TMP95CU54AF_技术文档

Quality and Reliability Assurance / Handling Precautions

Quality And Reliability Assurance / Handling Precautions

In recent years, technical revolutions have become almost a daily occurrence in the

electronics industry. This is accompanied by the increasing application of semiconductors in

both the consumer and industrial sectors, and demands for higher quality and higher

reliability.

Toshiba is making every effort to improve both quality and reliability with the following

quality control system which incorporates product design, quality assurance for parts and

materials received, manufacturing process quality assurance, shipping quality and

reliability assurance, and quality after-service based on user demands and market survey

data.

1 Quality And Reliability Assurance

1.1 Quality Assurance

Trying to sense the customer’s needs, we do our best to incorporate the quality and

reliability required by the customer into the design, while considering the safety

and PL (Product Liability) of the products.

Quality and reliability evaluation are performed on the developed products

according to the Toshiba’s reliability test standard which is prepared in conformity

with JIS, EIAJ, MIL, etc., thereby certifying the design. The parts and materials

are standardized through the engineering department and the quality assurance

department. After the design is accepted, standardization is performed by the

engineering department on the parts and materials, process plan, and inspection

plan. Engineering Institution of Works (EW) is then established on the working

detail. The quality and reliability evaluation are performed on the mass-produced

products on an experimental basis.

In the mass production, the production department has control of the

manufacturing process, the environment and facility, and the quality assurance

department. Quality assurance performs incoming inspection of parts and

materials, modification control, instrument control, periodical reliability test and

line audit. The production technology divisions also participate in process

improvement, automatization, etc.

Education and training for quality and reliability, are given to new workers,

inspectors, engineers and small groups (QC/ZD movement). In shipping the

finished products, a lot quality assurance test is performed by the quality assurance

department. We then commence preparation of specifications meeting pre-arranged

quality and reliability standards and the inspection and reports on discrepant

products “quick action” as the motto. Figure 1 shows the quality assurance system

of semiconductor.

030901

QUA-1

2002-02-20

Quality and Reliability Assurance / Handling Precautions

1.2 Quality Assurance Level of Semiconductor Products

Table 1 Lot Quality Assurance (AQL display: in accordance with ANSI Z 1.4-1993)

Table 1 shows the lot quality

assurance level, which is complied

with the sampling inspection

method (AGL) of MIL-STD-105E.

AQL

Item

Electrical Characteristics

0.15%

0.25%

Serious Defect

Appearance

Minor Defect

030901

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2002-02-20

Quality and Reliability Assurance / Handling Precautions

Department

Step

Control System

DR/AT Check Sheets

Market /

Customers

Application

Engineering

Manufacturing

Engineering

Production

Control

Marketing

QA

Manufacturing

Subcontractors

Meetings

Planning

Market Research

Development CS Development

Planning

Meeting

Review of

Specifications

Determine Development Plan

Development

Design

Determine Specification

Product Design

DR Development CS Design Planning

Meeting

Design Review, Safety and PL Check

Parts and

Materials

Approval

DAT DAT Execution

Plan CS

DAT Execution

Meeting

Trial Production of Developed Product,

Evaluation of Characteristics

Q & R Evaluation of Developed Product

Design Approval

Trial Run

Production

Standardization (Parts & Materials,

Process Plan, Inspection Plan)

DAT Execution

Meeting

Qualification

Preparation

of Parts and of Engineering

Materials

Instructions

Trial Run

Production

QAT QAT Execution

Plan CS

QAT Execution

Meeting

Q & R Evaluation of Trial Run Production

QAT Review

Meeting

Approval of Production

Quality

Transfer

Meeting

Transfer to Full Production

Full Production

*2

Full

Production

*1

*4

*3

Subcontracting

Control of Changes

Q & R Evaluation of

Production Product

PAT PAT Execution

Plan CS

PAT Execution

Meeting

PAT Review

Meeting

Approval of Production

Product

QA Meeting

Confirmation

of Shipped

Quality

Delivery

Shipment

Quality, Engineering and Complaint

Service

Failure

Analysis

Complaint

Handling

Complaint

DR: Design Review

*1 Improvement of Manufacturing Technology

Promotion of Automatization

*2 Inspection of Incoming Parts

Line Audit

DAT: Design Approval Test

QAT: Quality Approval Test

CS: Check Sheet

Reliability Test

Measurement Control

Quality Training & Education

*3 Manufacturing Control

Environmental Control

Facility Control

Assurance of Quality, Cost & Delivery

*4 Control of Delivery and Quantity

Figure 1 Quality Assurance (QA) System of Procedural Flow

030901

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2002-02-20

Quality and Reliability Assurance / Handling Precautions

1.3 Reliability of Microcontrollers

For microcontroller products, reliability can be estimated within the following

temperature range.

Tj = 0°C to 85°C

Tj (junction temperature) can be calculated using the following formula:

Tj = Ta + Q × θja

Ta: Operating environment temperature for the product [°C]

The operating environment temperature is the temperature of the

surrounding environment. The thermal effects of the operation of the

product are not taken into account.

Q: Average power consumption of the product [W]

θja: Thermal resistance of the package [°C / W]

Note 1: When operating the device outside the range Tj = 0°C to 85°C for

extended periods, please contact your nearest Toshiba office or

authorized Toshiba dealer.

Note 2: For details of the value of θja, please contact your nearest Toshiba office

or authorized Toshiba dealer.

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2002-02-20

Quality and Reliability Assurance / Handling Precautions

2 Handling Precautions for Microcontrollers

2.1 Mounting Precautions

Plastics have basically porous feature. When a chip (especially an SMD which has a thin

plastic surface) is heated in a state of moisturized and is soldered by the reflow soldering

method, moisture is vaporized as the temperature rises to cause a package expanded. Or a

borderd surface between a lead frame and a plastic material is peeled off to cause a crack.

These bring serious troubles on reliability.

In order to prevent hygroscopity or enable high heat treatment after absorbing moisture,

Toshiba uses a dampproof packing and/or a heat proof tray.

(1) Recommended Methods of Soldering for Flat Packages

•

Table 2.1 lists the recommended method of soldering flat packages. If you have

any question or request, please refer to “IC PACKAGE MANUAL” or contact

your local offices.

For overall heating method, recommended mounting methods and

conditions after opening the pack differ depending on products to be

used. See Table 2.2 and 2.3 for the details.

For locally heating a lead part, soldering iron method is

recommended. For other localized heating methods, refer to “IC

PACKAGE MANUAL” or contact your Toshiba local offices.

030901

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2002-02-20

Quality and Reliability Assurance / Handling Precautions

Table 2.1 Recommended soldering methods and precautions when mounting

Soldering method

Mounting method

Mounting precaution

The recommended soldering conditions are as follows:

Localized heating

method

Soldering iron method

(1) Standard:

EIAJ ED-4701A-133

Environment test, soldering heat-

resistance test (SMD)

(2) Soldering method: Soldering (lead only)

(3) Soldering condition: (a)at 350°C for up to 3 seconds.

(b)at 260°C for up to 10

seconds.

Overall heating method Wave soldering method

(Solder flow)

(1) Apply preheating for 60 to 120 seconds at a

temperature of 150°C.

(2) For lead insertion-type packages, complete

solder flow within 10 seconds with the

temperature at the stopper (or, if there is no

stopper, at a location more than 1.5 mm from the

body) which does not exceed 260°C.

(3) For

surface-mount

packages,

complete

soldering within 5 seconds at a temperature of

250°C or less in order to prevent thermal stress

in the device.

For details, contact your local Toshiba dealer.

Because thermal stress is severe, as with solder dipping,

the infrared reflow method is not recommended for some

products. For details, contact your local Toshiba dealer.

The recommended conditions for SMD reflow are as

follows:

Short infrared reflow

method

Far or middle infrared

Hot air reflow

(1) Standard:

EIAJ ED-4701 A-133

Environment test

(2) Soldering method: (a) Hot air reflow

(with optional far or middle

infrared reflow process)

(b) Far or middle infrared reflow

(3) Pre-heating: 140 to 160°C, for 60 to 120 seconds.

(4) Reflow:(a) 240°C max

(b) At more than 210°C, for 30 to 50 seconds.

(5) Number of reflows: Maximum of two times within the

allowable period of use

The specified soldering temperatures are based on

the temperature of the package surface.

For a sample recommended temperature profile,

refer to Figure 2.1.

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QUA-6

2002-02-20

Quality and Reliability Assurance / Handling Precautions

(°C)

240

210

160

150

140

30 to 50

seconds

60 to 120

seconds

100

TIME (in seconds)

Figure 2.1 Sample recommended temperature profile for infrared or hot air reflow

method

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2002-02-20

Quality and Reliability Assurance / Handling Precautions

(a) Method

2.1.1 Precaution for Dry Pack

Heat-proof tray (occasionally non-heat-proof)

Figure 2.2 shows the tray type of the dry

pack form. Precaution for handling dry pack

products are as follows.

x Do not toss or drop to avoid damaging the

devices and/or the moisture proof bag.

y Desiccant in the form of granulated silica

gel includes blue indicator beads which

become transparent when moisture is

present, such as if the bag is torn or opened.

In this case, the devices must be high

temperature baked to remove the moisture

prior to solder mounting.

IC

Silica gel

Indicator

Heat proof tray

z Store the pack at 30°C / 90%RH. After

opening the pack mount it the device within

12 months of the date on the seal. If the

30% humidity indicator is entirely pink

when the device unpacked, or when the 12-

month duration has expired treat the

device before use at high temperature (bake

it at more than 125°C for 20h) to remove

moisture.

