TOTX1350(F) [TOSHIBA]
Fiber-Optic Modules (simplex type);
| 型号： | TOTX1350(F) |
| 厂家： | 
TOSHIBA |
| 描述： | Fiber-Optic Modules (simplex type) 输出元件 光纤 |
| 文件： | 总6页 (文件大小：421K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
TOTX1350(F)
FIBER OPTIC TRANSMITTING MODULE
TOTX1350(F)
GENERAL PURPOSE OPTICAL TRANSMITTING MODULE
JIS F05 type fiber optic connector
650nm LED
Low current LED drive
1. Absolute Maximum Ratings (Ta = 25°C)
Characteristics
Storage Temperature
Symbol
Rating
Unit
T
stg
−40 to 95
−40 to 85
30
°C
°C
mA
V
Operating Temperature
Forward Current (DC)
Reverse Voltage
T
opr
IFDC
V
MAX 5
R
Soldering Temperature
T
sol
260 (Note 1)
°C
Note 1: Soldering time ≤ 10 s (More than 1 mm apart from the package).
Using continuously under heavy loads (e.g. the application of high temperature/current/voltage and the significant
change in temperature , etc) may cause this product to decrease in the reliability significantly even if the
operating conditions (i.e.operating temperature/ current/ voltage, etc.) are within the absolute maximum ratings.
Please design the appropriate reliability upon reviewing the Toshiba Semiconductor Reliability Handbook
(“Handling Precautions”/ “Derating Concept and Methods”) and individual reliability data (i.e. reliability test report and
estimated failure rate, etc).
2. Operating Ranges
Characteristics
Symbol
Min
Typ.
Max
Unit
Forward Current (DC)
Data Rate
I
-
6
8
mA
F
DC
-
10
Mb/s
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3. Electrical and Optical Characteristics (Ta = 25°C, V = 5 V)
CC
Characteristics
Symbol
Test Condition
NRZ Code(Note 2)
Min
Typ.
Max
Unit
-
-
Data Rate
DC
40
0.2
-30
- 6
-13
-
10
100
50
30
-2
Mb / s
m
APF(Note 3), IF=6mA, Using TORX1350(F)
APF(Note 3), IF=1.5mA, Using TORX1350(F)
Transmission Distance (Note 2)
Pulse Width Distortion (Note 4)
Fiber Output Power (Note 5)
Center Emission Wavelength
Forward Voltage
-
m
-
Δtw
％
-
IF=6mA, Using APF (Note3),
IF=1.5mA, Using APF (Note3),
dBm
dBm
nm
V
P
f
-
-8
λc
650
-
-
IF=6mA
IF=1.5mA
VR=5V
2.0
1.8
-
2.1
2.0
10
V
F
-
V
-
Reverse Current
IR
μA
Note 2: Data rate and transmission distance differ from driver circuit.
Note 3: All Plastic Fiber (980μm core / 1000μm cladding, NA=0.5). Polished surface.
Transmission loss is less than 0.18dB/m. (100m@650nm).
Note 4: Between input of driver circuit of TOTX1350(F) and output of TORX1350(F).
A value changes with LED drive circuits.
Note 5: Measure with a standard optical fiber with fiber optic connectors. Valued by peak.
4. Application Circuit
(1) IF = 6mA operation
TOTX1350(F)
(2) IF = 1.5mA operation
TOTX1350(F)
5. Applicable Optical Fiber with Fiber Optic Connectors
All Plastic Fiber (980μm core / 1000μm cladding, NA=0.5) with F05 type optical connector. Polished surface.
Transmission loss is less than 0.18dB/m. (100m@650nm).
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6. Precautions during use
(1) Absolute maximum rating
The absolute maximum ratings are the limit values which must not be exceeded during operation of device.
None of these rating value must not be exceeded. If the absolute maximum rating value is exceeded, the
characteristics of devices may never be restored properly. In extreme cases, the device may be
permanently damages.
(2) Operating Range
The operating range is the range of conditions necessary for the device to operate as specified in
individual technical datasheets and databooks. Care must be exercised in the design of the equipment.
If a device is used under conditions that do not exceed absolute maximum ratings but exceed the
operating range, the specifications related to device operation and electrical characteristics may not be
met, resulting in a decrease in reliability.
If greater reliability is required, derate the device’s operating ranges for voltage, current, power and
temperature before use.
