TLRM1108(T11) [TOSHIBA]

Visible LED, SINGLE COLOR LED, RED, 3.20 X 2.90 MM, 1.90 MM HEIGHT, ROHS COMPLIANT, PLASTIC, 4-3X1, 4 PIN;
TLRM1108(T11)
型号: TLRM1108(T11)
厂家: TOSHIBA    TOSHIBA
描述:

Visible LED, SINGLE COLOR LED, RED, 3.20 X 2.90 MM, 1.90 MM HEIGHT, ROHS COMPLIANT, PLASTIC, 4-3X1, 4 PIN

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中文:  中文翻译
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TL(RM,RMM,SM,OM,YM)1108(T11)  
TOSHIBA LED Lamps  
TLRM1108(T11), TLRMM1108(T11), TLSM1108(T11),  
TLOM1108(T11), TLYM1108(T11)  
Panel Circuit Indicator  
Unit: mm  
Cathode mark  
Surface-mount device  
3.2 (L) mm × 2.9 (W) mm × 1.9 (H) mm  
InGaAP LEDs  
Colors: red, orange, yellow  
High luminous intensity  
Anode index  
Standard embossed tape packing: T11 (2000/reel)  
4-mm tape reel  
High operating temperature  
T
opr  
= 40 to 100°C / Tstg=40 to 100°C  
1.Anode  
2.Cathode  
3.Cathode  
4.Cathode  
Applications: Instrumental panel Backlighting in Automotive  
equipment, message signboards, backlighting etc.  
JEDEC  
Color and Material  
JEITA  
Part Number  
Color  
Material  
TOSHIBA  
4-3X1  
TLRM1108  
TLRMM1108  
TLSM1108  
TLOM1108  
TLYM1108  
Red  
Red  
Weight: 0.035 g (typ.)  
InGaAP  
Red  
Orange  
Yellow  
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2010-01-29  
TL(RM,RMM,SM,OM,YM)1108(T11)  
Absolute Maximum Ratings (Ta = 25°C)  
Forward Current  
Operation  
Temperature  
Storage  
Temperature  
Reverse Voltage  
(V)  
Power Dissipation  
(mW)  
I
(mA)  
Product Name  
F
V
P
D
R
T
opr  
(°C)  
T
stg  
(°C)  
Please see Note 1  
TLRM1108  
TLRMM1108  
TLSM1108  
TLOM1108  
TLYM1108  
70  
4
203  
40 to 100  
40 to 100  
Note: Using continuously under heavy loads (e.g. the application of high temperature/current/voltage and the  
significant change in temperature, etc.) may cause this product to decrease in the reliability significantly even  
if the operating conditions (i.e. operating temperature/current/voltage, etc.) are within the absolute maximum  
ratings.  
Please design the appropriate reliability upon reviewing the Toshiba Semiconductor Reliability Handbook  
(“Handling Precautions”/“Derating Concept and Methods”) and individual reliability data (i.e. reliability test  
report and estimated failure rate, etc).  
Note 1: Forward current derating  
I
Ta  
F
100  
80  
60  
40  
20  
0
0
20  
40  
60  
80  
100  
120  
Ambient temperature Ta (°C)  
Electrical Characteristics (Ta = 25°C)  
Reverse Current  
Forward Voltage V  
F
I
R
Product Name  
Min  
2.2  
2.2  
2.2  
2.2  
2.2  
Typ.  
2.5  
2.5  
2.5  
2.55  
2.55  
V
Max  
2.9  
2.9  
2.9  
2.9  
2.9  
I
Max  
V
R
F
TLRM1108  
TLRMM1108  
TLSM1108  
TLOM1108  
TLYM1108  
Unit  
50  
10  
4
mA  
μA  
V
2
2010-01-29  
TL(RM,RMM,SM,OM,YM)1108(T11)  
Optical Characteristics–1 (Ta = 25°C)  
Luminous Intensity I  
Available Iv rank  
V
Product Name  
Please see Note 2  
Min  
630  
Typ.  
