TMPN3120B1AM [TOSHIBA]

TOSHIBA CMOS DIGITAL INTEGRATED CIRCUIT SILICON MONOLITHIC; 东芝CMOS数字集成电路硅单片
TMPN3120B1AM
型号: TMPN3120B1AM
厂家: TOSHIBA    TOSHIBA
描述:

TOSHIBA CMOS DIGITAL INTEGRATED CIRCUIT SILICON MONOLITHIC
东芝CMOS数字集成电路硅单片

微控制器和处理器 串行IO控制器 通信控制器 外围集成电路 光电二极管 数据传输 局域网 时钟
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TMPN3120B1AM  
TOSHIBA CMOS DIGITAL INTEGRATED CIRCUIT SILICON MONOLITHIC  
TMPN3120B1AM  
Neuron ® Chip  
®
For Distributed Intelligent Control Networks (L  
W
)
ON ORKS  
The TMPN3120B1AM is a Neuron Chip which configures  
L
W
nodes on a single chip.  
ON ORKS  
Neuron Chips have all the built-in communications and control  
functions required to implement L  
W
nodes.  
ON ORKS  
These nodes may then be easily integrated into highly-reliable  
distributed intelligent control networks.  
The typical functions for this chip are explained below.  
FEATURES  
l I / O Functions  
· Eleven programmable I / O pins.  
· Two programmable 16-bit timers and counters built in.  
· 34 different types of I / O functions to handle a wide range of  
input and output.  
Weight : 1.1g (Typ.)  
· ROM firmware image containing pre-programmed I / O  
drivers,greatly simplifying application programs.  
l Network functions  
· Two CPUs for communication protocol processing built in.  
The communications and application CPUs execute in parallel.  
· Equipped with a built-in LonTalk protocol which supports all seven levels of the OSI reference model with  
ISO.  
· The ROM firmware image contains a complete network operating system, greatly simplifying  
applicationprograms.  
· Built-in twisted-pair wire transceiver  
· Equipped with communications modes and communication speeds which support various types of  
externaltransceivers.  
Supports twisted-pair wire, power line, radio ( RF ), infrared, coaxial cables, and fiber optics.  
· Communication port transceiver modes and logical addresses stored within the EEPROM.  
Can be amended via the network.  
000707EBA1  
· TOSHIBA is continually working to improve the quality and reliability of its products. Nevertheless, semiconductor devices in general  
can malfunction or fail due to their inherent electrical sensitivity and vulnerability to physical stress. It is the responsibility of the  
buyer, when utilizing TOSHIBA products, to comply with the standards of safety in making a safe design for the entire system, and  
to avoid situations in which a malfunction or failure of such TOSHIBA products could cause loss of human life, bodily injury or  
damage to property.  
In developing your designs, please ensure that TOSHIBA products are used within specified operating ranges as set forth in the  
most recent TOSHIBA products specifications. Also, please keep in mind the precautions and conditions set forth in the “Handling  
Guide for Semiconductor Devices,” or “TOSHIBA Semiconductor Reliability Handbook” etc..  
· The TOSHIBA products listed in this document are intended for usage in general electronics applications (computer, personal  
equipment, office equipment, measuring equipment, industrial robotics, domestic appliances, etc.). These TOSHIBA products are  
neither intended nor warranted for usage in equipment that requires extraordinarily high quality and/or reliability or a malfunction or  
failure of which may cause loss of human life or bodily injury (“Unintended Usage”). Unintended Usage include atomic energy  
control instruments, airplane or spaceship instruments, transportation instruments, traffic signal instruments, combustion control  
instruments, medical instruments, all types of safety devices, etc.. Unintended Usage of TOSHIBA products listed in this document  
shall be made at the customer’s own risk.  
· The products described in this document are subject to the foreign exchange and foreign trade laws.  
· The information contained herein is presented only as a guide for the applications of our products. No responsibility is assumed by  
TOSHIBA CORPORATION for any infringements of intellectual property or other rights of the third parties which may result from its  
use. No license is granted by implication or otherwise under any intellectual property or other rights of TOSHIBA CORPORATION or  
others.  
· The information contained herein is subject to change without notice.  
2001-02-21 1/8  
TMPN3120B1AM  
l Other functions  
· Application programs are also stored within the EEPROM.  
