching Time Test Circuit and Waveform
©2019
Toshiba Electronic Devices & Storage Corporation
2019-05-24
Rev.1.0
3
TLP4176A
12. Characteristics Curves (Note)
Fig. 12.1 IF - Ta
Fig. 12.3 IF - VF
Fig. 12.5 RON - Ta
Fig. 12.2 ION - Ta
Fig. 12.4 ION - VON
Fig. 12.6 IFC - Ta
©2019
2019-05-24
Rev.1.0
4
Toshiba Electronic Devices & Storage Corporation
TLP4176A
Fig. 12.7 tON, tOFF - Ta
Fig. 12.8 IOFF - Ta
Note: The above characteristics curves are presented for reference only and not guaranteed by production test,
unless otherwise noted.
©2019
Toshiba Electronic Devices & Storage Corporation
2019-05-24
Rev.1.0
5
TLP4176A
13. Soldering and Storage
13.1. Precautions for Soldering
The soldering temperature should be controlled as closely as possible to the conditions shown below, irrespective
of whether a soldering iron or a reflow soldering method is used.
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When using soldering reflow.
The soldering temperature profile is based on the package surface temperature.
(See the figure shown below, which is based on the package surface temperature.)
Reflow soldering must be performed once or twice.
The mounting should be completed with the interval from the first to the last mountings being 2 weeks.
An Example of a Temperature Profile When Lead(Pb)-Free Solder Is Used
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When using soldering flow
Preheat the device at a temperature of 150 (package surface temperature) for 60 to 120 seconds.
Mounting condition of 260 within 10 seconds is recommended.
Flow soldering must be performed once.
When using soldering Iron
Complete soldering within 10 seconds for lead temperature not exceeding 260 or within 3 seconds not
exceeding 350
Heating by soldering iron must be done only once per lead.
13.2. Precautions for General Storage
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Avoid storage locations where devices may be exposed to moisture or direct sunlight.
Follow the precautions printed on the packing label of the device for transportation and storage.
Keep the storage location temperature and humidity within a range of 5 to 35 and 45 % to 75 %,
respectively.
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Do not store the products in locations with poisonous gases (especially corrosive gases) or in dusty
conditions.
Store the products in locations with minimal temperature fluctuations. Rapid temperature changes during
storage can cause condensation, resulting in lead oxidation or corrosion, which will deteriorate the
solderability of the leads.
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When restoring devices after removal from their packing, use anti-static containers.
Do not allow loads to be applied directly to devices while they are in storage.
If devices have been stored for more than two years under normal storage conditions, it is recommended
that you check the leads for ease of soldering prior to use.
©2019
Toshiba Electronic Devices & Storage Corporation
2019-05-24
Rev.1.0
6
TLP4176A
Package Dimensions
Unit: mm
Weight: 0.1 g (typ.)
Package Name(s)
TOSHIBA: 11-5H1S
©2019
Toshiba Electronic Devices & Storage Corporation
2019-05-24
Rev.1.0
7
TLP4176A
RESTRICTIONS ON PRODUCT USE
Toshiba Corporation and its subsidiaries and affiliates are collectively referred to as "TOSHIBA".
Hardware, software and systems described in this document are collectively referred to as "Product".
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TOSHIBA reserves the right to make changes to the information in this document and related Product without notice.
This document and any information herein may not be reproduced without prior written permission from TOSHIBA. Even with TOSHIBA's
written permission, reproduction is permissible only if reproduction is without alteration/omission.
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ThoughTOSHIBAworkscontinuallytoimproveProduct'squalityandreliability,Productcanmalfunctionorfail.Customersareresponsible
for complying with safety standards and for providing adequate designs and safeguards for their hardware, software and systems which
minimize risk and avoid situations in which a malfunction or failure of Product could cause loss of human life, bodily injury or damage
to property, including data loss or corruption. Before customers use the Product, create designs including the Product, or incorporate
the Product into their own applications, customers must also refer to and comply with (a) the latest versions of all relevant TOSHIBA
information, including without limitation, this document, the specifications, the data sheets and application notes for Product and the
precautions and conditions set forth in the "TOSHIBA Semiconductor Reliability Handbook" and (b) the instructions for the application
with which the Product will be used with or for. Customers are solely responsible for all aspects of their own product design or applications,
including but not limited to (a) determining the appropriateness of the use of this Product in such design or applications; (b) evaluating
and determining the applicability of any information contained in this document, or in charts, diagrams, programs, algorithms, sample
application circuits, or any other referenced documents; and (c) validating all operating parameters for such designs and applications.
