TLP705A [TOSHIBA]

Optocoupler - IC Output, LOGIC OUTPUT OPTOCOUPLER;
TLP705A
型号: TLP705A
厂家: TOSHIBA    TOSHIBA
描述:

Optocoupler - IC Output, LOGIC OUTPUT OPTOCOUPLER

输出元件 光电
文件: 总16页 (文件大小:373K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
TLP705A  
Photocouplers GaAℓAs Infrared LED & Photo IC  
TLP705A  
1. Applications  
Transistor Inverters  
Air Conditioner Inverters  
MOSFET Gate Drivers  
IGBT Gate Drivers  
2. General  
The TLP705A is a photocoupler in a SDIP6 package that consists of a GaAℓAs infrared light-emitting diode (LED)  
optically coupled to an integrated high-gain, high-speed photodetector IC chip. The TLP705A is physically smaller  
than the one in an 8-pin DIP package and compliant with international safety standards for reinforced insulation.  
It thus provides a smaller footprint solution for applications that require safety standard certification. The  
TLP705A has an internal Faraday shield that provides a guaranteed Common-mode transient immunity of 20  
kV/µs. It has a totem-pole output that can both sink and source current. It is ideal for IGBT and power MOSFET  
gate drive.  
3. Features  
(1) Output peak current: ±0.6 A (max)  
(2) Operating temperature: -40 to 100  
(3) Supply current: 3 mA (max)  
(4) Supply voltage: 10 to 30 V  
(5) Threshold input current: 7.5 mA (max)  
(6) Propagation delay time: tpHL/tpLH = 200 ns (max)  
(7) Common-mode transient immunity: ±20 kV/µs (min)  
(8) Isolation voltage: 5000 Vrms (min)  
(9) Safety standards  
UL-approved: UL1577 File No.E67349  
cUL-approved: CSA Component Acceptance Service No.5A, File No.E67349  
VDE-approved: Option (D4) EN60747-5-2 (Note)  
Certificate no. 40009302  
Maximum operating insulation voltage: 890 Vpk  
Highest permissible over voltage: 8000 Vpk  
Note: When an EN60747-5-2 approved type is needed, please designate the Option (D4).  
2012-07-10  
Rev.3.0  
1
TLP705A  
4. Packaging and Pin Configuration  
1: Anode  
2: N.C.  
3: Cathode  
4: GND  
5: VO(Output)  
6: VCC  
11-5J1S  
5. Internal Circuit (Note)  
Fig. 5.1 Internal Circuit  
Note: A 0.1-µF bypass capacitor must be connected between pin 6 and pin 4.  
6. Principle of Operation  
6.1. Truth Table  
Input  
LED  
M1  
M2  
Output  
H
L
ON  
ON  
OFF  
ON  
H
L
OFF  
OFF  
6.2. Mechanical Parameters  
7.62-mm Pitch  
10.16-mm Pitch  
Characteristics  
Unit  
mm  
TLP705A  
7.0 (min)  
7.0 (min)  
0.4 (min)  
TLP705AF  
8.0 (min)  
8.0 (min)  
0.4 (min)  
Creepage distances  
Clearance distances  
Internal isolation thickness  
2012-07-10  
Rev.3.0  
2
TLP705A  
7. Absolute Maximum Ratings (Note) (Unless otherwise specified, Ta = 25)  
Characteristics  
Input forward current  
Symbol  
Note  
Rating  
Unit  
LED  
IF  
25  
-0.67  
1
mA  
mA/  
A
Input forward current derating  
(Ta 85)  
(Ta 85)  
IF/Ta  
IFPT  
Peak transient input forward  
current  
(Note 1)  
Peak transient input forward  
current derating  
IFPT/Ta  
-25  
mA/  
Input reverse voltage  
Input power dissipation  
VR  
PD  
5
V
40  
mW  
Input power dissipation  
derating  
(Ta 85)  
PD/Ta  
-1.0  
mW/  
Detector Peak high-level output current  
Peak low-level output current  
Output voltage  
(Ta = -40 to 100)  
(Ta = -40 to 100)  
IOPH  
IOPL  
VO  
(Note 2)  
(Note 2)  
-0.6  
+0.6  
A
V
35  
Supply voltage  
VCC  
Topr  
Tstg  
Tsol  
BVS  
35  
Common Operating temperature  
Storage temperature  
-40 to 100  
-55 to 125  
260  
Lead soldering temperature  
Isolation voltage  
(10 s)  
(Note 3)  
(Note 4)  
AC, 1 min,  
5000  
Vrms  
R.H. 60%, Ta = 25  
Note: Using continuously under heavy loads (e.g. the application of high temperature/current/voltage and the  