Plastic band

Moisture proof bag

(Aluminum laminate)

Label

Heat seal

{ How quickly a product should be used after

the pack is opened depends of the product.

See Tables 2-2 and 2-3 for details. If the

time limit for use has expired when devices

are unpacked, they should be baked.

Turn under

| Devices in heat-proof trays should be baked

at 125°C for at least 20h.

Heat-proof trays bear the mold marking

Corrugated

cardboard box

“HEAT PROOF” .

Be careful not to bend the leads when

baking devices.

(b) Shipping carton

} Binding trays using a plastic tapes

If trays are rebound with plastic tapes after

having been untied, two tapes should be

used as shown in Figure 2.2 (a). If a tape is

tied lengthwise along the trays the tray

edges may break.

Sealing tape

Corrugated

cardboard box

Figure 2.2 SMDs Dry pack Form

030901

QUA-8

2002-02-20

Quality and Reliability Assurance / Handling Precautions

Table 2.2 Usable period after opening moisture proof bags

period after opening moisture proof bags

SYMBOLUsable

A = 168h

Products sealed in moisture proof packing should be stored in temperature below

30°C and relative humidity below 60%, and should be used within 168 hours (1 week),

after opened. If the products are kept beyond 168 hours (1 week) after opened, the

products should be baked for at least 20 hours at 125°C before mounted. After baked,

the products should be stored in temperature below 30°C and relative humidity below

60%, and should be used within 192 hours.

B = 72h

C = 48h

Products sealed in moisture proof packing should be stored in temperature below

30°C and relative humidity below 60%, and should be used within 72 hours (3 days),

after opened. If the products are kept beyond 72 hours (3days) after opened, the

products should be stored in temperature below 30°C and relative humidity below

60%, and should be used within 96 hours (4 days).

Products sealed in moisture proof packing should be stored in temperature below

30°C and relative humidity below 60%, and should be used within 48 hours (2 days),

after opened. If the products are kept beyond 48 hours (2 days) after opened, the

products should be baked for at least 20 hours at 125°C before mounted. After baked,

the products should be stored in temperature below 30°C and relative humidity below

60%, and should be used within 72 hours (3 days).

D = 24h

Products sealed in moisture proof packing should be stored in temperature below

30°C and relative humidity below 60%, and should be used within 24 hours (1 day),

after opened. If the products are kept beyond 24 hours (1 day) after opened, the

products should be baked for at least 20 hours at 125°C before mounted. After baked,

the products should be stored in temperature below 30°C and relative humidity below

60%, and should be used within 48 hours (2 days).

E = 12h

Products sealed in moisture proof packing should be stored in temperature below

30°C and relative humidity below 60%, and should be used within 12 hours, after

opened. If the products are kept beyond 12 hours after opened, the products should

be baked for at least 20 hours at 125°C before mounted. After baked, the products

should be stored in temperature below 30°C and relative humidity below 60%, and

should be used within 36 hours.

G

For the details, contact your Toshiba local offices.



Overall heating method is not recommended for mounting ; use soldering iron method

of localized heating method.

030901

QUA-9

2002-02-20

Quality and Reliability Assurance / Handling Precautions

(1) 900, 900/H, 900/L, 900/H2, 900/L1 Series

Table 2.3 Storage conditions, permissible usage Period after unpacking and baking

requirements for each soldering method (1/2)

Products

Name

Package no.

Air reflow

Infrared reflow

TMP96C141BF

TMP96C041BF

TMP96CM40F

TMP96PM40F

TMP96C031ZF

TMP93CM40F

TMP93CS40F

TMP93CS41F

TMP93PS40F

TMP93CS40DF

TMP93CS41DF

TMP93PS40DF

TMP93CW40DF

TMP93CW41DF

TMP93PW40DF

TMP93CS42AF

TMP93PS42AF

TMP93CW46AF

TMP93PW46AF

TMP93CS44F

TMP93CS45F

TMP93PS44F

TMP93CU44DF

TMP93CW44DF

TMP93PW44ADF

TMP93CS32F

TMP93PW32F

TMP93CS20F

TMP93PW20AF

TMP93CT76F

TMP93CU76F

TMP93CW76F

TMP93CF76F

TMP93CF77F

TMP93PW76F

TMP93PF76F

TMP93C071F

TMP95C061BF

TMP95C063F

TMP95C001F

TMP95CS64F

TMP95C265F

P-QFP80-1420-0.80B

P-QFP64-1420-1.00A

P-QFP100-1414-0.50

P-LQFP100-1414-0.50D

P-QFP100-1414-0.50

P-LQFP100-1414-0.50D

P-LQFP80-1212-0.50A

P-QFP80-1420-0.80B

P-QFP64-1414-0.80A

P-LQFP144-1616-0.40

P-QFP100-1420-0.65A

P-QFP-100-1420-0.65A

P-QFP100-1420-0.65A

P-QFP120-2828-0.80B

P-QFP100-1414-0.50

P-QFP144-2020-0.50

P-QFP64-1414-0.80A

P-LQFP100-1414-0.50D

P-LQFP100-1414-0.50C

A(168h)



A(168h)



A(168h)

C(48h)

A(168h)

B(72h)

A(168h)

C(48h)

A(168h)

B(72h)

G

A(168h)

B(72h)

A(168h)

B(72h)

A(168h)

Note 1: As of September, 2001

Note 2: Symbols A (168h), B (72h), C (48h), D (24h), E(12h), G and  indicate

the maximum permissible period between unpacking and mounting of

the device, and the required storage conditions for the device. For

details of these conditions, please refer to Table 2.2.

030901

QUA-10

2002-02-20

Quality and Reliability Assurance / Handling Precautions

Table 2.3 Storage conditions, permissible usage Period after unpacking and baking

requirements for each soldering method (2/2)

Products

Name

Package no.

Air reflow

Infrared reflow

TMP95CW64F

TMP95CW65F

TMP95PW64F

TMP95FY64F

TMP95CS66F

TMP95CS54F

TMP95PS54F

TMP95CU54AF

TMP95CW54AF

TMP95FW54AF

TMP94C241CF

TMP94C251AF

TMP94FU81F

TMP91CW18AF

TMP91PW18AF

TMP91CW12F

TMP91PW12F

TMP91CW12AF

TMP91FY12AF

TMP91CY22F

TMP91FY22F

TMP91CU10F

TMP91PW10F

TMP91CW11F

TMP91PW11F

TMP91C219F

TMP91C829F

TMP91C815F

TMP91C016F

TMP91C025F

TMP91C824F

P-LQFP100-1414-0.50D

P-QFP100-1414-0.50E

P-LQFP100-1414-0.50D

P-LQFP100-1414-0.50E

P-QFP160-2828-0.65A

P-QFP144-2020-0.50

A(168h)

G

A(168h)

G

P-LQFP100-1414-0.50C

P-QFP80-1420-0.80B

P-LQFP100-1414-0.50C

P-LQFP100-1414-0.50D

P-LQFP100-1414-0.50E

P-LQFP100-1414-0.50D

P-LQFP100-1414-0.50E

P-LQFP100-1414-0.50C

P-LQFP100-1414-0.50D

P-LQFP100-1414-0.50C

P-LQFP100-1414-0.50B

P-LQFP100-1414-0.50D

P-LQFP100-1414-0.50B

P-LQFP100-1414-0.50D

P-TQFP128-1414-0.40

P-LQFP100-1414-0.50D

A(168h)

B(72h)

A(168h)

B(72h)

A(168h)

G

A(168h)

G

A(168h)

Note 1: As of February, 2002

Note 2: Symbols A (168h), B (72h), C (48h), D (24h), E (12h), G and  indicate

the maximum permissible period between unpacking and mounting of

the device, and the required storage conditions for the device. For

details of these conditions, please refer to Table 2.2.

030901

QUA-11

2002-02-20

Quality and Reliability Assurance / Handling Precautions

(2) 90 Series

Table 2.4 Storage conditions, permissible usage Period after unpacking and baking

requirements for each soldering method (1/2)

Products

Package no.

Air reflow

Infrared reflow

Name

TMP90C840AF

TMP90C841AF

TMP91C640F

TMP91C641F

TMP90CM40AF

TMP90C041AF

TMP90C141F

TMP90C441F

TMP90C802AM

TMP90C803AM

TMP90CH02M

TMP90CH03M

TMP90C400F

TMP90C401F

TMP90C800F

TMP90C801F

TMP90C844AF

TMP90CH44F

TMP90C845AF

TMP90CH45F

TMP90CM36F

TMP90CM37F

TMP90CM38F

TMP90CM39F

TMP90C051F

TMP90CS36F

TMP90CS37F

TMP90CS38F

TMP90CS39F

TMP90C848F

TMP91P640F

TMP90PM40F

TMP90P802AM

TMP90PH02M

TMP90P800F

TMP90PH44F

TMP90PM36F

TMP90PM38F

TMP90PS36F

TMP90PS38F

P-QFP64-1420-1.00A

P-SSOP40-450-0.80

P-QFP64-1420-1.00A

P-QFP80-1414-0.65A

P-QFP80-1420-0.80B

P-QFP80-1414-0.65A

P-QFP80-1420-0.80B

P-QFP64-1420-1.00A

P-SSOP40-450-0.80

P-QFP64-1420-1.00A

P-QFP80-1414-0.65A

P-QFP44-1414-0.65A

A(168h)



A(168h)



A(168h)



A(168h)



A(168h)

Note 1: As of September, 2001

Note 2: Ensure that the conditions for top/bottom heating using the

long/medium infrared reflow method are strictly adhered to, even when

this method is used in combination with the air reflow method.

