TLSK1100C [TOSHIBA]
Panel Circuit Indicator; 面板指示灯电路
| 型号： | TLSK1100C |
| 厂家： | 
TOSHIBA |
| 描述： | Panel Circuit Indicator |
| 文件： | 总13页 (文件大小：292K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
TL(RK,RMK,SK,OK,YK)1100C(T11)
TOSHIBA LED Lamps
TLRK1100C(T11), TLRMK1100C(T11), TLSK1100C(T11),
TLOK1100C(T11), TLYK1100C(T11)
Panel Circuit Indicator
Unit: mm
•
•
•
•
•
•
•
•
Surface-mount devices
3.2 (L) × 2.8 (W) × 1.9 (H) mm
Flat-top type
InGaAℓP LEDs
High luminous intensity
Low drive current, high-intensity light emission
Colors: Red, Orange, Yellow
Applications: automotive use, message signboards, backlighting
etc.
•
Standard embossed tape packing: T11 (2000/reel)
8-mm tape reel
Color and Material
JEDEC
―
―
JEITA
Product Name
Color
Material
TOSHIBA
4-3R1
TLRK1100C
TLRMK1100C
TLSK1100C
TLOK1100C
TLYK1100C
Red
Red
Weight: 0.035 g (typ.)
InGaAℓP
Red
Orange
Yellow
1
2007-10-01
TL(RK,RMK,SK,OK,YK)1100C(T11)
Absolute Maximum Ratings (Ta = 25°C)
Forward Current
Operation
Temperature
Storage
Temperature
Reverse Voltage
(V)
Power Dissipation
I
(mA)
Product Name
F
V
P
(mW)
R
D
T
opr
(°C)
T
stg
(°C)
Please see Note 1
TLRK1100C
TLRMK1100C
TLSK1100C
TLOK1100C
TLYK1100C
30
4
75
−40~100
−40~100
Note: Using continuously under heavy loads (e.g. the application of high temperature/current/voltage and the
significant change in temperature, etc.) may cause this product to decrease in the reliability significantly even
if the operating conditions (i.e. operating temperature/current/voltage, etc.) are within the absolute maximum
ratings.
Please design the appropriate reliability upon reviewing the Toshiba Semiconductor Reliability Handbook
(“Handling Precautions”/“Derating Concept and Methods”) and individual reliability data (i.e. reliability test
report and estimated failure rate, etc).
Note 1: Forward current derating
I
– Ta
F
50
40
30
20
10
0
0
20
40
60
80
100
120
Ambient temperature Ta (°C))
Electrical Characteristics (Ta = 25°C)
Reverse Current
Forward Voltage V
F
I
R
Product Name
Min
1.8
1.8
1.8
1.8
1.8
Typ.
2.1
2.1
2.1
2.1
2.2
V
Max
2.5
2.5
2.5
2.5
2.5
I
Max
V
R
F
TLRK1100C
TLRMK1100C
TLSK1100C
TLOK1100C
TLYK1100C
Unit
20
10
4
mA
μA
V
2
2007-10-01
TL(RK,RMK,SK,OK,YK)1100C(T11)
Optical Characteristics–1 (Ta = 25°C)
Luminous Intensity I
Available Iv rank
V
Product Name
Please see Note 2
RA / SA / TA
SA / TA / UA
TA / UA / VA
TA / UA / VA
SA / TA / UA
mA
Min
100
160
250
250
160
mcd
Typ.
300
400
500
500
400
mcd
Max
500
I
F
TLRK1100C
TLRMK1100C
TLSK1100C
TLOK1100C
TLYK1100C
Unit
20
20
20
20
20
mA
800
1250
1250
800
mcd
Note 2: The specification on the above table is used for Iv classification of LEDs in Toshiba facility.
Each reel includes the same rank LEDs. Let the delivery ratio of each rank be unquestioned.
Luminous Intensity I
V
Rank
Min
100
160
250
400
630
mcd
Max
RA
SA
TA
200
320
500
UA
VA
Unit
800
1250
mcd
Optical Characteristics–2 (Ta = 25°C)
Emission Spectrum
Peak Emission
Product Name
Δλ
Dominant Wavelength λ
d
Wavelength λ
I
p
F
Min
Typ.
Max
Typ.
14
Min
624
Typ.
630
Max
638
TLRK1100C
TLRMK1100C
TLSK1100C
TLOK1100C
TLYK1100C
Unit
⎯
644
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
636
623
612
592
nm
14
14
14
13
nm
620
607
599
583
626
613
605
590
nm
634
621
613
595
20
mA
The cautions
•
This product is designed as a general display light source usage, and it has applied the measurement standard
that matched with the sensitivity of human's eyes. Therefore, it is not intended for usage of functional
application (ex. Light source for sensor, optical communication and etc) except general display light source.