significant change in temperature, etc.) may cause this product to decrease in the reliability significantly even  
if the operating conditions (i.e. operating temperature/current/voltage, etc.) are within the absolute maximum  
ratings.  
Please design the appropriate reliability upon reviewing the Toshiba Semiconductor Reliability Handbook  
("Handling Precautions"/"Derating Concept and Methods") and individual reliability data (i.e. reliability test  
report and estimated failure rate, etc).  
Note 1: Pulse width (PW) 1 µs, 300 pps  
Note 2: Exponential waveform. Pulse width 2 µs, f 15 kHz  
Note 3: 2 mm below seating plane.  
Note 4: This device is considered as a two-terminal device: Pins 1, 2 and 3 are shorted together, and pins 4, 5 and 6  
are shorted together.  
8. Recommended Operating Conditions (Note)  
Characteristics  
Symbol  
Note  
Min  
Typ.  
Max  
Unit  
Input on-state current  
Input off-state voltage  
Supply voltage  
IF(ON)  
VF(OFF)  
VCC  
(Note 1)  
10  
0
15  
0.8  
mA  
V
(Note 2)  
10  
30  
Peak high-level output current  
Peak low-level output current  
Operating frequency  
IOPH  
IOPL  
f
-0.2  
+0.2  
250  
A
(Note 3)  
kHz  
Note: The recommended operating conditions are given as a design guide necessary to obtain the intended  
performance of the device. Each parameter is an independent value. When creating a system design using  
this device, the electrical characteristics specified in this datasheet should also be considered.  
Note: A ceramic capacitor (0.1 µF) should be connected between pin 6 and pin 4 to stabilize the operation of a high-  
gain linear amplifier. Otherwise, this photocoupler may not switch properly. The bypass capacitor should be  
placed within 1 cm of each pin.  
Note 1: The rise and fall times of the input on-current should be less than 0.5 µs.  
Note 2: Denotes the operating range, not the recommended operating condition.  
Note 3: Exponential waveform. IOPH -0.25 A (90 ns), IOPL 0.25 A (90 ns), Ta = 100  
2012-07-10  
Rev.3.0  
3
TLP705A  
9. Electrical Characteristics (Note)  
(Unless otherwise specified, Ta = -40 to 100)  
Test  
Circuit  
Characteristics  
Symbol  
Note  
Test Condition  
Min  
Typ.  
Max  
Unit  
Input forward voltage  
VF  
IF = 10 mA, Ta = 25  
1.40  
1.57  
-1.8  
1.80  
V
Input forward voltage  
temperature coefficient  
VF/Ta  
IF = 10 mA  
mV/  
Input reverse current  
Input capacitance  
IR  
Ct  
VR = 5 V, Ta = 25  
60  
10  
µA  
pF  
A
V = 0 V, f = 1 MHz, Ta = 25  
IF = 10 mA, VCC = 15 V,  
Peak high-level output current  
IOPH  
(Note 1)  
(Note 1)  
Fig.  
-0.32  
-0.2  
12.1.1 V6-5 = 4 V  
IF = 10 mA, VCC = 15 V,  
V6-5 = 10 V  
0.2  
0.4  
6.0  
-0.6  
0.32  
0.6  
8.5  
0.35  
-0.4  
Peak low-level output current  
IOPL  
Fig.  
IF = 0 mA, VCC = 15 V,  
12.1.2 V5-4 = 2 V  
IF = 0 mA, VCC = 15 V,  
V5-4 = 10 V  
High-level output voltage  
Low-level output voltage  
High-level supply current  
Low-level supply current  
VOH  
VOL  
ICCH  
ICCL  
Fig.  
IF = 10 mA, VCC = 10 V,  
V
12.1.3 IO = -100 mA  
Fig.  
VF = 0.8 V, VCC = 10 V,  
1.0  
3.0  
3.0  
12.1.4 IO = 100 mA  
Fig.  
IF = 10 mA, VCC = 10 to 30 V,  
mA  
12.1.5 VO = Open  
Fig.  
IF = 0 mA, VCC = 10 to 30 V,  
12.1.6 VO = Open  
Threshold input current (L/H)  
Threshold input voltage (H/L)  
Supply voltage  
IFLH  
VFHL  
VCC  
VCC = 15 V, VO > 1 V  
0.8  
10  
7.5  
VCC = 15 V, VO < 1 V  
V
30  
Note: All typical values are at Ta = 25.  
Note: This device is designed for low power consumption, making it more sensitive to ESD than its predecessors.  
