TPD4113AK_07 [TOSHIBA]
High Voltage Monolithic Silicon Power IC; 高压硅单片电源IC
| 型号： | TPD4113AK_07 |
| 厂家： | 
TOSHIBA |
| 描述： | High Voltage Monolithic Silicon Power IC |
| 文件： | 总24页 (文件大小：343K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
TPD4113AK
TOSHIBA Intelligent Power Device High Voltage Monolithic Silicon Power IC
TPD4113AK
The TPD4113AK is a DC brush less motor driver using
high- voltage PWM control. It is fabricated using a high-voltage
SOI process. The device contains a level shift high side driver,
low side driver, IGBT outputs, FRDs and protective functions for
under-voltage protection circuits, and a thermal shutdown circuit.
It is easy to control a DC brush less motor by just putting logic
inputs from a MPU or motor controller to the TPD4113AK.
Features
•
•
•
Bootstrap circuit gives simple high-side power supply.
Bootstrap diodes are built in.
A dead time can be set as a minimum of 1.4 μs, and it is the
best for a Sine-wave from drive.
•
•
•
•
•
3-phase bridge output using IGBTs.
FRDs are built in.
Included under-voltage protection and thermal shutdown.
The regulator of 7V (typ.) is built in.
Package: 23-pin HZIP.
This product has a MOS structure and is sensitive to electrostatic
discharge. When handling this product, ensure that the environment
is protected against electrostatic discharge.
Weight
HZIP23-P-1.27F : 6.1 g (typ.)
HZIP23-P-1.27G : 6.1 g (typ.)
HZIP23-P-1.27H : 6.1 g (typ.)
1
2006-11-01
TPD4113AK
Pin Assignment
1
2
3
4
5
6
7
8
9
10 11 12 13 14 15 16 17 18 19 20 21 22 23
VBB
1
VREG
GND
HU HV HW LU LV LW IS1 NC BSU
U
BSV
V
BSW W VBB 2 NC IS2 NC DIAG VCC
Marking
Lot No.
A line indicates
TPD4113AK JAPAN
lead (Pb)-free package or
lead (Pb)-free finish.
Part No. (or abbreviation code)
2
2006-11-01
TPD4113AK
Block Diagram
V
21
23
9 BSU
CC
12 BSV
14 BSW
11 V
16 V
1
BB
BB
Under-
voltage
Protection
Under-
voltage
Protection Protection
Under-
voltage
7 V
V
REG
2
Regulator
Under-
voltage
High-side Level
Protection
Shift Drver
HU 1
HV 2
HW 3
LU 4
LV 5
LW 6
Thermal
10
U
Input Control
Shutdown
13 V
15 W
Low-side
Driver
DIAG 20
18 IS2
7 IS1
GND
22
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2006-11-01
TPD4113AK
Pin Description
Pin No.
1
Symbol
Pin Description
The control terminal of IGBT by the side of U top arm. It turns off more than by 1.5V.
It turns on more than by 3.5V.
HU
HV
The control terminal of IGBT by the side of V top arm. It turns off more than by 1.5V.
It turns on more than by 3.5V.
2
3
The control terminal of IGBT by the side of W top arm. It turns off more than by 1.5V.
It turns on more than by 3.5V.
HW
The control terminal of IGBT by the side of U bottom arm. It turns off more than by 1.5V.
It turns on more than by 3.5V.
4
5
6
LU
LV
The control terminal of IGBT by the side of V bottom arm. It turns off more than by 1.5V.
It turns on more than by 3.5V.
The control terminal of IGBT by the side of W bottom arm. It turns off more than by 1.5V.
It turns on more than by 3.5V.
LW
7
IS1
NC
BSU
U
IGBT emitter and FRD anode pin.
8
Unused pin, which is not connected to the chip internally.
U-phase bootstrap capacitor connecting pin.
U-phase output pin.
9
10
11
12
13
14
15
16
17
18
19
20
V
1
U and V-phase high-voltage power supply input pin.