Note 3: Symbols A (168h), B (72h), C (48h), D (24h), E(12h), G and  indicate

the maximum permissible period between unpacking and mounting of

the device, and the required storage conditions for the device. For

details of these conditions, please refer to Table 2.2.

030901

QUA-12

2002-02-20

Quality and Reliability Assurance / Handling Precautions

Table 2.4 Storage conditions, permissible usage Period after unpacking and baking

requirements for each soldering method (2/2)

Products

Name

Package no.

Air reflow

Infrared reflow

TMP90PH48F

TMP91P642F

TMP91C642AF

TMP90PM42F

TMP90PM42DF

TMP90CH42F

TMP90CH42DF

TMP90CK42F

TMP90CK42DF

TMP90PS74DF

TMP90CM36T

TMP90CM37T

TMP90PM36T

TMP90CM38T

TMP90CM39T

TMP90PM38T

TMP90CS36T

TMP90CS37T

TMP90PS36T

TMP90CS38T

TMP90CS39T

TMP90PS38T

P-QFP80-1420-0.80B

P-QFP64-1420-1.00A

P-QFP100-2222-0.80A

P-QFP100-1420-0.65A

P-QFP100-2222-0.80A

P-QFP100-1420-0.65A

P-QFP100-2222-0.80A

P-QFJ84-S115-1.27

A(168h)

B(72h)

A(168h)



A(168h)



A(168h)

B(72h)

A(168h)



A(168h)



A(168h)

Note 1: As of September, 2001

Note 2: Ensure that the conditions for top/bottom heating using the

long/medium infrared reflow method are strictly adhered to, even when

this method is used in combination with the air reflow method.

Note 3: Symbols A (168h), B (72h), C (48h), D (24h), E(12h), G and  indicate

the maximum permissible period between unpacking and mounting of

the device, and the required storage conditions for the device. For

details of these conditions, please refer to Table 2.2.

030901

QUA-13

2002-02-20

Quality and Reliability Assurance / Handling Precautions

(3) 870 Series

Table 2.5 Storage conditions, permissible usage Period after unpacking and baking

requirements for each soldering method (1/3)

Products

Name

Air reflow

Infrared reflow

TMP87C800F

A(168h)

B(72h)

A(168h)

B(72h)

TMP87CH00F

TMP87PH00F

TMP87C800DF

TMP87CH00DF

TMP87CH00LF

TMP87PH00DF

TMP87PH00LF

TMP87C807U

TMP87C408M

TMP87C408LM

TMP87C808M

TMP87C808LM

TMP87C408DM

TMP87P808M

TMP87P808LM

TMP87C814F

TMP87CH14F

TMP87CK14F

TMP87CM14F

TMP87PM14F

TMP87CC20F

TMP87CH20F

TMP87PH20F

TMP87CK20AF

TMP87CM20AF

TMP87PM20F

TMP87CH21F

TMP87CH21BF

TMP87CH21DF

TMP87CH21BDF

TMP87CM21F

TMP87CM21DF

TMP87PP21F

TMP87PP21DF

TMP87CM23F

TMP87CP23F

TMP87PP23F

TMP87CM24AF

TMP87CP24AF

TMP87PP24AF

TMP87CH29U

TMP87CK29U

TMP87CM29U

TMP87PM29U

A(168h)

B(72h)

A(168h)

B(72h)

A(168h)

B(72h)

A(168h)

B(72h)

A(168h)

B(72h)

A(168h)

B(72h)

A(168h)

B(72h)

A(168h)

B(72h)

A(168h)

B(72h)

A(168h)

B(72h)

A(168h)

B(72h)

A(168h)

B(72h)

A(168h)

Note 1: As of March, 2001

Note 2: Symbols A (168h), B (72h), C (48h), D (24h), E(12h), G and  indicate

the maximum permissible period between unpacking and mounting of

the device, and the required storage conditions for the device. For

details of these conditions, please refer to Table 2.2.

030901

QUA-14

2002-02-20

Quality and Reliability Assurance / Handling Precautions

Table 2.5 Storage conditions, permissible usage Period after unpacking and baking

requirements for each soldering method (2/3)

Products

Name

Air reflow

Infrared reflow

TMP87CH38F

A(168h)

D(24h)

A(168h)



A(168h)

D(24h)

A(168h)



A(168h)

TMP87CK38F

TMP87CM38F

TMP87CP38F

TMP87CS38F

TMP87PS38F

TMP87CM39F

TMP87CP39F

TMP87CS39F

TMP87PS39F

TMPA8700CHF

TMPA8700CKF

TMPA8700CMF

TMPA8700CPF

TMPA8700CSF

TMPA8700PSF

TMPA8701CHF

TMPA8701CKF

TMPA8701CMF

TMP87C840F

TMP87CC40F

TMP87CH40F

TMP87PH40AF

TMP87CK40AF

TMP87CK40F

TMP87CM40AF

TMP87PM40AF

TMP87C841F

TMP87CC41F

TMP87CH41F

TMP87CK41F

TMP87CM41F

TMP87PM41F

TMP87C841U

TMP87CC41U

TMP87CH41U

TMP87CK41U

TMP87CM41U

TMP87PM41U

TMP87C447U

TMP87C847U

TMP87C847LU

TMP87CH47U

TMP87CH47LU

TMP87PH47U

TMP87PH47LU

TMP87CH48U



A(168h)



A(168h)

B(72h)

A(168h)



A(168h)

B(72h)

A(168h)

B(72h)

A(168h)

B(72h)

A(168h)

Note 1: As of March, 2001

Note 2: Symbols A (168h), B (72h), C (48h), D (24h), E(12h), G and  indicate

the maximum permissible period between unpacking and mounting of

the device, and the required storage conditions for the device. For

details of these conditions, please refer to Table 2.2.

030901

QUA-15

2002-02-20

Quality and Reliability Assurance / Handling Precautions

Table 2.5 Storage conditions, permissible usage Period after unpacking and baking

requirements for each soldering method (3/3)

Products

Name

Air reflow

Infrared reflow

TMP87CH48DF

A(168h)

G

A(168h)

B(72h)

A(168h)

B(72h)

A(168h)

B(72h)

A(168h)

G

A(168h)

B(72h)

A(168h)

B(72h)

A(168h)

B(72h)

TMP87PH48U

TMP87PH48DF

TMP87CM53F

TMP87PM53F

TMP87CM64F

TMP87CP64F

TMP87CS64F

TMP87PS64F

TMP87CS68DF

TMP87PS68DF

TMP87CC70F

TMP87CH70F

TMP87CK70AF

TMP87CM70AF

TMP87CH70BF

TMP87CM70BF

TMP87PM70F

TMP87CM71F

TMP87CN71F

TMP87CP71F

TMP87CS71F

TMP87PS71F

TMP87CH74AF

TMP87CM74AF

TMP87PM74F

TMP87CH75F

TMP87CM75F

TMP87PM75F

TMP87CC78F

TMP87CH78F

TMP87CK78F

TMP87CM78F

TMP87PM78F

A(168h)

Note 1: As of March, 2001

Note 2: Symbols A (168h), B (72h), C (48h), D (24h), E(12h), G and  indicate

the maximum permissible period between unpacking and mounting of

the device, and the required storage conditions for the device. For

details of these conditions, please refer to Table 2.2.

030901

QUA-16

2002-02-20

Quality and Reliability Assurance / Handling Precautions

(4) 870/C Series

Table 2.6 Storage conditions, permissible usage Period after unpacking and baking

requirements for each soldering method

Products

Name

Package no.

Air reflow

Infrared reflow

A(168h)

TMP86CH06U

TMP86PH06U

TMP86C420F

TMP86C420U

TMP86C820F

TMP86C820U

TMP86C829AF

TMP86C829AU

TMP86CH29AF

TMP86CH29AU

TMP86CM29AF

TMP86CM29AU

TMP86PM29AF

TMP86PM29AU

TMP86CM41F

TMP86FS41F

P-QFP44-1010-0.80

P-QFP64-1414-0.80A

P-LQFP64-1010-0.50

P-QFP64-1414-0.80A

P-LQFP64-1010-0.50

P-QFP64-1414-0.80A

P-LQFP64-1010-0.50

P-QFP64-1414-0.80A

P-LQFP64-1010-0.50

P-QFP64-1414-0.80A

P-LQFP64-1010-0.50

P-QFP64-1414-0.80A

P-LQFP64-1010-0.50

P-QFP64-1414-0.80A

P-QFP64-1414-0.80B

Note 1: As of March, 2001

Note 2: Symbols A (168h), B (72h), C (48h), D (24h), E(12h), G and  indicate

the maximum permissible period between unpacking and mounting of

the device, and the required storage conditions for the device. For

details of these conditions, please refer to Table 2.2.

030901

QUA-17

2002-02-20

Quality and Reliability Assurance / Handling Precautions

(5) 870/X Series

Table 2.7 Storage conditions, permissible usage Period after unpacking and baking

requirements for each soldering method

Products

Name

Package no.