TOSHIBA ASSUMES NO LIABILITY FOR CUSTOMERS' PRODUCT DESIGN OR APPLICATIONS.
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PRODUCT IS NEITHER INTENDED NOR WARRANTED FOR USE IN EQUIPMENTS OR SYSTEMS THAT REQUIRE
EXTRAORDINARILY HIGH LEVELS OF QUALITY AND/OR RELIABILITY, AND/OR A MALFUNCTION OR FAILURE OF WHICH MAY
CAUSE LOSS OF HUMAN LIFE, BODILY INJURY, SERIOUS PROPERTY DAMAGE AND/OR SERIOUS PUBLIC IMPACT
("UNINTENDED USE").
Except for specific applications as expressly stated in this document, Unintended Use includes, without limitation, equipment used in
nuclear facilities, equipment used in the aerospace industry, lifesaving and/or life supporting medical equipment, equipment used for
automobiles, trains, ships and other transportation, traffic signaling equipment, equipment used to control combustions or explosions,
safety devices, elevators and escalators, and devices related to power plant.
IF YOU USE PRODUCT FOR UNINTENDED USE, TOSHIBA ASSUMES NO LIABILITY FOR PRODUCT.
For details, please contact your TOSHIBA sales representative or contact us via our website.
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Do not disassemble, analyze, reverse-engineer, alter, modify, translate or copy Product, whether in whole or in part.
Product shall not be used for or incorporated into any products or systems whose manufacture, use, or sale is prohibited under any
applicable laws or regulations.
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The information contained herein is presented only as guidance for Product use. No responsibility is assumed by TOSHIBA for any
infringement of patents or any other intellectual property rights of third parties that may result from the use of Product. No license to any
intellectual property right is granted by this document, whether express or implied, by estoppel or otherwise.
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FOR PRODUCT, AND TO THE MAXIMUM EXTENT ALLOWABLE BY LAW, TOSHIBA (1) ASSUMES NO LIABILITY WHATSOEVER,
INCLUDING WITHOUT LIMITATION, INDIRECT, CONSEQUENTIAL, SPECIAL, OR INCIDENTAL DAMAGES OR LOSS, INCLUDING
WITHOUT LIMITATION, LOSS OF PROFITS, LOSS OF OPPORTUNITIES, BUSINESS INTERRUPTION AND LOSS OF DATA, AND
(2) DISCLAIMS ANY AND ALL EXPRESS OR IMPLIED WARRANTIES AND CONDITIONS RELATED TO SALE, USE OF PRODUCT,
OR INFORMATION, INCLUDING WARRANTIES OR CONDITIONS OF MERCHANTABILITY, FITNESS FOR A PARTICULAR
PURPOSE, ACCURACY OF INFORMATION, OR NONINFRINGEMENT.
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GaAs (Gallium Arsenide) is used in Product. GaAs is harmful to humans if consumed or absorbed, whether in the form of dust or vapor.
Handle with care and do not break, cut, crush, grind, dissolve chemically or otherwise expose GaAs in Product.
Do not use or otherwise make available Product or related software or technology for any military purposes, including without limitation,
for the design, development, use, stockpiling or manufacturing of nuclear, chemical, or biological weapons or missile technology products
(mass destruction weapons). Product and related software and technology may be controlled under the applicable export laws and
regulations including, without limitation, the Japanese Foreign Exchange and Foreign Trade Law and the U.S. Export Administration
Regulations. Export and re-export of Product or related software or technology are strictly prohibited except in compliance with all
applicable export laws and regulations.
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Please contact your TOSHIBA sales representative for details as to environmental matters such as the RoHS compatibility of Product.
Please use Product in compliance with all applicable laws and regulations that regulate the inclusion or use of controlled substances,
including without limitation, the EU RoHS Directive. TOSHIBA ASSUMES NO LIABILITY FOR DAMAGES OR LOSSES OCCURRING
AS A RESULT OF NONCOMPLIANCE WITH APPLICABLE LAWS AND REGULATIONS.
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©2019
2019-05-24
Rev.1.0
8
Toshiba Electronic Devices & Storage Corporation
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