3
2007-10-01
TL(RK,RMK,SK,OK,YK)1100C(T11)
TLRK1100C
I
– V
I – I
V F
F
F
(typ.)
(typ.)
100
1000
Ta = 25°C
500
300
30
10
100
50
30
3
1
1.6
10
1
1.8
2.0
2.2
2.4
3
5
10
30
50
100
Forward voltage
V
(V)
F
Forward current
I
(mA)
F
I
– Tc
Wavelength characteristic
V
(typ.)
(typ.)
10
1.0
0.8
0.6
0.4
0.2
0
I
= 20 mA
F
Ta = 25°C
5
3
1
0.5
0.3
0.1
−25
0
25
50
75
100
580
600
620
640
660
680
700
Case temperature Tc (°C)
Wavelength
λ
(nm)
Radiation pattern
Ta = 25°C
(typ.)
0°
10°
10°
20°
20°
30°
30°
40°
50°
40°
50°
60°
70°
60°
70°
80°
90°
80°
90°
0.2 0.4 0.6 0.8 1.0
0
4
2007-10-01
TL(RK,RMK,SK,OK,YK)1100C(T11)
TLRMK1100C
I
– V
I – I
V F
F
F
(typ.)
(typ.)
100
1000
Ta = 25°C
500
300
30
10
100
50
30
3
1
10
1
1.6
1.8
2.0
2.2
2.4
3
5
10
30
50
100
Forward voltage
V
(V)
F
Forward current
I
(mA)
F
I
– Tc
Wavelength characteristic
V
(typ.)
(typ.)
10
1.0
0.8
0.6
0.4
0.2
0
I
= 20 mA
F
Ta = 25°C
5
3
1
0.5
0.3
0.1
−25
0
25
50
75
100
580
600
620
640
660
680
700
Case temperature Tc (°C)
Wavelength
λ
(nm)
Radiation pattern
Ta = 25°C
(typ.)
0°
10°
10°
20°
20°
30°
30°
40°
40°
50°
50°
60°
70°
60°
70°
80°
90°
80°
90°
0.2 0.4 0.6 0.8 1.0
0
5
2007-10-01
TL(RK,RMK,SK,OK,YK)1100C(T11)
TLSK1100C
I
– V
I – I
V F
F
F
(typ.)
(typ.)
100
1000
Ta = 25°C
500
300
30
10
100
50
30
3
1
1.6
10
1
1.8
2.0
2.2
2.4
3
5
10
30
50
100
Forward voltage
V
(V)
F
Forward current
I
(mA)
F
I
– Tc
Wavelength characteristic
V
(typ.)
(typ.)
10
1.0
0.8
0.6
0.4
0.2
0
I
= 20 mA
F
Ta = 25°C
5
3
1
0.5
0.3
0.1
−25
0
25
50
75
100
560
580
600
620
640
660
680
Case temperature Tc (°C)
Wavelength
λ
(nm)
Radiation pattern
Ta = 25°C
(typ.)
0°
10°
10°
20°
20°
30°
30°
40°
50°
40°
50°
60°
70°
60°
70°
80°
90°
80°
90°
0.2 0.4 0.6 0.8 1.0
0
6
2007-10-01
TL(RK,RMK,SK,OK,YK)1100C(T11)
TLOK1100C
I
– V
I – I
V F
F
F
(typ.)
(typ.)
100
1000
Ta = 25°C
500
300
30
10
100
50
30
3
1
1.6
10
1
1.8
2.0
2.2
2.4
3
5
10
30
50
100
Forward voltage
V
(V)
F
Forward current
I
(mA)
F
I
– Tc
Wavelength characteristic
V
(typ.)
(typ.)
1.0
0.8
0.6
0.4
0.2
0
10
I
= 20 mA
F
Ta = 25°C
5
3
1
0.5
0.3
0.1
−25
540
560
580
600
620
640
660
0
25
50
75
100
Case temperature Tc (°C)
Wavelength
λ
(nm)
Radiation pattern
Ta = 25°C
(typ.)
0°
10°
10°
20°
20°
30°
30°
40°
50°
40°
50°
60°
70°
60°
70°
80°
90°
80°
90°
0.2 0.4 0.6 0.8 1.0
0
7
2007-10-01
TL(RK,RMK,SK,OK,YK)1100C(T11)
TLYK1100C
I
– V
I – I
V F
F
F
(typ.)
