TLYF1050-(XA)(T20) [TOSHIBA]
Visible LED, SINGLE COLOR LED, YELLOW, 3.6 mm, ROHS COMPLIANT, 4-5AU1, 2 PIN;
| 型号： | TLYF1050-(XA)(T20) |
| 厂家： | 
TOSHIBA |
| 描述： | Visible LED, SINGLE COLOR LED, YELLOW, 3.6 mm, ROHS COMPLIANT, 4-5AU1, 2 PIN 光电 |
| 文件： | 总16页 (文件大小：387K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
TL(RMF,SF,OF,YF,GF,FGF,PGF)1050(T20)
TOSHIBA LED Lamp
TLRMF1050(T20),TLSF1050(T20),TLOF1050(T20),TLYF1050(T20),
TLGF1050(T20),TLFGF1050(T20),TLPGF1050(T20)
Panel Circuit Indicator
Unit: mm
•
•
5.2 (L) × 5.2 (W) × 4.0 (H) mm
TL□F1050 (T20) Series
φ3.6 mm transparent lens top type
InGaAℓP LEDs
•
•
High luminous intensity and low power
consumption.
•
•
Colors: red, orange, yellow, green, pure green
High operating temperature
T
−40 to 100°C
−40 to 110°C
opr:
stg:
T
•
•
Surface-mount devices
Standard embossed tape packing
8-mm component pitch: T20 (400 pcs/reel)
Reflow-soldering is available
•
•
Applications: automotive use, display of interiors,
display of air conditioners, car audio,
illumination of various switches, etc.
Color and Material
Part Number
Color
Material
TLRMF1050
TLSF1050
TLOF1050
TLYF1050
TLGF1050
TLFGF1050
TLPGF1050
Red
Red
Orange
Yellow
Green
InGaAℓP
JEDEC
―
Green
JEITA
―
Pure Green
TOSHIBA
4-5AU1
Weight: 0.085 g (typ.)
1
2008-08-26
TL(RMF,SF,OF,YF,GF,FGF,PGF)1050(T20)
Absolute Maximum Ratings (Ta = 25°C)
Operating
Temperature
Topr(℃)
Storage
Temperature
Tstg(℃)
Forward Current
Reverse Voltage
Power Dissipation
(mW)
Product
Name
I (mA)
F
V (V)
R
P
D
TLRMF1050
TLSF1050
TLOF1050
TLYF1050
TLGF1050
TLFGF1050
TLPGF1050
50
4
120
−40 to 100
−40 to 110
Note: Using continuously under heavy loads (e.g. the application of high temperature/current/voltage and the
significant change in temperature, etc.) may cause this product to decrease in the reliability significantly even
if the operating conditions (i.e. operating temperature/current/voltage, etc.) are within the absolute maximum
ratings.
Please design the appropriate reliability upon reviewing the Toshiba Semiconductor Reliability Handbook
(“Handling Precautions”/“Derating Concept and Methods”) and individual reliability data (i.e. reliability test
report and estimated failure rate, etc).
Note 1: Forward current derating
I
– Ta
F
80
60
40
20
0
0
20
40
60
80
100
120
Ambient temperature Ta (°C)
Electrical Characteristics (Ta = 25°C)
Forward Voltage
V
F
Reverse Current
I
R
Product
Name
I
V
R
Min
1.7
1.7
Typ.
Max
Max
F
TLRMF1050
TLSF1050
TLOF1050
TLYF1050
TLGF1050
TLFGF1050
TLPGF1050
Unit
2.0
2.5
2.5
2.5
2.5
2.6
2.6
2.6
2.0
2.0
2.1
2.2
2.3
2.3
V
1.7
1.7
20
50
4
1.8
1.9
1.9
mA
μA
V
2
2008-08-26
TL(RMF,SF,OF,YF,GF,FGF,PGF)1050(T20)
Optical Characteristics-1 (Ta = 25°C)
Luminous Intensity I
V
Corresponding brightness rank
Product Name
sign（Note 2）
Min
250
630
630
630
400
160
100
Typ
700
Max
2000
3200
3200
3200
2000
800
I
F
TLRMF1050
TLSF1050
TLOF1050
TLYF1050
TLGF1050
TLFGF1050
TLPGF1050
Unit
TA / UA / VA / WA
VA / WA / XA
VA / WA / XA
VA / WA / XA
UA / VA / WA
SA / TA / UA
RA / SA / TA
1400
1500
1000
900
20
370
180
500
mcd
mA
Note 2: The specification on the above table is used for Iv classification of LEDs in Toshiba facility.
