SF38GHA0 [TSC]

Glass Passivated Super Fast Rectifiers;
SF38GHA0
型号: SF38GHA0
厂家: TAIWAN SEMICONDUCTOR COMPANY, LTD    TAIWAN SEMICONDUCTOR COMPANY, LTD
描述:

Glass Passivated Super Fast Rectifiers

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中文:  中文翻译
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SF31G thru SF38G  
Taiwan Semiconductor  
CREAT BY ART  
Glass Passivated Super Fast Rectifiers  
FEATURES  
- Glass passivated chip junction  
- High current capability, Low VF  
- High reliability  
- High surge current capability  
- Low power loss  
- Compliant to RoHS Directive 2011/65/EU and  
in accordance to WEEE 2002/96/EC  
- Halogen-free according to IEC 61249-2-21 definition  
MECHANICAL DATA  
Case: DO-201AD  
DO-201AD  
Molding compound, UL flammability classification rating 94V-0  
Base P/N with suffix "G" on packing code - green compound (halogen-free)  
Base P/N with prefix "H" on packing code - AEC-Q101 qualified  
Terminal: Matte tin plated leads, solderable per JESD22-B102  
Meet JESD 201 class 1A whisker test  
with prefix "H" on packing code meet JESD 201 class 2 whisker test  
Weight: 1.1 g (approximately)  
MAXIMUM RATINGS AND ELECTRICAL CHARACTERSTICS (TA=25unless otherwise noted)  
SF  
31G  
50  
SF  
32G  
100  
70  
SF  
33G  
150  
105  
150  
SF  
34G  
200  
140  
200  
SF  
35G  
300  
210  
300  
SF  
36G  
400  
280  
400  
SF  
37G  
500  
350  
500  
SF  
38G  
600  
420  
600  
PARAMETER  
SYMBOL  
UNIT  
Maximum repetitive peak reverse voltage  
Maximum RMS voltage  
VRRM  
VRMS  
VDC  
V
V
V
A
35  
Maximum DC blocking voltage  
50  
100  
Maximum average forward rectified current  
IF(AV)  
3
Peak forward surge current, 8.3 ms single half sine-wave  
superimposed on rated load  
IFSM  
VF  
IR  
125  
A
V
Maximum instantaneous forward voltage (Note 1)  
@ 3 A  
0.95  
1.3  
1.7  
5
Maximum reverse current @ rated VR TJ=25 ℃  
TJ=125 ℃  
μA  
100  
35  
Maximum reverse recovery time (Note 2)  
Typical junction capacitance (Note 3)  
Trr  
Cj  
ns  
80  
60  
pF  
RθjC  
RθjL  
RθjA  
9
10  
35  
OC/W  
Typical thermal resistance  
OC  
OC  
Operating junction temperature range  
Storage temperature range  
TJ  
- 55 to +150  
- 55 to +150  
TSTG  
Note 1: Pulse Test with PW=300μs, 1% Duty Cycle  
Note 2: Reverse Recovery Test Conditions: IF=0.5A, IR=1.0A, IRR=0.25A  
Note 3: Measured at 1 MHz and Applied Reverse Voltage of 4.0V D.C.  
Document Number: DS_D1405024  
Version: G14  
SF31G thru SF38G  
Taiwan Semiconductor  
CREAT BY ART  
ORDERING INFORMATION  
PART NO.  
AEC-Q101  
QUALIFIED  
PACKING  
GREEN COMPOUND  
CODE  
PACKAGE  
PACKING  
CODE  
A0  
DO-201AD  
DO-201AD  
DO-201AD  
DO-201AD  
500 / Ammo box  
1,250 / 13" Paper reel  
500 / Bulk packing  
Forming  
R0  
SF3xG  
(Note 1)  
Prefix "H"  
Suffix "G"  
B0  
X0  
Note 1: "x" defines voltage from 50V (SF31G) to 600V (SF38G)  
EXAMPLE  
AEC-Q101  
GREEN COMPOUND  
CODE  
PREFERRED P/N  
PACKING CODE  
DESCRIPTION  
PART NO.  
QUALIFIED  
SF38G A0  
SF38G A0G  
SF38GHA0  
A0  
A0  
A0  
SF38G  
SF38G  
SF38G  
G
Green compound  
H
AEC-Q101 qualified  
RATINGS AND CHARACTERISTICS CURVES  
(TA=25unless otherwise noted)  
FIG. 2 TYPICAL REVERSE CHARACTERISTICS  
FIG.1 FORWARD CURRENT DERATING CURVE  
1000  
100  
10  
4
3
2
1
0
TJ=125℃  
TJ=75  
TJ=25℃  
1
RESISTIVE OR  
INDUCTIVE LOAD  
0.1  
0.01  
0
25  
50  
75  
100  
125  
150  
175  
LEAD TEMPERATURE (oC)  
0
20  
40  
60  
80  
100  
120  
140  
PERCENT OF RATED PEAK REVERSE VOLTAGE (%)  
FIG. 3 MAXIMUM NON-REPETITIVE FORWARD  
SURGE CURRENT  
FIG. 4 TYPICAL FORWARD CHARACTERISTICS  
100  
Pulse Width=300μs  
1% Duty Cycle  
175  
150  
125  
100  
75  
8.3ms Single Half Sine Wave  
JEDEC Method  
10  
1
SF31G-SF34G  
50  
SF35G-SF36G  
SF37G-SF38G  
25  
0
0.1  
1
10  
100  
0.4  
0.6  
0.8  
1
1.2  
1.4  
1.6  
1.8  
NUMBER OF CYCLES AT 60 Hz  
FORWARD VOLTAGE (V)  
Document Number: DS_D1405024  
Version: G14  
SF31G thru SF38G  
Taiwan Semiconductor  
CREAT BY ART  
FIG. 5 TYPICAL JUNCTION CAPACITANCE  
140  
120  
100  
80  
SF31G-SF34G  
60  
40  
SF35G-SF38G  
20  
0
0.1  
1
10  
100  
REVERSE VOLTAGE (V)  
PACKAGE OUTLINE DIMENSIONS  
Unit (mm)  
Unit (inch)  
DIM.  
Min  
Max  
5.60  
1.30  
-
Min  
Max  
0.220  
0.052  
-
A
B
C
D
E
5.00  
1.20  
0.197  
0.048  
1.000  
0.335  
1.000  
25.40  
8.50  
9.50  
-
0.375  
-
25.40  
MARKING DIAGRAM  
P/N =  
G =  
Specific Device Code  
Green Compound  
YWW = Date Code  
F =  
Factory Code  
Document Number: DS_D1405024  
Version: G14  
SF31G thru SF38G  
Taiwan Semiconductor  
CREAT BY ART  
Notice  
Specifications of the products displayed herein are subject to change without notice. TSC or anyone on its behalf,  
assumes no responsibility or liability for any errors inaccuracies.  
Information contained herein is intended to provide a product description only. No license, express or implied,to  
any intellectual property rights is granted by this document. Except as provided in TSC's terms and conditions of  
sale for such products, TSC assumes no liability whatsoever, and disclaims any express or implied warranty,  
relating to sale and/or use of TSC products including liability or warranties relating to fitness for a particular purpose,  
merchantability, or infringement of any patent, copyright, or other intellectual property right.  
The products shown herein are not designed for use in medical, life-saving, or life-sustaining applications.  
Customers using or seling these products for use in such applications do so at their own risk and agree to fully  
indemnify TSC for any damages resulting from such improper use or sale.  
Document Number: DS_D1405024  
Version: G14  

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