TVR2B [TOSHIBA]
TV Applications (fast recovery); 电视应用程序（快速恢复）
| 型号： | TVR2B |
| 厂家： | 
TOSHIBA |
| 描述： | TV Applications (fast recovery) |
| 文件： | 总4页 (文件大小：105K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
TVR2B,TVR2G,TVR2J
TOSHIBA Fast Recovery Diode Silicon Diffused Type
TVR2B,TVR2G,TVR2J
TV Applications (fast recovery)
Unit: mm
•
•
•
•
Average Forward Current: I
= 0.5 A (Ta = 50°C)
F (AV)
Repetitive Peak Reverse Voltage: V
= 100 to 600 V
RRM
Reverse Recovery Time: t = 5 to 20 µs
rr
Plastic Mold Type.
Maximum Ratings
=
(Ta 25°C)
Characteristics
Symbol
Rating
Unit
V
TVR2B
TVR2G
TVR2J
TVR2B
TVR2G
TVR2J
100
400
Repetitive peak
reverse voltage
V
RRM
600
50
Reverse voltage
(DC)
V
R
V
300
500
JEDEC
DO-41
―
Average forward current (Ta = 50°C)
I
0.5
A
A
F (AV)
30 (50 Hz)
33 (60 Hz)
−40 to 125
−40 to 125
JEITA
Peak one cycle surge forward current
(non repetitive)
I
FSM
TOSHIBA
3-3C1A
Junction temperature
T
j
°C
°C
Weight: 0.3 g (typ.)
Storage temperature range
T
stg
Electrical Characteristics (Ta = 25°C)
Characteristics
Peak forward voltage
Symbol
Test Condition
Min
Typ.
Max
Unit
V
I
= 1.0 A
FM
⎯
⎯
5
⎯
⎯
⎯
⎯
1.4
10
20
6
V
µA
µs
V
FM
Repetitive peak reverse current
Reverse recovery time
I
V
= Rated
RRM
RRM
t
I
I
= 20 mA, I = 1 mA
R
rr
F
F
Forward recovery voltage
V
fr
= 0.1 A, t = 100 ns, t = 5 µs
⎯
r
w
Note1: Soldering: 5 mm is the minimum to be kept between case and soldering part.
Note2: Lead bending: 5 mm is the minimum to be kept from the case when bend the lead wire.
Marking
Abbreviation Code
Part No.
Part No. (or abbreviation code)
Lot No.
VR2B
VR2G
VR2J
TVR2B
TVR2G
TVR2J
A line indicates
lead (Pb)-free package or
lead (Pb)-free finish.
1
2004-08-10
TVR2B,TVR2G,TVR2J
Handling Precaution
The maximum ratings denote the absolute maximum ratings, which are rated values and must not be exceeded
during operation, even for an instant. The following are the general derating methods that we recommend when
you design a circuit with a device.
V
:
We recommend that the worst case voltage, including surge voltage, be no greater than 80% of the
maximum rating of V for a DC circuit and be no greater than 50% of that of V for an AC
RRM
RRM RRM
circuit. V
RRM
has a temperature coefficient of 0.1%/°C. Take this temperature coefficient into
account designing a device at low temperature.
I
:
We recommend that the worst case current be no greater than 80% of the maximum rating of I
.
F(AV)
F(AV)
Carry out adequate heat design. If you can’t design a circuit with excellent heat radiation, set the
margin by using an allowable Tamax-I curve.
F(AV)
This rating specifies the non-repetitive peak current in one cycle of a 50-Hz sine wave, condition angle 180.
Therefore, this is only applied for an abnormal operation, which seldom occurs during the lifespan of the device.
We recommend that a device be used at a Tj of below 100°C under the worst load and heat radiation conditions.
Thermal resistance between junction and ambient fluctuates depending on the device’s mounting condition. When
using a device, design a circuit board and a soldering land size to match the appropriate thermal resistance value.
Please refer to the Rectifiers databook for further information.
2
2004-08-10
TVR2B,TVR2G,TVR2J
Ta max – I
Surge forward current (non-repetitive)
F (AV)
200
160
50
40
30
20
10
0
T = 25°C
j
120
80
40
0
Resistive and inductive load
Capacitive load
60 Hz
50 Hz
0
0.1
0.2
0.3
0.4
0.5
0.6
1
3
10
Number of cycles
30
100
Average forward current
I
(A)
F (AV)
3
2004-08-10
TVR2B,TVR2G,TVR2J
RESTRICTIONS ON PRODUCT USE
030619EAA
• The information contained herein is subject to change without notice.
• The information contained herein is presented only as a guide for the applications of our products. No
responsibility is assumed by TOSHIBA for any infringements of patents or other rights of the third parties which
may result from its use. No license is granted by implication or otherwise under any patent or patent rights of
TOSHIBA or others.
• TOSHIBA is continually working to improve the quality and reliability of its products. Nevertheless, semiconductor
devices in general can malfunction or fail due to their inherent electrical sensitivity and vulnerability to physical
stress. It is the responsibility of the buyer, when utilizing TOSHIBA products, to comply with the standards of
safety in making a safe design for the entire system, and to avoid situations in which a malfunction or failure of
such TOSHIBA products could cause loss of human life, bodily injury or damage to property.
In developing your designs, please ensure that TOSHIBA products are used within specified operating ranges as
set forth in the most recent TOSHIBA products specifications. Also, please keep in mind the precautions and
conditions set forth in the “Handling Guide for Semiconductor Devices,” or “TOSHIBA Semiconductor Reliability
Handbook” etc..
• The TOSHIBA products listed in this document are intended for usage in general electronics applications
(computer, personal equipment, office equipment, measuring equipment, industrial robotics, domestic appliances,
etc.). These TOSHIBA products are neither intended nor warranted for usage in equipment that requires
extraordinarily high quality and/or reliability or a malfunction or failure of which may cause loss of human life or
bodily injury (“Unintended Usage”). Unintended Usage include atomic energy control instruments, airplane or
spaceship instruments, transportation instruments, traffic signal instruments, combustion control instruments,
medical instruments, all types of safety devices, etc.. Unintended Usage of TOSHIBA products listed in this
document shall be made at the customer’s own risk.
• TOSHIBA products should not be embedded to the downstream products which are prohibited to be produced
and sold, under any law and regulations.
4
2004-08-10
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