Each reel includes the same rank LEDs. Let the delivery ratio of each rank be unquestioned..
Brightness rank
Rank sign
RA
Min
100
Max
200
SA
160
320
TA
250
500
UA
400
800
VA
630
1250
2000
3200
mcd
WA
XA
1000
1600
mcd
Unit
Optical Characteristics-2 (Ta = 25°C)
Emission Spectrum
Peak Emission Wavelength λ
Dominant Wavelength λ
d
Δλ
Product Name
p
Min
⎯
⎯
⎯
Typ
636
623
612
590
574
568
562
nm
Max
⎯
⎯
⎯
Typ
17
17
15
13
11
11
11
nm
Min
620
607
599
581
565
559
555
Typ
626
613
605
587
571
565
558
nm
Max
634
621
613
595
576
571
564
I
F
TLRMF1050
TLSF1050
TLOF1050
TLYF1050
TLGF1050
TLFGF1050
TLPGF1050
Unit
20
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
mA
Cautions
z
This LED lamp emits some infrared light in addition to light in the visible spectrum. Ensure that this IR light affects
no photosensitive device used near the LED lamp.
z
This product is a product developed as a display source of light usage, and the measurement standard matched
to the sensitivity of human eyes is applied.
Therefore, use to functional usages (source of light for the sensor and the communication) other than the
source of light for the display is not intended.
3
2008-08-26
TL(RMF,SF,OF,YF,GF,FGF,PGF)1050(T20)
TLRMF1050
I
– I
V
F
I
– V
F
F
100
Ta = 25°C
3000
1000
30
10
300
100
3
30
10
1
1.6
1.8
2.0
2.2
2.4
1
3
10
30
100
Forward voltage
V
(V)
F
Forward current
I
(mA)
F
Wavelength characteristic
I
– Tc
V
10
1.0
0.8
0.6
0.4
0.2
0
I
= 20 mA
F
Ta = 25°C
5
3
1
0.5
0.3
0.1
−40
−20
0
20
40
60
80
100
580
600
620
640
660
680
700
Case temperature Tc (°C)
Wavelength
λ
(nm)
Radiation pattern
Ta = 25°C
0°
30°
30°
60°
60°
90
0 0.2 0.4 0.6 0.8 1.0
90
4
2008-08-26
TL(RMF,SF,OF,YF,GF,FGF,PGF)1050(T20)
TLSF1050
I
– I
V
F
I
– V
F
F
100
Ta = 25°C
3000
1000
30
10
300
100
3
30
10
1
1.6
1.8
2.0
2.2
2.4
1
3
10
30
100
Forward voltage
V
(V)
F
Forward current
I
(mA)
F
I
– Tc
Wavelength characteristic
V
1.0
0.8
0.6
0.4
0.2
0
10
I
= 20 mA
F
Ta = 25°C
5
3
1
0.5
0.3
0.1
−40
580
600
620
640
660
680
700
−20
0
20
40
60
80
100
Case temperature Tc (°C)
Wavelength
λ
(nm)
Radiation pattern
Ta = 25°C
0°
30°
30°
60°
60°
90
0 0.2 0.4 0.6 0.8 1.0
90
5
2008-08-26
TL(RMF,SF,OF,YF,GF,FGF,PGF)1050(T20)
TLOF1050
I
– I
V
F
I
– V
F
F
100
Ta = 25°C
3000
1000
30
10
300
100
3
30
10
1
1.6
1.8
2.0
2.2
2.4
1
3
10
30
100
Forward voltage
V
(V)
F
Forward current
I
(mA)
F
I
– Tc
Wavelength characteristic
V
10
1.0
0.8
0.6
0.4
0.2
0
I
= 20 mA
F
5
3
Ta = 25°C
1
0.5
0.3
0.1
−40
−20
0
20
40
60
80
100
540
560
580
600
620
640
660
Wavelength
λ
(nm)
Case temperature Tc (°C)
Radiation pattern
Ta = 25°C
0°
30°
30°
60°
60°
90
0 0.2 0.4 0.6 0.8 1.0