Air reflow

Infrared reflow

A(168h)

B(72h)

A(168h)

B(72h)

A(168h)

B(72h)

A(168h)

B(72h)

TMP88CK48F

TMP88CM48F

TMP88CS48AF

TMP88CK49F

TMP88CM49F

TMP88PS49F

TMP88C060F

TMP88CU74F

TMP88PU74F

TMP88CP76F

TMP88CS76F

TMP88PS76F

TMP88CP77F

TMP88CS77F

TMP88PU77F

P-QFP64-1420-1.00A

P-LQFP80-1212-0.50A

P-QFP80-1420-0.80B

P-QFP100-1420-0.65A

A(168h)

B(72h)

A(168h)

B(72h)

A(168h)

B(72h)

A(168h)

B(72h)

A(168h)

B(72h)

A(168h)

B(72h)

Note 1: As of March, 2001

Note 2: Symbols A (168h), B (72h), C (48h), D (24h), E(12h), G and  indicate

the maximum permissible period between unpacking and mounting of

the device, and the required storage conditions for the device. For

details of these conditions, please refer to Table 2.2.

030901

QUA-18

2002-02-20

Quality and Reliability Assurance / Handling Precautions

(6) 47 Series

Table 2.8 Storage conditions, permissible usage Period after unpacking and baking

requirements for each soldering method (1/3)

Products

Name

Package no.

Air reflow

Infrared reflow

A(168h)

C(48h)

A(168h)

C(48h)

TMP47C101M

TMP47C201M

TMP47C102M

TMP47C202M

TMP47P202VM

TMP47C103M

TMP47C203M

TMP47C206M

TMP47P206VM

TMP47C241VM

TMP47P241VM

TMP47P403VM

TMP47C222F

TMP47C422F

TMP47P422VF

TMP47C243M

TMP47C243DM

TMP47C443M

TMP47C443DM

TMP47P443VM

TMP47P443VDM

TMP47E186M

TMP47E187M

TMP47P186M

TMP47P187M

TMP47E885AIF

TMP47E885AWF

TMP47P885F

P-SOP16-300-1.27

P-SOP20-300-1.27

P-SOP28-450-1.27

P-SOP20-300-1.27

P-SOP28-450-1.27

P-QFP44-1414-0.80D

P-SOP28-450-1.27

P-SSOP30-56-0.65

P-SOP28-450-1.27

P-SSOP30-56-0.65

P-SOP28-450-1.27

P-SSOP30-56-0.65

P-SOP16-300-1.27

P-QFP44-1414-0.80D

P-QFP64-1420-1.00A

C(48h)

A(168h)

D(24h)

A(168h)

D(24h)

TMP47C200BF

TMP47C400BF

TMP47P400VF

TMP47C407AF

TMP47P407VF

TMP47C210AF

TMP47C410AF

TMP47P410AF

TMP47C216F

TMP47C416F

TMP47P416VF

TMP47C221ADF

TMP47C421ADF

TMP47P421ADF

TMP47C423ADF

A(168h)

Note 1: As of March, 2001

Note 2: Symbols A (168h), B (72h), C (48h), D (24h), E(12h), G and  indicate

the maximum permissible period between unpacking and mounting of

the device, and the required storage conditions for the device. For

details of these conditions, please refer to Table 2.2.

030901

QUA-19

2002-02-20

Quality and Reliability Assurance / Handling Precautions

Table 2.8 Storage conditions, permissible usage Period after unpacking and baking

requirements for each soldering method (2/3)

Products

Name

Package no.

Air reflow

Infrared reflow

A(168h)



A(168h)



A(168h)

B(72h)

A(168h)



A(168h)



A(168h)

B(72h)

TMP47C440BF

TMP47P440VF

TMP47C441AF

TMP47P441AF

TMP47C446ADF

TMP47P446VDF

TMP47C452BF

TMP47P452VF

TMP47C453AF

TMP47P453VF

TMP47C456ADF

TMP47C434AF

TMP47C634AF

TMP47C800F

TMP47P800F

TMP47C620DF

TMP47C820DF

TMP47P820VDF

TMP47C623F

TMP47C823F

TMP47P823VF

TMP47C834F

TMP47P834F

TMP47C640F

TMP47C840F

TMP47P840VF

TMP47C647F

TMP47C847F

TMP47P847VF

TMP47C850F

TMP47P850VF

TMP47C853F

TMP47P853VF

TMP47C857F

TMP47C457F

TMP47P857F

TMP47C655F

TMP47C855F

TMP47P855VF

TMP47C858F

P-QFP44-1414-0.80D

P-QFP64-1420-1.00A

P-QFP44-1414-0.80D

P-QFP80-1420-0.80B

P-QFP44-1414-0.80D

P-QFP80-1420-0.80B

P-QFP64-1420-1.00A

P-QFP44-1414-0.80D

P-QFP80-1420-0.80B

P-QFP64-1420-1.00A

P-QFP44-1414-0.80D

P-QFP80-1420-0.80B

P-QFP100-1420-0.65A

A(168h)

Note 1: As of March, 2001

Note 2: Symbols A (168h), B (72h), C (48h), D (24h), E(12h), G and  indicate

the maximum permissible period between unpacking and mounting of

the device, and the required storage conditions for the device. For

details of these conditions, please refer to Table 2.2.

030901

QUA-20

2002-02-20

Quality and Reliability Assurance / Handling Precautions

Table 2.8 Storage conditions, permissible usage Period after unpacking and baking

requirements for each soldering method (3/3)

Products

Name

Package no.

Air reflow

Infrared reflow

A(168h)

G

A(168h)

G

TMP47C660AF

TMP47C860AF

TMP47P860VF

TMP47C1220F

TMP47C1620F

TMP47P1620VF

TMP47C1260F

TMP47C1660F

TMP47P1660VF

P-QFP64-1420-1.00A

P-QFP80-1420-0.80B

P-QFP64-1420-1.00A

A(168h)

B(72h)

A(168h)

B(72h)

A(168h)

B(72h)

A(168h)

B(72h)

Note 1: As of March, 2001

Note 2: Symbols A (168h), B (72h), C (48h), D (24h), E(12h), G and  indicate

the maximum permissible period between unpacking and mounting of

the device, and the required storage conditions for the device. For

details of these conditions, please refer to Table 2.2.

030901

QUA-21

2002-02-20

Quality and Reliability Assurance / Handling Precautions

(7) 68000 Series

Table 2.9 Storage conditions, permissible usage Period after unpacking and baking

requirements for each soldering method

Products

Name

Package no.

Air reflow

Infrared reflow

A(168h)

G

A(168h)

TMP68301AF-xx

TMP68301AKF-xx

TMP68303DF-xx

TMP68305F-xx

P-QFP100-2222-0.80A

P-QFP100-1420-0.65A

A(168h)

G

TMP68301AFR-xx

TMP68301AKFR-xx P-QFP100-1420-0.65A

TMP68HC003F-xx

TMP68204F-xx

P-QFP80-1420-0.80B

P-QFP160-2828-0.65A

Note 1: As of February, 1998

Note 2: Ensure that the conditions for top/bottom heating using the

long/medium infrared reflow method are strictly adhered to, even when

this method is used in combination with the air reflow method.

Note 3: Symbols A (168h), B (72h), C (48h), D (24h), E(12h), G and  indicate

the maximum permissible period between unpacking and mounting of

the device, and the required storage conditions for the device. For

details of these conditions, please refer to Table 2.2.

(8) Z80 Series

Table 2.10 Storage conditions, permissible usage Period after unpacking and baking

requirements for each soldering method

Products

Name

Package no.

Air reflow

Infrared reflow

TMPZ84C011BF

TMPZ84C015BF

TMPZ84C013AT

TMPZ84C112AF

TMPZ84C711AF

TMPZ84C810AF

P-QFP100-1420-0.65A

P-QFJ84-S115-1.27

P-QFP64-1420-1.00A

P-QFP144-2626-0.65B

P-QFP100-1420-0.65A

A(168h)

Note 1: As of September, 1994

Note 2: Ensure that the conditions for top/bottom heating using the

long/medium infrared reflow method are strictly adhered to, even when

this method is used in combination with the air reflow method.

Note 3: Symbols A (168h), B (72h), C (48h), D (24h), E(12h), G and  indicate

the maximum permissible period between unpacking and mounting of

the device, and the required storage conditions for the device. For

details of these conditions, please refer to Table 2.2.

030901

QUA-22

2002-02-20

Quality and Reliability Assurance / Handling Precautions

2.1.2 Writing an OTP type Microcontrollers-Recommended Flow

In the case of blank OTP (One Time PROM) type MCU, it is not

completely possible to screen defect parts that occur during assembly

process, because it is not possible to perform programming test after a

chip is assembled in a plastic package.

As a result, it is recommended to do the following screening process to

maintain quality and reliability of OTP type MCU after data are

programmed.

Programming and verification with an

EPROM programmer.

Stored in high temperature.

125°C, more than 20 hours.

Data verification with an EPROM programmer

Board assembly

For details of the initial failure rate of OTP-type microcontrollers when

screening is not performed at 125°C for 20 hours or more after

programming, please contact your Toshiba local offices.

Figure 2.3 Recommended Screening flow chart of type MCU

030901

QUA-23

2002-02-20

Quality and Reliability Assurance / Handling Precautions

2.2 Transport Precautions

The device and its packaging material should be handled with care. To avoid

damage to the device, do not toss or drop it. During transport, ensure that the

device is not subjected to mechanical vibration or shock.

Avoid getting devices wet. Moisture can also adversely affect the packaging by

nullifying the effect of the anti-static agent.