Extra care should be taken in the design of circuitry and pc board implementation to avoid ESD problems.  
Note 1: IO application time 50 µs, single pulse.  
10. Isolation Characteristics (Unless otherwise specified, Ta = 25)  
Characteristics  
Symbol  
Note  
Test Conditions  
Min  
Typ.  
Max  
Unit  
Total capacitance (input to output)  
Isolation resistance  
CS  
RS  
(Note 1) VS = 0 V, f = 1 MHz  
(Note 1) VS = 500 V, R.H. 60%  
(Note 1) AC, 1 min  
1×1012  
5000  
1.0  
1014  
pF  
Isolation voltage  
BVS  
Vrms  
AC, 1 s, in oil  
10000  
10000  
DC, 1 min, in oil  
Vdc  
Note 1: This device is considered as a two-terminal device: Pins 1, 2 and 3 are shorted together, and pins 4, 5 and 6  
are shorted together.  
2012-07-10  
Rev.3.0  
4
TLP705A  
11. Switching Characteristics (Note)  
(Unless otherwise specified, Ta = -40 to 100)  
Test  
Circuit  
Characteristics  
Symbol  
Note  
Test Condition  
Min  
Typ.  
125  
Max  
170  
Unit  
ns  
Propagation delay time  
(L/H)  
tpLH  
(Note 1)  
Fig.  
IF = 0 10 mA, VCC = 20 V,  
12.1.7 Rg = 30 , Cg = 1 nF,Ta = 25  
Propagation delay time  
(H/L)  
tpHL  
tpLH  
tpHL  
tpsk  
(Note 1)  
(Note 1)  
(Note 1)  
IF = 10 0 mA, VCC = 20 V,  
Rg = 30 , Cg = 1 nF,Ta = 25  
50  
50  
-85  
120  
125  
120  
170  
200  
200  
85  
Propagation delay time  
(L/H)  
IF = 0 10 mA, VCC = 20 V,  
Rg = 30 , Cg = 1 nF  
Propagation delay time  
(H/L)  
IF = 10 0 mA, VCC = 20 V,  
Rg = 30 , Cg = 1 nF  
Propagation delay skew  
(device to device)  
(Note 1)  
(Note 4)  
IF = 0 ←→ 10 mA, VCC = 20 V,  
Rg = 30 , Cg = 1 nF  
Pulse width distortion  
|tpHL-tpLH| (Note 1)  
IF = 0 ←→ 10 mA, VCC = 20 V,  
Rg = 30 , Cg = 1 nF  
5
50  
Rise time  
tr  
tf  
(Note 1)  
(Note 1)  
(Note 2)  
IF = 0 10 mA, VCC = 20 V,  
Rg = 30 , Cg = 1 nF  
35  
15  
Fall time  
IF = 10 0 mA, VCC = 20 V,  
Rg = 30 , Cg = 1 nF  
Common-mode transient  
immunity at output high  
CMH  
Fig.  
VCM = 1000 Vp-p, IF = 10 mA,  
12.1.8 VCC = 20 V, Ta = 25,  
±20  
kV/µs  
VO(min) = 16 V  
Common-mode transient  
immunity at output low  
CML  
(Note 3)  
VCM = 1000 Vp-p, IF = 0 mA,  
VCC = 20 V, Ta = 25,  
VO(max) = 1 V  
±20  
Note: All typical values are at Ta = 25.  
Note 1: Input signal ( f = 250 kHz, duty = 50%, tr = tf = 5 ns or less ).  
CL is approximately 15 pF which includes probe and stray wiring capacitance.  
Note 2: CMH is the maximum rate of rise of the common mode voltage that can be sustained with the output voltage  
in the logic high state (VO > 16 V).  
Note 3: CML is the maximum rate of fall of the common mode voltage that can be sustained with the output voltage in  
the logic low state (VO < 1 V).  
Note 4: The propagation delay skew, tpsk, is equal to the magnitude of the worst-case difference in tpHL and/or tpLH  
that will be seen between units at the same given conditions (supply voltage, input current, temperature, etc).  
2012-07-10  
Rev.3.0  
5
TLP705A  
12. Test Circuits and Characteristics Curves  
12.1. Test Circuits  
Fig. 12.1.1 IOPH Test Circuit  
Fig. 12.1.2 IOPL Test Circuit  
Fig. 12.1.3 VOH Test Circuit  
Fig. 12.1.4 VOL Test Circuit  
Fig. 12.1.5 ICCH Test Circuit  
Fig. 12.1.6 ICCL Test Circuit  
Fig. 12.1.7 Switching Time Test Circuit and Waveform  
Fig. 12.1.8 Common-Mode Transient Immunity Test Circuit and Waveform  
2012-07-10  
Rev.3.0  
6
TLP705A  
12.2. Characteristics Curves (Note)  
Fig. 12.2.1 IF - VF  
Fig. 12.2.3 PO - Ta  
Fig. 12.2.5 ICCL - Ta  
Fig. 12.2.2 IF - Ta  
Fig. 12.2.4 IFLH - Ta  
Fig. 12.2.6 ICCH - Ta  
2012-07-10  
Rev.3.0  
7
TLP705A  
Fig. 12.2.7 VOL - Ta  
Fig. 12.2.8 VOH - Ta  
Fig. 12.2.9 VOL - IOPL  
Fig. 12.2.10 (VOH-VCC) - IOPH  