(typ.)
1000
100
Ta = 25°C
500
300
30
10
100
50
30
3
1
1.6
10
1
1.8
2.0
2.2
2.4
3
5
10
30
50
100
Forward voltage
V
(V)
F
Forward current
I
(mA)
F
I
– Tc
Wavelength characteristic
V
(typ.)
(typ.)
10
1.0
0.8
0.6
0.4
0.2
0
I
= 20 mA
F
Ta = 25°C
5
3
1
0.5
0.3
0.1
−25
540
560
580
600
620
640
660
0
25
50
75
100
Case temperature Tc (°C)
Wavelength
λ
(nm)
Radiation pattern
Ta = 25°C
(typ.)
0°
10°
10°
20°
20°
30°
30°
40°
50°
40°
50°
60°
70°
60°
70°
80°
90°
80°
90°
0.2 0.4 0.6 0.8 1.0
0
8
2007-10-01
TL(RK,RMK,SK,OK,YK)1100C(T11)
Packaging
These LED devices are packed in an aluminum envelope with a silica gel and a moisture indicator to avoid
moisture absorption. The optical characteristics of the devices may be affected by exposure to moisture in the air
before soldering and they should therefore be stored under the following conditions:
1. This moisture proof bag may be stored unopened within 12 months at the following conditions.
Temperature: 5°C~30°C
Humidity: 90% (max)
2. After opening the moisture proof bag, the devices should be assembled within 168 hours in an environment of
5°C to 30°C/60% RH or below.
3. If upon opening, the moisture indicator card shows humidity 30% or above (Color of indication changes to
pink) or the expiration date has passed, the devices should be baked in taping with reel.
After baking, use the baked devices within 72 hours, but perform baking only once.
Baking conditions: 60±5°C, for 12 to 24 hours.
Expiration date: 12 months from sealing date, which is imprinted on the same side as this label affixed.
4. Repeated baking can cause the peeling strength of the taping to change, then leads to trouble in mounting.
Furthermore, prevent the devices from being destructed against static electricity for baking of it.
5. If the packing material of laminate would be broken, the hermeticity would deteriorate. Therefore, do not
throw or drop the packed devices.
Mounting Method
Soldering
•
Reflow soldering (example)
Temperature profile for Pb soldering (example)
Temperature profile for Pb-free soldering (example)
(*)
(*)
10 s max
5 s max
(*)
(*)
240°C max
260°C max
(*)
4°C/s max
max(*)
max(*)
140~160°C
230°C
150~180°C
(*)
(*)
4°C/s max
4°C/s max
(*)
4°C/s max
max(*)
60~120 s
60~120 s
max(*)
30~50s max(*)
Time (s)
Time (s)
•
The products are evaluated using above reflow soldering conditions. No additional test is performed exceed the
condition (i.e. the condition more than (*)MAX values) as a evaluation. Please perform reflow soldering under
the above conditions.
•
•
Please perform the first reflow soldering with reference to the above temperature profile and within 168 h of
opening the package.
Second reflow soldering
In case of second reflow soldering should be performed within 168 h of the first reflow under the above
conditions.
Storage conditions before the second reflow soldering: 30°C, 60% RH (max)
•
•
Make any necessary soldering corrections manually.
(only once at each soldering point)
Soldering iron: 25 W
Temperature : 300°C or less
Time
: within 3 s
If the products need to be performed by other soldering method (ex. wave soldering), please contact Toshiba
sales representative.
Recommended soldering pattern
Unit: mm
1.65
1.15
1.65
2.41
9
2007-10-01
TL(RK,RMK,SK,OK,YK)1100C(T11)
Cleaning
When cleaning is required after soldering, Toshiba recommends the following cleaning solvents.
It is confirmed that these solvents have no effect on semiconductor devices in our dipping test (under the
recommended conditions). In selecting the one for your actual usage, please perform sufficient review
on washing condition, using condition and etc.
ASAHI CLEAN AK-225AES
KAO CLEAN TROUGH 750H
PINE ALPHA ST-100S
TOSHIBA TECHNOCARE
(FRW-17, FRW-1, FRV-100)
: (made by ASAHI GLASS)
: (made by KAO)
: (made by ARAKAWA CHEMICAL)
: (made by GE TOSHIBA SILICONES)
Precautions when Mounting
Do not apply force to the plastic part of the LED under high-temperature conditions.
To avoid damaging the LED plastic, do not apply friction using a hard material.
When installing the PCB in a product, ensure that the device does not come into contact with other cmponents.