2.3 Using Toshiba Semiconductor Safely

TOSHIBA is continually working to improve the quality and reliability of its

products. Nevertheless, semiconductor devices in general can malfunction or fail

due to their inherent electrical sensitivity and vulnerability to physical stress. It is

the responsibility of the buyer, when utilizing TOSHIBA products, to comply with

the standards of safety in making a safe design for the entire system, and to avoid

situations in which a malfunction or failure of such TOSHIBA products could cause

loss of human life, bodily injury or damage to property.

In developing your designs, please ensure that TOSHIBA products are used within

specified operating ranges as set forth in the most recent TOSHIBA products

specifications. Also, please keep in mind the precautions and conditions set forth in

the “Handling Guide for Semiconductor Devices,” or “TOSHIBA Semiconductor

Reliability Handbook” etc..

The TOSHIBA products listed in this document are intended for usage in general

electronics applications (computer, personal equipment, office equipment,

measuring equipment, industrial robotics, domestic appliances, etc.). These

TOSHIBA products are neither intended nor warranted for usage in equipment

that requires extraordinarily high quality and/or reliability or a malfunction or

failure of which may cause loss of human life or bodily injury (“Unintended Usage”).

Unintended Usage include atomic energy control instruments, airplane or

spaceship instruments, transportation instruments, traffic signal instruments,

combustion control instruments, medical instruments, all types of safety devices,

etc.. Unintended Usage of TOSHIBA products listed in this document shall be made

at the customer’s own risk.

030901

QUA-24

2002-02-20

Quality and Reliability Assurance / Handling Precautions

2.4 Product-Specific Precautions and Usage Considerations

2.4.1 Using Resonators not Listed Under “Recommended Types”

Resonators recommended for use with Toshiba products in microcontroller

oscillator applications are listed in Toshiba databooks along with information

about oscillation conditions. If you use a resonator not included in this list,

please consult Toshiba or the resonator manufacturer concerning the

suitability of the device for your application.

2.4.2 Undefined Functions

In some microcontrollers certain instruction code values do not constitute

valid processor instructions. Also, it is possible that the values of bits in

registers will become undefined. Take care in your applications not to use

invalid instructions or to let register bit values become undefined.

2.4.3 Injuries from Probe Tips

Some probes and adapters have sharp pointed leads. Be careful not to injure

yourself on the leads of devices.

030901

QUA-25

2002-02-20

Quality and Reliability Assurance / Handling Precautions

3 Safety Precautions

This section lists important precautions which users of semiconductor devices (and anyone

else) should observe in order to avoid injury and damage to property, and to ensure safe

and correct use of devices.

Please be sure that you understand the meanings of the labels and the graphic symbol

described below before you move on to the detailed descriptions of the precautions.

[Explanation of labels]

Graphic symbol

Meaning

Indicates an imminently hazardous situation which will result in death or

serious injury if you do not follow instructions.

Indicates a potentially hazardous situation which could result in death or

serious injury if you do not follow instructions.

Indicates a potentially hazardous situation which if not avoided, may result in

minor injury or moderate injury.

[Explanation of graphic symbol]

Graphic symbol

Meaning

Indicates that caution is required (laser beam is dangerous to eyes).

030901

QUA-26

2002-02-20

Quality and Reliability Assurance / Handling Precautions

3.1 General Precautions Regarding Semiconductor Devices

Do not use devices under conditions exceeding their absolute maximum ratings (e.g. current, voltage,

power dissipation or temperature).

This may cause the device to break down, degrade its performance, or cause it to catch fire or explode,

resulting in injury.

Do not insert devices in the wrong orientation.

Make sure that the positive and negative terminals of power supplies are connected correctly. Otherwise

the rated maximum current or power dissipation may be exceeded and the device may break down or

undergo performance degradation, causing it to catch fire or explode and resulting in injury.

When power to a device is on, do not touch the device’s heat sink.

Heat sinks become hot, so you may burn your hand.

Do not touch the tips of device leads.

Because some types of device have leads with pointed tips, you may prick your finger.

When conducting any kind of evaluation, inspection or testing, be sure to connect the testing equipment’s

electrodes or probes to the pins of the device under test before powering it on.

Otherwise, you may receive an electric shock causing injury.

Before grounding an item of measuring equipment or a soldering iron, check that there is no electrical

leakage from it.

Electrical leakage may cause the device which you are testing or soldering to break down, or could give

you an electric shock.

Always wear protective glasses when cutting the leads of a device with clippers or a similar tool.

If you do not, small bits of metal flying off the cut ends may damage your eyes.

030901

QUA-27

2002-02-20

Quality and Reliability Assurance / Handling Precautions

4 General Safety Precautions and Usage Considerations

This section is designed to help you gain a better understanding of semiconductor devices,

so as to ensure the safety, quality and reliability of the devices which you incorporate into

your designs.

4.1 From Incoming to Shipping

4.1.1 Electrostatic Discharge (ESD)

When handling individual devices (which are not yet

mounted on a printed circuit board), be sure that the

environment is protected against electrostatic electricity.

Operators should wear anti-static clothing, and containers

and other objects which come into direct contact with devices

should be made of anti-static materials and should be

grounded to earth via an 0.5- to 1.0-MΩ protective resistor.

Please follow the precautions described below; this is particularly important

for devices which are marked “Be careful of static.”.

4.1.1.1 Work Environment

(1) When humidity in the working environment decreases, the human

body and other insulators can easily become charged with static

electricity due to friction. Maintain the recommended humidity of

40% to 60% in the work environment, while also taking into account

the fact that moisture-proof-packed products may absorb moisture

after unpacking.

(2) Be sure that all equipment, jigs and tools in the working area are

grounded to earth.

(3) Place a conductive mat over the floor of the work area, or take other

appropriate measures, so that the floor surface is protected against

static electricity and is grounded to earth. The surface resistivity

should be 10⁴to 10⁸Ω/sq and the resistance between surface and

ground, 7.5 × 10⁵to 10⁸Ω.

(4) Cover the workbench surface also with a conductive mat (with a

surface resistivity of 10⁴to 10⁸Ω/sq, for a resistance between

surface and ground of 7.5 × 10⁵to 10⁸Ω). The purpose of this is to

disperse static electricity on the surface (through resistive

components) and ground it to earth. Workbench surfaces must not

be constructed of low-resistance metallic materials that allow rapid

static discharge when a charged device touches them directly.

030901

QUA-28

2002-02-20

Quality and Reliability Assurance / Handling Precautions

(5) Pay attention to the following points when using automatic

equipment in your workplace:

(a) When picking up ICs with a vacuum unit, use a conductive

rubber fitting on the end of the pick-up wand to protect against

electrostatic charge.

(b) Minimize friction on IC package surfaces. If some rubbing is

unavoidable due to the device’s mechanical structure,

minimize the friction plane or use material with a small

friction coefficient and low electrical resistance. Also consider

the use of an ionizer.

(c) In sections that come into contact with device lead terminals,

use a material which dissipates static electricity.

(d) Ensure that no statically charged bodies (such as work clothes

or the human body) touch the devices.

(e) Make sure that sections of the tape carrier which come into

contact with installation devices or other electrical machinery

are made of a low-resistance material.

(f) Make sure that jigs and tools used in the assembly process do

not touch devices.

(g) In processes in which packages may retain an electrostatic

charge, use an ionizer to neutralize the ions.

(6) Make sure that CRT displays in the working area are protected

against static charge, for example by a VDT filter. As much as

possible, avoid turning displays on and off. Doing so can cause

electrostatic induction in devices.

(7) Keep track of charged potential in the working area by taking

periodic measurements.

(8) Ensure that work chairs are protected by an anti-static textile cover

and are grounded to the floor surface by a grounding chain.

(Suggested resistance between the seat surface and grounding

chain is 7.5 × 10⁵to 10¹²Ω.)

(9) Install anti-static mats on storage shelf surfaces. (Suggested

surface resistivity is 10⁴to 10⁸Ω/sq; suggested resistance between

surface and ground is 7.5 × 10⁵to 10⁸Ω.)

(10) For transport and temporary storage of devices, use containers

(boxes, jigs or bags) that are made of anti-static materials or

materials which dissipate electrostatic charge.

(11) Make sure that cart surfaces which come into contact with device

packaging are made of materials which will conduct static

electricity, and verify that they are grounded to the floor surface via

a grounding chain.

(12) In any location where the level of static electricity is to be closely

controlled, the ground resistance level should be Class 3 or above.

Use different ground wires for all items of equipment which may

come into physical contact with devices.

030901

QUA-29

2002-02-20

Quality and Reliability Assurance / Handling Precautions

4.1.1.2 Operating Environment

(1) Operators must wear anti-static

clothing and conductive shoes (or a

leg or heel strap).

(2) Operators must wear a wrist strap

grounded to earth via a resistor of about 1 MΩ.

(3) Soldering irons must be grounded from iron tip to earth, and must

be used only at low voltages (6 V to 24 V).

(4) If the tweezers you use are likely to touch the device terminals, use

anti-static tweezers and in particular avoid metallic tweezers. If a

charged device touches a low-resistance tool, rapid discharge can

occur. When using vacuum tweezers, attach a conductive chucking

pat to the tip, and connect it to a dedicated ground used especially

for anti-static purposes (suggested resistance value: 10⁴to 10⁸Ω).

(5) Do not place devices or their containers near sources of strong

electrical fields (such as above a CRT).

(6) When storing printed circuit boards which have devices mounted on

them, use a board container or bag that is protected against static

charge. To avoid the occurrence of static charge or discharge due to

friction, keep the boards separate from one other and do not stack

them directly on top of one another.