(3) Lifetime of light emitters
If an optical module is used for a long period of time, degeneration in the characteristics will mostly be due
to a lowering of the fiber output power (Pf). This is caused by the degradation of the optical output of the
LEDs used as the light source. The cause of degradation of the optical output of the LEDs may be defects
in wafer crystallization or mold resin stress. The detailed causes are, however, not clear.
The lifetime of light emitters is greatly influenced by the operating conditions and the environment in which
it is used as well as by the lifetime characteristics unique to the device type. Thus, when a light emitting
device and its operating conditions determined, Toshiba recommend that lifetime characteristics be
checked.
Depending on the environment conditions, Toshiba recommend that maintenance such as regular checks
of the amount of optical output in accordance with the condition of operating environment.
(4) Soldering
Optical modules are comprised of internal semiconductor devices. However, in principle, optical modules
are optical components. During soldering, ensure that flux does not contact with the emitting surface or the
detecting surface. Also ensure that proper flux removal is conducted after soldering.
Some optical modules come with a protective cap. The protective cap is used to avoid malfunction when
the optical module is not in use. Note that it is not dust or waterproof.
As mentioned before, optical modules are optical components. Thus, in principle, soldering where there
may be flux residue and flux removal after soldering is not recommended. Toshiba recommend that
soldering be performed without the optical module mounted on the board. Then, after the board has been
cleaned, the optical module should be soldered on to the board manually.
If the optical module cannot be soldered manually, use non−halogen (chlorine−free) flux and make sure,
without cleaning, there is no residue such as chlorine. This is one of the ways to eliminate the effects of
flux. In such a cases, be sure to check the devices’ reliability.
(5) Vibration and shock
This module is plastic sealed and has its wire fixed by resin. This structure is relatively resistant to vibration
and shock. In actual equipment, there are sometime cases in which vibration, shock, or stress is applied to
soldered parts or connected parts, resulting in lines cut. A care must be taken in the design of equipment
which will be subject to high levels of vibration.
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(6) Fixing fiber optical transmitting module
Solder the fixed pin (pins 4 and 5) of fiber optic transmitting module TOTX1350(F) to the printed circuit
board to fix the module to the board.
(7) Solvent
When using solvent for flux removal, do not use a high acid or high alkali solvent. Be careful not to pour
solvent in to the optical connector ports. If solvent is inadvertently poured in to them, clean it off using
cotton tips.
(8) Protective cap
When the TOTX1350(F) is not in use, attach the protective cap..
(9) An influence of flash or strong light
Do not emit a flash or a strong light to the optical module directly they may cause an error in data
transmission.
(10) Soldering condition
Solder at 260°C or less for no more than ten seconds.
(11) Precautions when disposing of devices and packing materials.
When disposing devices and packing materials, follow the procedures stipulated by local regulations in
order to protect the environment against contamination.
(12) Others
This product is an optical transmitting module for plastic optical fiber.
Use only for an optical transmitting module purpose.
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7. Package Outline drawing
Unit: mm
5
4
Pin connection
3
2
1
1. NC
2. Cathode
3. Anode
4. NC
5. NC
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RESTRICTIONS ON PRODUCT USE
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Toshiba Corporation, and its subsidiaries and affiliates (collectively "TOSHIBA"), reserve the right to make changes to the information
in this document, and related hardware, software and systems (collectively "Product") without notice.
This document and any information herein may not be reproduced without prior written permission from TOSHIBA. Even with
TOSHIBA's written permission, reproduction is permissible only if reproduction is without alteration/omission.
Though TOSHIBA works continually to improve Product's quality and reliability, Product can malfunction or fail. Customers are
responsible for complying with safety standards and for providing adequate designs and safeguards for their hardware, software and
systems which minimize risk and avoid situations in which a malfunction or failure of Product could cause loss of human life, bodily
injury or damage to property, including data loss or corruption. Before customers use the Product, create designs including the
Product, or incorporate the Product into their own applications, customers must also refer to and comply with (a) the latest versions of
all relevant TOSHIBA information, including without limitation, this document, the specifications, the data sheets and application notes
for Product and the precautions and conditions set forth in the "TOSHIBA Semiconductor Reliability Handbook" and (b) the
instructions for the application with which the Product will be used with or for. Customers are solely responsible for all aspects of their
own product design or applications, including but not limited to (a) determining the appropriateness of the use of this Product in such
design or applications; (b) evaluating and determining the applicability of any information contained in this document, or in charts,
diagrams, programs, algorithms, sample application circuits, or any other referenced documents; and (c) validating all operating
parameters for such designs and applications. TOSHIBA ASSUMES NO LIABILITY FOR CUSTOMERS' PRODUCT DESIGN OR
APPLICATIONS.
