TOTX193 [TOSHIBA]
FIBER OPTIC TRANSMITTING MODULE; 光纤传输模块
| 型号： | TOTX193 |
| 厂家： | 
TOSHIBA |
| 描述： | FIBER OPTIC TRANSMITTING MODULE |
| 文件： | 总7页 (文件大小：137K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
TOTX193
FIBER OPTIC TRANSMITTING MODULE
TOTX193
FIBER OPTIC TRANSMITTING
Unit: mm
MODULE FOR DIGITAL AUDIO
EQUIPMENT AND NAVIGATION
SYSTEM
l Conform to JEITA standard CP−1201
(For Digital audio interfaces including
fiber optic inter−connections).
l TTL interface
l LED is driven by differential circuit.
1. Maximum Ratings (Ta = 25°C)
Characteristics
Symbol
Rating
Unit
Storage Temperature
Operating Temperature
Supply Voltage
T
−40 to 85
−40 to 85
−0.5 to 7
°C
°C
V
stg
opr
CC
T
V
Input Voltage
V
−0.5 to V + 0.5
V
IN
CC
Soldering Temperature
T
sol
260 (Note 1)
°C
Note 1: Soldering time ≤ 10 s (More than 1 mm apart from the package).
Handling precaution: The LEDs used in this product contain GaAs (Gallium Arsenide).
Care must be taken to protect the safety of people and the environment when scrapping or
terminal processing.
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TOTX193
2. Recommended Operating Conditions
Characteristics
Supply Voltage
Symbol
Min
Typ.
Max
5.25
Unit
V
4.75
2.0
0
5.0
―
V
V
V
CC
High Level Input Voltage
Low Level Input Voltage
V
V
CC
IH
V
―
0.8
IL
3. Electrical and Optical Characteristics (Ta = 25°C, V = 5 V)
CC
Characteristics
Symbol
Test Condition
NRZ Code
Min
Typ.
Max
Unit
Data Rate
(Note 2)
DC
0.2
―
―
6
Mb / s
m
Transmission Distance
Using APF (Note 3), TORX193
Pulse width 165 ns
10
Pulse Width Distortion
(Note 4)
∆tw
Pulse cycle 330 ns, C = 10 F
−25
―
25
ns
L
p
Using TORX193
Fiber Output Power
P
APF 1 m, R = 8.2 kΩ
(Note 5)
−21
―
―
660
15
―
−15
―
dBm
nm
mA
V
f
Peak Emission Wavelength
Current Consumption
λ
p
I
R = 8.2 k Ω
―
25
CC
High Level Input Voltage
Low Level Input Voltage
High Level Input Current
Low Level Input Current
V
2.0
―
―
IH
V
―
0.8
20
V
IL
I
―
―
µA
mA
IH
I
―
―
−0.4
IL
Note 2: For data rate > 3 Mb / s, the duty factor must be such as kept 25 to 75%.
LED is on when input signal is high level, it is off when it is low level.
Note 3: All Plastic Fiber (980 / 1000 µm)
Note 4: Between input of TOTX193 and output of a fiber optic receiving module TORX193.
Note 5: Measure with a standard optical fiber with fiber optic connectors. Valued by peak.
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4. Example of Typical Characteristics (Note 6)
Note 6: There give characteristic examples, and its values are not guaranteed.
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Note 6: There give characteristic examples, and its values are not guaranteed.
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5. Application Circuit
6. Precautions during use
(1) Maximum rating
The maximum ratings are the limit values which must not be exceeded when using the device. Any
one of the rating must not be exceeded. If The maximum rating is exceeded, the characteristics may
not be recovered. In some extreme cases, the device may be permanently damage.
(2) Life of light emitters
When the optical module is used for over a long period, degeneration of characteristics is mostly due
to lowering of the fiber output power (Pf). This is caused by the degradation of the optical output of
the LED’s used as the light source. The cause of degradation of the optical output of the LED’s may be
defects in wafer crystallization or mold resin stress. The detailed causes are, however, not clear.
The life of light emitters is greatly influenced by operating conditions and usage environment as well
as the life characteristics unique to the device. Thus, when selecting a light emitter and setting the
operating conditions, Toshiba recommends that you check the life characteristics.
Depending on the environment conditions, Toshiba recommends maintenance such as regular checks
on the amount of optical output.
(3) Soldering
Optical modules use semiconductor devices internally. However, in principle, optical modules are
optical components. At soldering, take care that flux dose not contact the emitting surface or detecting
surface. Also take care at flux removal after soldering.
Some optical modules come with protective cap. The protective cap is used to avoid malfunction when
the optical module is not in use. Not that it is not dust or waterproof.