Can be updated by downloading over the network. Up to 400-byte applications can be stored.  
· Built-in watch-dog timer.  
· Each chip has a unique ID number.  
Effective during the logical installation of networks.  
· Low electrical consumption mode supported with a sleep mode.  
· Built-in low-voltage detection circuit.  
Prevents incorrect operations and writing errors in the EEPROM during drops in power voltage.  
· The package is SOP32-P-525-1.27.  
2001-02-21 2/8  
TMPN3120B1AM  
BLOCK DIAGRAM  
TMPN3120B1AM  
ITEM  
CPU  
RAM  
8-bit CPU×3  
1,024 bytes  
10,240 bytes  
512 bytes  
ROM  
EEPROM  
16-bit Timer / Counter  
2 channels  
Not available  
32-pin SOP  
External Memory Interface  
Package  
2001-02-21 3/8  
TMPN3120B1AM  
PIN ASSIGNMENT  
PIN FUNCTION  
PIN No.  
15  
PIN NAME  
CLK1  
I / O  
Input  
PIN FUNCTION  
Oscillator connection, or external clock input.  
Oscillator connection. Leave open when external clock is  
input to CLK1.  
14  
CLK2  
Output  
I / O  
(built-in configurable  
pull-up)  
1
~RESET  
Reset pin. (Active low)  
I / O  
(built-in configurable  
pull-up)  
8
~SERVICE  
Service pin. Indicator output during operation.  
Large current sink capacity (20mA).  
General I / O port.  
7~4  
IO ~IO  
I / O  
0
3
General I / O port. One of IO to IO can be specified as  
4
7
I / O  
(built-in configurable  
pull-up)  
No.1 timer / counter input. Output signal can be output to  
IO .  
3, 30~28  
IO ~IO  
4
7
0
4
IO can be used as the No.2 timer / counter input with  
IO as output.  
1
General I / O port. Can be used for serial communication  
with other device.  
27, 26, 24  
IO ~IO  
I / O  
8
10  
2, 11, 12, 18, 25, 32  
9, 10, 13, 16, 23, 31  
V
Input  
Input  
Power input (5.0V Typ.)  
Power input (0V GND)  
DD  
V
SS  
Bidirectional port for communications. Supports several  
communications protocols by specifying mode.  
19, 20, 17, 21, 22  
CP ~CP  
I / O  
0
4
* : The ~SERVICE and IO to IO terminals are programmable pull-ups.  
4
7
All V  
DD  
terminals must be externally connected.  
All V terminals must be externally connected.  
SS  
2001-02-21 4/8  
TMPN3120B1AM  
MAXIMUM RATINGS ( V = 0V, V typ.)  
SS  
SS  
CHARACTERISTICS  
SYMBOL  
RATING  
UNIT  
Power Supply Voltage  
V
0.3~7.0  
V
V
DD  
Input Voltage  
V
0.3~V +0.3  
IN  
DD  
Power Dissipation  
Storage Temperature  
PD  
800  
mW  
°C  
T
stg  
65~150  
OPERATING CONDITIONS  
ITEM  
SYMBOL  
MIN  
TYP.  