V-phase bootstrap capacitor connecting pin.
V-phase output pin.
BB
BSV
V
BSW
W
W-phase bootstrap capacitor connecting pin.
Ｗ-phase output pin.
V
2
BB
W-phase high-voltage power supply input pin.
Unused pin, which is not connected to the chip internally.
IGBT emitter and FRD anode pin.
NC
IS2
NC
Unused pin, which is not connected to the chip internally.
With the diagnostic output terminal of open drain , a pull-up is carried out by resistance.
It turns it on at the time of unusual.
DIAG
21
22
23
V
Control power supply pin.(15V typ.)
Ground pin.
CC
GND
V
7V regulator output pin.
REG
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2006-11-01
TPD4113AK
Equivalent Circuit of Input Pins
Internal circuit diagram of HU, HV, HW, LU, LV, LW input pins
5 kΩ
5 kΩ
2 kΩ
HU/HV/HW
LU/LV/LW
To internal circuit
6.5 V
6.5 V
6.5 V
6.5 V
Internal circuit diagram of DIAG pin
DIAG
To internal circuit
26 V
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2006-11-01
TPD4113AK
Timing Chart
HU
HV
HW
LU
LV
Input Voltage
LW
VU
Output voltage
VV
VW
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2006-11-01
TPD4113AK
Truth Table
Mode
Input
Top arm
Ｖ
Bottom arm
Ｖ
DIAG
Ｕ
Ｗ
Ｕ
Ｗ
ＨＵ ＨＶ ＨＷ ＬＵ ＬＶ ＬＷ
phase
ＯＮ
phase
ＯＦＦ
ＯＦＦ
ＯＮ
phase
ＯＦＦ
ＯＦＦ
ＯＦＦ
ＯＦＦ
ＯＮ
phase
ＯＦＦ
ＯＦＦ
ＯＦＦ
ＯＮ
phase
ＯＮ
phase
Normal
Ｈ
Ｈ
Ｌ
Ｌ
Ｌ
Ｌ
Ｌ
Ｌ
Ｈ
Ｈ
Ｌ
Ｌ
Ｌ
Ｌ
Ｈ
Ｈ
Ｌ
Ｌ
Ｌ
Ｌ
Ｈ
Ｈ
Ｌ
Ｌ
Ｌ
Ｌ
Ｌ
Ｌ
Ｈ
Ｈ
Ｌ
Ｌ
Ｌ
Ｌ
Ｈ
Ｈ
Ｌ
Ｌ
Ｌ
Ｌ
Ｈ
Ｈ
Ｌ
Ｌ
Ｌ
Ｈ
Ｈ
Ｌ
Ｌ
Ｌ
Ｌ
Ｈ
Ｈ
Ｌ
Ｌ
Ｌ
Ｌ
Ｈ
Ｈ
Ｌ
Ｈ
Ｌ
Ｌ
Ｌ
Ｌ
Ｈ
Ｈ
Ｌ
Ｌ
Ｌ
Ｌ
Ｈ
Ｈ
Ｌ
Ｌ
Ｌ
Ｌ
Ｈ
Ｌ
Ｈ
Ｈ
Ｌ
Ｌ
Ｌ
Ｌ
Ｈ
Ｈ
Ｌ
Ｌ
Ｌ
Ｌ
Ｈ
Ｈ
Ｌ
Ｌ
Ｌ
ＯＦＦ ＯＦＦ
ＯＮ
ＯＦＦ
ＯＦＦ
ＯＦＦ
ＯＦＦ
ＯＮ
ＯＮ
ＯＮ
ＯＦＦ
ＯＦＦ
ＯＦＦ
ＯＦＦ
ＯＦＦ
ＯＦＦ
ＯＦＦ
ＯＦＦ
ＯＦＦ
ＯＦＦ
ＯＦＦ
ＯＦＦ
ＯＦＦ
ＯＦＦ
ＯＦＦ
ＯＦＦ
ＯＦＦ
ＯＦＦ
ＯＮ
ＯＦＦ ＯＦＦ
ＯＦＦ ＯＦＦ
ＯＦＦ ＯＦＦ
ＯＦＦ
ＯＦＦ
ＯＦＦ
ＯＦＦ
ＯＦＦ
ＯＦＦ
ＯＦＦ
ＯＦＦ
ＯＦＦ