90
6
2008-08-26
TL(RMF,SF,OF,YF,GF,FGF,PGF)1050(T20)
TLYF1050
I
– I
V
F
I
– V
F
F
100
Ta = 25°C
3000
1000
30
10
300
100
3
1
30
10
1.6
1.8
2.0
2.2
2.4
1
3
10
30
100
Forward voltage
V
(V)
F
Forward current
I
(mA)
F
Wavelength characteristic
I
– Tc
V
10
1.0
0.8
0.6
0.4
0.2
0
I
= 20 mA
F
Ta = 25°C
5
3
1
0.5
0.3
0.1
−40
−20
0
20
40
60
80
100
540
560
580
600
620
640
660
Case temperature Tc (°C)
Wavelength
λ (nm)
Radiation pattern
Ta = 25°C
0°
30°
30°
60°
60°
90
0 0.2 0.4 0.6 0.8 1.0
90
7
2008-08-26
TL(RMF,SF,OF,YF,GF,FGF,PGF)1050(T20)
TLGF1050
I
– I
V
F
I
– V
F
F
Ta = 25°C
100
3000
1000
30
10
300
100
3
1
30
10
1.8
2.0
2.2
2.4
2.6
1
3
10
30
100
Forward current
I
(mA)
F
Forward voltage
V
(V)
F
I
– Tc
Wavelength characteristic
V
10
1.0
0.8
0.6
0.4
0.2
I
= 20 mA
F
Ta = 25°C
5
3
1
0.5
0.3
0.1
−40
0
540
−20
0
20
40
60
80
100
560
580
600
620
Case temperature Tc (°C)
Wavelength
λ
(nm)
Radiation pattern
Ta = 25°C
0°
30°
30°
60°
60°
90
0 0.2 0.4 0.6 0.8 1.0
90
8
2008-08-26
TL(RMF,SF,OF,YF,GF,FGF,PGF)1050(T20)
TLFGF1050
I
– I
F
V
I
– V
F
F
1000
100
Ta = 25°C
300
100
30
10
30
10
3
1
3
1
1.8
2.0
2.2
2.4
2.6
1
3
10
30
100
Forward voltage
V
(V)
F
Forward current
I
(mA)
F
I
– Tc
V
Wavelength characteristic
10
1.0
0.8
0.6
0.4
0.2
I
= 20 mA
F
Ta = 25°C
5
3
1
0.5
0.3
0.1
−40
−20
0
20
40
60
80
100
520
540
560
580
600
Case temperature Tc (°C)
Wavelength
λ (nm)
Radiation pattern
Ta = 25°C
0°
30°
30°
60°
60°
90
0 0.2 0.4 0.6 0.8 1.0
90
9
2008-08-26
TL(RMF,SF,OF,YF,GF,FGF,PGF)1050(T20)
TLPGF1050
I
– I
F
V
I
– V
F
F
1000
100
Ta = 25°C
Ta = 25°C
50
30
300
100
10
30
10
5
3
3
1
1
1.6
1.8
2.0
2.2
2.4
2.6
2.8
1
3
10
30
100
Forward voltage
V
(V)
F
Forward voltage I
(mA)
F
I
– Tc
Wavelength characteristic
V
10
1.0
0.8
0.6
0.4
0.2
I
= 20 mA
F
Ta = 25°C
5
3
1
0.5
0.3
0.1
−40
0
520
−20
0
20
40
60
80
100
540
560
580
600
Case temperature Tc (°C)
Wavelength
λ (nm)
Radiation pattern
Ta = 25°C
0°
30°
30°
60°
60°
90
0 0.2 0.4 0.6 0.8 1.0
90
10
2008-08-26
TL(RMF,SF,OF,YF,GF,FGF,PGF)1050(T20)
Packaging
These LED devices are packed in an aluminum envelope with silica gel and a moisture indicator to prevent
moisture absorption. The optical characteristics of the devices may be affected by exposure to moisture in the air
before soldering and they should therefore be stored under the following conditions:
1. This moisture-proof bag may be stored unopened for up to 12 months under the following conditions.
Temperature: 5°C to 30°C
Humidity: 90% (max)
2. After the moisture-proof bag has been opened, the devices should be assembled within 168 hours in an
environment of 5°C to 30°C/70% RH or below.