1300  
1600  
2400  
2500  
2200  
mcd  
Max  
3200  
3200  
5000  
5000  
5000  
mcd  
I
F
TLRM1108  
TLRMM1108  
TLSM1108  
TLOM1108  
TLYM1108  
Unit  
50  
50  
50  
50  
50  
mA  
VA / WA / XA  
VA / WA / XA  
WA / XA / YA  
WA / XA / YA  
WA / XA / YA  
630  
1000  
1000  
1000  
mcd  
Note 2: The specification on the above table is used for Iv classification of LEDs in Toshiba facility.  
Each reel includes the same rank LEDs. Let the delivery ratio of each rank be unquestioned.  
Luminous Intensity I  
V
Rank  
Min  
630  
Max  
VA  
WA  
XA  
1250  
2000  
3200  
5000  
mcd  
1000  
1600  
2500  
mcd  
YA  
Unit  
Optical Characteristics–2 (Ta = 25°C)  
Emission Spectrum  
Peak Emission  
Product Name  
Δλ  
Dominant Wavelength λ  
d
Wavelength λ  
p
I
F
Min  
Typ.  
Max  
Typ.  
14  
Min  
624  
Typ.  
630  
Max  
638  
TLRM1108  
TLRMM1108  
TLSM1108  
TLOM1108  
TLYM1108  
Unit  
644  
636  
623  
612  
592  
nm  
14  
14  
14  
13  
nm  
620  
607  
599  
583  
626  
613  
605  
590  
nm  
634  
621  
613  
595  
50  
mA  
Handling precautions  
This product is designed as a general display light source usage, and it has applied the measurement standard  
that matched with the sensitivity of human's eyes. Therefore, it is not intended for usage of functional  
application (ex. Light source for sensor, optical communication and etc) except general display light source.  
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2010-01-29  
TL(RM,RMM,SM,OM,YM)1108(T11)  
TLRM1108  
I
– V  
I
– I  
F
F
V
F
(typ.)  
(typ.)  
100  
Ta = 25°C  
Ta = 25°C  
3000  
1000  
30  
10  
300  
100  
3
1
30  
10  
1.7  
1.9  
2.1  
2.3  
2.5  
2.7  
2.9  
1
3
10  
30  
100  
Forward voltage  
V
(V)  
F
Forward current  
I
(mA)  
F
Wavelength characteristic  
I
Tc  
V
(typ.)  
(typ.)  
10  
1.0  
0.8  
0.6  
0.4  
0.2  
0
I
= 50 mA  
F
Ta = 25°C  
5
3
1
0.5  
0.3  
0.1  
40  
20  
0
20  
40  
60  
80  
100  
580  
600  
620  
640  
660  
680  
700  
Wavelength  
λ (nm)  
Case temperature Tc (°C)  
Radiation pattern  
Ta = 25°C  
(typ.)  
0°  
10°  
10°  
20°  
20°  
30°  
30°  
40°  
40°  
50°  
50°  
60°  
70°  
80°  
90°  
60°  
70°  
80°  
90°  
0.2 0.4 0.6 0.8 1.0  
0
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2010-01-29  
TL(RM,RMM,SM,OM,YM)1108(T11)  
TLRMM1108  
I
– V  
I
– I  
F
F
V
F
(typ.)  
(typ.)  
100  
Ta = 25°C  
Ta = 25°C  
3000  
1000  
30  
10  
100  
3
1
30  
10  
1.7  
1.9  
2.1  
2.3  
2.5  
2.7  
2.9  
1
3
10  
30  
100  
Forward voltage  
V
(V)  
F
Forward current  
I
(mA)  
F
Wavelength characteristic  
I
Tc  
V
(typ.)  
(typ.)  
1.0  
0.8  
0.6  
0.4  
0.2  
0
10  
I
= 50 mA  
F
Ta = 25°C  
5
3
1
0.5  
0.3  
0.1  
40  
580  
600  
620  
640  
660  
680  
700  
20  
0
20  
40  
60  
80  
100  
Wavelength  
λ (nm)  
Case temperature Tc (°C)  
Radiation pattern  
Ta = 25°C  
(typ.)  