ＯＦＦ
ＯＦＦ
ＯＦＦ
ＯＦＦ
ＯＦＦ
ＯＮ
ＯＮ
ＯＦＦ
ＯＦＦ
ＯＦＦ
ＯＦＦ
ＯＦＦ
ＯＦＦ
ＯＦＦ
ＯＦＦ
ＯＦＦ
ＯＦＦ
ＯＦＦ
ＯＦＦ
ＯＦＦ
Thermal shutdown Ｈ
ＯＦＦ
ＯＦＦ
ＯＦＦ
ＯＦＦ
ＯＦＦ
ＯＦＦ
ＯＦＦ
ＯＦＦ
ＯＦＦ
ＯＦＦ
ＯＦＦ
ＯＦＦ
ＯＦＦ
ＯＦＦ
ＯＦＦ
ＯＦＦ
ＯＦＦ
ＯＦＦ
ＯＦＦ
ＯＦＦ
ＯＦＦ
ＯＦＦ
ＯＦＦ
ＯＦＦ
ＯＦＦ
ＯＦＦ
ＯＦＦ
ＯＦＦ
ＯＦＦ
ＯＦＦ
ＯＦＦ
ＯＦＦ
ＯＦＦ
ＯＦＦ
ＯＦＦ
ＯＦＦ
ＯＮ
ＯＮ
ＯＮ
ＯＮ
ＯＮ
ＯＮ
ＯＮ
ＯＮ
ＯＮ
ＯＮ
ＯＮ
ＯＮ
Ｈ
Ｌ
Ｌ
Ｌ
Ｌ
Under-voltage
Ｈ
Ｈ
Ｌ
Ｌ
Ｌ
Ｌ
Notes: Release of Thermal shutdown protection and under voltage protection depends release of a self-reset .
Absolute Maximum Ratings (Ta = 25°C)
Characteristics
Symbol
Rating
Unit
V
500
V
V
BB
CC
out
out
Power supply voltage
V
18
Output current (DC)
Output current (pulse)
Input voltage
I
I
1
A
2
−0.5~7
50
A
V
V
IN
VREG current
I
mA
mA
W
REG
VDIAGcurrent
I
20
DIAG
Power dissipation (Ta = 25°C)
Power dissipation (Tc = 25°C)
Operating temperature
Junction temperature
Storage temperature
Lead-heat sink isolation voltage
P
P
4
C
C
20
W
T
jopr
−20~135
150
°C
°C
°C
Vrms
T
j
T
stg
−55~150
1000 (1 min)
Vhs
Note: Using continuously under heavy loads (e.g. the application of high temperature/current/voltage and the
significant change in temperature, etc.) may cause this product to decrease in the reliability significantly even
if the operating conditions (i.e. operating temperature/current/voltage, etc.) are within the absolute maximum
ratings and the operating ranges.
Please design the appropriate reliability upon reviewing the Toshiba Semiconductor Reliability Handbook
(“Handling Precautions”/Derating Concept and Methods) and individual reliability data (i.e. reliability test report
and estimated failure rate, etc).
7
2006-11-01
TPD4113AK
Electrical Characteristics (Ta = 25°C)
Characteristics
Symbol
Test Condition
Min
Typ.