3. If, upon opening, the moisture indicator card shows humidity of 30% or above (when the indication color
changes to pink) or the expiration date has passed, the devices should be baked while packed in the tape reel.
After baking, use the baked devices within 72 hours, but perform baking only once.
Baking conditions: 60 ±5°C, for 12 to 24 hours.
Expiration date: 12 months from the sealing date, which is imprinted on the same side as this label.
4. Repeated baking may cause the peeling strength of the tape to change, leading to trouble in mounting. Also,
be sure to prevent damage to the device from static electricity during the baking process.
5. Any breakage in the laminate packing material will cause the hermetically of the product to deteriorate. Do
not toss or drop the packed devices.
Mounting Method
Soldering
•
Reflow soldering (example)
Temperature profile for Pb soldering (example)
Temperature profile for Pb-free soldering (example)
(*)
(*)
10 s max
5 s max
(*)
(*)
240°C max
260°C max
(*)
4°C/s max
max(*)
max(*)
140 to 160°C
230°C
150 to 180°C
(*)
(*)
4°C/s max
4°C/s max
(*)
4°C/s max
max(*)
60 to 120 s
max(*)
60 to 120 s
Time (s)
30 to 50s max(*)
Time (s)
•
The product is evaluated using above reflow soldering conditions. No additional test is performed exceed the
condition (i.e. the condition more than (*)MAX values) as a evaluation. Please perform reflow soldering under
the above conditions.
•
•
Perform the first reflow soldering in accordance with the above temperature profile and within 168 hours of
opening the package.
Second time reflow
In case of second reflow soldering should be performed within 168 hours of the first reflow under the above
conditions.
Storage conditions before the second reflow soldering: 5 to 30°C, 70% RH max
•
•
Do not perform flow soldering and dip soldering.
Make any necessary soldering corrections manually.
(only once at each soldering point)
Soldering iron: Less than 25 W
Temperature: Less than 350°C or less
Time:
within 3 s (Up to one time per place)
11
2008-08-26
TL(RMF,SF,OF,YF,GF,FGF,PGF)1050(T20)
Recommended Soldering Pattern
Unit: mm
2.45
1.3
2.45
2.7
Cleaning
When cleaning is required after soldering, Toshiba recommends the following cleaning solvents. Our
dipping tests (carried out under the recommended conditions) confirm that these solvents have no effect on
semiconductor devices. In selecting the cleaning solvent you will actually use, be sure to take into account
the cleaning conditions and usage conditions.
Cleaning Solvent
Manufacturer
ASAHI GLASS
KAO
ASAHI CLEAN AK-225AES
KAO CLEAN THROUGH 750H
PINE ALPHA ST-100S
ARAKAWA CHEMICAL
Precautions When Mounting
Do not apply force to plastic parts of the LED under high-temperature conditions.
The LED plastic is easily scratched. Avoid friction between plastic parts and hard objects or materials.
When installing the PCB in a product, ensure that the device does not come into contact with other components.
This product doesn't apply mounting that solder flow. Please mount on recommended reflow solder mounting
condition.
Tape Specifications
1. Product Number Format
The type of package used for shipment is denoted by a symbol suffix after the product number. The method
of classification is as below. (This method, however, does not apply to products whose electrical
characteristics differ from standard Toshiba specifications.)
(1) Tape Type: T20 (8-mm pitch)
(2) Example
TLRMF1050 (T20)
Tape type
Toshiba product No.
2. Handling Precautions
Tape material protected against static electricity. However, static electricity may occur depending on
quantity of charged static electricity and a device may attach to a tape, or a device may be unstable
when peeling a tape cover.