10°  
10°  
20°  
20°  
30°  
30°  
40°  
40°  
50°  
50°  
60°  
70°  
60°  
70°  
80°  
90°  
80°  
90°  
0.2 0.4 0.6 0.8 1.0  
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2010-01-29  
TL(RM,RMM,SM,OM,YM)1108(T11)  
TLSM1108  
I
– V  
I
– I  
F
F
V
F
(typ.)  
(typ.)  
100  
Ta = 25°C  
Ta = 25°C  
3000  
1000  
30  
10  
300  
100  
3
1
30  
10  
1.9  
2.1  
2.3  
2.5  
2.7  
2.9  
1.7  
1
3
10  
30  
100  
Forward voltage  
V
(V)  
F
Forward current  
I
(mA)  
F
I
Tc  
Wavelength characteristic  
V
(typ.)  
(typ.)  
1.0  
0.8  
0.6  
0.4  
0.2  
0
10  
I
= 50 mA  
F
Ta = 25°C  
5
3
1
0.5  
0.3  
0.1  
40  
560  
580  
600  
620  
640  
660  
680  
20  
0
20  
40  
60  
80  
100  
Wavelength  
λ (nm)  
Case temperature Tc (°C)  
Radiation pattern  
Ta = 25°C  
(typ.)  
0°  
10°  
10°  
20°  
20°  
30°  
30°  
40°  
40°  
50°  
50°  
60°  
70°  
60°  
70°  
80°  
90°  
80°  
90°  
0.2 0.4 0.6 0.8 1.0  
0
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2010-01-29  
TL(RM,RMM,SM,OM,YM)1108(T11)  
TLOM1108  
I
– V  
I
– I  
F
F
F
V
(typ.)  
(typ.)  
100  
Ta = 25°C  
Ta = 25°C  
3000  
1000  
30  
10  
300  
100  
3
1
30  
10  
1.7  
1.9  
2.1  
2.3  
2.5  
2.7  
2.9  
1
3
10  
30  
100  
Forward voltage  
V
(V)  
F
Forward current  
I
(mA)  
F
Wavelength characteristic  
I
Tc  
V
(typ.)  
(typ.)  
1.0  
0.8  
0.6  
0.4  
0.2  
0
10  
I
= 50 mA  
F
Ta = 25°C  
5
3
1
0.5  
0.3  
0.1  
40  
540  
560  
580  
600  
620  
640  
660  
20  
0
20  
40  
60  
80  
100  
Wavelength  
λ (nm)  
Case temperature Tc (°C)  
Radiation pattern  
Ta = 25°C  
(typ.)  
0°  
10°  
10°  
20°  
20°  
30°  
30°  
40°  
40°  
50°  
50°  
60°  
70°  
60°  
70°  
80°  
90°  
80°  
90°  
0.2 0.4 0.6 0.8 1.0  
0
7
2010-01-29  
TL(RM,RMM,SM,OM,YM)1108(T11)  
TLYM1108  
I
– V  
I
– I  
F
F
F
V
(typ.)  
(typ.)  
100  
Ta = 25°C  
Ta = 25°C  
3000  
1000  
30  
10  
300  
100  
3
1
30  
10  
1.7  
1.9  
2.1  
2.3  
2.5  
2.7  
2.9  
1
3
10  
30  
100  
Forward voltage  
V
(V)  
F
Forward current  
I
(mA)  
F
Wavelength characteristic  
I
Tc  
V
(typ.)  
(typ.)  
10  
1.0  
0.8  
0.6  
0.4  
0.2  
0
I
= 50 mA  
F
Ta = 25°C  
5
3
1
0.5  
0.3  
0.1  
40  
20  
0
20  
40  
60  
80  
100  
540  
560  
580  
600  
620  
640  
660  
Wavelength  
λ (nm)  
Case temperature Tc (°C)  
Radiation pattern  
Ta = 25°C  
(typ.)  