(7) Ensure, if possible, that any articles (such as clipboards) which are

brought to any location where the level of static electricity must be

closely controlled are constructed of anti-static materials.

(8) In cases where the human body comes into direct contact with a

device, be sure to wear anti-static finger covers or gloves (suggested

resistance value: 10⁸Ω or less).

(9) Equipment safety covers installed near devices should have

resistance ratings of 10⁹Ω or less.

(10) If a wrist strap cannot be used for some reason, and there is a

possibility of imparting friction to devices, use an ionizer.

(11) The transport film used in TCP products is manufactured from

materials in which static charges tend to build up. When using

these products, install an ionizer to prevent the film from being

charged with static electricity. Also, ensure that no static electricity

will be applied to the product’s copper foils by taking measures to

prevent static occurring in the peripheral equipment.

030901

QUA-30

2002-02-20

Quality and Reliability Assurance / Handling Precautions

4.1.2 Vibration, Impact and Stress

Handle devices and packaging materials with care.

To avoid damage to devices, do not toss or drop

packages. Ensure that devices are not subjected to

mechanical vibration or shock during

Vibration

transportation. Ceramic package devices and

devices in canister-type packages which have

empty space inside them are subject to damage

from vibration and shock because the bonding wires are secured only at their

ends.

Plastic molded devices, on the other hand, have a relatively high level of

resistance to vibration and mechanical shock because their bonding wires are

enveloped and fixed in resin. However, when any device or package type is

installed in target equipment, it is to some extent susceptible to wiring

disconnections and other damage from vibration, shock and stressed solder

junctions. Therefore when devices are incorporated into the design of

equipment which will be subject to vibration, the structural design of the

equipment must be thought out carefully.

If a device is subjected to especially strong vibration, mechanical shock or

stress, the package or the chip itself may crack. In products such as CCDs

which incorporate window glass, this could cause surface flaws in the glass or

cause the connection between the glass and the ceramic to separate.

Furthermore, it is known that stress applied to a semiconductor device

through the package changes the resistance characteristics of the chip because

of piezoelectric effects. In analog circuit design attention must be paid to the

problem of package stress as well as to the dangers of vibration and shock as

described above.

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4.2 Storage

4.2.1 General Storage

(1) Avoid storage locations where devices will be exposed to moisture or

direct sunlight.

(2) Follow the instructions printed on the

device cartons regarding transportation and

storage.

Temperature:

Humidity:

(3) The storage area temperature should be

kept within a temperature range of 5°C to

35°C, and relative humidity should be

maintained at between 45% and 75%.

(4) Do not store devices in the presence of

harmful (especially corrosive) gases, or in

dusty conditions.

(5) Use storage areas where there is minimal temperature fluctuation. Rapid

temperature changes can cause moisture to form on stored devices,

resulting in lead oxidation or corrosion. As a result, the solderability of

the leads will be degraded.

(6) When repacking devices, use anti-static containers.

(7) Do not allow external forces or loads to be applied to devices while they

are in storage.

(8) If devices have been stored for more than two years, their electrical

characteristics should be tested and their leads should be tested for ease

of soldering before they are used.

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2002-02-20

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4.2.2 Moisture-Proof Packing

(1) Moisture-proof packing should be handled with

care. The handling procedure specified for each

packing type should be followed scrupulously. If

the proper procedures are not followed, the quality

and reliability of devices may be degraded. This

section describes general precautions for handling moisture-proof packing.

Since the details may differ from device to device, refer also to the

relevant individual datasheets or databook.

(2) General precautions

Follow the instructions printed on the device cartons regarding

transportation and storage.

(3) Do not drop or toss device packing. The laminated aluminum material in

it can be rendered ineffective by rough handling.

(4) The storage area temperature should be kept within a temperature range

of 5°C to 30°C, and relative humidity should be maintained at 90% (max).

Use devices within 12 months of the date marked on the package seal.

(5) If the 12-month storage period has expired, or if the 30% humidity

indicator shown in Figure 4.1 is pink when the packing is opened, it may

be advisable, depending on the device and packing type, to back the

devices at high temperature to remove any moisture. Please refer to the

table below. After the pack has been opened, use the devices in a 5°C to

30°C. 60% RH environment and within the effective usage period listed

on the moisture-proof package. If the effective usage period has expired,

or if the packing has been stored in a high-humidity environment, bake

the devices at high temperature.

Packing

Moisture removal

If the packing bears the “Heatproof” marking or indicates the maximum temperature which it can withstand,

bake at 125°C for 20 hours. (Some devices require a different procedure.)

Transfer devices to trays bearing the “Heatproof” marking or indicating the temperature which they can

withstand, or to aluminum tubes before baking at 125°C for 20 hours.

Deviced packed on tape cannot be baked and must be used within the effective usage period after

unpacking, as specified on the packing.

Tray

Tube

Tape

When baking devices, protect the devices from static electricity.

Moisture indicators can detect the approximate humidity level at a standard temperature

of 25°C. 6-point indicators and 3-point indicators are currently in use, but eventually all

indicators will be 3-point indicators.

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HUMIDITY INDICATOR

60%

50%

40%

30%

20%

10%

HUMIDITY INDICATOR

40

30

20

READ AT LAVENDER

BETWEEN PINK & BLUE

(a) 6-point indicator

(b) 3-point indicator

Figure 4.1 Humidity Indicator

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2002-02-20

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4.3 Design

Care must be exercised in the design of electronic equipment to achieve the desired

reliability. It is important not only to adhere to specifications concerning absolute

maximum ratings and recommended operating conditions, it is also important to

consider the overall environment in which equipment will be used, including factors

such as the ambient temperature, transient noise and voltage and current surges,

as well as mounting conditions which affect device reliability. This section describes

some general precautions which you should observe when designing circuits and

when mounting devices on printed circuit boards.

For more detailed information about each product family, refer to the relevant

individual technical datasheets available from Toshiba.

4.3.1 Absolute Maximum Ratings

Do not use devices under conditions in which their absolute maximum

ratings (e.g. current, voltage, power dissipation or temperature) will

be exceeded. A device may break down or its performance may be

degraded, causing it to catch fire or explode resulting in injury to the

user.

The absolute maximum ratings are rated values which

must not be exceeded during operation, even for an instant.

Although absolute maximum ratings differ from product to

product, they essentially concern the voltage and current

at each pin, the allowable power dissipation, and the

junction and storage temperatures.

If the voltage or current on any pin exceeds the absolute

maximum rating, the device’s internal circuitry can become degraded. In the

worst case, heat generated in internal circuitry can fuse wiring or cause the

semiconductor chip to break down.

If storage or operating temperatures exceed rated values, the package seal can

deteriorate or the wires can become disconnected due to the differences

between the thermal expansion coefficients of the materials from which the

device is constructed.

4.3.2 Recommended Operating Conditions

The recommended operating conditions for each device are those necessary to

guarantee that the device will operate as specified in the datasheet.

If greater reliability is required, derate the device’s absolute maximum ratings

for voltage, current, power and temperature before using it.

4.3.3 Derating

When incorporating a device into your design, reduce its rated absolute

maximum voltage, current, power dissipation and operating temperature in

order to ensure high reliability.

Since derating differs from application to application, refer to the technical

datasheets available for the various devices used in your design.

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4.3.4 Unused Pins

If unused pins are left open, some devices can exhibit input instability

problems, resulting in malfunctions such as abrupt increase in current flow.

Similarly, if the unused output pins on a device are connected to the power

supply pin, the ground pin or to other output pins, the IC may malfunction or

break down.

Since the details regarding the handling of unused pins differ from device to

device and from pin to pin, please follow the instructions given in the relevant

individual datasheets or databook.

CMOS logic IC inputs, for example, have extremely high impedance. If an

input pin is left open, it can easily pick up extraneous noise and become

unstable. In this case, if the input voltage level reaches an intermediate level,

it is possible that both the P-channel and N-channel transistors will be turned

on, allowing unwanted supply current to flow. Therefore, ensure that the

unused input pins of a device are connected to the power supply (Vcc) pin or

ground (GND) pin of the same device. For details of what to do with the pins of

heat sinks, refer to the relevant technical datasheet and databook.

4.3.5 Latch-up

Latch-up is an abnormal condition inherent in CMOS devices, in which Vcc

gets shorted to ground. This happens when a parasitic PN-PN junction

(thyristor structure) internal to the CMOS chip is turned on, causing a large

current of the order of several hundred mA or more to flow between Vcc and

GND, eventually causing the device to break down.

Latch-up occurs when the input or output voltage exceeds the rated value,

causing a large current to flow in the internal chip, or when the voltage on the

Vcc (Vdd) pin exceeds its rated value, forcing the internal chip into a

breakdown condition. Once the chip falls into the latch-up state, even though

the excess voltage may have been applied only for an instant, the large current

continues to flow between Vcc (Vdd) and GND (Vss). This causes the device to

heat up and, in extreme cases, to emit gas fumes as well. To avoid this problem,

observe the following precautions:

(1) Do not allow voltage levels on the input and output pins either to rise

above Vcc (Vdd) or to fall below GND (Vss). Also, follow any prescribed

power-on sequence, so that power is applied gradually or in steps rather

than abruptly.

(2) Do not allow any abnormal noise signals to be applied to the device.

(3) Set the voltage levels of unused input pins to Vcc (Vdd) or (GND) Vss.

(4) Do not connect outputs to one another.

4.3.6 Input/Output Protection

Wired-AND configurations, in which outputs are connected together, cannot

be used, since this short-circuits the outputs. Outputs should, of course, never

be connected to Vcc (Vdd) or GND (Vss).

