LRF1206-R02GW [TTELEC]
Low Value Flat cChip Resistor;
| 型号： | LRF1206-R02GW |
| 厂家： | 
TT Electronics |
| 描述： | Low Value Flat cChip Resistor |
| 文件： | 总2页 (文件大小：766K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
Resistors
Low Value Flat Chip Resistor
LR Series
Standard 2512, 2010 and 1206 sizes
Resistance values down to 0.003 ohms
ꢀ Leachꢀresistantꢀsolder-platedꢀcopperꢀwrap-aroundꢀterminaꢁon
ꢀ AEC-Q200ꢀQualified
RoHS compliant and SnPb variants
AllꢀpartsꢀareꢀPb-freeꢀandꢀcomplyꢀwithꢀEUꢀDirecꢁveꢀ2011/65/EUꢀ(RoHS2)
LR1206
0.5
LR2010
1
LR2512
2
Power rating @70°C
Resistance range1
Resistance tolerance1
watts
ohms
%
R003 to 1R0
<R01: 5, ≥R01: 1, 2, 5
≥R05: 100, R025ꢀR0ꢁ7: <ꢂ200, R015ꢃR02ꢁ: <ꢂ300,
R01ꢃR01ꢁ: <ꢂ500, <R01: <ꢂ900
TCR
ppm/°C
Dielectric withstand
Ambient temperature range
Values
volts
°C
200
ꢃ55 to ꢂ150
E2ꢁ preferred2
80
Temperature rise at rated power
Pad / trace area3
°C
mm2
ꢁ0
30
90
100
300
Note 1: Contact factory for value ꢀ tolerance combinations outside this range. Note 2: Many values = N x R001 and N x R005 up to N=10 are also
available. Note 3: Recommended minimum pad & adjacent trace area for each termination for rated dissipation on FRꢁ PCB
Physical Data
Dimensions (mm)
Size
L
W
H (max)
0.8
D
LR1206
LR2010
LR2512
3.20 0.305
5.23 0.38
6.50 0.38
1.63 0.20
2.64 0.25
3.25 0.25
0.48 0.25
0.48 0.25
0.48 0.25
0.84
0.84
LR 1206 / 2010 / 2512
W
L
H
D
Solder Plating
Nickel Barrier Layer
Copper Wraparound
Termination
Protective Overcoat
Resistive Element
Copper Termination
Alumina Substrate
Recommended Solder Pad Dimensions (mm)
A
A
B
C
LR1206
LR2010
LR2512
2.0
3.05
3.7
4.0
1.25
B
6.5
1.5
1.5
C
7.75
General Note
BI Technologies IRC Welwyn
TT Electronics reserves the right to make changes in product specification without notice or liability.
All information is subject to TT Electronics’ own data and is considered accurate at time of going to print.
www.ttelectronics.com/resistors
© TT Electronics plc
06.17
Low Value Flat
Chip Resistor
LR Series
(%)
100
AEC-Q200 Table 7
Max.
Typ.
Method
(add R05)
(@1R0)
ref
3
Test
80
High Temp. Exposure MIL-STD-202 Method 108
Temperature Cycling JESD22 Method JA-104
R% 0.5 0.2
R% 0.25 0.1
4
60
40
20
6
7
Moisture Resistance MIL-STD-202 Method 106
Biased Humidity MIL-STD-202 Method 103
R% 0.5 0.2
R% 0.5 0.2
8
Operational Life (Cyclic Load) MIL-STD-202 Method 108
Vibration MIL-STD-202 Method 204
R%
1
0.5
14
R% 0.5 0.05
R% 0.25 0.05
R% 0.25 0.1
>95% coverage
R% 0.5 0.2
R% 0.25 0.1
R% 0.5
0
70
150 (°C)
25
15 Resistance to Soldering Heat MIL-STD-202 Method 210
Ambient temperature
16
18
21
22
Thermal Shock MIL-STD-202 Method 107
Solderability
Board Flex
J-STD-002
AEC-Q200-005
AEC-Q200-006
6.25 x Pr for 2s
LRC 2512 21 w
LRC 2010 10.w5 watt
Terminal Strength
att
att
LR
C
1206 0.525ww
Short Term Overload
Low Temperature Storage
Leach Resistance
att
att
-65°C for 100 hours
Solder dip at 250°C
R% 0.5
90s minimum
Note:
1. Although 2010 and 2512 sizes have passed temperature cycling and thermal shock, it is in general not recommended that ceramic
chips this large be used on FR4 in a severe temperature cycle environment due to the possibility of solder joint fatigue.
2. Full AEC-Q200 qualification applies only to European Part Numbers at ohmic values ≥R01.
Ordering Procedure
This product has two valid part numbers:
European (Welwyn) Part Number: LRF1206-R02FW (1206, 20 milliohms ±1%, Pb-free)
L
R
1
F
1
2
0
6
-
R
0
3
2
F
4
W
5
2
1
2
3
4
5
Type
Size
Value
Tolerance
Termination & Packing
1206
F = ±1%
W
Pb-free, standard packing
LR = Conventional orientation
(values >R025)
E24 = 3/4
2010 characters G = ±2% T1 Pb-free, 1000/reel (non-standard)
R = ohms
2512
J = ±5% PB
SnPb finish, standard packing
Standard packing is tape & reel
LRF = Flip-chip orientation
(values ≤R025)
1206 & 2010
2512
3000/reel
1800/reel
USA (IRC) Part Number: LRC-LRF1206LF-01-R020-F (1206, 20 milliohms ±1%, Pb-free)
L
R
1
C
-
L
R
2
F
1
2
0
6
L
F
-
0
1
-
R
0
2
0
-
F
7
3
4
5
6
1
2
3
4
5
6
7
Packing
Family
Model
Size Termination
TCR
Value
Tolerance
LRC
1206 Omit for SnPb
2010 LF = Pb-free (±100ppm/°C
2512
F = ±1%
G = ±2%
J = ±5%
LR = Conventional orientation
(values >R025)
4 characters
R = ohms
01 = standard
Standard packing is tape & reel
All sizes 1000/reel Standard
values ≥R05)
LRF = Flip-chip orientation
(values ≤R025)
1206 & 2010 3000/reel
1800/reel
Non-
standard
2512
General Note
BI Technologies IRC Welwyn
TT Electronics reserves the right to make changes in product specification without notice or liability.
All information is subject to TT Electronics’ own data and is considered accurate at time of going to print.
www.ttelectronics.com/resistors
© TT Electronics plc
06.17
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