0°  
10°  
10°  
20°  
20°  
30°  
30°  
40°  
40°  
50°  
50°  
60°  
70°  
60°  
70°  
80°  
90°  
80°  
90°  
0.2 0.4 0.6 0.8 1.0  
0
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2010-01-29  
TL(RM,RMM,SM,OM,YM)1108(T11)  
Packaging  
These LED devices are packed in an aluminum envelope with a silica gel and a moisture indicator to avoid  
moisture absorption. The optical characteristics of the devices may be affected by exposure to moisture in the air  
before soldering and they should therefore be stored under the following conditions:  
1. This moisture proof bag may be stored unopened within 12 months at the following conditions.  
Temperature: 5°C to 30°C  
Humidity: 90% (max)  
2. After opening the moisture proof bag, the devices should be assembled within 4weeks in an environment of  
5°C to 30°C/60% RH or below.  
3. If upon opening, the moisture indicator card shows humidity 30% or above (Color of indication changes to  
pink) or the expiration date has passed, the devices should be baked in taping with reel.  
After baking, use the baked devices within 72 hours, but perform baking only once.  
Baking conditions: 60±5°C, for 12 to 24 hours.  
Expiration date: 12 months from sealing date, which is imprinted on the same side as this label affixed.  
4. Repeated baking can cause the peeling strength of the taping to change, then leads to trouble in mounting.  
Furthermore, prevent the devices from being destructed against static electricity for baking of it.  
5. If the packing material of laminate would be broken, the hermeticity would deteriorate. Therefore, do not  
throw or drop the packed devices.  
Mounting Method  
Soldering  
Reflow soldering (example)  
Temperature profile for Pb soldering (example)  
Temperature profile for Pb-free soldering (example)  
(*)  
(*)  
10 s max  
5 s max  
(*)  
(*)  
240°C max  
260°C max  
(*)  
4°C/s max  
max(*)  
max(*)  
140 to 160°C  
230°C  
150 to 180°C  
(*)  
(*)  
4°C/s max  
4°C/s max  
(*)  
4°C/s max  
max(*)  
60 to 120 s  
max(*)  
60 to 120 s  
30 to 50 s max(*)  
Time (s)  
Time (s)  
The products are evaluated using above reflow soldering conditions. No additional test is performed exceed the  
condition (i.e. the condition more than (*)MAX values) as a evaluation. Please perform reflow soldering under  
the above conditions.  
Please perform the first reflow soldering with reference to the above temperature profile and within 4weeks of  
opening the package.  
Second reflow soldering  
In case of second reflow soldering should be performed within 168 h of the first reflow under the above  
conditions.  
Storage conditions before the second reflow soldering: 30°C, 60% RH (max)  
Make any necessary soldering corrections manually.  
(only once at each soldering point)  
Soldering iron: 25 W  
Temperature: 350°C or less  
Time:  
within 3 s  
If the products need to be performed by other soldering method (ex. wave soldering), please contact Toshiba  
sales representative.  
9
2010-01-29  
TL(RM,RMM,SM,OM,YM)1108(T11)  
Recommended soldering pattern  
Cu area > 16 mm2  
Unit: mm  
1.5  
4.0  
4.0  
Do not use this area for  
electrical contact.  
Cathode  
4.0  
2.3  
0.7  
0.8  
Do not use this area for  
electrical contact.  
1.1  
Anode  
10  
2010-01-29  
TL(RM,RMM,SM,OM,YM)1108(T11)  
Cleaning  
When cleaning is required after soldering, Toshiba recommends the following cleaning solvents.  
It is confirmed that these solvents have no effect on semiconductor devices in our dipping test (under the  
recommended conditions). In selecting the one for your actual usage, please perform sufficient review  
on washing condition, using condition and etc.  
ASAHI CLEAN AK-225AES:  
KAO CLEAN THROUGH 750HS:  
PINE ALPHA ST-100S:  
(made by ASAHI GLASS)  
(made by KAO)  
(made by ARAKAWA CHEMICAL)  
Precautions when Mounting  
Do not apply force to the plastic part of the LED under high-temperature conditions.  
To avoid damaging the LED plastic, do not apply friction using a hard material.  
When installing the PCB in a product, ensure that the device does not come into contact with other cmponents.  
Tape Specifications  
1. Product number format  
The type of package used for shipment is denoted by a symbol suffix after the product number. The  
method of classification is as below. (this method, however does not apply to products whose electrical  
characteristics differ from standard Toshiba specifications)  
(1) Tape Type: T11 (4-mm pitch)  
(2) Example  
TLSM1108 (T11)  
Tape type  
Toshiba product No.  