Fig. 12.2.11 tpLH,tpHL,|tpHL-tpLH| - Ta  
Fig. 12.2.12 tpLH,tpHL,|tpHL-tpLH| - IF  
2012-07-10  
Rev.3.0  
8
TLP705A  
Fig. 12.2.13 tpLH,tpHL,|tpHL-tpLH| - VCC  
NOTE: The above characteristics curves are presented for reference only and not guaranteed by production test,  
unless otherwise noted.  
2012-07-10  
Rev.3.0  
9
TLP705A  
13. Soldering and Storage  
13.1. Precautions for Soldering  
The soldering temperature should be controlled as closely as possible to the conditions shown below, irrespective  
of whether a soldering iron or a reflow soldering method is used.  
When using soldering reflow (See Fig. 13.1.1 and 13.1.2)  
Reflow soldering must be performed once or twice.  
The mounting should be completed with the interval from the first to the last mountings being 2 weeks.  
Fig. 13.1.1 An Example of a Temperature Profile Fig. 13.1.2 An Example of a Temperature Profile  
When Sn-Pb Eutectic Solder Is Used When Lead(Pb)-Free Solder Is Used  
When using soldering flow (Applicable to both eutectic solder and Lead(Pb)-Free solder)  
Apply preheating of 150for 60 to 120 seconds.  
Mounting condition of 260within 10 seconds is recommended.  
Flow soldering must be performed once.  
When using soldering Iron (Applicable to both eutectic solder and Lead(Pb)-Free solder)  
Complete soldering within 10 seconds for lead temperature not exceeding 260or within 3 seconds not  
exceeding 350  
Heating by soldering iron must be done only once per lead.  
13.2. Precautions for General Storage  
Avoid storage locations where devices may be exposed to moisture or direct sunlight.  
Follow the precautions printed on the packing label of the device for transportation and storage.  
Keep the storage location temperature and humidity within a range of 5to 35and 45% to 75%,  
respectively.  
Do not store the products in locations with poisonous gases (especially corrosive gases) or in dusty  
conditions.  
Store the products in locations with minimal temperature fluctuations. Rapid temperature changes during  
storage can cause condensation, resulting in lead oxidation or corrosion, which will deteriorate the  
solderability of the leads.  
When restoring devices after removal from their packing, use anti-static containers.  
Do not allow loads to be applied directly to devices while they are in storage.  
If devices have been stored for more than two years under normal storage conditions, it is recommended  
that you check the leads for ease of soldering prior to use.  
2012-07-10  
Rev.3.0  
10  
TLP705A  
14. Land Pattern Dimensions for Reference Only  
Fig. 14.1 7.62 mm Pitch (unit: mm)  
Fig. 14.2 10.16 mm Pitch (unit: mm)  
15. Marking  
Fig. 15.1 Marking  
2012-07-10  
Rev.3.0  
11  
TLP705A  
16. EN60747-5-2 Option (D4) Specification  
Part number: TLP705A, TLP705AF (Note)  
The following part naming conventions are used for the devices that have been qualified according to  
option (D4) of EN60747.  
Example: TLP705A(D4-TP, F)  
D4: EN60747 option  
TP: Tape type  
F: [[G]]/RoHS COMPATIBLE (Note 1)  
Note: Use TOSHIBA standard type number for safety standard application.  
e.g., TLP705A(D4-TP,F) TLP705A  
Note 1: Please contact your Toshiba sales representative for details on environmental information such as the product's  
RoHS compatibility.  
RoHS is the Directive 2002/95/EC of the European Parliament and of the Council of 27 January 2003 on the  
restriction of the use of certain hazardous substances in electrical and electronics equipment.  
Fig. 16.1 EN60747 Isolation Characteristics  
2012-07-10  
Rev.3.0  
12  
TLP705A  