As mentioned before, optical modules are optical component. Thus, in principle, soldering where there
may be flux residue or flux removal after soldering is not recommended. Toshiba recommends that
soldering be performed without the optical module mounted on the board. Then, after the board is
cleaned, solder the optical module manually. Do not perform any further cleaning.
If the optical module cannot be soldered manually, use non−halogen (chlorine−free) flux and make
sure, without cleaning, there is no residue such as chlorine. This is one of the ways to eliminate the
effects of flux. In such a case, check the reliability.
(4) Vibration and shock
This module is resin−molded construction with wire fixed by resin. This structure is relatively sound
against vibration or shock, In actual equipment, there are some cases where vibration, shock, and
stress is applied to soldered parts or connected parts, resultingin line cut. Attention must be paid to
the design of the mechanism for applications which are subject to large amounts of vibration.
(5) Fixing fiber optical transceiving module
Solder the fixed pin (pins 5 and 6) of fiber optic transmitting module TOTX193 to the printed circuit
board to fix the module to the board.
(6) Solvent
When using solvent for flux removal, do not use a high acid or high alkali solvent. Be careful not to
pour solvent in the optical connector ports. If solvent is inadvertently poured there, clean with cotton
tips.
(7) Protective cap
When the fiber optic transmitting module TOTX193 is not in use, use the protective cap.
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(8) Supply voltage
Use the supply voltage within the Typ. operating condition (V
= 5 ± 0.25V). Make sure that supply
CC
voltage does not exceed the maximum rating value of 7V, even instantaneously.
(9) Input voltage
If a voltage exceeding the maximum rating value (V
+ 0.5V) is applied to the transmitter input, the
CC
internal IC may degrade causing some damage. If excessive voltage due to surges may be added to the
input, insert a protective circuit.
(10) Soldering condition
Solder at 260°C or less within ten seconds.
(11) Precaution on waste
When discarding devices and packing materials, follow procedures stipulated by local regulations in
order to protect the environment against contamination.
Compound semiconductors such as GaAs are used as LED materials for this module. When discarding
waste or at final processing, attention must be paid to workers and the environment.
(12) Precaution on use
Toshiba is continually working to improve the quality and the reliability of its products. Nevertheless,
semiconductor devices in general can malfunction or fail due to their inherent electrical sensitivity
and vulnerability to physical stress. It is the responsibility of the buyer, when utilizing Toshiba
products, to observe standards of safety, and to avoid situations in which a malfunction or failure of a
Toshiba product could cause loss of human life, bodily injury or damage to property.
In developing your designs, please ensure that Toshiba products are used within specified operating
ranges as set forth in the most recent product specifications. Also, please keep in mind the
precautions and conditions set forth in the Toshiba Semiconductor Reliability Handbook.
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RESTRICTIONS ON PRODUCT USE
000707EAC
· TOSHIBA is continually working to improve the quality and reliability of its products. Nevertheless, semiconductor
devices in general can malfunction or fail due to their inherent electrical sensitivity and vulnerability to physical
stress. It is the responsibility of the buyer, when utilizing TOSHIBA products, to comply with the standards of
safety in making a safe design for the entire system, and to avoid situations in which a malfunction or failure of
such TOSHIBA products could cause loss of human life, bodily injury or damage to property.
In developing your designs, please ensure that TOSHIBA products are used within specified operating ranges as
set forth in the most recent TOSHIBA products specifications. Also, please keep in mind the precautions and
conditions set forth in the “Handling Guide for Semiconductor Devices,” or “TOSHIBA Semiconductor Reliability
Handbook” etc..
· The TOSHIBA products listed in this document are intended for usage in general electronics applications
(computer, personal equipment, office equipment, measuring equipment, industrial robotics, domestic appliances,
etc.). These TOSHIBA products are neither intended nor warranted for usage in equipment that requires
extraordinarily high quality and/or reliability or a malfunction or failure of which may cause loss of human life or
bodily injury (“Unintended Usage”). Unintended Usage include atomic energy control instruments, airplane or
spaceship instruments, transportation instruments, traffic signal instruments, combustion control instruments,
medical instruments, all types of safety devices, etc.. Unintended Usage of TOSHIBA products listed in this
document shall be made at the customer’s own risk.
· Gallium arsenide (GaAs) is a substance used in the products described in this document. GaAs dust and fumes
are toxic. Do not break, cut or pulverize the product, or use chemicals to dissolve them. When disposing of the
products, follow the appropriate regulations. Do not dispose of the products with other industrial waste or with
domestic garbage.
· The information contained herein is presented only as a guide for the applications of our products. No
responsibility is assumed by TOSHIBA CORPORATION for any infringements of intellectual property or other
rights of the third parties which may result from its use. No license is granted by implication or otherwise under
any intellectual property or other rights of TOSHIBA CORPORATION or others.
· The information contained herein is subject to change without notice.
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