TMP47C443NG [TOSHIBA]

TLCS-47 Series; TLCS -47系列


型号：	TMP47C443NG
厂家：	TOSHIBA
描述：	TLCS-47 Series TLCS -47系列微控制器和处理器外围集成电路光电二极管时钟
文件：	总64页 (文件大小：3463K)
中文：	中文翻译
下载：	下载PDF数据表文档文件

TOSHIBA Original CMOS 4-Bit Microcontroller

TLCS-47 Series

TMP47C243NG

TMP47C443NG

TMP47C243MG

TMP47C443MG

TMP47C243DMG

TMP47C443DMG

Semiconductor Company

TMP47C243/443

Document Change Notification

The purpose of this notification is to inform customers about the launch of the Pb-free version of the

device. The introduction of a Pb-free replacement affects the datasheet. Please understand that this

notification is intended as a temporary substitute for a revision of the datasheet.

Changes to the datasheet may include the following, though not all of them may apply to this

particular device.

1. Part number

Example: TMPxxxxxxF → TMPxxxxxxFG

All references to the previous part number were left unchanged in body text. The new

part number is indicated on the prelims pages (cover page and this notification).

2. Package code and package dimensions

Example: LQFP100-P-1414-0.50C → LQFP100-P-1414-0.50F

All references to the previous package code and package dimensions were left unchanged

in body text. The new ones are indicated on the prelims pages.

3. Addition of notes on lead solderability

Now that the device is Pb-free, notes on lead solderability have been added.

4. RESTRICTIONS ON PRODUCT USE

The previous (obsolete) provision might be left unchanged on page 1 of body text. A new

replacement is included on the next page.

5. Publication date of the datasheet

The publication date at the lower right corner of the prelims pages applies to the new

device.

2008-03-06

TMP47C243/443

1. Part number

2. Package code and dimensions

Previous Part Number Previous Package Code

New Part Number New Package Code

OTP

(in Body Text)

TMP47C243N

TMP47C243M

TMP47C243DM

TMP47C443N

TMP47C443M

TMP47C443DM

P-SDIP28-400-1.78

P-SOP28-450-1.27

P-SSOP30-56-0.65

P-SDIP28-400-1.78

P-SOP28-450-1.27

P-SSOP30-56-0.65

TMP47C243NG

TMP47C243MG

TMP47C243DMG

TMP47C443NG

TMP47C443MG

TMP47C443DMG

SDIP28-P-400-1.78

SOP28-P-450-1.27B

SSOP30-P-56-0.65

SDIP28-P-400-1.78

SOP28-P-450-1.27B

SSOP30-P-56-0.65

TMP47P443VNG

TMP47P443VMG

TMP47P443VDMG

TMP47P443VNG

TMP47P443VMG

TMP47P443VDMG

*: For the dimensions of the new package, see the attached Package Dimensions diagram.

3. Addition of notes on lead solderability

The following solderability test is conducted on the new device.

Lead solderability of Pb-free devices (with the G suffix)

Test

Test Conditions

Remark

(1) Use of Lead (Pb)

·solder bath temperature = 230°C

·dipping time = 5 seconds

·the number of times = once

·use of R-type flux

(2) Use of Lead (Pb)-Free

·solder bath temperature = 245°C

·dipping time = 5 seconds

·the number of times = once

·use of R-type flux

Leads with over 95% solder coverage

till lead forming are acceptable.

Solderability

2008-03-06

TMP47C243/443

4. RESTRICTIONS ON PRODUCT USE

The following replaces the “RESTRICTIONS ON PRODUCT USE” on page 1 of body text.

RESTRICTIONS ON PRODUCT USE

20070701-EN

• The information contained herein is subject to change without notice.

• TOSHIBA is continually working to improve the quality and reliability of its products. Nevertheless, semiconductor

devices in general can malfunction or fail due to their inherent electrical sensitivity and vulnerability to physical

stress. It is the responsibility of the buyer, when utilizing TOSHIBA products, to comply with the standards of safety

in making a safe design for the entire system, and to avoid situations in which a malfunction or failure of such

TOSHIBA products could cause loss of human life, bodily injury or damage to property.

In developing your designs, please ensure that TOSHIBA products are used within specified operating ranges as

set forth in the most recent TOSHIBA products specifications. Also, please keep in mind the precautions and

conditions set forth in the “Handling Guide for Semiconductor Devices,” or “TOSHIBA Semiconductor Reliability

Handbook” etc.

• The TOSHIBA products listed in this document are intended for usage in general electronics applications (computer,

personal equipment, office equipment, measuring equipment, industrial robotics, domestic appliances, etc.).These

TOSHIBA products are neither intended nor warranted for usage in equipment that requires extraordinarily high

quality and/or reliability or a malfunction or failure of which may cause loss of human life or bodily injury

(“Unintended Usage”). Unintended Usage include atomic energy control instruments, airplane or spaceship

instruments, transportation instruments, traffic signal instruments, combustion control instruments, medical

instruments, all types of safety devices, etc.. Unintended Usage of TOSHIBA products listed in his document shall

be made at the customer’s own risk.

• The products described in this document shall not be used or embedded to any downstream products of which

manufacture, use and/or sale are prohibited under any applicable laws and regulations.

• The information contained herein is presented only as a guide for the applications of our products. No responsibility

is assumed by TOSHIBA for any infringements of patents or other rights of the third parties which may result from its

use. No license is granted by implication or otherwise under any patents or other rights of TOSHIBA or the third

parties.

• Please contact your sales representative for product-by-product details in this document regarding RoHS

compatibility. Please use these products in this document in compliance with all applicable laws and regulations that

regulate the inclusion or use of controlled substances. Toshiba assumes no liability for damage or losses occurring

as a result of noncompliance with applicable laws and regulations.

• For a discussion of how the reliability of microcontrollers can be predicted, please refer to Section 1.3 of the chapter

entitled Quality and Reliability Assurance/Handling Precautions.

5. Publication date of the datasheet

The publication date of this datasheet is printed at the lower right corner of this notification.

III

2008-03-06

TMP47C243/443

(Annex)

Package Dimensions

SDIP28-P-400-1.78

Unit: mm

2008-03-06

TMP47C243/443

Unit: mm

SOP28-P-450-1.27B

0.43 ^+0.1

1.27

0.995TYP

0.06

0.2

19.0MAX

18.5 0.2

0.10

0.8 0.2

Note: Palladium plated

2008-03-06

TMP47C243/443

SSOP30-P-56-0.65

Unit: mm

2008-03-06

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