(a) In process, taping materials may sustain an electrostatic charge, use an ionizer to
neutralize the ions.
(b) For transport and temporary storage of devices, use containers(boxes, jigs, and bags) that
are made of anti-static materials or of materials that dissipate electrostatic electricity.
12
2008-08-26
TL(RMF,SF,OF,YF,GF,FGF,PGF)1050(T20)
3. Tape Dimensions
(Unit: mm)
Symbol
Dimension
Tolerance
Symbol
Dimension
Tolerance
D
E
1.5
1.75
4.0
+0.1/−0
±0.1
P
2.0
12.0
8.0
5.5
±0.05
±0.2
±0.1
±0.1
±0.1
±0.1
2
W
P
P
±0.1
0
t
0.4
±0.05
±0.05
±0.1
A
B
K
0
0
0
F
5.5
5.5
D
1
1.6
4.4
K
P
0
0
D
t
P
2
E
F
W
B
0
POLARITY
P
D
1
A
0
13
2008-08-26
TL(RMF,SF,OF,YF,GF,FGF,PGF)1050(T20)
4. Reel Dimensions
Unit: mm
13 ± 0.3
15.4 ± 1.0
φ44
2 ± 0.5
5. Leader and Trailer Section of Tape
40mm or more
40mm or more
Leading part 190 mm (min)
14
2008-08-26
TL(RMF,SF,OF,YF,GF,FGF,PGF)1050(T20)
6. Packing Form
(1) Packing quantity
Reel
400 pcs
Carton
2,000 pcs
(2) Packing form: Each reel is sealed in an aluminum pack with silica gel.
7. Label Format
(1) Example: TLRMF1050 (T20)
P/N:
TOSHIBA
TYPE
ADDC
TLRMF1050
(T20)
Q’TY
32C
400 pcs
400
Lot Number
Key code for TSB
(RANK SYMBOL)
Use under 5-30degC/70%RH within 168h
SEALED
DIFFUSED IN *****
ASSEMBLED IN *****
[[G]]/RoHS COMPATIBLE
*Y380xxxxxxxxxxxxxxxxxx*
(2) Label location
•
Reel
•
Carton
Tape reel direction
Label position
Label position
•
The aluminum package in which the reel is supplied also has a copy of the label
attached to the center of one side.
*The Lot Number includes the following information.
Example: 270 8 D 3 B “Packaged April 22, 2008”
b c d e
a: Domestic ID
→
a
b: Last digit of the year (CE): “0” (Y2000), “1” (Y2001), “2” (Y2002) to “9” (Y2009)
Repeated for each decade
c: Month: “A” (Jan), “B” (Feb), “C” (Mar) to “L” (Dec)
d: Decade of the month: “1” (First), “2” (Middle), “3” (Last)
e: Day in d above: “A” (1st), “B” (2nd), “C” (3rd) to “J” (9th), “K” (10th)
“L” denotes the 31st of the month
“I” is not used to denote a day in this date system
15
2008-08-26
TL(RMF,SF,OF,YF,GF,FGF,PGF)1050(T20)
RESTRICTIONS ON PRODUCT USE
•
•
•
Toshiba Corporation, and its subsidiaries and affiliates (collectively “TOSHIBA”), reserve the right to make changes to the information
in this document, and related hardware, software and systems (collectively “Product”) without notice.
This document and any information herein may not be reproduced without prior written permission from TOSHIBA. Even with
TOSHIBA’s written permission, reproduction is permissible only if reproduction is without alteration/omission.
Though TOSHIBA works continually to improve Product’s quality and reliability, Product can malfunction or fail. Customers are
responsible for complying with safety standards and for providing adequate designs and safeguards for their hardware, software and
systems which minimize risk and avoid situations in which a malfunction or failure of Product could cause loss of human life, bodily
injury or damage to property, including data loss or corruption. Before creating and producing designs and using, customers must
also refer to and comply with (a) the latest versions of all relevant TOSHIBA information, including without limitation, this document,
the specifications, the data sheets and application notes for Product and the precautions and conditions set forth in the “TOSHIBA
Semiconductor Reliability Handbook” and (b) the instructions for the application that Product will be used with or for. Customers are
solely responsible for all aspects of their own product design or applications, including but not limited to (a) determining the
appropriateness of the use of this Product in such design or applications; (b) evaluating and determining the applicability of any
information contained in this document, or in charts, diagrams, programs, algorithms, sample application circuits, or any other
referenced documents; and (c) validating all operating parameters for such designs and applications. TOSHIBA ASSUMES NO
LIABILITY FOR CUSTOMERS’ PRODUCT DESIGN OR APPLICATIONS.