2. Handling precautions  
Tape material protected against static electricity. However, static electricity may occur depending on  
quantity of charged static electricity and a device may attach to a tape, or a device may be unstable  
when peeling a tape cover.  
(a)In process, taping materials may sustain an electrostatic charge, use an ionizer to  
neutralize the ions.  
(b)For transport and temporary storage of devices, use containers(boxes, jigs, and bags) that  
are made of anti-static materials or of materials that dissipate electrostatic electricity.  
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2010-01-29  
TL(RM,RMM,SM,OM,YM)1108(T11)  
3. Tape dimensions  
Unit: mm  
Symbol  
Dimension  
Tolerance  
Symbol  
Dimension  
Tolerance  
D
E
1.5  
1.75  
4.0  
+0.1/0  
±0.1  
P
2.0  
8.0  
4.0  
2.9  
3.7  
2.3  
±0.05  
±0.3  
±0.1  
±0.1  
±0.1  
±0.1  
2
W
P
P
±0.1  
0
t
0.3  
±0.05  
±0.05  
±0.1  
A
B
K
0
0
0
F
3.5  
D
1
1.5  
K
0
P
0
D
t
P
2
E
F
W
B
0
Polarity  
P
D
1
A
0
12  
2010-01-29  
TL(RM,RMM,SM,OM,YM)1108(T11)  
4. Reel dimensions  
Unit: mm  
9 +1/ −0  
11.4 ± 1.0  
φ44  
2 ± 0.5  
5. Leader and trailer sections of tape  
40 mm or more  
(Note 1)  
40 mm or more  
(Note 2)  
Leading part: 190 mm (min)  
Note 1: Empty trailer section  
Note 2: Empty leader section  
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2010-01-29  
TL(RM,RMM,SM,OM,YM)1108(T11)  
6. Packing form  
(1) Packing quantity  
Reel  
2,000 pcs  
Carton  
10,000 pcs  
(2) Packing form: Each reel is sealed in an aluminum pack with silica gel.  
7. Label format  
(1) Example: TLSM1108 (T11)  
P/N:  
TOSHIBA  
TYPE  
ADDC  
TLSM1108  
(T11)  
Q’TY  
32C  
2,000 pcs  
2000  
Lot Number  
Key code for TSB  
(RANK SYMBOL)  
Use under 5-30degC/60%RH in 4weeks  
SEALED:  
[[G]]/RoHS COMPATIBLE  
*Y380xxxxxxxxxxxxxxxxxx*  
DIFFUSED IN *****  
ASSEMBLED IN *****  
(2) Label location  
Reel  
Carton  
Tape feel direction  
Label position  
Label position  
The aluminum package in which the reel is supplied also has the label attached to  
center of one side.  
14  
2010-01-29  
TL(RM,RMM,SM,OM,YM)1108(T11)  
RESTRICTIONS ON PRODUCT USE  
Toshiba Corporation, and its subsidiaries and affiliates (collectively “TOSHIBA”), reserve the right to make changes to the information  
in this document, and related hardware, software and systems (collectively “Product”) without notice.  
This document and any information herein may not be reproduced without prior written permission from TOSHIBA. Even with  
TOSHIBA’s written permission, reproduction is permissible only if reproduction is without alteration/omission.  
Though TOSHIBA works continually to improve Product’s quality and reliability, Product can malfunction or fail. Customers are  
responsible for complying with safety standards and for providing adequate designs and safeguards for their hardware, software and  
systems which minimize risk and avoid situations in which a malfunction or failure of Product could cause loss of human life, bodily  
injury or damage to property, including data loss or corruption. Before customers use the Product, create designs including the  
Product, or incorporate the Product into their own applications, customers must also refer to and comply with (a) the latest versions of  
all relevant TOSHIBA information, including without limitation, this document, the specifications, the data sheets and application notes  
for Product and the precautions and conditions set forth in the “TOSHIBA Semiconductor Reliability Handbook” and (b) the  
instructions for the application with which the Product will be used with or for. Customers are solely responsible for all aspects of their  
own product design or applications, including but not limited to (a) determining the appropriateness of the use of this Product in such  
design or applications; (b) evaluating and determining the applicability of any information contained in this document, or in charts,  
diagrams, programs, algorithms, sample application circuits, or any other referenced documents; and (c) validating all operating  
parameters for such designs and applications. TOSHIBA ASSUMES NO LIABILITY FOR CUSTOMERS’ PRODUCT DESIGN OR  
APPLICATIONS.  
