TQRLC [TRIQUINT]
Advanced Passives Foundry Service; 先进的无源器件代工服务
| 型号： | TQRLC |
| 厂家： | 
TRIQUINT SEMICONDUCTOR |
| 描述： | Advanced Passives Foundry Service |
| 文件： | 总3页 (文件大小：395K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
ProductionProcess
TQRLC
Advanced Passives Foundry Service
Features
•
•
Thick 4 Layer Metal; > 9 µm total
thickness
High Density Interconnects:
•
3 Global
•
1 Local
•
High-Q Passives; Inductor Q >50
@ 2 GHz
•
•
•
•
Low Cost: Passives Only
Thin Film Resistors
Dielectric Encapsulated Metals
Planarized Surface;
simplified plastic packaging
Volume Production Process
•
TQRLCProcess Cross-Section
Applications
•
Passive Components:
•
•
•
•
•
Phase Shifters
Baluns
Transformers
Couplers
General Description
TriQuint’s TQRLC is a pure passives process. It is targeted at
high performance, small size passive-only circuits and utilizes
over 9 µm of gold metal. High density interconnections are ac-
complished with three thick global and one surface metal inter-
connect layers. The four metal layers are encapsulated in a high
performance, low dielectric constant material that allows wiring
flexibility and plastic packaging simplicity. Precision NiCr resis-
tors, inductors, and high value MIM capacitors are available.
The process is based on the TQTRx process, currently
TriQuint’s highest volume process. The TQRLC process is
available on 150-mm (6 inch) wafers.
Mixers (with off-chip di-
ode arrays)
•
Circuits Requiring High-Q
Passive Elements
Matching Circuits
RF Module Front-End Filters
General RF and Microwave Imped-
ance Matching
•
•
•
Semiconductors for Communications
Phone: 503-615-9000
TriQuint Semiconductor
2300 NE Brookwood Pkwy
www.triquint.com
Fax: 503-615-8905
Page1of3;Rev2.33/18/04
Hillsboro, Oregon 97124
Email: info@triquint.com
ProductionProcess
TQRLC
Advanced Passives Foundry Service
Element
Parameter
Value
Units
µm
TQRLC
Process
Details
Interconnects Metal Layers
Space Width
Four: 0.4,2,2,5.5
Met3= 5; Met1&2= 3
Met3= 5; Met1&2= 2
µm
Trace Width
µm
BCB Dielectric Nom. Thickness
ILD1= 1 +/-0.1;
µm
ILD2&3= 3.2 +/- 0.2
Dielectric Constant
2.8
600
50+/-3
No
MIM Caps
Resistors
Vias
Values
NiCr
pF/mm2
Ohms/sq
Mask Layers
No Vias
10
Capacitor Breakdown Voltage
40
V
Maximum
Ratings
Passivation
Met3
Via3
ILD3
dielectric
Met2
Met1
Via2
Via1
ILD2
dielectric
Example of Metal Stack Configurations
Possible with TQRLC Process; Edge– or
Parallel-Coupled Structures Through
The ILD Layers Are Also Possible.
Met0
MIM
ILD1 dielectric
Specifications Subject to Change
Semiconductors for Communications
Phone: 503-615-9000
TriQuint Semiconductor
2300 NE Brookwood Pkwy
www.triquint.com
Fax: 503-615-8905
Page2of3;Rev2.33/18/04
Hillsboro, Oregon 97124
Email: info@triquint.com
Production Process
TQRLC
Advanced Passives Foundry Service
Prototyping and Development
Process Qualification Status
•
•
Prototype Development Quickturn (PDQ):
•
•
TQRLC is a fully-released process
Reliability Reports
•
•
•
Shared Mask Set;
Run Monthly;
Hot Lot Cycle Time;
•
TQRLC Process Qualification
•
TQTRx Element Qualification Report
•
For more information on Quality and
Reliability, contact TriQuint or visit:
Prototype Wafer Option (PWO):
•
•
•
Customer-specific Masks, Customer Schedule
2 wafers delivered
With thinning and sawing
www.tqs.com/Manufacturing/QR/bdy_qr-pubs.htm.
Applications Support Services
•
•
•
•
Tiling of GDSII Stream Files including PCM
Design Rule Check Services
Layout versus Schematic Check Services
Engineering Services:
Design Tool Status
•
•
Design Manual Available Now
Device Library of Circuit Elements includes Thin Film
Resistors, Capacitors, Inductors
Agilent ADS Definition File for E-M Simulation Now
Layout/Verification Kit for ICEditors
•
Packaging Development
•
Test Development Engineering (on-wafer and
packaged parts)
Thermal Analysis Engineering
Yield Enhancement Engineering
•
•
•
•
•
Cadence Layout Library Available Now
•
•
Part Qualification Services
Failure Analysis
Manufacturing Services
•
•
•
•
•
•
•
•
Mask Making
Production 150 mm Wafer Fab
Wafer Thinning
Training
•
•
GaAs Design Classes:
•
•
Half Day Introduction; Upon Request
Four Day Technical Training; Fall & Spring at
TriQuint Oregon facility
Wafer Sawing
DC Die Sort Testing
RF On-Wafer Testing
Plastic Packaging
For Training Schedules, please visit:
www.triquint.com/foundry/
RF Packaged Part Testing
Please contact your local TriQuint Semiconductor Representative or
Foundry Services Staff for additional information:
E-mail: sales@triquint.com
Phone: (503) 615-9000
Fax: (503) 615-8905
Semiconductors for Communications
www.triquint.com
TriQuint Semiconductor
2300 NE Brookwood Pkwy
Hillsboro, Oregon 97124
Phone: 503-615-9000
Fax: 503-615-8905
Email: info@triquint.com
Page 3 of 3; Rev 2.3 3/18/04
相关型号：
©2020 ICPDF网 联系我们和版权申明