Fig. 16.2 Insulation Related Specifications (Note)  
Note: If a printed circuit is incorporated, the creepage distance and clearance may be reduced below this value. (e.  
g., at a standard distance between soldering eye centers of 3.5 mm). If this is not permissible, the user shall  
take suitable measures.  
Note: This photocoupler is suitable for safe electrical isolation only within the safety limit data.  
Maintenance of the safety data shall be ensured by means of protective circuits.  
Fig. 16.3 Marking Example (Note)  
Note: Theabovemarkingisappliedtothephotocouplersthathavebeenqualifiedaccordingtooption(D4)ofEN60747.  
2012-07-10  
Rev.3.0  
13  
TLP705A  
Fig. 16.4 Measurement Procedure  
2012-07-10  
Rev.3.0  
14  
TLP705A  
Package Dimensions  
Unit: mm  
Weight: 0.26 g (typ.)  
Package Name(s)  
TOSHIBA: 11-5J1S  
2012-07-10  
Rev.3.0  
15  
TLP705A  
RESTRICTIONS ON PRODUCT USE  
Toshiba Corporation, and its subsidiaries and affiliates (collectively "TOSHIBA"), reserve the right to make changes to the information  
in this document, and related hardware, software and systems (collectively "Product") without notice.  
This document and any information herein may not be reproduced without prior written permission from TOSHIBA. Even with TOSHIBA's  
written permission, reproduction is permissible only if reproduction is without alteration/omission.  
ThoughTOSHIBAworkscontinuallytoimproveProduct'squalityandreliability,Productcanmalfunctionorfail.Customersareresponsible  
for complying with safety standards and for providing adequate designs and safeguards for their hardware, software and systems which  
minimize risk and avoid situations in which a malfunction or failure of Product could cause loss of human life, bodily injury or damage  
to property, including data loss or corruption. Before customers use the Product, create designs including the Product, or incorporate  
the Product into their own applications, customers must also refer to and comply with (a) the latest versions of all relevant TOSHIBA  
information, including without limitation, this document, the specifications, the data sheets and application notes for Product and the  
precautions and conditions set forth in the "TOSHIBA Semiconductor Reliability Handbook" and (b) the instructions for the application  
with which the Product will be used with or for. Customers are solely responsible for all aspects of their own product design or applications,  
including but not limited to (a) determining the appropriateness of the use of this Product in such design or applications; (b) evaluating  
and determining the applicability of any information contained in this document, or in charts, diagrams, programs, algorithms, sample  
application circuits, or any other referenced documents; and (c) validating all operating parameters for such designs and applications.  
TOSHIBA ASSUMES NO LIABILITY FOR CUSTOMERS' PRODUCT DESIGN OR APPLICATIONS.  
PRODUCT IS NEITHER INTENDED NOR WARRANTED FOR USE IN EQUIPMENTS OR SYSTEMS THAT REQUIRE  
EXTRAORDINARILY HIGH LEVELS OF QUALITY AND/OR RELIABILITY, AND/OR A MALFUNCTION OR FAILURE OF WHICH MAY  
CAUSE LOSS OF HUMAN LIFE, BODILY INJURY, SERIOUS PROPERTY DAMAGE AND/OR SERIOUS PUBLIC IMPACT  
("UNINTENDEDUSE").Exceptforspecificapplicationsasexpresslystatedinthisdocument, UnintendedUseincludes, withoutlimitation,  
equipment used in nuclear facilities, equipment used in the aerospace industry, medical equipment, equipment used for automobiles,  
trains, ships and other transportation, traffic signaling equipment, equipment used to control combustions or explosions, safety devices,  