Product is intended for use in general electronics applications (e.g., computers, personal equipment, office equipment, measuring  
equipment, industrial robots and home electronics appliances) or for specific applications as expressly stated in this document.  
Product is neither intended nor warranted for use in equipment or systems that require extraordinarily high levels of quality and/or  
reliability and/or a malfunction or failure of which may cause loss of human life, bodily injury, serious property damage or serious  
public impact (“Unintended Use”). Unintended Use includes, without limitation, equipment used in nuclear facilities, equipment used  
in the aerospace industry, medical equipment, equipment used for automobiles, trains, ships and other transportation, traffic signaling  
equipment, equipment used to control combustions or explosions, safety devices, elevators and escalators, devices related to electric  
power, and equipment used in finance-related fields. Do not use Product for Unintended Use unless specifically permitted in this  
document.  
Do not disassemble, analyze, reverse-engineer, alter, modify, translate or copy Product, whether in whole or in part.  
Product shall not be used for or incorporated into any products or systems whose manufacture, use, or sale is prohibited under any  
applicable laws or regulations.  
The information contained herein is presented only as guidance for Product use. No responsibility is assumed by TOSHIBA for any  
infringement of patents or any other intellectual property rights of third parties that may result from the use of Product. No license to  
any intellectual property right is granted by this document, whether express or implied, by estoppel or otherwise.  
ABSENT A WRITTEN SIGNED AGREEMENT, EXCEPT AS PROVIDED IN THE RELEVANT TERMS AND CONDITIONS OF SALE  
FOR PRODUCT, AND TO THE MAXIMUM EXTENT ALLOWABLE BY LAW, TOSHIBA (1) ASSUMES NO LIABILITY  
WHATSOEVER, INCLUDING WITHOUT LIMITATION, INDIRECT, CONSEQUENTIAL, SPECIAL, OR INCIDENTAL DAMAGES OR  
LOSS, INCLUDING WITHOUT LIMITATION, LOSS OF PROFITS, LOSS OF OPPORTUNITIES, BUSINESS INTERRUPTION AND  
LOSS OF DATA, AND (2) DISCLAIMS ANY AND ALL EXPRESS OR IMPLIED WARRANTIES AND CONDITIONS RELATED TO  
SALE, USE OF PRODUCT, OR INFORMATION, INCLUDING WARRANTIES OR CONDITIONS OF MERCHANTABILITY, FITNESS  
FOR A PARTICULAR PURPOSE, ACCURACY OF INFORMATION, OR NONINFRINGEMENT.  
GaAs (Gallium Arsenide) is used in Product. GaAs is harmful to humans if consumed or absorbed, whether in the form of dust or  
vapor. Handle with care and do not break, cut, crush, grind, dissolve chemically or otherwise expose GaAs in Product.  
Do not use or otherwise make available Product or related software or technology for any military purposes, including without  
limitation, for the design, development, use, stockpiling or manufacturing of nuclear, chemical, or biological weapons or missile  
technology products (mass destruction weapons). Product and related software and technology may be controlled under the  
Japanese Foreign Exchange and Foreign Trade Law and the U.S. Export Administration Regulations. Export and re-export of Product  
or related software or technology are strictly prohibited except in compliance with all applicable export laws and regulations.  
Please contact your TOSHIBA sales representative for details as to environmental matters such as the RoHS compatibility of Product.  
Please use Product in compliance with all applicable laws and regulations that regulate the inclusion or use of controlled substances,  
including without limitation, the EU RoHS Directive. TOSHIBA assumes no liability for damages or losses occurring as a result of  
noncompliance with applicable laws and regulations.  
15  
2010-01-29  

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