Max
Unit
V
V
⎯
⎯
50
13.5
⎯
280
15
450
16.5
0.5
5
BB
CC
BB
CC
Operating power supply voltage
V
I
V
V
V
V
V
V
V
V
V
V
= 450 V
= 15 V
⎯
BB
CC
BS
BS
mA
μA
V
I
⎯
1.1
260
230
⎯
Current dissipation
I
= 15 V, high side ON
= 15 V, high side OFF
⎯
410
370
⎯
BS (ON)
I
⎯
BS (OFF)
V
= “H”
= “L”
= 5Ｖ
= 0 V
3.5
⎯
IH
IN
Input voltage
V
⎯
1.5
150
100
3
IL
IN
I
⎯
⎯
IH
IN
Input current
μA
V
I
⎯
⎯
IL
IN
V
H
= 15 V, IC = 0.5 A
= 15 V, IC = 0.5 A
⎯
2.4
2.4
1.6
1.6
7
CEsat
CC
CC
Output saturation voltage
FRD forward voltage
V
L
⎯
3
CEsat
V H
IF = 0.5 A, high side
IF = 0.5 A, low side
⎯
2.0
2.0
7.5
1.2
185
⎯
F
V
V L
F
⎯
Regulator voltage
V
V
= 15 V, I = 30 mA
6.5
⎯
V
V
REG
CC
O
BSD forward voltage
V
(BSD)
IF = 500μＡ
0.9
⎯
F
Thermal shutdown temperature
Thermal shutdown hysteresis
VCC under-voltage protection
VCC under-voltage protection recovery
TSD
ΔTSD
V
V
= 15 V
= 15 V
135
⎯
℃
℃
V
CC
CC
50
V
V
UVD
⎯
⎯
⎯
⎯
10
10.5
8
11
12
CC
CC
UVR
UVD
UVR
11.5
9
12.5
9.5
10.5
0.5
3
V
V
V
under-voltage protection
V
V
V
V
BS
BS
BS
BS
under-voltage protection recovery
8.5
⎯
9.5
⎯
V
DIAG saturation voltage
Output-on delay time
Output-off delay time
Dead time
I
=5mA
V
DIAGsat
DIAG
t
on
t
off
V
V
V
V
= 280 V, IC = 0.5 A
= 280 V, IC = 0.5 A
= 280 V, IC = 0.5 A
= 280 V, IC = 0.5 A
⎯
1.5
1.2
⎯
μs
μs
μs
ns
BB
BB
BB
BB
⎯
3
tdead
1.4
⎯
⎯
FRD reverse recovery time
t
200
⎯
rr
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2006-11-01
TPD4113AK
Application Circuit Example
15V
V
CC
21
9
BSU
BSV
BSW
+
12
14
11
C
C
5
4
V
V
1
BB
BB
7 V
Under-
voltage
Under-
voltage
Under-
voltage
23
16
Regulator
V
REG
2
+
Protection Protection Protection
C
C
7
6
Under-
voltage
Protection
High-side
Level Shift
Driver
C
1
C C
2 3
1
2
HU
HV
HW
LU
10
13
15
Thermal
U
V
Control IC
or
Shutdown
Ｍ
3
Input Control
4
Microcomputer
W
5
Low-side
Driver
LV
6
LW
20
DIAG
18
7
R
２
IS2
IS1
R
１
22
GND
9
2006-11-01
TPD4113AK
External Parts
Standard external parts are shown in the following table.
Part
Recommended Value
Purpose
Remarks
C , C , C
25 V/2.2 μF
0.62 Ω ± 1% (1 W)
25 V/10 μF
Bootstrap capacitor
Current detection
(Note 1)
(Note 2)
(Note 3)
(Note 3)
(Note 3)
(Note 3)
(Note 4)
1
2
1
4
3
R
C
C
V
power supply stability
CC
25 V/0.1 μF
16 V/1 μF
V
for surge absorber
CC
５
C
V
REG
power supply stability
6
7
2
C
R
16 V/1000 pF
5.1 kΩ
V
for surge absorber
REG
DIAG pin pull-up resistor
Note 1: The required bootstrap capacitance value varies according to the motor drive conditions. The capacitor is
biased by V and must be sufficiently derated for it.
CC
Note 2: The following formula shows the detection current: I = V ÷ R1
O
R
Do not exceed a detection current of 1A when using this product.