elevators and escalators, devices related to electric power, and equipment used in finance-related fields. IF YOU USE PRODUCT FOR  
UNINTENDED USE, TOSHIBA ASSUMES NO LIABILITY FOR PRODUCT. For details, please contact your TOSHIBA sales  
representative.  
Do not disassemble, analyze, reverse-engineer, alter, modify, translate or copy Product, whether in whole or in part.  
Product shall not be used for or incorporated into any products or systems whose manufacture, use, or sale is prohibited under any  
applicable laws or regulations.  
The information contained herein is presented only as guidance for Product use. No responsibility is assumed by TOSHIBA for any  
infringement of patents or any other intellectual property rights of third parties that may result from the use of Product. No license to any  
intellectual property right is granted by this document, whether express or implied, by estoppel or otherwise.  
ABSENT A WRITTEN SIGNED AGREEMENT, EXCEPT AS PROVIDED IN THE RELEVANT TERMS AND CONDITIONS OF SALE  
FOR PRODUCT, AND TO THE MAXIMUM EXTENT ALLOWABLE BY LAW, TOSHIBA (1) ASSUMES NO LIABILITY WHATSOEVER,  
INCLUDING WITHOUT LIMITATION, INDIRECT, CONSEQUENTIAL, SPECIAL, OR INCIDENTAL DAMAGES OR LOSS, INCLUDING  
WITHOUT LIMITATION, LOSS OF PROFITS, LOSS OF OPPORTUNITIES, BUSINESS INTERRUPTION AND LOSS OF DATA, AND  
(2) DISCLAIMS ANY AND ALL EXPRESS OR IMPLIED WARRANTIES AND CONDITIONS RELATED TO SALE, USE OF PRODUCT,  
OR INFORMATION, INCLUDING WARRANTIES OR CONDITIONS OF MERCHANTABILITY, FITNESS FOR A PARTICULAR  
PURPOSE, ACCURACY OF INFORMATION, OR NONINFRINGEMENT.  
GaAs (Gallium Arsenide) is used in Product. GaAs is harmful to humans if consumed or absorbed, whether in the form of dust or vapor.  
Handle with care and do not break, cut, crush, grind, dissolve chemically or otherwise expose GaAs in Product.  
Do not use or otherwise make available Product or related software or technology for any military purposes, including without limitation,  
for the design, development, use, stockpiling or manufacturing of nuclear, chemical, or biological weapons or missile technology products  
(mass destruction weapons). Product and related software and technology may be controlled under the applicable export laws and  
regulations including, without limitation, the Japanese Foreign Exchange and Foreign Trade Law and the U.S. Export Administration  
Regulations. Export and re-export of Product or related software or technology are strictly prohibited except in compliance with all  
applicable export laws and regulations.  
Please contact your TOSHIBA sales representative for details as to environmental matters such as the RoHS compatibility of Product.  
Please use Product in compliance with all applicable laws and regulations that regulate the inclusion or use of controlled substances,  
including without limitation, the EU RoHS Directive. TOSHIBA ASSUMES NO LIABILITY FOR DAMAGES OR LOSSES OCCURRING  
AS A RESULT OF NONCOMPLIANCE WITH APPLICABLE LAWS AND REGULATIONS.  
2012-07-10  
Rev.3.0  
16  

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TOSHIBA

TLP705AF(TP,F)

Optocoupler - IC Output, LOGIC OUTPUT OPTOCOUPLER

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TOSHIBA

TLP705F

Plasma Display Panel

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TOSHIBA

TLP705F(D4)

Optocoupler - IC Output, 1 CHANNEL LOGIC OUTPUT OPTOCOUPLER, 11-5J101, SDIP-6

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TOSHIBA

TLP705F(TP)

TRANSISTOR-STAGE-OUTPUT OPTOCOUPLER,1-CHANNEL,5KV ISOLATION,SO

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TOSHIBA