MAX  
UNIT  
Operating Voltage  
VDD  
VIH  
VIL  
4.5  
2.0  
5.0  
5.5  
VDD  
0.8  
VDD  
0.8  
10  
V
V
Input Voltage ( TTL )  
VSS  
V
VIH  
VIL  
VDD0.8  
VSS  
V
Input Voltage ( CMOS )  
V
Operating Frequency  
fosc  
Topr  
0.625  
40  
MHz  
°C  
Operating Temperature  
85  
ELECTRICAL CHARACTERISTICS  
DC characteristic ( V = 5.0 V ± 10%, V = 0 V, Ta = 40~85°C )  
DD  
SS  
( Above operating conditions apply unless otherwise states. )  
CHARACTERISTICS  
SYMBOL  
PINS  
TEST CONDITION  
MIN  
MAX  
UNIT  
I
I
=20mA  
=10mA  
0
0
0
0
0.8  
0.4  
0.8  
0.4  
V
V
V
V
OL  
LOW Output Voltage (1)  
V
V
(1)  
(2)  
IO ~IO  
OL  
OL  
0
3
OL  
I
I
=20mA  
=10mA  
OL  
Duty  
LOW Output Voltage (2)  
~SERVICE  
CP , CP  
cycle=50%  
OL  
LOW Output Voltage (3)  
LOW Output Voltage (4)  
V
V
(3)  
(4)  
I
I
=40mA  
=1.4mA  
0
0
1.0  
0.4  
V
V
OL  
OL  
2
3
OL  
Others (Note 1)  
IO ~IO  
OL  
V
DD  
HIGH Output Voltage (1)  
HIGH Output Voltage (2)  
HIGH Output Voltage (3)  
V
V
V
V
(1)  
(2)  
(3)  
(4)  
I
I
I
I
=1.4mA  
=1.4mA  
=40mA  
=1.4mA  
V
V
V
V
V
V
V
OH  
OH  
OH  
OH  
0
3
OH  
OH  
OH  
OH  
DD  
DD  
DD  
DD  
0.4  
V
DD  
~SERVICE  
CP , CP  
0.4  
V
DD  
2
3
1.0  
V
DD  
HIGH Output Voltage (4)  
Input Current  
Others (Note 1)  
(Note 2)  
V
0.4  
10  
IIN  
IPU  
V
V
=V ~V  
IN SS DD  
+10  
300  
4.5  
µA  
IO ~IO  
4
7
Pull-up Current  
~SERVICE,  
=0V  
IN  
30  
µA  
V
~RESET (Note 3)  
Low-voltage Detection Level  
V
V
3.8  
LVD  
DD  
Note1 : Output voltage characteristics exclude the ~RESET pin and CLK2 pin.  
Note2 : Excludes pull-up input pins.  
Note3 : The IO to IO and ~SERVICE pins have programmable pull-ups. ~RESET has a fixed pull-up.  
4
7
2001-02-21 5/8  
TMPN3120B1AM  
ITEM  
SYMBOL  
TYP.  
MAX  
UNIT  
mA  
10 MHz Clock  
5 MHz Clock  
17  
9
30  
15  
8
Operating  
Mode  
I
2.5 MHz Clock  
1.25 MHz Clock  
6
DD (OP)  
Current  
Consumption  
4
5
0.625 MHz Clock  
2
3
Sleep Mode Current  
Consumption  
I
16  
100  
µA  
DD (SLP)  
Note: Test conditions for current dissipation  
V
=5V, all output=with no load, all input=0.2V or below or V 0.2V, programmable pull-up=off, crystal  
DD  
DD  
oscillator clock input, differential receiver disabled.  
The current value ( typ. ) is a typical value when Ta=25°C  
The current value ( max ) applies to the rated temperature range at V =5.5V.  
DD  
200µA ( typ. ) to 600µA ( max ) is added to the current of the differential receiver when the receiver is  
enabled.  
The differential receiver is enabled by either of the following conditions :  
When the Neuron chip is in Run mode and the communication ports are in Differential mode.  
When the Neuron chip is in Sleep mode, the communication ports are in Differential mode, and the  
Comm Port Wakeup is not masked.  
2001-02-21 6/8  
TMPN3120B1AM  
l Echelon, Neuron, LON, LonTalk, LonBuilder, NodeBuilder, LONWORKS, 3150, 3120 and LonManager are the  
registered trade marks of America’s Echelon Inc.  
l The Neuron Chip is manufactured by Toshiba under license from Echelon Corporation, USA. A licensing  
agreement between the customer and Echelon Corporation must be concluded before purchasing any of the  
neuron chip products.  
2
2
l The Neuron chip itself does not include the I C object function. You need the “I C Library” deliveried by  
Echelon.  
2
2
The Neuron chip and the I C Library do not convey nor imply a right under any I C patent rights of Philips  
Electronics N.V. ( “Philips” ) to make, use or sell any product employing such patent rights. Please refer all  
2
questions with respect to I C patents and licenses to Philips at:  
Mr. Gert-Jan Hessenlmann  
Corporate Intellectual Property  
Philips International B.V.  
Prof. Holstlaan 6  
Building WAH 1-100  
P.O. Box 220  
5600 AE, Eindhoven, The Netherlands  
Phone : +31 40 274 32 61  
Fax : +31 40 274 34 89  
E-mail: Gert.Jan.Hesselmann@philips.com.  
2001-02-21 7/8  
TMPN3120B1AM  
PACKCAGE DIMENSIONS  
2001-02-21 8/8  

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