•
PRODUCT IS NEITHER INTENDED NOR WARRANTED FOR USE IN EQUIPMENTS OR SYSTEMS THAT REQUIRE
EXTRAORDINARILY HIGH LEVELS OF QUALITY AND/OR RELIABILITY, AND/OR A MALFUNCTION OR FAILURE OF WHICH
MAY CAUSE LOSS OF HUMAN LIFE, BODILY INJURY, SERIOUS PROPERTY DAMAGE AND/OR SERIOUS PUBLIC IMPACT
("UNINTENDED USE"). Except for specific applications as expressly stated in this document, Unintended Use includes, without
limitation, equipment used in nuclear facilities, equipment used in the aerospace industry, medical equipment, equipment used for
automobiles, trains, ships and other transportation, traffic signaling equipment, equipment used to control combustions or explosions,
safety devices, elevators and escalators, devices related to electric power, and equipment used in finance-related fields. IF YOU USE
PRODUCT FOR UNINTENDED USE, TOSHIBA ASSUMES NO LIABILITY FOR PRODUCT. For details, please contact your
TOSHIBA sales representative.
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Do not disassemble, analyze, reverse-engineer, alter, modify, translate or copy Product, whether in whole or in part.
Product shall not be used for or incorporated into any products or systems whose manufacture, use, or sale is prohibited under any
applicable laws or regulations.
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The information contained herein is presented only as guidance for Product use. No responsibility is assumed by TOSHIBA for any
infringement of patents or any other intellectual property rights of third parties that may result from the use of Product. No license to
any intellectual property right is granted by this document, whether express or implied, by estoppel or otherwise.
ABSENT A WRITTEN SIGNED AGREEMENT, EXCEPT AS PROVIDED IN THE RELEVANT TERMS AND CONDITIONS OF SALE
FOR PRODUCT, AND TO THE MAXIMUM EXTENT ALLOWABLE BY LAW, TOSHIBA (1) ASSUMES NO LIABILITY
WHATSOEVER, INCLUDING WITHOUT LIMITATION, INDIRECT, CONSEQUENTIAL, SPECIAL, OR INCIDENTAL DAMAGES OR
LOSS, INCLUDING WITHOUT LIMITATION, LOSS OF PROFITS, LOSS OF OPPORTUNITIES, BUSINESS INTERRUPTION AND
LOSS OF DATA, AND (2) DISCLAIMS ANY AND ALL EXPRESS OR IMPLIED WARRANTIES AND CONDITIONS RELATED TO
SALE, USE OF PRODUCT, OR INFORMATION, INCLUDING WARRANTIES OR CONDITIONS OF MERCHANTABILITY, FITNESS
FOR A PARTICULAR PURPOSE, ACCURACY OF INFORMATION, OR NONINFRINGEMENT.
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GaAs (Gallium Arsenide) is used in Product. GaAs is harmful to humans if consumed or absorbed, whether in the form of dust or
vapor. Handle with care and do not break, cut, crush, grind, dissolve chemically or otherwise expose GaAs in Product.
Do not use or otherwise make available Product or related software or technology for any military purposes, including without
limitation, for the design, development, use, stockpiling or manufacturing of nuclear, chemical, or biological weapons or missile
technology products (mass destruction weapons). Product and related software and technology may be controlled under the
applicable export laws and regulations including, without limitation, the Japanese Foreign Exchange and Foreign Trade Law and the
U.S. Export Administration Regulations. Export and re-export of Product or related software or technology are strictly prohibited
except in compliance with all applicable export laws and regulations.
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Please contact your TOSHIBA sales representative for details as to environmental matters such as the RoHS compatibility of Product.
Please use Product in compliance with all applicable laws and regulations that regulate the inclusion or use of controlled substances,
including without limitation, the EU RoHS Directive. TOSHIBA ASSUMES NO LIABILITY FOR DAMAGES OR LOSSES
OCCURRING AS A RESULT OF NONCOMPLIANCE WITH APPLICABLE LAWS AND REGULATIONS.
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