Furthermore, ICs with tri-state outputs can undergo performance degradation

if a shorted output current is allowed to flow for an extended period of time.

Therefore, when designing circuits, make sure that tri-state outputs will not

be enabled simultaneously.

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4.3.7 Load Capacitance

Some devices display increased delay times if the load capacitance is large. Also,

large charging and discharging currents will flow in the device, causing noise.

Furthermore, since outputs are shorted for a relatively long time, wiring can

become fused.

Consult the technical information for the device being used to determine the

recommended load capacitance.

4.3.8 Thermal Design

The failure rate of semiconductor devices is greatly increased as operating

temperatures increase. As shown in Figure 4.2, the internal thermal stress on a

device is the sum of the ambient temperature and the temperature rise due to

power dissipation in the device. Therefore, to achieve optimum reliability, observe

the following precautions concerning thermal design:

(1) Keep the ambient temperature (Ta) as low as possible.

(2) If the device’s dynamic power dissipation is relatively large, select the

most appropriate circuit board material, and consider the use of heat

sinks or of forced air cooling. Such measures will help lower the thermal

resistance of the package.

(3) Derate the device’s absolute maximum ratings to minimize thermal stress

from power dissipation.

θja = θjc + θca

θja = (Tj – Ta)/P

θjc = (Tj – Tc)/P

θca = (Tc – Ta)/P

in which θja = thermal resistance between junction and surrounding air (°C/W)

θjc = thermal resistance between junction and package surface, or

internal thermal resistance (°C/W)

θca = thermal resistance between package surface and

surrounding air, or external thermal resistance (°C/W)

Tj = junction temperature or chip temperature (°C)

Tc = package surface temperature or case temperature (°C)

Ta = ambient temperature (°C)

P

= power dissipation (W)

Ta

θca

Tc

θjc

Tj

Figure 4.2 Thermal Resistance of Package

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2002-02-20

Quality and Reliability Assurance / Handling Precautions

4.3.9 Interfacing

When connecting inputs and outputs between devices, make sure input

voltage (V^IL/V^IH) and output voltage (V^OL/V^OH) levels are matched. Otherwise,

the devices may malfunction. When connecting devices operating at different

supply voltages, such as in a dual-power-supply system, be aware that

erroneous power-on and power-off sequences can result in device breakdown.

For details of how to interface particular devices, consult the relevant

technical datasheets and databooks. If you have any questions or doubts about

interfacing, contact your nearest Toshiba office or distributor.

4.3.10 Decoupling

Spike currents generated during switching can cause Vcc (Vdd) and GND

(Vss) voltage levels to fluctuate, causing ringing in the output waveform or a

delay in response speed. (The power supply and GND wiring impedance is

normally 50Ω to 100 Ω.) For this reason, the impedance of power supply lines

with respect to high frequencies must be kept low. This can be accomplished

by using thick and short wiring for the Vcc (Vdd) and GND (Vss) lines and by

installing decoupling capacitors (of approximately 0.01 to 1 µF capacitance) as

high-frequency filters between Vcc (Vdd) and GND (Vss) at strategic locations

on the printed circuit board.

For low-frequency filtering, it is a good idea to install a 10- to 100-µF capacitor

on the printed circuit board (one capacitor will suffice). If the capacitance is

excessively large, however, (e.g. several thousand¬µF) latch-up can be a

problem. Be sure to choose an appropriate capacitance value.

An important point about wiring is that, in the case of high-speed logic ICs,

noise is caused mainly by reflection and crosstalk, or by the power supply

impedance. Reflections cause increased signal delay, ringing, overshoot and

undershoot, thereby reducing the device’s safety margins with respect to noise.

To prevent reflections, reduce the wiring length by increasing the device

mounting density so as to lower the inductance (L) and capacitance (C) in the

wiring. Extreme care must be taken, however, when taking this corrective

measure, since it tends to cause crosstalk between the wires. In practice, there

must be a trade-off between these two factors.

4.3.11 External Noise

Printed circuit boards with long I/O or signal

pattern lines are vulnerable to induced noise or

surges from outside sources. Consequently,

malfunctions or breakdowns can result from

overcurrent or overvoltage, depending on the

types of device used. To protect against noise,

lower the impedance of the pattern line or insert

a noise-canceling circuit. Protective measures

must also be taken against surges.

For details of the appropriate protective measures for a particular device,

consult the relevant databook.

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2002-02-20

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4.3.12 Electromagnetic Interference

Widespread use of electrical and electronic equipment in recent years has

brought with it radio and TV reception problems due to electromagnetic

interference. To use the radio spectrum effectively and to maintain radio

communications quality, each country has formulated regulations limiting the

amount of electromagnetic interference which can be generated by individual

products.

Electromagnetic interference includes conduction noise propagated through

power supply and telephone lines, and noise from direct electromagnetic

waves radiated by equipment. Different measurement methods and corrective

measures are used to assess and counteract each specific type of noise.

Difficulties in controlling electromagnetic interference derive from the fact

that there is no method available which allows designers to calculate, at the

design stage, the strength of the electromagnetic waves which will emanate

from each component in a piece of equipment. For this reason, it is only after

the prototype equipment has been completed that the designer can take

measurements using a dedicated instrument to determine the strength of

electromagnetic interference waves.

Yet it is possible during system design to incorporate some measures for the

prevention of electromagnetic interference, which can facilitate taking

corrective measures once the design has been completed. These include

installing shields and noise filters, and increasing the thickness of the power

supply wiring patterns on the printed circuit board. One effective method, for

example, is to devise several shielding options during design, and then select

the most suitable shielding method based on the results of measurements

taken after the prototype has been completed.

4.3.13 Peripheral Circuits

In most cases semiconductor devices are used with peripheral circuits and

components. The input and output signal voltages and currents of these

circuits must be chosen to match the semiconductor device’s specifications.

The following factors must be taken into account.

(1) Inappropriate voltages or currents applied to a device’s input pins may

cause it to operate erratically. Some devices contain pull-up or pull-down

resistors. When designing your system, remember to take the effect of this

on the voltage and current levels into account.

(2) The output pins on a device have a predetermined external circuit drive

capability. If this drive capability is greater than that required, either

incorporate a compensating circuit into your design or carefully select

suitable components for use in external circuits.

4.3.14 Safety Standards

Each country has safety standards which must be observed. These safety

standards include requirements for quality assurance systems and design of

device insulation. Such requirements must be fully taken into account to

ensure that your design conforms to the applicable safety standards.

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2002-02-20

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4.3.15 Other Precautions

(1) When designing a system, be sure to incorporate fail-safe and other

appropriate measures according to the intended purpose of your system.

Also, be sure to debug your system under actual board-mounted

conditions.

(2) If a plastic-package device is placed in a strong electric field, surface

leakage may occur due to the charge-up phenomenon, resulting in device

malfunction. In such cases, take appropriate measures to prevent this

problem, for example by protecting the package surface with a conductive

shield.

(3) With some microcomputers and MOS memory devices, caution is required

when powering on or resetting the device. To ensure that your design does

not violate device specifications, consult the relevant databook for each

constituent device.

(4) Ensure that no conductive material or object (such as a metal pin) can

drop onto and short the leads of a device mounted on a printed circuit

board.

4.4 Inspection, Testing and Evaluation

4.4.1 Grounding

Ground all measuring instruments, jigs, tools and soldering irons to

earth.

Electrical leakage may cause a device to break down or may result in

electric shock.

4.4.2 Inspection Sequence

x Do not insert devices in the wrong orientation. Make sure that the

positive and negative electrodes of the power supply are correctly

connected. Otherwise, the rated maximum current or maximum

power dissipation may be exceeded and the device may break down

or undergo performance degradation, causing it to catch fire or

explode, resulting in injury to the user.

y When conducting any kind of evaluation, inspection or testing using

AC power with a peak voltage of 42.4 V or DC power exceeding 60

V, be sure to connect the electrodes or probes of the testing

equipment to the device under test before powering it on.

Connecting the electrodes or probes of testing equipment to a device

while it is powered on may result in electric shock, causing injury.

(1) Apply voltage to the test jig only after inserting the device securely into it.

When applying or removing power, observe relevant precautions, if any.

(2) Make sure that the voltage applied to the device is off before removing the

device from the test jig. Otherwise, the device may undergo performance

degradation or be destroyed.

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(3) Make sure that no surge voltages from the measuring equipment are

applied to the device.

(4) The chips housed in tape carrier packages (TCPs) are bare chips and are

therefore exposed. During inspection take care not to crack the chip or

cause any flaws in it.

Electrical contact may also cause a chip to become faulty. Therefore make

sure that nothing comes into electrical contact with the chip.

4.5 Mounting

There are essentially two main types of semiconductor device package: lead

insertion and surface mount. During mounting on printed circuit boards, devices

can become contaminated by flux or damaged by thermal stress from the soldering

process. With surface-mount devices in particular, the most significant problem is

thermal stress from solder reflow, when the entire package is subjected to heat.

This section describes a recommended temperature profile for each mounting

method, as well as general precautions which you should take when mounting

devices on printed circuit boards. Note, however, that even for devices with the

same package type, the appropriate mounting method varies according to the size of

the chip and the size and shape of the lead frame. Therefore, please consult the

relevant technical datasheet or databook.

4.5.1 Lead Forming

x Always wear protective glasses when cutting the leads of a device

with clippers or a similar tool. If you do not, small bits of metal

flying off the cut ends may damage your eyes.

y Do not touch the tips of device leads. Because some types of device

have leads with pointed tips, you may prick your finger.