(Please go from the outside in the over current protection.)
Note 3: When using this product, some adjustment is required in accordance with the use environment. When
mounting, place as close to the base of this product leads as possible to improve the ripple and noise
elimination.
Note 4: The DIAG pin is open drain. Note that when the DIAG pin is connected to a power supply with a voltage
higher than or equal to the V , a protection circuit is triggered so that the current flows continuously. If the
CC
DIAG pin is not used, connect to the GND.
Handling precautions
(1) Please control the input signal in the state to which the V
voltage is steady. Both of the order of
CC
the VBB power supply and the V
power supply are not cared about either.
CC
Note that if the power supply is switched off as described above, this product may be destroyed if the
current regeneration route to the V power supply is blocked when the V line is disconnected by
BB
BB
a relay or similar while the motor is still running.
(2)
The excess voltage such as the voltage serge which exceed the maximum rating is added, for example,
may destroy the circuit. Accordingly, be careful of handling this product or of surge voltage in its
application environment.
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2006-11-01
TPD4113AK
Description of Protection Function
(1)
Under-voltage protection
This product incorporates an under-voltage protection circuit to prevent the IGBT from operating in
unsaturated mode when the V voltage or the V voltage drops.
CC
BS
When the V
power supply falls to this product internal setting (V UVD = 11 V typ.), all IGBT
CC
CC
outputs shut down regardless of the input. This protection function has hysteresis. When the
UVR (= 11.5 V typ.) reaches 0.5 V higher than the shutdown voltage, this product is
V
CC
automatically restored and the IGBT is turned on/off again by the input.
When the V supply voltage drops (V UVD = 9 V typ.), the high-side IGBT output shuts down.
BS
BS
When the V UVR (= 9.5 V typ.) reaches 0.5 V higher than the shutdown voltage, the IGBT is
BS
turned on/off again by the input signal.
(2)
Thermal shutdown
This product incorporates a thermal shutdown circuit to protect itself against excessive rise in
temperature.When the temperature of this chip rises to the internal setting TSD due to external
causes or internal heat generation all IGBT outputs shut down regardless of the input. This
protection function has hysteresis (ΔTSD = 50°C typ.). When the chip temperature falls to TSD −
ΔTSD, the chip is automatically restored and the IGBT is turned on/off again by the input.
Because the chip contains just one temperature-detection location, when the chip heats up due to the
IGBT, for example, the differences in distance between the detection location and the IGBT (the
source of the heat) can cause differences in the time taken for shutdown to occur. Therefore, the
temperature of the chip may rise higher than the initial thermal shutdown temperature.
Safe Operating Area
1.0
0.9
0.9
0.83
0
0
0
400 450
(V)
0
400 450
(V)
Power supply voltage
V
Power supply voltage
V
BB
BB
Figure 1 SOA at Tj = 135°C
Figure 2 SOA at Tc = 95°C
Note 1: The above safe operating areas are at Tj = 135°C (Figure 1) and Tc = 95°C (Figure 2). If the temperature
exceeds these, the safe operation areas reduce.
Note 2: The above safe operating areas include the over current protection operation area.