Tape Specifications
1. Product number format
The type of package used for shipment is denoted by a symbol suffix after the product number. The
method of classification is as below. (this method, however does not apply to products whose electrical
characteristics differ from standard Toshiba specifications)
(1) Tape Type: T11 (4-mm pitch)
(2) Example
TLYK1100C (T11)
Tape type
Toshiba product No.
2. Tape dimensions
Unit: mm
Symbol
Dimension
Tolerance
Symbol
Dimension
Tolerance
D
E
1.5
1.75
4.0
+0.1/−0
±0.1
P
2.0
8.0
4.0
2.9
3.7
2.3
±0.05
±0.3
±0.1
±0.1
±0.1
±0.1
2
W
P
P
±0.1
0
t
0.3
±0.05
±0.05
±0.1
A
B
K
0
0
0
F
3.5
D
1
1.5
K
P
0
0
D
t
P
2
E
F
W
B
0
Polarity
P
D
1
A
0
10
2007-10-01
TL(RK,RMK,SK,OK,YK)1100C(T11)
3. Reel dimensions
Unit: mm
9 ± 0.3
11.4 ± 1.0
φ44
2 ± 0.5
4. Leader and trailer sections of tape
40 mm or more
(Note 1)
40 mm or more
(Note 2)
Leading part: 190 mm (min)
Note1: Empty trailer section
Note2: Empty leader section
11
2007-10-01
TL(RK,RMK,SK,OK,YK)1100C(T11)
5. Packing form
(1) Packing quantity
Reel
2,000 pcs
Carton
10,000 pcs
(2) Packing form: Each reel is sealed in an aluminum pack with silica gel.
6. Label format
(1) Example: TLYK1100C (T11)
P/N:
TOSHIBA
TYPE
ADDC
TLYK1100C
(T11)
Q’TY
32C
2,000 pcs
2000
Lot Number
Key code for TSB
(RANK SYMBOL)
Use under 5-30degC/60%RH within 168h
SEAL DATE:
DIFFUSED IN *****
ASSEMBLED IN *****
[[G]]/RoHS COMPATIBLE
*Y3804xxxxxxxxxxxxxxxxx*
(2) Label location
•
Reel
• Carton
Tape feel direction
Label position
Label position
•
The aluminum package in which the reel is supplied also has the label attached to
center of one side.
12
2007-10-01
TL(RK,RMK,SK,OK,YK)1100C(T11)
RESTRICTIONS ON PRODUCT USE
20070701-EN
• The information contained herein is subject to change without notice.
• TOSHIBA is continually working to improve the quality and reliability of its products. Nevertheless, semiconductor
devices in general can malfunction or fail due to their inherent electrical sensitivity and vulnerability to physical
stress. It is the responsibility of the buyer, when utilizing TOSHIBA products, to comply with the standards of
safety in making a safe design for the entire system, and to avoid situations in which a malfunction or failure of
such TOSHIBA products could cause loss of human life, bodily injury or damage to property.
In developing your designs, please ensure that TOSHIBA products are used within specified operating ranges as
set forth in the most recent TOSHIBA products specifications. Also, please keep in mind the precautions and
conditions set forth in the “Handling Guide for Semiconductor Devices,” or “TOSHIBA Semiconductor Reliability
Handbook” etc.
• The TOSHIBA products listed in this document are intended for usage in general electronics applications
(computer, personal equipment, office equipment, measuring equipment, industrial robotics, domestic appliances,
etc.).These TOSHIBA products are neither intended nor warranted for usage in equipment that requires
extraordinarily high quality and/or reliability or a malfunction or failure of which may cause loss of human life or
bodily injury (“Unintended Usage”). Unintended Usage include atomic energy control instruments, airplane or
spaceship instruments, transportation instruments, traffic signal instruments, combustion control instruments,
medical instruments, all types of safety devices, etc.. Unintended Usage of TOSHIBA products listed in his
document shall be made at the customer’s own risk.
• The products described in this document shall not be used or embedded to any downstream products of which
manufacture, use and/or sale are prohibited under any applicable laws and regulations.
• GaAs(Gallium Arsenide) is used in this product. The dust or vapor is harmful to the human body. Do not break,
cut, crush or dissolve chemically.
• Please contact your sales representative for product-by-product details in this document regarding RoHS
compatibility. Please use these products in this document in compliance with all applicable laws and regulations
that regulate the inclusion or use of controlled substances. Toshiba assumes no liability for damage or losses
occurring as a result of noncompliance with applicable laws and regulations.
13
2007-10-01
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