Semiconductor devices must undergo a process in which the leads are cut and

formed before the devices can be mounted on a printed circuit board. If undue

stress is applied to the interior of a device during this process, mechanical

breakdown or performance degradation can result. This is attributable

primarily to differences between the stress on the device’s external leads and

the stress on the internal leads. If the relative difference is great enough, the

device’s internal leads, adhesive properties or sealant can be damaged.

Observe these precautions during the lead-forming process (this does not

apply to surface-mount devices):

(1) Lead insertion hole intervals on the printed circuit board should match

the lead pitch of the device precisely.

(2) If lead insertion hole intervals on the printed circuit board do not

precisely match the lead pitch of the device, do not attempt to forcibly

insert devices by pressing on them or by pulling on their leads.

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(3) For the minimum clearance specification between

a device and a printed circuit board, refer to the

relevant device’s datasheet or databook. If

necessary, achieve the required clearance by

forming the device’s leads appropriately. Do not

use the spacers which are used to raise devices

above the surface of the printed circuit board during soldering to achieve

clearance. These spacers normally continue to expand due to heat, even

after the solder has begun to solidify; this applies severe stress to the

device.

(4) Observe the following precautions when forming the leads of a device

prior to mounting so as to avoid mechanical stress to the device. Also

avoid ending or stretching device leads repeatedly.

(a) Use a tool or jig to secure the lead at its base (where the lead meets

the device package) while bending so as to avoid mechanical stress

to the device. Also avoid bending or stretching device leads

repeatedly.

(b) Be careful not to damage the lead during lead forming.

(c) Follow any other precautions described in the individual datasheets

and databooks for each device and package type.

4.5.2 Socket Mounting

(1) When socket mounting devices on a printed circuit board, use sockets

which match the inserted device’s package.

(2) Use sockets whose contacts have the appropriate contact pressure. If the

contact pressure is insufficient, the socket may not make a perfect contact

when the device is repeatedly inserted and removed; if the pressure is

excessively high, the device leads may be bent or damaged when they are

inserted into or removed from the socket.

(3) When soldering sockets to the printed circuit board, use sockets whose

construction prevents flux from penetrating into the contacts or which

allows flux to be completely cleaned off.

(4) Make sure the coating agent applied to the printed circuit board for

moisture-proofing purposes does not stick to the socket contacts.

(5) If the device leads are severely bent by a socket as it is inserted or

removed and you wish to repair the leads so as to continue using the

device, make sure that this lead correction is only performed once. Do not

use devices whose leads have been corrected more than once.

(6) If the printed circuit board with the devices mounted on it will be

subjected to vibration from external sources, use sockets which have a

strong contact pressure so as to prevent the sockets and devices from

vibrating relative to one another.

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2002-02-20

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4.5.3 Soldering Temperature Profile

The soldering temperature and heating time vary from device to device.

Therefore, when specifying the mounting conditions, refer to the individual

datasheets and databooks for the devices used.

(1) Using a Soldering Iron

Complete soldering within ten seconds for lead temperatures of up to

260°C, or within three seconds for lead temperatures up to 350°C.

(2) Standard Mounting Conditions for SMDs

(Surface Mount Devices)

For details, refer to section 2.1 Mounting Precautions in chapter 2

Handling Precautions for Microcontrollers.

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2002-02-20

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4.5.4 Flux Cleaning and Ultrasonic Cleaning

(1) When cleaning circuit boards to remove flux, make sure that no residual

reactive ions such as Na or Cl remain. Note that organic solvents react

with water to generate hydrogen chloride and other corrosive gases which

can degrade device performance.

(2) Washing devices with water will not cause any problems. However, make

sure that no reactive ions such as sodium and chlorine are left as residues.

Also, be sure to dry devices sufficiently after washing.

(3) Do not rub device markings with a brush or with your hand during

cleaning or while the devices are still wet from the cleaning agent. Doing

so can rub off the markings.

(4) The dip cleaning, shower cleaning and steam cleaning processes all

involve the chemical action of a solvent. Use only recommended solvents

for these cleaning methods. When immersing devices in a solvent or

steam bath, make sure that the temperature of the liquid is 50°C or below,

and that the circuit board is removed from the bath within one minute.

(5) Ultrasonic cleaning should not be used with hermetically-sealed ceramic

packages such as a leadless chip carrier (LCC), pin grid array (PGA) or

charge-coupled device (CCD), because the bonding wires can become

disconnected due to resonance during the cleaning process. Even if a

device package allows ultrasonic cleaning, limit the duration of ultrasonic

cleaning to as short a time as possible, since long hours of ultrasonic

cleaning degrade the adhesion between the mold resin and the frame

material. The following ultrasonic cleaning conditions are recommended:

Frequency: 27 kHz to 29 kHz

Ultrasonic output power: 300 W or less (0.25 W/cm²or less)

Cleaning time: 30 seconds or less

Suspend the circuit board in the solvent bath during ultrasonic cleaning

in such a way that the ultrasonic vibrator does not come into direct

contact with the circuit board or the device.

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2002-02-20

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4.5.5 Circuit Board Coating

When devices are to be used in equipment requiring a high degree of reliability

or in extreme environments (where moisture, corrosive gas or dust is present),

circuit boards may be coated for protection. However, before doing so, you

must carefully consider the possible stress and contamination effects that may

result and then choose the coating resin which results in the minimum level of

stress to the device.

4.6 Protecting Devices in the Field

4.6.1 Temperature

Semiconductor devices are generally more sensitive to temperature than are

other electronic components. The various electrical characteristics of a

semiconductor device are dependent on the ambient temperature at which the

device is used. It is therefore necessary to understand the temperature

characteristics of a device and to incorporate device derating into circuit

design. Note also that if a device is used above its maximum temperature

rating, device deterioration is more rapid and it will reach the end of its usable

life sooner than expected.

4.6.2 Humidity

Resin-molded devices are sometimes improperly sealed. When these devices

are used for an extended period of time in a high-humidity environment,

moisture can penetrate into the device and cause chip degradation or

malfunction. Furthermore, when devices are mounted on a regular printed

circuit board, the impedance between wiring components can decrease under

high-humidity conditions. In systems which require a high signal-source

impedance, circuit board leakage or leakage between device lead pins can

cause malfunctions. The application of a moisture-proof treatment to the

device surface should be considered in this case. On the other hand, operation

under low-humidity conditions can damage a device due to the occurrence of

electrostatic discharge. Unless damp-proofing measures have been specifically

taken, use devices only in environments with appropriate ambient moisture

levels (i.e. within a relative humidity range of 40% to 60%).

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4.6.3 Corrosive Gases

Corrosive gases can cause chemical reactions in devices, degrading device

characteristics.

For example, sulphur-bearing corrosive gases emanating from rubber placed

near a device (accompanied by condensation under high-humidity conditions)

can corrode a device’s leads. The resulting chemical reaction between leads

forms foreign particles which can cause electrical leakage.

4.6.4 Radioactive and Cosmic Rays

Most industrial and consumer semiconductor devices are not designed with

protection against radioactive and cosmic rays. Devices used in aerospace

equipment or in radioactive environments must therefore be shielded.

4.6.5 Strong Electrical and Magnetic Fields

Devices exposed to strong magnetic fields can undergo a polarization

phenomenon in their plastic material, or within the chip, which gives rise to

abnormal symptoms such as impedance changes or increased leakage current.

Failures have been reported in LSIs mounted near malfunctioning deflection

yokes in TV sets. In such cases, the device’s installation location must be

changed or the device must be shielded against the electrical or magnetic field.

Shielding against magnetism is especially necessary for devices used in an

alternating magnetic field because of the electromotive forces generated in this

type of environment.

4.6.6 Interference from Light (ultraviolet rays, sunlight, fluorescent

lamps and incandescent lamps)

Light striking a semiconductor device generates electromotive force due to

photoelectric effects. In some cases the device can malfunction. This is

especially true for devices in which the internal chip is exposed. When

designing circuits, make sure that devices are protected against incident light

from external sources. This problem is not limited to optical semiconductors

and EPROMs. All types of device can be affected by light.

4.6.7 Dust and Oil

Just like corrosive gases, dust and oil can cause chemical reactions in devices,

which will adversely affect a device’s electrical characteristics. To avoid this

problem, do not use devices in dusty or oily environments. This is especially

important for optical devices because dust and oil can affect a device’s optical

characteristics as well as its physical integrity and the electrical performance

factors mentioned above.

4.6.8 Fire

Semiconductor devices are combustible; they can emit smoke and catch fire if

heated sufficiently. When this happens, some devices may generate poisonous

gases. Devices should therefore never be used in close proximity to an open

flame or a heat-generating body, or near flammable or combustible materials.

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Quality and Reliability Assurance / Handling Precautions

4.7 Disposal of Devices and Packing Materials

When discarding unused devices and packing materials, follow all procedures

specified by local regulations in order to protect the environment against

contamination.

030901

QUA-47

2002-02-20

Quality and Reliability Assurance / Handling Precautions

030901

QUA-48

2002-02-20


型号：	TMP95CU54AF
厂家：	TOSHIBA
描述：	Quality And Reliability Assurance / Handling Precautions 质量和可靠性保证/注意事项
文件：	总48页 (文件大小：385K)
中文：	中文翻译
下载：	下载PDF数据表文档文件

TMP95CU54AF [TOSHIBA]

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