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2006-11-01
TPD4113AK
V
H – T
V
L – T
CEsat
CEsat
j
j
3.6
3.2
2.8
2.4
2.0
1.6
3.6
3.2
2.8
2.4
2.0
1.6
V
= 15 V
V
= 15 V
CC
CC
I
= 700 mA
C
I
I
= 700 mA
= 500 mA
C
C
I
I
= 500 mA
= 300 mA
C
C
I
= 300 mA
C
−20
20
60
100
140
140
18
−20
20
60
100
140
140
18
Junction temperature
T
(°C)
Junction temperature
T
(°C)
j
j
V H – T
F
V L – T
F
j
j
1.6
1.4
1.2
1.0
0.8
1.6
1.4
1.2
1.0
0.8
I
= 700 mA
F
I
I
= 700 mA
= 500 mA
F
F
I
I
= 500 mA
= 300 mA
F
F
I
= 300 mA
F
−20
20
60
100
−20
20
60
100
Junction temperature
T
(°C)
Junction temperature
T
(°C)
j
j
I
– V
V
– V
REG CC
CC
CC
2.0
1.5
1.0
0.5
0
8.0
7.5
7.0
6.5
6.0
−20°C
25°C
135°C
−20°C
25°C
135°C
I
= 30 mA
reg
12
14
16
12
14
16
Control power supply voltage
V
(V)
Control power supply voltage
V
(V)
CC
CC
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2006-11-01
TPD4113AK
t
– T
t – T
OFF j
ON
j
3.0
2.0
1.0
0
3.0
2.0
1.0
0
V
V
= 280 V
= 15 V
BB
CC
I
= 0.5 A
C
High-side
Low-side
V
V
= 280 V
= 15 V
BB
CC
I
= 0.5 A
C
High-side
Low-side
−20
20
60
100
140
−20
20
60
100
140
Junction temperature
T
(°C)
Junction temperature
T
(°C)
j
j
V
UV– T
V
UV – T
BS j
CC
j
12.5
12.0
11.5
11.0
10.5
10.0
10.5
10.0
9.5
V
V
UVD
UVR
V
V
UVD
UVR
CC
BS
BS
CC
9.0
8.5
8.0
−20
−20
20
60
100
140
20
60
100
140
Junction temperature
T
(°C)
Junction temperature
T
(°C)
j
j
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2006-11-01
TPD4113AK
I
– V (ON)
BS
I
– V (OFF)
BS BS
BS
500
400
300
200
100
500
400
300
200
100
−20°C
25°C
135°C
−20°C
25°C
135°C
12
14
16
18
12
14
16
18
Control power supply Voltage
V
(V)
Control power supply Voltage
V
(V)
BS
BS
Wton – T
j
V
– T
j
F (BSD)
250
200
150
100
50
1.0
0.9
0.8
0.7
0.6
I
I
= 700 mA
C
I
= 700 μA
F
= 500 mA
= 300 mA
C
I
C
I
= 500 μA
F
I
= 300 μA
F
0
−20
−20
20
60
100
140
20
60
100
140
Junction temperature
T
(°C)
Junction temperature
T
(°C)
j
j
Wtoff – T
j
50
40
30
20
10
0
I
= 700 mA
C
I
I
= 500 mA
= 300 mA
C
C
−20
20
60
100
140
Junction temperature
T
(°C)
j
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2006-11-01
TPD4113AK
Test Circuits
IGBT Saturation Voltage (U-phase low side)
HU = 0 V
HV = 0 V
HW = 0 V
LU = 5 V
LV = 0 V
LW = 0 V
V
= 15 V
VM
CC
FRD Forward Voltage (U-phase low side)
VM
15
2006-11-01
TPD4113AK
V
CC
Current Dissipation
IM
V
= 15 V
CC
Regulator Voltage
VM
V
= 15 V
CC
16
2006-11-01
TPD4113AK
Output ON/OFF Delay Time (U-phase low side)
HU = 0 V
HV = 0 V
HW = 0 V
LU =
PG
LV = 0 V
LW = 0 V
V
= 15 V
CC
U = 280 V
IM
90%
LU
10%
90%
10%
IM
t
t
OFF
ON
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TPD4113AK
V
CC
Under-voltage Protection Operation/Recovery Voltage (U-phase low side)
HU = 0 V
HV = 0 V
HW = 0 V
LU = 5 V
LV = 0 V
LW = 0 V
15 V → 6 V
V
=
VM
CC
6 V → 15 V
U = 18 V
*:Note:Sweeps the V
pin voltage from 15 V and monitors the U pin voltage.
CC
The V
pin voltage when output is off defines the under voltage protection operating voltage.