•
Product is intended for use in general electronics applications (e.g., computers, personal equipment, office equipment, measuring
equipment, industrial robots and home electronics appliances) or for specific applications as expressly stated in this document.
Product is neither intended nor warranted for use in equipment or systems that require extraordinarily high levels of quality and/or
reliability and/or a malfunction or failure of which may cause loss of human life, bodily injury, serious property damage or serious
public impact (“Unintended Use”). Unintended Use includes, without limitation, equipment used in nuclear facilities, equipment used
in the aerospace industry, medical equipment, equipment used for automobiles, trains, ships and other transportation, traffic signaling
equipment, equipment used to control combustions or explosions, safety devices, elevators and escalators, devices related to electric
power, and equipment used in finance-related fields. Do not use Product for Unintended Use unless specifically permitted in this
document.
•
•
Do not disassemble, analyze, reverse-engineer, alter, modify, translate or copy Product, whether in whole or in part.
Product shall not be used for or incorporated into any products or systems whose manufacture, use, or sale is prohibited under any
applicable laws or regulations.
•
•
The information contained herein is presented only as guidance for Product use. No responsibility is assumed by TOSHIBA for any
infringement of patents or any other intellectual property rights of third parties that may result from the use of Product. No license to
any intellectual property right is granted by this document, whether express or implied, by estoppel or otherwise.
ABSENT A WRITTEN SIGNED AGREEMENT, EXCEPT AS PROVIDED IN THE RELEVANT TERMS AND CONDITIONS OF SALE
FOR PRODUCT, AND TO THE MAXIMUM EXTENT ALLOWABLE BY LAW, TOSHIBA (1) ASSUMES NO LIABILITY
WHATSOEVER, INCLUDING WITHOUT LIMITATION, INDIRECT, CONSEQUENTIAL, SPECIAL, OR INCIDENTAL DAMAGES OR
LOSS, INCLUDING WITHOUT LIMITATION, LOSS OF PROFITS, LOSS OF OPPORTUNITIES, BUSINESS INTERRUPTION AND
LOSS OF DATA, AND (2) DISCLAIMS ANY AND ALL EXPRESS OR IMPLIED WARRANTIES AND CONDITIONS RELATED TO
SALE, USE OF PRODUCT, OR INFORMATION, INCLUDING WARRANTIES OR CONDITIONS OF MERCHANTABILITY, FITNESS
FOR A PARTICULAR PURPOSE, ACCURACY OF INFORMATION, OR NONINFRINGEMENT.
•
•
GaAs (Gallium Arsenide) is used in Product. GaAs is harmful to humans if consumed or absorbed, whether in the form of dust or
vapor. Handle with care and do not break, cut, crush, grind, dissolve chemically or otherwise expose GaAs in Product.
Do not use or otherwise make available Product or related software or technology for any military purposes, including without
limitation, for the design, development, use, stockpiling or manufacturing of nuclear, chemical, or biological weapons or missile
technology products (mass destruction weapons). Product and related software and technology may be controlled under the
Japanese Foreign Exchange and Foreign Trade Law and the U.S. Export Administration Regulations. Export and re-export of Product
or related software or technology are strictly prohibited except in compliance with all applicable export laws and regulations.
•
Please contact your TOSHIBA sales representative for details as to environmental matters such as the RoHS compatibility of Product.
Please use Product in compliance with all applicable laws and regulations that regulate the inclusion or use of controlled substances,
including without limitation, the EU RoHS Directive. TOSHIBA assumes no liability for damages or losses occurring as a result of
noncompliance with applicable laws and regulations.
16
2008-08-26
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