CC
Also sweeps from 6 V to increase. The V
recovery voltage.
pin voltage when output is on defines the under voltage protection
CC
V
BS
Under-voltage Protection Operation/Recovery Voltage (U-phase high side)
HU = 5 V
HV = 0 V
HW = 0 V
LU = 0 V
LV = 0 V
LW = 0 V
V
V
BSU =
= 15 V
= 18 V
VM
CC
BB
15 V → 6 V
6 V → 15 V
*:Note:Sweeps the BSU pin voltage from 15 V and monitors the V pin voltage.
BB
The BSU pin voltage when output is off defines the under-voltage protection operating voltage.
Also sweeps the BSU pin voltage from 6 V and changes from the HU pin voltage at 0 V → 5 V → 0 V.
The BSU pin voltage when output is on defines the under-voltage protection recovery voltage.
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2006-11-01
TPD4113AK
V
BS
Current Consumption (U-phase high side)
HU = 0 V/ 5 V
HV = 0 V
HW = 0 V
LU = 0 V
LV = 0 V
LW = 0 V
V
= 15 V
CC
BSU = 15 V
IM
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2006-11-01
TPD4113AK
Turn-On/Off Loss (low-side IGBT + high-side FRD)
HU = 0 V
HV = 0 V
HW = 0 V
LU=
PG
LV = 0 V
LW = 0 V
V
V
= 15 V
CC
/U = 280 V
VM
L
IM
BB
5 mH
Input (HU)
IGBT (C-E voltage)
(U-GND)
Power supply current
Wtoff
Wton
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TPD4113AK
Package Dimensions
Weight: 6.1 g (typ.)
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2006-11-01
TPD4113AK
Package Dimensions
Weight: 6.1 g (typ.)
22
2006-11-01
TPD4113AK
Package Dimensions
Weight: 6.1 g (typ.)
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2006-11-01
TPD4113AK
RESTRICTIONS ON PRODUCT USE
20070701-EN
• The information contained herein is subject to change without notice.
• TOSHIBA is continually working to improve the quality and reliability of its products. Nevertheless, semiconductor
devices in general can malfunction or fail due to their inherent electrical sensitivity and vulnerability to physical
stress. It is the responsibility of the buyer, when utilizing TOSHIBA products, to comply with the standards of
safety in making a safe design for the entire system, and to avoid situations in which a malfunction or failure of
such TOSHIBA products could cause loss of human life, bodily injury or damage to property.
In developing your designs, please ensure that TOSHIBA products are used within specified operating ranges as
set forth in the most recent TOSHIBA products specifications. Also, please keep in mind the precautions and
conditions set forth in the “Handling Guide for Semiconductor Devices,” or “TOSHIBA Semiconductor Reliability
Handbook” etc.
• The TOSHIBA products listed in this document are intended for usage in general electronics applications
(computer, personal equipment, office equipment, measuring equipment, industrial robotics, domestic appliances,
etc.).These TOSHIBA products are neither intended nor warranted for usage in equipment that requires
extraordinarily high quality and/or reliability or a malfunction or failure of which may cause loss of human life or
bodily injury (“Unintended Usage”). Unintended Usage include atomic energy control instruments, airplane or
spaceship instruments, transportation instruments, traffic signal instruments, combustion control instruments,
medical instruments, all types of safety devices, etc.. Unintended Usage of TOSHIBA products listed in his
document shall be made at the customer’s own risk.
• The products described in this document shall not be used or embedded to any downstream products of which
manufacture, use and/or sale are prohibited under any applicable laws and regulations.
• The information contained herein is presented only as a guide for the applications of our products. No
responsibility is assumed by TOSHIBA for any infringements of patents or other rights of the third parties which
may result from its use. No license is granted by implication or otherwise under any patents or other rights of
TOSHIBA or the third parties.
• Please contact your sales representative for product-by-product details in this document regarding RoHS
compatibility. Please use these products in this document in compliance with all applicable laws and regulations
that regulate the inclusion or use of controlled substances. Toshiba assumes no liability for damage or losses
occurring as a result of noncompliance with applicable laws and regulations.
24
2006-11-01
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